An interconnect sheet and diode automatic placement apparatus

Abstract

The utility model discloses an interconnect piece and diode automatic material placing equipment, including base and the processing board of setting at the base upper end position, when using this equipment, the equipment will produce heat and dust when working, and the motor work of heat dissipation dust collector inside will through multiple dust absorption pipe inhale the dust in interconnect piece and diode automatic material placing equipment inside into dust inlet pipe, then the dust in dust inlet pipe inside will be transported to heat dissipation dust collector inside through first conveying pipe, dust inlet, at the same time, the wind in heat dissipation dust collector inside will be transmitted to the outlet pipe through air outlet, second conveying pipe, and the wind in outlet pipe inside will again be blown to interconnect piece and diode automatic material placing equipment inside through multiple air blowing pipe and blow heat dissipation, through the setting of dust absorption pipe, dust inlet pipe, first conveying pipe, dust inlet, heat dissipation dust collector, air outlet, second conveying pipe, outlet pipe and air blowing pipe, the dust removal and heat dissipation performance of interconnect piece and diode automatic material placing equipment are strengthened.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor and electronic component technology, specifically relating to an automatic material placement device for interconnect chips and diodes. Background Technology

[0002] The automatic interconnect and diode placement equipment is an automated production auxiliary device specifically designed for interconnects (mostly thin conductive metal sheets, commonly used for circuit connections and component fixing, such as new energy battery tab connectors, electronic component pin connections, etc.) and diodes (semiconductor electronic components, with unidirectional conductivity, widely used in rectification, voltage regulation, switching, and other circuits). Its core function is to replace manual labor in completing the entire process of "material loading → posture adjustment → precise positioning → orderly placement" through the synergy of mechanical structure, electronic control system, and sensing technology. Ultimately, it neatly places both materials onto a designated carrier (such as a PCB) according to preset process requirements (such as spacing, orientation, and stacking layers). On the plate, tray, tooling fixture, etc., a standardized material base is provided for downstream welding, assembly, testing and other processes. The automatic interconnect chip and diode material handling equipment of this utility model is mainly composed of support columns, base, protective frame, warning light, LCD screen, control button, feed port, support pad, upper and lower material bin assembly, defective product tray assembly, flexible vibration assembly, feeding hopper assembly, processing plate, material picking and moving assembly, camera detection assembly, moving wheels, placement seat and other components. Existing automatic interconnect chip and diode material handling equipment has problems such as excessive internal temperature and dust affecting normal operation. Therefore, an automatic interconnect chip and diode material handling equipment is essential. Utility Model Content

[0003] The purpose of this invention is to provide an automatic interconnect chip and diode placement device to solve the problems mentioned in the background art, such as excessive internal temperature and excessive dust affecting the normal operation of existing automatic interconnect chip and diode placement devices.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an automatic interconnect chip and diode placement device, comprising... A base and a processing plate disposed at the upper end of the base; A material picking and moving assembly is installed at the upper front side of the processing plate. A camera detection assembly is installed at the rear side of the material picking and moving assembly. A feeding hopper assembly is installed below the material picking and moving assembly and inside the camera detection assembly. A flexible vibration assembly is installed at the rear side of the feeding hopper assembly. A defective product tray assembly is installed at the rear side of the flexible vibration assembly. An upper and lower material bin assembly is installed at the rear side of the defective product tray assembly. A heat dissipation and dust removal device is installed inside the base. From left to right, the heat dissipation and dust removal device contains a protective net, a motor body, an output shaft, and blades. An insertion hole is provided inside the upper end of the base. A through hole is provided inside the processing plate at the position corresponding to the insertion hole. A dust inlet is provided on the left side of the heat dissipation and dust removal device. A first conveying pipe is installed outside the dust inlet. A dust inlet pipe is installed at the upper end of the first conveying pipe. A suction pipe is installed at the upper end of the dust inlet pipe and inside the insertion hole and through hole. An air outlet is provided on the right side of the heat dissipation and dust removal device. A second conveying pipe is installed outside the air outlet. An air outlet pipe is installed at the upper end of the second conveying pipe. A blower pipe is installed at the upper end of the air outlet pipe and inside the insertion hole and through hole. The flexible vibration component, the material handling and moving component, the camera detection component, the loading and unloading hopper component, and the motor body are electrically connected to an external power source. The combined use of the suction pipe, dust inlet pipe, first conveying pipe, dust inlet, heat dissipation and dust removal device, motor body, output shaft, blades, air outlet, second conveying pipe, air outlet pipe and blowing pipe enhances the dust removal and heat dissipation performance of the automatic material handling equipment for interconnect chips and diodes.

