Silicon wafer transport and positioning apparatus

Abstract

The application relates to the technical field of crystalline silicon cell processing, and particularly discloses a silicon wafer conveying and positioning device, which comprises a mounting frame and a wafer hooking device; the wafer hooking device comprises a lifting platform arranged on the mounting frame and capable of lifting in a vertical direction and a transfer platform horizontally arranged on the lifting platform; a linear driving mechanism for driving the transfer platform to move linearly in a horizontal plane is arranged on the lifting platform; at least two wafer hooking assemblies are arranged on the transfer platform; the wafer hooking assemblies are distributed on both sides of the silicon wafer along the linear motion direction; the transfer platform is driven to hook the silicon wafer at the silicon wafer storage device through the wafer hooking assemblies and then convey the silicon wafer to the silicon wafer grabbing mechanism. The wafer conveying and positioning device provided by the application does not damage the silicon wafer during the wafer transfer process, guarantees the quality of the silicon wafer and can improve the yield of the silicon wafer preparation process.

Description

Technical Field

[0001] This application relates to the field of crystalline silicon cell processing technology, and more specifically, to a silicon wafer conveying and positioning device. Background Technology

[0002] Crystalline silicon solar cells are widely used due to their simple manufacturing process and high solar energy conversion efficiency. In the production of crystalline silicon cells, a wafer transport and positioning device is needed to transfer silicon wafers back and forth between the wafer storage device and the wafer gripping mechanism. Current technologies typically use vacuum belt conveyors to hold and fix the wafers. During transport, friction usually occurs between the belt and the wafer, which can easily damage the wafer, leaving belt marks and reducing the yield of subsequent production processes. For example, in CVD deposition, poor substrate deposition can occur, leading to downgraded or scrapped wafers. Utility Model Content

[0003] The purpose of this application is to provide a wafer conveying and positioning device that does not damage the silicon wafer during the transfer process, ensures the quality of the silicon wafer, and improves the yield of the silicon wafer manufacturing process.

[0004] The embodiments of this application are implemented as follows: This application provides a silicon wafer conveying and positioning device for connecting a silicon wafer storage device and a silicon wafer gripping mechanism. The silicon wafer conveying and positioning device includes a mounting frame and a wafer hooking device. The wafer hooking device includes a lifting platform mounted on the mounting frame and moving vertically, and a transfer platform horizontally mounted on the lifting platform. The lifting platform is provided with a linear drive mechanism that drives the transfer platform to move linearly in a horizontal plane. The transfer platform is provided with at least two wafer hooking assemblies. The wafer hooking assemblies are distributed on both sides of the silicon wafer along the linear movement direction. The transfer platform is driven to hook the silicon wafer at the silicon wafer storage device through the wafer hooking assemblies and convey it to the silicon wafer gripping mechanism.

[0005] As an optional implementation, the mounting frame is provided with at least one horizontal silicon wafer positioning platform; the silicon wafer positioning platform includes a positioning baffle disposed on one side of the transfer platform along the linear movement direction and a push plate assembly disposed on the other side of the transfer platform along the linear movement direction; the push plate assembly pushes the silicon wafer in the horizontal direction to abut against the positioning baffle.

[0006] As an optional implementation, the lifting platform includes a horizontally arranged lifting plate and a plurality of sliding shafts that slide through the mounting frame; one end of the sliding shaft is connected to the lifting plate and the other end is provided with a connecting rod assembly, and an eccentric drive assembly is provided on the mounting frame; the eccentric drive assembly drives the sliding shaft to slide up and down through the connecting rod assembly.

[0007] As an optional implementation, the eccentric drive assembly includes a horizontally arranged eccentric rotating shaft, and a first rotating wheel and a second rotating wheel sleeved on the eccentric rotating shaft; the first rotating wheel is rotatably connected to the mounting bracket, and the second rotating wheel is rotatably connected to the connecting rod assembly; the central axes of the first rotating wheel and the second rotating wheel coincide, and the axis of the eccentric rotating shaft deviates from the central axis of the first rotating wheel; the eccentric rotating shaft is driven to drive the sliding shaft to move up and down through the connecting rod assembly.

