Transfer shuttle and singulating device

Abstract

This application relates to the field of chip manufacturing equipment technology, and provides a transfer shuttle and sorting device. The transfer shuttle includes an assembly support, a drive mechanism, and a support structure. The support structure is movably mounted on the assembly support and connected to the drive mechanism. The support structure includes a support substrate, multiple floating blocks, and multiple sets of connecting components. The multiple floating blocks are spaced apart on the support substrate, and each floating block is correspondingly provided with a connecting component. The floating blocks float vertically relative to the support substrate in the vertical direction through the corresponding connecting components. Each floating block has a support pit for limiting the chip, and the first direction is set at an angle to the vertical direction. The support structure also includes a positioning component disposed between the support substrate and the floating blocks, which guides the floating blocks to float. The transfer shuttle provided by this application can be applied to the movement of chips of different specifications, improving adaptability and compatibility with the loading and unloading of test arms, and reducing chip wear and the risk of chip lifting.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing equipment technology, and in particular to a transfer shuttle and sorting device. Background Technology

[0002] During chip sorting, the sorter's loading structure moves the chips to the infeed position. The test arm picks up the chips at the infeed position and moves them to the test socket, which is electrically connected to the tester for testing. Simultaneously, the loading structure moves to the discharge position, and after the chips have completed testing, they are moved back to the loading structure by the test arm. Therefore, the pick-up position of the test arm and the pick-up structure used for picking up the chips are both affected by the loading structure.

[0003] In related technologies, sorting machines typically use the same material carrier structure to transfer chips of different specifications. This leads to certain risks when the test arm picks up and puts in materials, resulting in chip wear or chip removal. Utility Model Content

[0004] Therefore, it is necessary to provide a transfer shuttle that can be used to move chips of different specifications, improve the adaptability and compatibility with the test arm when picking up and putting down chips, and reduce the risk of chip wear and chip removal.

[0005] A transfer shuttle includes an assembly support, a drive mechanism, and a load-bearing structure. The load-bearing structure is movably disposed on the assembly support and connected to the drive mechanism. The drive mechanism is used to drive the load-bearing structure to move along a first direction.

[0006] The supporting structure includes a supporting substrate, multiple floating blocks, and multiple sets of connecting components. The multiple floating blocks are arranged at intervals on the supporting substrate, and each floating block is provided with a corresponding connecting component. The floating blocks float up and down relative to the supporting substrate in the vertical direction through the corresponding connecting components. Each floating block is provided with a supporting pit for limiting the chip. The first direction is set at an angle to the vertical direction. The supporting structure also includes a positioning component disposed between the supporting substrate and the floating blocks. The positioning component is used to guide the floating blocks to float.

[0007] Understandably, using assembly supports to support the carrier structure facilitates its movement along the first direction under the action of the drive mechanism, enabling chip transport. Each floating block in the carrier structure has a corresponding carrier slot to accommodate and limit the integration of multiple chips. Since the floating blocks are connected to the carrier substrate via corresponding connecting components, the gravity acting on the floating blocks differs depending on the chip size when it is positioned in the carrier slot. Smaller chips result in smaller floating displacements, while larger chips result in larger floating displacements, thus helping to maintain a relatively uniform pick-up position between chips of different sizes and the test arm. Furthermore, the individual floating configuration of each floating block ensures a relatively uniform pick-up position for each chip. Moreover, the positioning components positioned between the carrier substrate and the floating blocks guide the vertical movement of the floating blocks, reducing offset during the floating process. This improves the adaptability and compatibility with the test arm during pick-up and drop, and reduces the risk of chip wear and warping.

[0008] In some embodiments, both the carrier substrate and the floating block are provided with clearance notches extending along a first direction and / or a second direction, each clearance notch connecting multiple carrier pits, and the clearance notch defining a detection path.

[0009] In some embodiments, the connecting assembly includes an elastic element and a limiting portion; one end of the elastic element is connected to the carrier substrate, and the other end is connected to the floating block; one end of the limiting portion is connected to the carrier substrate, and the other end is provided with a limiting boss, which can abut against the side of the floating block away from the carrier substrate; wherein, the limiting portion and the elastic element are arranged at intervals, or the elastic element is sleeved on the limiting portion.