[0005] Preferably, an installation ring is connected to the inner side of the first conveying pipe and the second conveying pipe at a position outside the dust inlet and the air outlet, a connecting pipe is connected to the inner side of the first conveying pipe and the second conveying pipe at a position below the dust inlet and the air outlet, and an installation pipe is connected to the upper end of the dust inlet and the air outlet at a position outside the suction pipe and the blower pipe.

[0006] Preferably, the first conveying pipe and the second conveying pipe are threadedly connected to the dust inlet and the air outlet via mounting rings. The dust inlet pipe and the air outlet pipe are threadedly connected to the first conveying pipe and the second conveying pipe via connecting pipes. The suction pipe and the blower pipe are threadedly connected to the dust inlet pipe and the air outlet pipe via mounting pipes. The combined use of the mounting ring, connecting pipe, mounting pipe, and threaded connection enhances the convenience and stability of connecting the first conveying pipe, the second conveying pipe, the dust inlet pipe, the air outlet pipe, the suction pipe, the blower pipe, and the dust inlet and the air outlet pipe.

[0007] Preferably, a fixing column is connected to the lower end of the heat dissipation and dust removal device and located inside the base. A mounting plate is connected to the lower end of the fixing column. The mounting plate is fixedly connected to the base by a fastening nut. The use of the fixing column, the mounting plate and the threaded connection enhances the convenience of installing and disassembling the heat dissipation and dust removal device.

[0008] Preferably, a placement seat is connected to the upper end of the base and the lower end of the processing plate, and a protective frame is installed on the upper end of the processing plate and the outer side of the loading and unloading hopper assembly, the defective product tray assembly, the flexible vibration assembly, the feeding hopper assembly, the material picking and moving assembly, and the camera detection assembly.

[0009] Preferably, a warning light is installed at the upper end of the protective frame, and an LCD screen, control buttons and a feed inlet are arranged sequentially from top to bottom on the front of the protective frame.

[0010] Preferably, support columns are welded at the four corners of the lower end of the base, and support pads are installed at the lower outer positions of the support columns. The support pads are made of rubber material.

[0011] Preferably, a caster wheel is installed at the lower end of the base and inside the support column. The support column and support pad enhance the stability of the interconnect chip and diode automatic placement equipment, while the caster wheel enhances the ease of movement of the interconnect chip and diode automatic placement equipment.

[0012] Compared with the prior art, the present invention provides an automatic interconnect chip and diode placement device, which has the following advantages: This invention improves an automatic interconnect chip and diode feeding device. When using the device, materials are first poured into the feeding hopper assembly through the inlet. The feeding hopper assembly then transfers the materials to a flexible vibration assembly. The flexible vibration assembly gently and randomly arranges a large amount of scattered materials onto a plane. A camera detection system then accurately identifies the position and angle of each material, guiding the material-grabbing component to pick it up. The camera detection component uses a camera to detect and classify the materials into good and defective products. The material-grabbing component then transfers the materials from the flexible vibration plate to a good product tray or defective product box. The upper and lower hopper assemblies neatly arrange the scattered materials into the trays in a consistent direction and order using the material-grabbing component. When a tray is full, the system automatically transfers it to the hopper. Empty trays are moved to the corresponding positions for continued feeding. During operation, the automatic interconnect chip and diode feeding device... Heat and dust are generated. At this time, the motor inside the heat dissipation and dust removal device operates, drawing the dust from inside the interconnect chip and diode automatic placement equipment into the dust inlet pipe through multiple suction pipes. Then, the dust inside the dust inlet pipe is transported to the heat dissipation and dust removal device through the first conveying pipe and dust inlet. Simultaneously, the air inside the heat dissipation and dust removal device is transmitted to the exhaust pipe through the exhaust port and second conveying pipe. The air inside the exhaust pipe is then blown through multiple air blowing pipes to dissipate heat from inside the interconnect chip and diode automatic placement equipment, thereby reducing the internal temperature of the interconnect chip and diode automatic placement equipment. Through the coordinated use of suction pipes, dust inlet pipes, first conveying pipes, dust inlet, heat dissipation and dust removal device, motor body, output shaft, blades, exhaust port, second conveying pipe, exhaust pipe, and air blowing pipes, the dust removal and heat dissipation performance of the interconnect chip and diode automatic placement equipment is enhanced, preventing the interconnect chip and diode automatic placement equipment from overheating and excessive dust from affecting the normal operation of the equipment. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the automatic interconnect chip and diode placement equipment of this utility model.

