Wafer rotation switching mechanism

Abstract

This utility model discloses a wafer rotation switching mechanism, including a wafer rotary table, an X-axis module, and a Y-axis module. The X-axis module is disposed at the drive end of the Y-axis module. The wafer rotary table includes a mounting plate, a turntable, and a rotation drive assembly. The mounting plate is disposed at the drive end of the X-axis module, and the rotation drive assembly is mounted on the mounting plate and used to drive the turntable to rotate. Multiple wafer mounting structures are arranged in a ring on the turntable. This wafer rotation switching mechanism can perform rotary multi-wafer loading, improving wafer loading efficiency and thus wafer placement efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and specifically to a wafer rotation switching mechanism. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Wafer mounting technology is widely used in semiconductor manufacturing, especially in integrated circuit chip packaging. Its purpose is to protect, fix, or enhance the mechanical strength of the wafer during the wafer manufacturing process through mounting or bonding.

[0003] Existing wafer mounting equipment often only allows for the mounting of one type of wafer, requiring frequent loading and unloading. This excessive time spent on wafer loading and unloading significantly impacts wafer mounting efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a wafer rotation switching mechanism that can perform rotary multi-wafer loading, improve wafer loading efficiency, and thus improve wafer placement efficiency.

[0005] The technical solution adopted by this utility model to solve its technical problem is: A wafer rotation switching mechanism includes a wafer rotary table, an X-axis module, and a Y-axis module. The X-axis module is disposed at the drive end of the Y-axis module. The wafer rotary table includes a mounting plate, a turntable, and a rotation drive assembly. The mounting plate is disposed at the drive end of the X-axis module. The rotation drive assembly is mounted on the mounting plate and is used to drive the turntable to rotate. Multiple wafer mounting structures are arranged in a ring on the turntable.

[0006] As a further improvement to the above technical solution, the rotary drive assembly includes a slewing bearing, a rotary motor, and a transmission mechanism. The turntable is rotatably connected to the mounting plate via the slewing bearing, the rotary motor is mounted on the mounting plate, and the transmission mechanism is connected between the main shaft of the rotary motor and the slewing bearing.

[0007] As a further improvement to the above technical solution, the transmission mechanism includes a drive wheel, a driven wheel, and a transmission belt. The transmission belt is connected between the drive wheel and the driven wheel. The drive wheel is connected to the main shaft of the rotary motor. The driven wheel is fixedly connected to and coaxial with the inner ring of the slewing bearing. The outer ring of the slewing bearing is fixedly connected to the mounting plate. The turntable is fixedly connected to the driven wheel.

[0008] As a further improvement to the above technical solution, the mounting plate is provided with a through hole located directly below the inner ring of the slewing bearing. The inner ring of the slewing bearing is connected to a connecting pipe, which is located inside the through hole and has a sensing plate at its bottom. The bottom of the mounting plate is provided with a slotted photoelectric sensor. When the connecting pipe rotates with the inner ring of the slewing bearing, the sensing plate passes through the sensing area of ​​the slotted photoelectric sensor.

[0009] As a further improvement to the above technical solution, the mounting plate is provided with a tension wheel and a tension wheel adjustment assembly. The tension wheel adjustment assembly is used to adjust the position of the tension wheel, and the tension wheel abuts against the transmission belt.

[0010] As a further improvement to the above technical solution, the X-axis module includes an X-axis motor, an X-axis lead screw, an X-axis linear guide, and an X-axis base plate. The bottom of the mounting plate is slidably connected to the X-axis base plate along the X-axis direction via the X-axis linear guide. The X-axis motor and the X-axis lead screw are mounted on the X-axis base plate. The nut of the X-axis lead screw is fixedly connected to the mounting plate. The main shaft of the X-axis motor is coaxially connected to the lead screw of the X-axis lead screw.

[0011] As a further improvement to the above technical solution, the X-axis base plate is provided with a clearance hole, and the trajectory of the rotary motor moving with the mounting plate is located within the clearance hole.