[0010] In some embodiments, the floating block includes opposing and spaced-apart limiting sides, each of the limiting sides having a limiting step that abuts against and limits the limiting boss.

[0011] In some embodiments, the floating block is provided with a clearance notch that connects to the bearing pit and allows the laser to pass through. The clearance notch is provided with limiting steps on both sides along its width direction, and each limiting step corresponds to a limiting boss.

[0012] In some embodiments, the limiting step includes at least an arcuate sidewall disposed along the floating direction of the floating block, and the connecting assembly further includes a gasket connected to the limiting portion. The gasket has an arcuate limiting surface, and the arcuate limiting surface abuts against the arcuate sidewall to limit the floating of the floating block in the horizontal direction.

[0013] In some embodiments, the limiting portion includes a limiting post and a limiting seat. One end of the limiting post is limited and connected to the carrier substrate, and the other end is connected to the limiting seat. The limiting seat protrudes outward along the radial direction of the limiting post to form the limiting boss.

[0014] In some embodiments, the carrier substrate is provided with an assembly groove for accommodating the floating block and a connecting groove communicating with the assembly groove. The connecting groove is located on the outer periphery of the assembly groove, and the bottom of the connecting groove is provided with a connecting hole for connecting the limiting part.

[0015] In some embodiments, the positioning component includes a positioning hole and a positioning post that engages with the positioning hole, wherein one of the positioning hole and the positioning post is located on the support substrate and the other is located on the floating block.

[0016] This application also provides a sorting device, including a testing machine, a testing structure, and the aforementioned transfer shuttle. The testing machine is provided with an inlet position, a testing position, and an outlet position arranged at intervals. There are at least two transfer shuttles, one of which is located at the inlet position and the other at the outlet position. The testing structure is located at the testing position, and the robotic arm in the testing structure can move between the inlet position and the testing position, and between the testing position and the outlet position. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial exploded view of the load-bearing structure in a transfer shuttle provided in an embodiment of this application;

[0019] Figure 2 This is a top view of the load-bearing structure in a transfer shuttle provided in an embodiment of this application;

[0020] Figure 3 A partial top view of a sorting device provided in an embodiment of this application;

[0021] Figure 4 This is a partial schematic diagram of a sorting device provided in an embodiment of this application.

[0022] Reference numerals: 100, transfer shuttle; 110, assembly support; 120, drive mechanism; 130, bearing structure; 131, bearing base plate; 132, floating block; 133, connecting assembly; 134, positioning assembly; 200, testing machine; 210, infeed position; 220, testing position; 230, outfeed position; 300, testing structure; 1301, clearance notch; 1301a, first clearance notch; 1301b, second clearance notch; 1302. Groove; 1311 Assembly groove; 1312 Connecting groove; 1313 Connecting hole; 1314 First inspection hole; 1321 Bearing pit; 1322 Limiting step; 1322a Arc-shaped sidewall; 1322b Horizontal surface; 1323 Second inspection hole; 1331 Elastic element; 1332 Limiting part; 1332a Limiting post; 1332b Limiting seat; 1333 Gasket; 1333a Arc-shaped limiting surface; 1341 Positioning post. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0028] Please see Figures 1 to 4 One embodiment of this application provides a transfer shuttle 100, including an assembly support 110, a drive mechanism 120, and a support structure 130. The support structure 130 is movably disposed on the assembly support 110 and connected to the drive mechanism 120. The drive mechanism 120 is used to drive the support structure 130 to move along a first direction. The support structure 130 includes a support substrate 131, a plurality of floating blocks 132, and a plurality of connecting components 133. The plurality of floating blocks 132 are spaced apart on the support substrate 131, and each floating block 132 is provided with a corresponding connecting component 133. The floating blocks 132 float up and down relative to the support substrate 131 in the vertical direction through the corresponding connecting components 133. Each floating block 132 is provided with a support pit 1321 for limiting the chip, and the first direction is set at an angle to the vertical direction. The support structure 130 also includes a positioning component 134 disposed between the support substrate 131 and the floating blocks 132, and the positioning component 134 is used to guide the floating blocks 132 to float.