[0014] Figure 2 This is a schematic diagram of the automatic interconnect chip and diode placement equipment of this utility model without the installation of a protective frame.

[0015] Figure 3 This is a structural schematic diagram of the front view of the automatic interconnect chip and diode placement equipment of this utility model.

[0016] Figure 4 This is an enlarged cross-sectional schematic diagram of the base of the automatic diode stacking equipment of this utility model.

[0017] In the diagram: 1. Support column; 2. Base; 3. Protective frame; 4. Warning light; 5. LCD screen; 6. Control button; 7. Feed inlet; 8. Support pad; 9. Loading and unloading hopper assembly; 10. Defective product tray assembly; 11. Flexible vibration assembly; 12. Feeding hopper assembly; 13. Processing plate; 14. Material handling and moving assembly; 15. Camera detection assembly; 16. Moving wheel; 17. Placement seat; 18. Through hole; 19. Mounting pipe; 20. Dust inlet pipe; 21. First conveying pipe; 22. Dust inlet; 23. Protective net; 24. Motor body; 25. Output shaft; 26. Fixed column; 27. Blade; 28. Air outlet; 29. ​​Second conveying pipe; 30. Connecting pipe; 31. Air outlet pipe; 32. Insertion hole; 33. Blowing pipe; 34. Suction pipe; 35. Heat dissipation and dust removal device. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] This utility model provides, for example Figure 1-4The automatic interconnect chip and diode placement device shown includes a base 2 and a processing plate 13 disposed at the upper end of the base 2. A material picking and moving assembly 14 is installed at the upper front side of the processing plate 13, a camera detection assembly 15 is installed at the rear side of the material picking and moving assembly 14, a feeding hopper assembly 12 is installed below the material picking and moving assembly 14 and inside the camera detection assembly 15, and a flexible vibration assembly 11 is installed at the rear side of the feeding hopper assembly 12. A defective material tray assembly 10 is installed at the rear of the flexible vibration component 11, and an upper and lower material bin assembly 9 is installed at the rear of the defective material tray assembly 10; a heat dissipation and dust removal device 35 is installed inside the base 2, and the heat dissipation and dust removal device 35 has a protective net 23, a motor body 24, an output shaft 25, and blades 27 arranged sequentially from left to right inside the heat dissipation and dust removal device 35; an insertion hole 32 is provided at the upper end of the base 2, and a through hole 18 is provided inside the processing plate 13 at a position corresponding to the insertion hole 32; the left side of the heat dissipation and dust removal device 35 is located at... A dust inlet 22 is provided at the location of the heat dissipation and dust removal device 35. A first conveying pipe 21 is installed at the outer position of the dust inlet 22. A dust inlet pipe 20 is installed at the upper end of the first conveying pipe 21. A suction pipe 34 is installed at the upper end of the dust inlet pipe 20, located inside the insertion hole 32 and the through hole 18. An air outlet 28 is provided at the right side of the heat dissipation and dust removal device 35. A second conveying pipe 29 is installed at the outer position of the air outlet 28. An air outlet pipe 31 is installed at the upper end of the second conveying pipe 29. The upper end of the air outlet pipe 31 is located inside the insertion hole 32 and the through hole 18. A blower pipe 33 is installed on the inner side; the flexible vibration component 11, the material handling and moving component 14, the camera detection component 15, the loading and unloading hopper component 9, and the motor body 24 are electrically connected to an external power supply; through the combined use of the suction pipe 34, the dust inlet pipe 20, the first conveying pipe 21, the dust inlet 22, the heat dissipation and dust removal device 35, the motor body 24, the output shaft 25, the blades 27, the air outlet 28, the second conveying pipe 29, the air outlet pipe 31, and the blower pipe 33, the dust removal and heat dissipation performance of the automatic material handling equipment for interconnect chips and diodes is enhanced.