[0012] As a further improvement to the above technical solution, the Y-axis module includes a Y-axis base, a Y-axis linear guide, a Y-axis motor, and a Y-axis lead screw. Two Y-axis bases are provided. The two ends of the X-axis base plate are slidably connected to the two Y-axis bases through a Y-axis linear guide. The Y-axis motor and the Y-axis lead screw are installed on one of the Y-axis bases. The nut of the Y-axis lead screw is fixedly connected to the X-axis base plate. The spindle of the Y-axis motor is coaxially connected to the lead screw of the Y-axis lead screw.

[0013] As a further improvement to the above technical solution, the wafer mounting structure includes a first mounting hole disposed on the turntable, a stepped first mounting groove disposed on the edge of the first mounting hole, a first spring piece disposed on the side of the first mounting groove near the center of the turntable, and a limit post detachably connected to the side of the first mounting groove away from the center of the turntable.

[0014] As a further improvement to the above technical solution, a mounting block is connected in the first mounting groove, a second mounting hole is provided on the mounting block above the first mounting hole, a stepped second mounting groove is provided on the edge of the second mounting hole, a second spring is provided on the mounting block, and the elastic end of the second spring is located above the second mounting groove.

[0015] The beneficial effects of this utility model are: the rotary drive assembly drives the turntable to rotate multiple wafer mounting structures sequentially to the loading position or the working position. At the loading position, the wafers are mounted onto the wafer mounting structures. Then, the rotary drive assembly rotates the wafers to the working position, realizing rapid switching of multiple wafers and improving wafer loading efficiency. The wafer X-axis module and the wafer Y-axis module are used to drive the wafers to adjust their positions in the X-axis and Y-axis directions. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is an assembly diagram of a wafer rotation switching mechanism of this utility model in one direction; Figure 2 This is an assembly diagram of a wafer rotation switching mechanism of this utility model in another direction; Figure 3 This is a front view of a wafer rotation switching mechanism according to this utility model; Figure 4 This is a structural exploded view of the wafer rotary table in a wafer rotation switching mechanism according to this utility model; Figure 5 This is a schematic diagram of the structure of the wafer rotary table in a wafer rotation switching mechanism according to this utility model; Figure 6 This is a schematic diagram of the structure of the turntable in a wafer rotation switching mechanism according to this utility model; Figure 7 This is a schematic diagram of the structure of the first mounting block in a wafer rotation switching mechanism of this utility model; Figure 8 This is a schematic diagram of the structure of the second mounting block in a wafer rotation switching mechanism of this utility model.

[0018] Reference numerals: 100, wafer rotary stage; 110, turntable; 111, connecting part; 112, wafer mounting structure; 113, first mounting slot; 114, first mounting hole; 115, first spring; 116, limiting post; 117, wafer; 118, second square wafer; 119, second mounting block; 1120, first square wafer; 1121, first mounting block; 1122, second mounting slot; 1123, second spring; 1191, third mounting slot; 1192, third spring; 120, rotation drive assembly; 121 122. Rotary motor; 123. Drive wheel; 124. Driven wheel; 125. Transmission belt; 126. Slewing bearing; 127. Connecting pipe; 128. Induction plate; 129. Tensioning wheel; 120. Tensioning wheel adjusting block; 121. Slotted photoelectric sensor; 130. Mounting plate; 200. X-axis module; 210. X-axis base plate; 220. X-axis linear guide; 230. X-axis motor; 240. X-axis lead screw; 300. Y-axis module; 310. Y-axis base; 320. Y-axis linear guide; 330. Y-axis motor; 340. Y-axis lead screw. Detailed Implementation

[0019] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.