[0029] The vertical direction is the Z-axis direction in the diagram, and the first direction is the X-axis direction. The power output end of the drive mechanism 120 is connected to the carrier substrate 131. Each floating block 132 accommodates a chip through a carrier pit 1321, and then, under the action of the drive mechanism 120, moves back and forth along the X-axis direction with the carrier substrate 131 to achieve chip transport. The drive mechanism 120 can be a belt drive mechanism. The mounting support 110 can be equipped with a guide rail, and a slider is provided at the bottom of the carrier substrate 131, with the slider slidably connected to the guide rail. Alternatively, the mounting support 110 can be a side guide mechanism provided on the carrier substrate 131, allowing the carrier substrate 131 to be movably mounted on the testing machine 200 via the mounting support 110. In actual use, the mounting support 110 can be fixed to the testing machine 200 with screws to ensure transport stability.

[0030] Understandably, the assembly support 110 supports the carrier structure 130, facilitating its movement along the first direction under the action of the drive mechanism 120, thus enabling chip transport. Each floating block 132 in the carrier structure 130 is provided with a corresponding carrier pit 1321, satisfying the integration and positioning of multiple chips. Since the floating blocks 132 are floatingly connected to the carrier substrate 131 via corresponding connecting components 133, the gravity acting on the floating blocks 132 when chips of different specifications are positioned in the carrier pit 1321 is different. Smaller chips correspond to smaller floating displacements of the floating blocks 132, while larger chips correspond to larger floating displacements of the floating blocks 132. This helps to maintain a basically uniform picking position between chips of different specifications and the test arm. Furthermore, it is precisely because of the individual floating setting of each floating block 132 that the picking position of each chip can be guaranteed to be basically uniform, allowing each chip to float independently without interference during the picking process by nozzles at different heights. Furthermore, the positioning component 134, positioned between the carrier substrate 131 and the floating block 132, guides the vertical movement of the floating block 132, reducing its offset during floating. The positioning component 134 also facilitates the proper assembly of the floating block 132 relative to the carrier substrate 131. This improves compatibility and adaptability with the test arm's material handling, and reduces the risk of chip wear and chip removal.

[0031] Please see Figure 1In some embodiments, the positioning component 134 includes a positioning hole (not shown) and a positioning post 1341 that engages with the positioning hole. One of the positioning hole and the positioning post 1341 is located on the support substrate 131, and the other is located on the floating block 132. That is, the engagement of the positioning post 1341 and the positioning hole guides the floating plate along the Z-axis, reducing horizontal displacement of the floating plate during floating. For example, the positioning post 1341 may protrude from the support substrate 131, and the bottom of the floating block 132 may have a positioning hole; conversely, the positioning post 1341 may protrude from the bottom of the floating block 132, and the support substrate 131 may have a positioning hole. The end of the positioning post 1341 may be tapered to facilitate insertion into the positioning hole. The cross-section of the positioning post 1341 is the same as the cross-section of the positioning hole, and may be circular, resulting in a smoother contact surface and reducing wear between the outer wall of the positioning post 1341 and the wall of the positioning hole. Of course, the cross-section can also be square, as long as it can meet the positioning and guiding requirements; this is just an example.

[0032] The positioning pin 1341 is fitted with the wall of the positioning hole with a clearance fit.

[0033] like Figure 1 As shown, in some embodiments, the supporting substrate 131 is recessed with an assembly groove 1311, and at least the lower portion of the floating block 132 is accommodated within the assembly groove 1311. Each floating block 132 corresponds to one assembly groove 1311. This arrangement improves the assembly reliability of the floating block 132 relative to the supporting substrate 131, and the groove wall of the assembly groove 1311 can also guide the floating plate, further reducing swaying during floating and improving docking accuracy. The bottom wall of the assembly groove 1311 may protrude with the aforementioned positioning post 1341. Simultaneously, the bottom wall of the assembly groove 1311 is recessed with a cavity for a structure on the floating block 132 that adapts to the supporting pit 1321. This is merely an example.