[0008] As an optional implementation, the linear drive mechanism includes a sliding rail disposed on the lifting platform and located below the transfer platform, and a drive component; a slider connected to the transfer platform is disposed on the sliding rail; the drive component drives the transfer platform to slide linearly on the sliding rail through the slider.

[0009] As an optional implementation, the driving assembly includes a first pulley and a second pulley spaced apart along the extension direction of the sliding track, and a belt connecting the first pulley and the second pulley; the belt is provided with a movable connector connected to the slider, and the belt drives the movable connector to move along the extension direction of the sliding track.

[0010] As an optional implementation, the lifting platform is provided with a drive motor connected to the first pulley or the second pulley.

[0011] As an optional implementation, the wafer hook assembly is a baffle vertically arranged on the transfer platform, with two baffles arranged in parallel and distributed on both sides of the silicon wafer along the linear motion direction.

[0012] As an optional implementation, there are four hook assemblies, which are spaced apart along the linear movement direction; there are two silicon wafer positioning platforms, and each silicon wafer positioning platform has hook assemblies on both sides that contact the side of the silicon wafer.

[0013] As an optional implementation, the pusher assembly includes a telescopic cylinder and a pusher plate disposed at the telescopic end of the telescopic cylinder; the telescopic cylinder drives the pusher plate to move in the horizontal direction, and the direction of movement is perpendicular to the linear movement direction.

[0014] The beneficial effects of the embodiments of this application include: The silicon wafer conveying and positioning device provided in this application includes a mounting frame and a wafer hooking device. The wafer hooking device includes a lifting platform mounted on the mounting frame and raised / lowered vertically, and a transfer platform horizontally mounted on the lifting platform. A linear drive mechanism is provided on the lifting platform to drive the transfer platform in a linear motion in the horizontal plane. At least two wafer hooking assemblies are provided on the transfer platform. The wafer hooking assemblies are distributed on both sides of the silicon wafer along the linear motion direction. The transfer platform, driven by the wafer hooking assemblies, hooks the silicon wafer at the silicon wafer storage device and conveys it to the silicon wafer gripping mechanism. Alternatively, the silicon wafer placed on the transfer platform by the silicon wafer gripping mechanism can be returned to the silicon wafer storage device. The transfer platform provided in this application can hook and transfer silicon wafers through lifting and linear motion. Compared with the prior art, this avoids wear on the silicon wafer surface, prevents marks on the silicon wafer surface, ensures silicon wafer quality, and improves the yield of the silicon wafer manufacturing process. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is one of the structural schematic diagrams of the silicon wafer conveying and positioning device according to an embodiment of this application; Figure 2 This is a second schematic diagram of the silicon wafer conveying and positioning device according to an embodiment of this application; Figure 3 This is the third schematic diagram of the silicon wafer conveying and positioning device according to an embodiment of this application; Figure 4 This is the fourth schematic diagram of the silicon wafer conveying and positioning device in the embodiments of this application.

[0017] Icons: 100-Mounting bracket; 101-Wafer hooking device; 102-Lifting platform; 103-Transfer platform; 104-Linear drive mechanism; 105-Wafer hooking assembly; 106-Wafer positioning platform; 107-Positioning baffle; 108-Push plate assembly; 109-Sliding shaft; 110-Linkage assembly; 111-Eccentric drive assembly; 112-Eccentric rotation shaft; 113-First rotating wheel; 114-Second rotating wheel; 115-Sliding rail; 116-Slider; 117-First pulley; 118-Second pulley; 119-Belt; 120-Moving connector; 121-Telescopic cylinder. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] In the production of crystalline silicon solar cells, a silicon wafer conveying and positioning device is needed to transfer silicon wafers back and forth between the silicon wafer storage device and the silicon wafer gripping mechanism. Existing technology usually uses a vacuum belt track to adsorb and fix the silicon wafers. During the transfer, friction usually occurs between the belt and the silicon wafer, which can easily damage the silicon wafers, leaving belt marks on the wafers and reducing the yield of subsequent production processes.

[0023] To address the aforementioned technical problems, this application provides a silicon wafer conveying and positioning device.