[0020] Reference Figure 1 , Figure 2This utility model provides a wafer rotation switching mechanism, including a wafer rotary table 100, an X-axis module 200, and a Y-axis module 300. The X-axis module 200 is disposed at the drive end of the Y-axis module 300. The wafer rotary table 100 includes a mounting plate 130, a turntable 110, and a rotation drive assembly 120. The mounting plate 130 is disposed at the drive end of the X-axis module 200. The rotation drive assembly 120 is mounted on the mounting plate 130 and is used to drive the turntable 110 to rotate. The turntable 110 is mounted on the rotation drive assembly 120. A plurality of wafer mounting structures 112 are arranged in a ring on the turntable 110. Each wafer mounting structure 112 can mount different types of wafers as needed. In this way, the rotary drive assembly 120 can drive the turntable 110 to rotate, and the multiple wafer mounting structures 112 can be rotated sequentially to the loading position or the working position. At the loading position, the wafers 117 are mounted on the wafer mounting structures 112. Then, the rotary drive assembly 120 rotates the wafers 117 to the working position, realizing the rapid switching of multiple wafers 117, improving the loading efficiency of wafers 117, and thus improving the placement efficiency of wafers 117. The X-axis module 200 and the Y-axis module 300 adjust the position of the wafer rotary table 100.

[0021] In this embodiment, refer to Figure 3 The X-axis module 200 includes an X-axis motor 230, an X-axis lead screw 240, an X-axis linear guide 220, and an X-axis base plate 210. The bottom of the mounting plate 130 is slidably connected to the X-axis base plate 210 along the X-axis direction via the X-axis linear guide 220. The X-axis motor 230 and the X-axis lead screw 240 are mounted on the X-axis base plate 210. The nut of the X-axis lead screw 240 is fixedly connected to the mounting plate 130. The spindle of the X-axis motor 230 is coaxially connected to the lead screw of the X-axis lead screw 240. Starting the X-axis motor 230 drives the lead screw of the X-axis lead screw 240 to rotate, which in turn moves the nut of the X-axis lead screw 240, thereby causing the mounting plate 130 to slide on the X-axis linear guide 220, thereby adjusting the position of the wafer rotary table 100 in the X-axis direction.

[0022] Reference Figure 3The Y-axis module 300 includes a Y-axis base 310, a Y-axis linear guide 320, a Y-axis motor 330, and a Y-axis lead screw 340. Two Y-axis bases 310 are provided. The two ends of the X-axis base plate 210 are slidably connected to the two Y-axis bases 310 via a Y-axis linear guide 320. The Y-axis motor 330 and the Y-axis lead screw 340 are mounted on one of the Y-axis bases. The nut of the Y-axis lead screw 340 is fixedly connected to the X-axis base plate 210. The spindle of the Y-axis motor 330 is coaxially connected to the lead screw of the Y-axis lead screw 340. Starting the Y-axis motor 330 drives the lead screw of the Y-axis lead screw 340 to rotate, causing the nut of the Y-axis lead screw 340 to move, thereby causing the X-axis base plate 210 to slide on the Y-axis linear guide 320, thus adjusting the position of the wafer rotary table 100 in the Y-axis direction.

[0023] In this embodiment, refer to Figure 4 The rotary drive assembly 120 includes a slewing bearing 125, a rotary motor 121, and a transmission mechanism. The rotary motor 121 is mounted on the bottom of the mounting plate 130. The X-axis base plate 210 has a clearance hole, and the trajectory of the rotary motor 121 as it moves with the mounting plate 130 lies within this clearance hole. The main shaft of the rotary motor 121 is vertically upward. The mounting plate 130 has a through hole for the main shaft of the rotary motor 121 to pass through. The transmission mechanism connects the main shaft of the rotary motor 121 to the slewing bearing 125. The transmission mechanism includes a drive wheel 122 and a driven wheel 123. 3. A transmission belt 124 is connected between the drive wheel 122 and the driven wheel 123. The drive wheel 122 is connected to the main shaft of the rotary motor 121. The driven wheel 123 is fixedly connected to the inner ring of the slewing bearing 125 and is coaxial. The outer ring of the slewing bearing 125 is fixedly connected to the mounting plate 130. The connecting part 111 at the center of the turntable 110 is fixedly connected to the driven wheel 123. Thus, when the rotary motor 121 runs, it drives the driven wheel 123 to rotate. Under the action of the transmission belt 124, the driven wheel 123 rotates, thereby driving the turntable 110 to rotate.