[0034] The assembly groove 1311 has a gap between its wall and the side wall of the floating block 132, which reduces wear and ensures that the floating block 132 floats smoothly, avoiding floating interference caused by contact between the two.

[0035] Please combine Figure 1 and Figure 2 In some specific embodiments, the carrier substrate 131 is provided with a plurality of assembly slots 1311, and the plurality of assembly slots 1311 are arranged at intervals along the X-axis and Y-axis directions, and a floating block 132 is installed in each assembly slot 1311.

[0036] like Figure 1As shown, in some specific embodiments, each assembly slot 1311 is provided with at least two spaced positioning posts 1341, each positioning post 1341 corresponding to a positioning hole at the bottom of the floating block 132. At least two positioning posts 1341 are arranged spaced apart along the circumference of the floating block 132. The positioning posts 1341 in the positioning assembly 134 can be detachably connected to the supporting base plate 131 or to the floating block 132, facilitating disassembly, assembly, and replacement.

[0037] Furthermore, when the cross-section of the floating block 132 is quadrilateral, such as a square or a rectangle with a length-to-side ratio close to 1, the cross-section of the assembly groove 1311 is adapted to the cross-section of the floating block 132. Positioning components 134 may be provided at corresponding positions on two opposite sides to ensure uniform force distribution; or, positioning components 134 may be provided on each side.

[0038] In other words, the positioning components 134 are provided in at least two sets and are arranged at intervals along the circumference of the floating block 132. This arrangement can create constraints between the positioning components 134, further improving the stability of the floating block 132 during the floating process and significantly reducing the offset that occurs during the floating process. The positioning posts 1341 in each set of positioning components 134 are detachable.

[0039] Please see Figure 1 and Figure 2 In some embodiments, both the carrier substrate 131 and the floating block 132 are provided with clearance notches 1301 that extend through the first direction and / or the second direction. Each clearance notch 1301 connects to a plurality of carrier pits 1321 and defines a detection path.

[0040] The second direction is the Y-axis direction. A first clearance notch 1301a extends along the X-axis, and a second clearance notch 1301b extends along the Y-axis. Therefore, multiple first clearance notches 1301a collectively define a first detection path along the X-axis, and multiple second clearance notches 1301b collectively define a second detection path along the Y-axis. In actual use, the feed shuttle 100 also includes a laser sensor mounted on the mounting support 110. The laser emitted by the laser sensor can pass through the clearance notches 1301. The laser sensor includes a first laser sensor for emitting laser light along the X-axis and a second laser sensor for emitting laser light along the Y-axis. The first laser sensor corresponds to the first detection path, and the second laser sensor corresponds to the second detection path. When a chip in the bearing slot 1321 experiences problems such as warping, the warped portion of the chip will block the laser transmission, facilitating timely handling by the operator. If the chips in each bearing slot 1321 are properly positioned, the laser can pass through the corresponding first clearance notch 1301a or second clearance notch 1301b. Therefore, the aforementioned detection path is the channel through which the laser passes.

[0041] like Figure 1 As shown, in some embodiments, the connecting component 133 includes an elastic element 1331 and a limiting part 1332. One end of the elastic element 1331 is connected to the carrier substrate 131, and the other end of the elastic element 1331 is connected to the floating block 132. One end of the limiting part 1332 is connected to the carrier substrate 131, and the other end of the limiting part 1332 is provided with a limiting boss, which can abut against the side of the floating block 132 away from the carrier substrate 131. It can be understood that when the chip is placed in the carrier pit 1321, it will press down on the floating block 132 under its own gravity, and the elastic element 1331 will be compressed and deformed. The larger the chip size, the greater the weight, and the greater the deformation of the elastic element 1331, thereby ensuring that the upper surface of chips of different specifications can be kept as consistent as possible, and achieving a basically uniform picking position. After the chip is taken away by the robot, the floating block 132 can move upward under the action of the elastic element 1331 to return to its original position, waiting for the placement of the next chip. Moreover, due to the setting of the limiting boss, the upward movement of the floating block 132 can be limited, preventing the floating block 132 from detaching from the supporting substrate 131.