[0024] Reference Figure 1 and Figure 2As shown in the embodiment of this application, a silicon wafer conveying and positioning device is provided for connecting a silicon wafer storage device and a silicon wafer gripping mechanism. The silicon wafer conveying and positioning device includes a mounting frame 100 and a wafer hooking device 101. The wafer hooking device 101 includes a lifting platform 102 mounted on the mounting frame 100 and raised and lowered vertically, and a transfer platform 103 horizontally mounted on the lifting platform 102. A linear drive mechanism 104 is provided on the lifting platform 102 to drive the transfer platform 103 to move linearly in the horizontal plane. At least two wafer hooking assemblies 105 are provided on the transfer platform 103. The wafer hooking assemblies 105 are distributed on both sides of the silicon wafer along the linear movement direction. The transfer platform 103 is driven to hook the silicon wafer at the silicon wafer storage device through the wafer hooking assemblies 105 and convey it to the silicon wafer gripping mechanism.

[0025] It should be noted that the lifting platform 102 can drive the transfer platform 103 to move up and down, while the linear drive mechanism 104 can drive the transfer platform 103 to move linearly. During wafer retrieval, the lifting platform 102 drives the transfer platform 103 to descend a certain distance, and the linear drive mechanism 104 positions the transfer platform 103 below the silicon wafer storage device. Then, the lifting platform 102 drives the transfer platform 103 to rise, causing the wafer hooking assembly 105 to contact both sides of the silicon wafer on the silicon wafer storage device, achieving wafer clamping. The linear drive mechanism 104 then drives the transfer platform 103, loaded with silicon wafers, back below the silicon wafer gripping mechanism, facilitating wafer gripping. It should be noted that the distance the lifting platform 102 descends can be the thickness of a silicon wafer, or slightly greater than the thickness of the silicon wafer. For example, the vertical movement distance of the lifting platform 102 is 3 millimeters.

[0026] The silicon wafer conveying and positioning device provided in this application includes a mounting frame 100 and a wafer hooking device 101. The wafer hooking device 101 in this application includes a lifting platform 102 mounted on the mounting frame 100 and raised and lowered vertically, and a transfer platform 103 horizontally mounted on the lifting platform 102. In this application, a linear drive mechanism 104 is provided on the lifting platform 102 to drive the transfer platform 103 to move linearly in the horizontal plane. At least two wafer hooking assemblies 105 are provided on the transfer platform 103. The wafer hooking assemblies 105 are distributed on both sides of the silicon wafer along the linear movement direction. In this application, the transfer platform 103 is driven to hook the silicon wafer at the silicon wafer storage device through the wafer hooking assemblies 105 and convey it to the silicon wafer gripping mechanism. Alternatively, the silicon wafer placed on the transfer platform 103 by the silicon wafer gripping mechanism can be sent back to the silicon wafer storage device. The transfer platform 103 provided in this application embodiment can pick up and transfer silicon wafers through lifting and linear motion. Compared with the prior art, it can avoid wear on the surface of the silicon wafer and prevent marks from appearing on the surface of the silicon wafer, thus ensuring the quality of the silicon wafer and improving the yield of the silicon wafer manufacturing process.

[0027] Reference Figure 2As shown, as an optional implementation, the mounting frame 100 is provided with at least one horizontal silicon wafer positioning platform 106; the silicon wafer positioning platform 106 includes a positioning baffle 107 disposed on one side of the transfer platform 103 along the linear movement direction and a push plate assembly 108 disposed on the other side of the transfer platform 103 along the linear movement direction; the push plate assembly 108 pushes the silicon wafer in the horizontal direction to abut against the positioning baffle 107.

[0028] It should be noted that the silicon wafer positioning platform 106 disclosed in this application embodiment is arranged parallel to the transfer platform 103. When the transfer platform 103 is at its highest position, it is flush with the silicon wafer positioning platform 106. In this application embodiment, a positioning baffle 107 and a pusher assembly 108 are respectively provided on both sides of the transfer platform 103. When the transfer platform 103 is flush with the silicon wafer positioning platform 106, the pusher assembly 108 on one side can push the silicon wafer to abut against the positioning baffle 107, thereby achieving silicon wafer positioning and facilitating precise gripping by the silicon wafer gripping mechanism.