[0024] Furthermore, refer to Figure 4The mounting plate 130 is provided with a tension wheel 127 and a tension wheel adjustment assembly. The tension wheel 127 abuts against the transmission belt 124. The tension wheel adjustment assembly is used to adjust the position of the tension wheel 127. The tension wheel adjustment assembly includes a tension wheel adjustment block 128 and an adjustment screw. The tension wheel 127 is disposed on the tension wheel adjustment block 128. The mounting plate 130 is provided with an adjustment groove. The tension wheel adjustment block 128 is movably connected to the adjustment groove. The bottom of the adjustment groove is provided with a plurality of first adjustment holes. The tension wheel adjustment block 128 is provided with a second adjustment hole. The adjustment screw passes through the second adjustment hole and connects to the first adjustment hole. The position of the tension wheel 127 is adjusted by connecting the adjustment screw to different first adjustment holes, thereby adjusting the tension of the transmission belt 124.

[0025] The mounting plate 130 is provided with a through hole, which is located directly below the inner ring of the slewing bearing 125. The inner ring of the slewing bearing 125 is connected to a connecting pipe 126. The connecting pipe 126 is located in the through hole and a sensing plate 1261 is provided at its bottom. A slotted photoelectric sensor 129 is provided at the bottom of the mounting plate 130. When the connecting pipe 126 rotates with the inner ring of the slewing bearing 125, the sensing plate 1261 passes through the sensing area of ​​the slotted photoelectric sensor 129.

[0026] In the preferred embodiment, refer to Figure 5 The mounting plate 130 is provided with a through hole, which is located directly below the inner ring of the slewing bearing 125. The inner ring of the slewing bearing 125 is connected to a connecting pipe 126. The connecting pipe 126 is located in the through hole and has a sensing plate 1261 at its bottom. The bottom of the mounting plate 130 is provided with a slotted photoelectric sensor 129. When the connecting pipe 126 rotates with the inner ring of the slewing bearing 125, the sensing plate 1261 passes through the sensing area of ​​the slotted photoelectric sensor 129. The slotted photoelectric sensor 129 detects the rotation angle of the turntable 110, thereby accurately controlling the rotation position of the turntable 110.

[0027] In this embodiment, refer to Figure 6The wafer mounting structure 112 includes a circular first mounting hole 114 disposed on the turntable 110. The edge of the first mounting hole 114 is provided with a stepped first mounting groove 113. A first spring piece 115 is provided on the side of the first mounting groove 113 near the center of the turntable 110. A limiting post 116 is detachably connected to the side of the first mounting groove 113 away from the center of the turntable 110. When the wafer 117 is loaded, the ring with the wafer 117 is horizontally placed into the first mounting groove 113, the ring compresses the first spring piece 115, and then the limiting post 116 is installed. Under the action of the first spring piece 115, the ring is fixed in the first mounting groove 113. The wafer 117 is located above the first mounting hole 114, which facilitates the chip placement operation.

[0028] In some embodiments, in order to achieve the feeding of square wafers, refer to Figure 6 and Figure 7 A first mounting block 1121 is connected to the first mounting groove 113. A second mounting hole is provided on the first mounting block 1121, which is located above the first mounting hole 114. A stepped second mounting groove 1122 is provided on the edge of the second mounting hole. A second spring piece 1123 is provided on the first mounting block 1121, with the elastic end of the second spring piece 1123 located above the second mounting groove 1122. A square ring with a first square wafer 1120 is horizontally placed into the second mounting groove 1122, and the second spring piece 1123 presses down on the square ring to fix it.

[0029] In other embodiments, the difference from the above embodiments lies in the smaller size of the square wafers. Multiple small-sized square wafers are loaded into the same wafer mounting structure 112, as shown in the reference. Figure 6 and Figure 8 The first mounting slot 113 is connected to a second mounting block 119. The second mounting block 119 is provided with two third mounting holes, which are located above the first mounting hole 114. The edges of the two third mounting holes are provided with stepped third mounting slots 1191. The second mounting block 119 is provided with a third spring piece 1192, and the elastic end of the third spring piece 1192 is located above the third mounting slot 1191. A square ring with a second square wafer 118 is horizontally placed into the third mounting slot 1191, and the third spring piece 1192 presses down on the square ring to fix it.