[0042] Furthermore, a groove 1302 is recessed on one side wall opposite to the floating block 132 and the supporting substrate 131. The two ends of the elastic member 1331 are respectively accommodated in the corresponding groove 1302 to limit the assembly of the elastic member 1331 and improve its assembly stability. The elastic member 1331 and the limiting part 1332 are arranged at intervals so that they do not interfere with each other and can function independently. Alternatively, the elastic member 1331 can be sleeved on the outside of the limiting part 1332 to utilize the limiting part 1332 to support the elastic member 1331 and prevent it from tilting.

[0043] The elastic element 1331 is a spring. The floating block 132 and the supporting base plate 131 are also provided with a third clearance notch to reduce fatigue of the elastic element 1331.

[0044] In some specific embodiments, a set of connecting components 133 is provided at or near the four apex corners of the floating block 132. In each set of connecting components 133, an elastic element 1331 is sleeved on the outside of the corresponding limiting part 1332. The top of the elastic element 1331 abuts against the bottom surface of the floating block 132, and the bottom of the elastic element 1331 abuts against the bottom wall of the mounting groove 1311 on the carrier substrate 131. The four sets of connecting components 133 surround the outer periphery of the carrier pit 1321 to reduce interference with chip placement.

[0045] like Figure 1 As shown, in some embodiments, the floating block 132 includes opposing and spaced-apart limiting sides, each of which is provided with a limiting step 1322, which abuts against and limits the limiting protrusion. Taking a quadrilateral cross-section of the floating block 132 as an example, two opposing and spaced-apart sides serve as the aforementioned limiting sides. This arrangement is equivalent to using the limiting protrusion on the limiting part 1332 to abut against and limit the edge of the floating block 132, reducing the space occupied in the middle of the floating block 132. Thus, while satisfying the space setting of the bearing pit 1321, the size of the floating block 132 is reduced, making it easier to integrate more floating blocks 132 on the bearing substrate 131. Meanwhile, due to the setting of the limiting step 1322, the position of the contact limit between the floating block 132 and the limiting part 1332 is set downward, which reduces the size of the limiting part 1332 protruding from the floating block 132 in the vertical direction, thereby reducing the risk of the limiting part 1332 being easily collided or interfered with, and improving safety.

[0046] The upper surface of the floating block 132 may be recessed downward to form a limiting step 1322. The limiting boss abuts against the horizontal surface 1322b of the limiting step 1322 for limiting.

[0047] For example, limiting steps 1322 can be provided on both sides of the floating block 132 along the X-axis direction, and two limiting steps 1322 are provided on each side at intervals along the Y-axis direction, with each limiting step 1322 corresponding to a set of connecting components 133.

[0048] like Figure 1 As shown, in some embodiments, the limiting portion 1332 includes a limiting post 1332a and a limiting seat 1332b. One end of the limiting post 1332a is limitedly connected to the supporting substrate 131, and the other end is connected to the limiting seat 1332b. The limiting seat 1332b protrudes radially outward along the limiting post 1332a to form a limiting boss. For example, the end of the limiting post 1332a opposite to the limiting seat 1332b is provided with an external thread, and the supporting substrate 131 is provided with a corresponding threaded hole to thread the limiting post 1332a to the supporting substrate 131 for easy assembly and disassembly. The diameter of the limiting seat 1332b is larger than the diameter of the limiting post 1332a, so that the portion of the limiting seat 1332b protruding radially outward relative to the limiting post 1332a serves as the aforementioned limiting boss, facilitating contact and limiting with the horizontal surface 1322b of the limiting step 1322 on the floating block 132.