[0029] Reference Figure 2 As shown, the push plate assembly 108 of this application embodiment includes a telescopic cylinder 121 and a push plate disposed at the telescopic end of the telescopic cylinder 121; the telescopic cylinder 121 drives the push plate to move in the horizontal direction, and the direction of movement is perpendicular to the direction of linear movement.

[0030] Reference Figure 3 As shown, in one optional implementation, the lifting platform 102 includes a horizontally arranged lifting plate and a plurality of sliding shafts 109 that slide through the mounting frame 100; one end of the sliding shaft 109 is connected to the lifting plate and the other end is provided with a connecting rod assembly 110, and an eccentric drive assembly 111 is provided on the mounting frame 100; the eccentric drive assembly 111 drives the sliding shaft 109 to slide up and down through the connecting rod assembly 110.

[0031] Furthermore, this application discloses a specific configuration of a lifting platform 102. The eccentric drive assembly 111 drives the connecting rod assembly 110 and the sliding shaft 109 to slide up and down, thereby enabling the lifting plate to move up and down. The eccentric drive assembly 111 can drive the lifting plate to achieve short-distance up and down movement.

[0032] Reference Figure 3As shown, the eccentric drive assembly 111 further includes a horizontally arranged eccentric rotating shaft 112, and a first rotating wheel 113 and a second rotating wheel 114 sleeved on the eccentric rotating shaft 112; the first rotating wheel 113 is rotatably connected to the mounting bracket 100, and the second rotating wheel 114 is rotatably connected to the connecting rod assembly 110; the central axes of the first rotating wheel 113 and the second rotating wheel 114 coincide, and the axis of the eccentric rotating shaft 112 deviates from the central axis of the first rotating wheel 113; the eccentric rotating shaft 112 is driven to drive the sliding shaft 109 to move up and down through the connecting rod assembly 110.

[0033] It should be noted that the axis of the eccentric rotating shaft 112 is parallel to and spaced apart from the central axis of the first rotating wheel 113, and the distance between them is the distance that the lifting plate can move up and down. Those skilled in the art can set the vertical distance that the eccentric drive assembly 111 can drive as needed. It should also be noted that a drive motor connected to the first rotating wheel 113 can be installed on the mounting bracket 100, and the first rotating wheel 113 is driven to rotate by the drive motor.

[0034] Reference Figure 3 and Figure 4 As shown, as an optional implementation, the linear drive mechanism 104 includes a sliding rail 115 disposed on the lifting platform 102 and located below the transfer platform 103, and a drive assembly; a slider 116 connected to the transfer platform 103 is disposed on the sliding rail 115; the drive assembly drives the transfer platform 103 to slide linearly on the sliding rail 115 through the slider 116.

[0035] Reference Figure 4 As shown, the drive assembly includes a first pulley 117 and a second pulley 118 spaced apart along the extension direction of the sliding track 115, and a belt 119 connecting the first pulley 117 and the second pulley 118; the belt 119 is provided with a movable connector 120 connected to the slider 116, and the belt 119 drives the movable connector 120 to move along the extension direction of the sliding track 115.

[0036] This application discloses a specific configuration of a linear drive mechanism 104. In this embodiment, a movable connector 120 connected to a slider 116 is provided on the belt 119, allowing the belt 119 to drive the transfer platform 103 to move on the sliding track 115 via the slider 116. The sliding track 115 ensures the stability of the linear motion of the transfer platform 103, while the drive component provides power, enabling the transfer platform 103 to perform stable linear motion.

[0037] As an optional implementation, the lifting platform 102 is equipped with a drive motor connected to either the first pulley 117 or the second pulley 118. Furthermore, the drive motor can be mounted on either the first pulley 117 or the second pulley 118, and those skilled in the art can choose the appropriate configuration as needed.

[0038] As an optional implementation, the wafer hook assembly 105 is a baffle vertically disposed on the transfer platform 103, with two baffles disposed on both sides of the silicon wafer along the linear direction of movement. This application discloses a set of baffles disposed on both sides of the silicon wafer, which can hold the silicon wafer in place, facilitating its hooking and thus enabling rapid transfer of the silicon wafer.