[0030] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A wafer rotation switching mechanism, characterized in that: The device includes a wafer rotary table, an X-axis module, and a Y-axis module. The X-axis module is disposed at the drive end of the Y-axis module. The wafer rotary table includes a mounting plate, a turntable, and a rotation drive assembly. The mounting plate is disposed at the drive end of the X-axis module. The rotation drive assembly is mounted on the mounting plate and is used to drive the turntable to rotate. Multiple wafer mounting structures are arranged in a ring on the turntable.

2. The wafer rotation switching mechanism according to claim 1, characterized in that: The rotary drive assembly includes a slewing bearing, a rotary motor, and a transmission mechanism. The turntable is rotatably connected to the mounting plate via the slewing bearing. The rotary motor is mounted on the mounting plate, and the transmission mechanism connects the main shaft of the rotary motor to the slewing bearing.

3. The wafer rotation switching mechanism according to claim 2, characterized in that: The transmission mechanism includes a drive wheel, a driven wheel, and a transmission belt. The transmission belt is connected between the drive wheel and the driven wheel. The drive wheel is connected to the main shaft of the rotary motor. The driven wheel is fixedly connected to and coaxial with the inner ring of the slewing bearing. The outer ring of the slewing bearing is fixedly connected to the mounting plate. The turntable is fixedly connected to the driven wheel.

4. A wafer rotation switching mechanism according to claim 3, characterized in that: The mounting plate is provided with a through hole located directly below the inner ring of the slewing bearing. The inner ring of the slewing bearing is connected to a connecting pipe, which is located inside the through hole and has a sensing plate at its bottom. The bottom of the mounting plate is provided with a slotted photoelectric sensor. When the connecting pipe rotates with the inner ring of the slewing bearing, the sensing plate passes through the sensing area of ​​the slotted photoelectric sensor.

5. A wafer rotation switching mechanism according to claim 3, characterized in that: The mounting plate is provided with a tension wheel and a tension wheel adjustment assembly. The tension wheel adjustment assembly is used to adjust the position of the tension wheel, and the tension wheel abuts against the transmission belt.

6. A wafer rotation switching mechanism according to claim 2, characterized in that: The X-axis module includes an X-axis motor, an X-axis lead screw, an X-axis linear guide, and an X-axis base plate. The bottom of the mounting plate is slidably connected to the X-axis base plate along the X-axis direction via the X-axis linear guide. The X-axis motor and the X-axis lead screw are mounted on the X-axis base plate. The nut of the X-axis lead screw is fixedly connected to the mounting plate. The main shaft of the X-axis motor is coaxially connected to the lead screw of the X-axis lead screw.

7. A wafer rotation switching mechanism according to claim 6, characterized in that: The X-axis base plate is provided with clearance holes, and the trajectory of the rotary motor moving with the mounting plate is located within the clearance holes.

8. A wafer rotation switching mechanism according to claim 6, characterized in that: The Y-axis module includes a Y-axis base, a Y-axis linear guide, a Y-axis motor, and a Y-axis lead screw. Two Y-axis bases are provided. The two ends of the X-axis base plate are slidably connected to the two Y-axis bases through the Y-axis linear guide. The Y-axis motor and the Y-axis lead screw are installed on one of the Y-axis bases. The nut of the Y-axis lead screw is fixedly connected to the X-axis base plate. The spindle of the Y-axis motor is coaxially connected to the lead screw of the Y-axis lead screw.

9. A wafer rotation switching mechanism according to claim 8, characterized in that: The wafer mounting structure includes a first mounting hole disposed on the turntable, a stepped first mounting groove disposed on the edge of the first mounting hole, a first spring piece disposed on the side of the first mounting groove near the center of the turntable, and a limit post detachably connected to the side of the first mounting groove away from the center of the turntable.

10. A wafer rotation switching mechanism according to claim 9, characterized in that: A mounting block is connected to the first mounting slot. The mounting block is provided with a second mounting hole located above the first mounting hole. The edge of the second mounting hole is provided with a stepped second mounting slot. A second spring is provided on the mounting block, and the elastic end of the second spring is located above the second mounting slot.

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