[0020] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, to enhance the dust removal and heat dissipation performance of the automatic interconnect chip and diode loading equipment, when using the automatic interconnect chip and diode loading equipment, the material is first poured into the feeding hopper assembly 12 through the feeding port 7. The feeding hopper assembly 12 transfers the material to the flexible vibration assembly 11. The flexible vibration assembly 11 gently and randomly presents a large amount of scattered material on a plane. Then, the camera detection assembly 15 accurately identifies the position and angle of each material and guides the material picking moving assembly 14 to complete the grabbing. The camera detection assembly 15 uses a camera to detect the material and classify it into good and defective products. The material picking moving assembly 14 transports the material from the flexible vibration plate to the good product tray or defective product box. The upper and lower hopper assembly 9 arranges the scattered material neatly in the tray in a consistent direction and order through the material picking moving assembly 14. When a tray is full, the system can automatically transfer it to the hopper. Empty trays are transferred to the corresponding positions to continue feeding. The automatic interconnect chip and diode loading equipment generates heat and dust during operation, which requires heat dissipation and dust removal. The motor inside device 35 draws dust from the automatic interconnect and diode placement equipment into the dust inlet pipe 20 through multiple suction pipes 34. The dust in the dust inlet pipe 20 is then transported to the heat dissipation and dust removal device 35 through the first conveying pipe 21 and the dust inlet 22. Simultaneously, air from inside the heat dissipation and dust removal device 35 is transmitted to the air outlet pipe 31 through the air outlet 28 and the second conveying pipe 29. The air in the air outlet pipe 31 then blows air into the automatic interconnect and diode placement equipment through multiple blowing pipes 33. Heat dissipation is achieved by using a combination of a suction pipe 34, a dust inlet pipe 20, a first conveying pipe 21, a dust inlet 22, a heat dissipation and dust removal device 35, a motor body 24, an output shaft 25, blades 27, an air outlet 28, a second conveying pipe 29, an air outlet pipe 31, and a blower pipe 33 to enhance the dust removal and heat dissipation performance of the automatic interconnect chip and diode arranging equipment. This prevents the automatic interconnect chip and diode arranging equipment from overheating and excessive dust from affecting the normal operation of the equipment.

[0021] An mounting ring is connected to the inner side of the first conveying pipe 21 and the second conveying pipe 29, located outside the dust inlet 22 and the air outlet 28. A connecting pipe 30 is connected to the inner side of the first conveying pipe 21 and the second conveying pipe 29, located at the lower end of the dust inlet pipe 20 and the air outlet 31. An mounting pipe 19 is connected to the upper end of the dust inlet pipe 20 and the air outlet 31, located outside the suction pipe 34 and the blowing pipe 33. The first conveying pipe 21 and the second conveying pipe 29 are threadedly connected to the dust inlet 22 and the air outlet 28 via the mounting ring. The dust inlet pipe 20 and the air outlet 31 are connected via... The connecting pipe 30 is threadedly connected to the first conveying pipe 21 and the second conveying pipe 29. The suction pipe 34 and the blowing pipe 33 are threadedly connected to the dust inlet pipe 20 and the air outlet pipe 31 through the mounting pipe 19. The use of the mounting ring, the connecting pipe 30, the mounting pipe 19 and the threaded connection enhances the convenience and stability of the connection between the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20, the air outlet pipe 31, the suction pipe 34, the blowing pipe 33 and the dust inlet 22, the air outlet 28, the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20, and the air outlet pipe 31.

[0022] like Figure 4 As shown, to enhance the convenience and stability of connecting the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20, the air outlet pipe 31, the dust suction pipe 34, the blower pipe 33 to the dust inlet 22 and the air outlet 28, and the connection of the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20, and the air outlet pipe 31, when using the automatic interconnect chip and diode loading equipment, firstly connect the first conveying pipe 21 and the second conveying pipe 29 to the dust inlet 22 and the air outlet 28 through the mounting ring, so that the first conveying pipe 21 and the second conveying pipe 29 are installed on the left and right sides of the heat dissipation and dust removal device 35. Then, the dust inlet pipe 20 and the air outlet pipe 31 are connected to the first conveying pipe 21 and the second conveying pipe 29 through the connecting pipe 30. The connection allows the dust inlet pipe 20 and the air outlet pipe 31 to be installed at the upper ends of the first conveying pipe 21 and the second conveying pipe 29. Then, the suction pipe 34 and the blower pipe 33 are connected to the dust inlet pipe 20 and the air outlet pipe 31 through the mounting pipe 19, so that the suction pipe 34 and the blower pipe 33 are installed at the upper ends of the dust inlet pipe 20 and the air outlet pipe 31. Through the combined use of the mounting ring, the connecting pipe 30, the mounting pipe 19 and the threaded connection, the convenience and stability of the connection between the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20, the air outlet pipe 31, the suction pipe 34, the blower pipe 33 and the dust inlet 22 and the air outlet 28, as well as the connection between the first conveying pipe 21, the second conveying pipe 29, the dust inlet pipe 20 and the air outlet pipe 31 are enhanced.