[0049] Furthermore, the connecting assembly 133 also includes a gasket 1333 connected to the limiting portion 1332. Specifically, the gasket 1333 is sleeved on the outside of the limiting post 1332a and installed below the limiting seat 1332b, so that it can be pressed between the limiting seat 1332b and the horizontal surface 1322b when it abuts against the limiting position, thereby reducing wear between the two.

[0050] like Figure 1 As shown, further, the limiting step 1322 includes an arc-shaped sidewall 1322a arranged vertically, and the gasket 1333 is provided with an arc-shaped limiting surface 1333a. The arc-shaped limiting surface 1333a abuts against the arc-shaped sidewall 1322a to limit the floating block 132's floating in the horizontal direction. That is, during the floating block 132's vertical floating process, the gasket 1333 is accommodated in the space defined by the limiting step 1322, and the arc-shaped limiting surface 1333a of the gasket 1333 can abut against the arc-shaped sidewall 1322a, thereby reducing the swaying of the floating block 132 on the horizontal plane 1322b during floating, further improving accuracy and stability.

[0051] like Figure 1 and Figure 2As shown, in some embodiments, the floating block 132 is provided with a clearance notch 1301 that connects to the bearing pit 1321 and allows the laser to pass through. The clearance notch 1301 has limiting steps 1322 on both sides along its width direction, with each limiting step 1322 corresponding to a limiting boss. This arrangement ensures uniform force distribution between the connecting component 133 and the floating block 132, improving the floating and limiting effects of the floating block 132. Furthermore, the cooperation between the connecting component 133 and the floating block 132 does not interfere with the chip removal detection within the bearing pit 1321.

[0052] Alternatively, the limiting step 1322 can also be set diagonally offset. For example, with Figure 2 The left-right direction is the X-axis direction, and the up-down direction is the Y-axis direction. Therefore, avoidance notches 1301 can be provided at the upper left and lower right of the floating block 132, and corresponding connecting components 133 can be provided. As long as it can meet the stable floating of the floating block 132, it is only for illustrative purposes.

[0053] like Figure 1 As shown, in some embodiments, the supporting substrate 131 is provided with an assembly groove 1311 for accommodating the floating block 132 and a connecting groove 1312 communicating with the assembly groove 1311. The connecting groove 1312 is located on the outer periphery of the assembly groove 1311, and the bottom of the connecting groove 1312 is provided with a connecting hole 1313 for connecting with the limiting part 1332. The depth of the assembly groove 1311 is greater than the depth of the connecting groove 1312, ensuring that the supporting substrate 131 has sufficient space to provide the connecting hole 1313 at the position corresponding to the connecting groove 1312. This ensures that the connecting hole 1313 has sufficient depth to be threadedly connected with the limiting post 1332a in the limiting part 1332, improving connection reliability. Furthermore, the bottom wall of the connecting groove 1312 can also support the gasket 1333 and the limiting seat 1332b, ensuring uniform force distribution.

[0054] like Figure 1 As shown, in some embodiments, the carrier substrate 131 is provided with a first detection hole 1314, and the floating block 132 is provided with a second detection hole 1323 extending vertically. The first detection hole 1314 and the second detection hole 1323 are aligned vertically. In actual use, a third laser sensor is also provided above the transfer shuttle 100. The laser emitted by the third laser sensor can pass through the second detection hole 1323 and enter the first detection hole 1314 to detect the position of the floating block 132 relative to the carrier substrate 131. When the floating block 132 is tilted relative to the carrier substrate 131, the laser of the third laser sensor may not be able to pass smoothly through the second detection hole 1323, and the third laser sensor will emit a failure detection signal, which will facilitate timely adjustment by the operator.

[0055] Please see Figure 1 , Figure 3 and Figure 4 This application also provides a sorting device, including a testing machine 200, a testing structure 300 and the aforementioned transfer shuttle 100. The testing machine 200 is provided with an infeed position 210, a testing position 220 and an outlet position 230 arranged at intervals. There are at least two transfer shuttles 100, one of which is located at the infeed position 210 and the other at the outlet position 230. The testing structure 300 is located at the testing position 220. The robotic arm in the testing structure 300 can move between the infeed position 210 and the testing position 220, and between the testing position 220 and the outlet position 230.