[0039] More preferably, there are four wafer hook assemblies 105, spaced apart along the linear direction of movement; there are two silicon wafer positioning platforms 106, each with a wafer hook assembly 105 on both sides that contacts the side of the silicon wafer. Unlike the above embodiments, this application has four wafer hook assemblies 105, which enables the transfer platform 103 to transfer two silicon wafers at a time. The number of silicon wafers transferred in this embodiment can be set by those skilled in the art as needed, and no special limitation is made here.

[0040] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A silicon wafer conveying and positioning device, used to connect a silicon wafer storage device and a silicon wafer gripping mechanism; characterized in that, The silicon wafer conveying and positioning device includes a mounting frame and a wafer hooking device; the wafer hooking device includes a lifting platform mounted on the mounting frame and raised and lowered vertically, and a transfer platform horizontally mounted on the lifting platform; the lifting platform is provided with a linear drive mechanism that drives the transfer platform to move linearly in a horizontal plane; the transfer platform is provided with at least two wafer hooking assemblies; the wafer hooking assemblies are distributed on both sides of the silicon wafer along the linear movement direction; the transfer platform is driven to hook the silicon wafer at the silicon wafer storage device through the wafer hooking assemblies and convey it to the silicon wafer gripping mechanism.

2. The silicon wafer conveying and positioning device according to claim 1, characterized in that, The mounting frame is provided with at least one horizontal silicon wafer positioning platform; the silicon wafer positioning platform includes a positioning baffle disposed on one side of the transfer platform along the linear movement direction and a push plate assembly disposed on the other side of the transfer platform along the linear movement direction; the push plate assembly pushes the silicon wafer in the horizontal direction to abut against the positioning baffle.

3. The silicon wafer conveying and positioning device according to claim 1, characterized in that, The lifting platform includes a horizontally arranged lifting plate and multiple sliding shafts that slide through the mounting frame; one end of each sliding shaft is connected to the lifting plate and the other end is provided with a connecting rod assembly; an eccentric drive assembly is provided on the mounting frame; the eccentric drive assembly drives the sliding shaft to slide up and down through the connecting rod assembly.

4. The silicon wafer conveying and positioning device according to claim 3, characterized in that, The eccentric drive assembly includes a horizontally arranged eccentric rotating shaft, and a first rotating wheel and a second rotating wheel sleeved on the eccentric rotating shaft; the first rotating wheel is rotatably connected to the mounting bracket, and the second rotating wheel is rotatably connected to the connecting rod assembly; the central axes of the first rotating wheel and the second rotating wheel coincide, and the axis of the eccentric rotating shaft deviates from the central axis of the first rotating wheel; the eccentric rotating shaft is driven to drive the sliding shaft to move up and down through the connecting rod assembly.

5. The silicon wafer conveying and positioning device according to any one of claims 1-4, characterized in that, The linear drive mechanism includes a sliding rail disposed on the lifting platform and located below the transfer platform, and a drive component; a slider connected to the transfer platform is disposed on the sliding rail; the drive component drives the transfer platform to slide linearly on the sliding rail through the slider.

6. The silicon wafer conveying and positioning device according to claim 5, characterized in that, The driving assembly includes a first pulley and a second pulley spaced apart along the extension direction of the sliding track, and a belt connecting the first pulley and the second pulley; the belt is provided with a movable connector connected to the slider, and the belt drives the movable connector to move along the extension direction of the sliding track.

7. The silicon wafer conveying and positioning device according to claim 6, characterized in that, The lifting platform is equipped with a drive motor connected to the first pulley or the second pulley.

8. The silicon wafer conveying and positioning device according to any one of claims 1-4 and 6-7, characterized in that, The hook assembly is a baffle vertically arranged on the transfer platform, and the two baffles are arranged in parallel and distributed on both sides of the silicon wafer along the linear motion direction.

9. The silicon wafer conveying and positioning device according to claim 2, characterized in that, There are four hook assemblies, which are spaced apart along the linear movement direction; there are two silicon wafer positioning platforms, and each silicon wafer positioning platform has hook assemblies on both sides that contact the side of the silicon wafer.

10. The silicon wafer conveying and positioning device according to claim 2 or 9, characterized in that, The push plate assembly includes a telescopic cylinder and a push plate disposed at the telescopic end of the telescopic cylinder; the telescopic cylinder drives the push plate to move in the horizontal direction, and the direction of movement is perpendicular to the linear movement direction.

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