[0023] A fixing post 26 is connected to the lower end of the heat dissipation and dust removal device 35 and located inside the base 2. A mounting plate is connected to the lower end of the fixing post 26. The mounting plate is fixedly connected to the base 2 by a fastening nut. The use of the fixing post 26, the mounting plate and the threaded connection enhances the ease of installation and disassembly of the heat dissipation and dust removal device 35.

[0024] like Figure 4 As shown, in order to enhance the ease of installation and disassembly of the heat dissipation and dust removal device 35, when using the interconnect chip and diode automatic loading equipment, the fixing post 26 is first connected to the mounting plate, and then the fixing post 26 is installed at the lower end of the heat dissipation and dust removal device 35. Next, the mounting plate is placed inside the base 2 and fixedly connected by fastening nuts, so that the heat dissipation and dust removal device 35 is installed inside the base 2. Through the combined use of the fixing post 26, the mounting plate and the threaded connection, the ease of installation and disassembly of the heat dissipation and dust removal device 35 is enhanced.

[0025] A placement seat 17 is connected to the upper end of the base 2 and the lower end of the processing plate 13. A protective frame 3 is installed on the upper end of the processing plate 13 and outside the upper and lower material bin assembly 9, defective product tray assembly 10, flexible vibration assembly 11, feeding hopper assembly 12, material picking and moving assembly 14, and camera detection assembly 15. A warning light 4 is installed at the upper end of the protective frame 3. The front of the protective frame 3 is provided with an LCD screen 5, control buttons 6, and a feed port 7 from top to bottom. Support columns 1 are welded at the four corners of the lower end of the base 2. Support pads 8 are installed on the lower outer side of the support columns 1. The support pads 8 are made of rubber. A moving wheel 16 is installed on the lower end of the base 2 and inside the support columns 1. The support columns 1 and support pads 8 enhance the stability of the automatic interconnect chip and diode placement equipment, while the moving wheel 16 enhances the ease of movement of the automatic interconnect chip and diode placement equipment.

[0026] like Figure 1 , Figure 2 and Figure 3As shown, to enhance the stability and ease of movement of the automatic interconnect and diode placement equipment, when using it, first weld the support column 1 to the four corners of the lower end of the base 2. Then, fit the support pad 8 onto the outside of the lower end of the support column 1. Next, install the moving wheel 16 on the lower end of the base 2, located inside the support column 1. When it is necessary to move the automatic interconnect and diode placement equipment, remove the support pad 6 from the lower end of the support column 1, so that the moving wheel 16 contacts the ground. Then, it can be moved... The moving wheel 16 moves the interconnect chip and diode automatic placement device. After the automatic placement device moves to the corresponding position, the support pad 6 is sleeved on the lower end of the support column 1, and then the support pad 1 contacts the ground, so that the automatic placement device is placed on the ground by the support column 1. The setting of the support column 1 and the support pad 8 enhances the stability of the placement of the automatic placement device, while the setting of the moving wheel 16 enhances the convenience of moving the automatic placement device.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automatic stacking device for interconnect chips and diodes, characterized in that: include The base (2) and the processing plate (13) disposed at the upper end of the base (2); A material picking moving assembly (14) is installed at the upper front side of the processing plate (13). A camera detection assembly (15) is installed at the rear side of the material picking moving assembly (14). A material feeding hopper assembly (12) is installed below the material picking moving assembly (14) and inside the camera detection assembly (15). A flexible vibration assembly (11) is installed at the rear side of the material feeding hopper assembly (12). A defective product tray assembly (10) is installed at the rear side of the flexible vibration assembly (11). An upper and lower hopper assembly (9) is installed at the rear side of the defective product tray assembly (10). A heat dissipation and dust removal device (35) is installed inside the base (2). The heat dissipation and dust removal device (35) is arranged from left to right as follows: a protective net (23), a motor body (24), an output shaft (25), and a blade (27). An insertion hole (32) is provided inside the upper end of the base (2). A through hole (18) is provided inside the processing plate (13) at the position corresponding to the insertion hole (32). The heat dissipation and dust removal device (35) is provided with a dust inlet (22) on the left side. A first conveying pipe (21) is installed on the outside of the dust inlet (22). A dust inlet pipe (20) is installed at the upper end of the first conveying pipe (21). A suction pipe (34) is installed at the upper end of the dust inlet pipe (20) and inside the insertion hole (32) and through hole (18). An air outlet (28) is provided on the right side of the heat dissipation and dust removal device (35). A second conveying pipe (29) is installed on the outside of the air outlet (28). An air outlet pipe (31) is installed at the upper end of the second conveying pipe (29). A blower pipe (33) is installed at the upper end of the air outlet pipe (31) and inside the insertion hole (32) and through hole (18). The flexible vibration component (11), the material handling and moving component (14), the camera detection component (15), the loading and unloading hopper component (9), and the motor body (24) are electrically connected to an external power source; The dust removal and heat dissipation performance of the automatic interconnect chip and diode loading equipment is enhanced by the combined use of the suction pipe (34), dust inlet pipe (20), first conveying pipe (21), dust inlet (22), heat dissipation and dust removal device (35), motor body (24), output shaft (25), blade (27), air outlet (28), second conveying pipe (29), air outlet pipe (31) and blowing pipe (33).

2. The automatic interconnect chip and diode placement equipment according to claim 1, characterized in that: An installation ring is connected to the inner side of the first conveying pipe (21) and the second conveying pipe (29) and to the outer position of the dust inlet (22) and the air outlet (28). A connecting pipe (30) is connected to the inner side of the first conveying pipe (21) and the second conveying pipe (29) and to the lower end of the dust inlet pipe (20) and the air outlet pipe (31). An installation pipe (19) is connected to the upper end of the dust inlet pipe (20) and the air outlet pipe (31) and to the outer position of the suction pipe (34) and the blower pipe (33).

3. The automatic interconnect chip and diode placement equipment according to claim 2, characterized in that: The first conveying pipe (21) and the second conveying pipe (29) are threadedly connected to the dust inlet (22) and the air outlet (28) through the mounting ring. The dust inlet pipe (20) and the air outlet pipe (31) are threadedly connected to the first conveying pipe (21) and the second conveying pipe (29) through the connecting pipe (30). The dust suction pipe (34) and the air blowing pipe (33) are threadedly connected to the dust inlet pipe (20) and the air outlet pipe (31) through the mounting pipe (19). Through the combined use of the mounting ring, the connecting pipe (30), the mounting pipe (19) and the threaded connection, the convenience and stability of connecting the first conveying pipe (21), the second conveying pipe (29), the dust inlet pipe (20), the air outlet pipe (31), the dust suction pipe (34), the air blowing pipe (33) to the dust inlet (22) and the air outlet (28), and connecting the first conveying pipe (21) and the air outlet pipe (31) are enhanced.

4. The automatic interconnect chip and diode placement equipment according to claim 1, characterized in that: A fixing column (26) is connected to the lower end of the heat dissipation and dust removal device (35) and located inside the base (2). A mounting plate is connected to the lower end of the fixing column (26). The mounting plate is fixedly connected to the base (2) by a fastening nut. The use of the fixing column (26), the mounting plate and the threaded connection enhances the ease of installation and disassembly of the heat dissipation and dust removal device (35).

5. The automatic interconnect chip and diode placement equipment according to claim 4, characterized in that: A placement seat (17) is connected to the upper end of the base (2) and the lower end of the processing plate (13). A protective frame (3) is installed on the upper end of the processing plate (13) and the outer side of the upper and lower hopper assembly (9), the defective product tray assembly (10), the flexible vibration assembly (11), the feeding hopper assembly (12), the material picking and moving assembly (14), and the camera detection assembly (15).

6. The automatic interconnect chip and diode placement equipment according to claim 5, characterized in that: A warning light (4) is installed at the upper end of the protective frame (3), and an LCD screen (5), a control button (6) and a feed inlet (7) are arranged sequentially from top to bottom on the front of the protective frame (3).

7. The automatic interconnect chip and diode placement equipment according to claim 5, characterized in that: Support columns (1) are welded at the four corners of the lower end of the base (2), and support pads (8) are installed at the lower outer position of the support columns (1). The support pads (8) are made of rubber material.

8. The automatic interconnect chip and diode placement equipment according to claim 7, characterized in that: A movable wheel (16) is installed at the lower end of the base (2) and inside the support column (1). The support column (1) and the support pad (8) enhance the stability of the interconnect chip and diode automatic placement equipment, while the movable wheel (16) enhances the ease of movement of the interconnect chip and diode automatic placement equipment.

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