[0056] Specifically, the assembly support 110 in the transfer shuttle 100 is fixed to the testing machine 200. The testing position 220 can be located between the infeed position 210 and the outfeed position 230. The infeed position 210 is equipped with the transfer shuttle 100, and the outfeed position 230 is also equipped with the transfer shuttle 100. The transfer shuttle 100 at the infeed position 210 can move the chip to be tested from the loading station to this location, where it is picked up by the robotic arm in the testing structure 300 for testing. After testing, the chip is picked up by the robotic arm and placed in the transfer shuttle 100 at the outfeed position 230, and then transferred to the receiving station. Because the floating block 132 forming the chip carrying pit 1321 in each transfer shuttle 100 can float vertically, it is beneficial to maintain a basically uniform picking position between chips of different specifications and the testing arm, improve the adaptability and compatibility with the testing arm when picking up and placing materials, and reduce the risk of chip wear and chip lifting.

[0057] Each conveyor shuttle 100 may be provided with at least two load-bearing structures 130 arranged at intervals along the X-axis direction.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A material conveying shuttle, characterized in that, It includes an assembly support (110), a drive mechanism (120), and a load-bearing structure (130). The load-bearing structure (130) is movably disposed on the assembly support (110) and connected to the drive mechanism (120). The drive mechanism (120) is used to drive the load-bearing structure (130) to move along a first direction. The supporting structure (130) includes a supporting substrate (131), a plurality of floating blocks (132) and a plurality of connecting components (133). The plurality of floating blocks (132) are arranged at intervals on the supporting substrate (131). Each floating block (132) is provided with a corresponding connecting component (133). The floating block (132) floats up and down relative to the supporting substrate (131) in the vertical direction through the corresponding connecting component (133). Each floating block (132) is provided with a supporting pit (1321) for limiting the chip. The first direction is set at an angle to the vertical direction. The supporting structure (130) also includes a positioning component (134) disposed between the supporting substrate (131) and the floating block (132). The positioning component (134) is used to guide the floating block (132) to float.

2. The conveying shuttle according to claim 1, characterized in that, Both the carrier substrate (131) and the floating block (132) are provided with clearance notches (1301) that extend through the first direction and / or the second direction. Each clearance notch (1301) connects to a plurality of carrier pits (1321), and the clearance notch (1301) defines the detection path.

3. The conveying shuttle according to claim 1, characterized in that, The connection component (133) includes: The elastic element (1331) has one end connected to the supporting substrate (131) and the other end connected to the floating block (132); and The limiting part (1332) has one end connected to the carrier substrate (131) and the other end provided with a limiting boss, which can abut against the side of the floating block (132) away from the carrier substrate (131). The limiting part (1332) and the elastic member (1331) are arranged at intervals, or the elastic member (1331) is sleeved on the limiting part (1332).

4. The transfer shuttle according to claim 3, characterized in that, The floating block (132) includes opposing and spaced-apart limiting sides, each of which is provided with a limiting step (1322), the limiting step (1322) abutting against the limiting boss for limiting.

5. The transfer shuttle according to claim 4, characterized in that, The floating block (132) is provided with a clearance notch (1301) that connects to the bearing pit (1321). The clearance notch (1301) is provided with a limiting step (1322) on both sides along its width direction. Each limiting step (1322) corresponds to a limiting boss.

6. The transfer shuttle according to claim 4, characterized in that, The limiting step (1322) includes at least an arcuate sidewall (1322a) arranged along the floating direction of the floating block (132). The connecting assembly (133) also includes a gasket (1333) connected to the limiting part (1332). The gasket (1333) is provided with an arcuate limiting surface (1333a). The arcuate limiting surface (1333a) abuts against the arcuate sidewall (1322a) to limit the floating of the floating block (132) in the horizontal direction.

7. The transfer shuttle according to claim 3, characterized in that, The limiting part (1332) includes a limiting post (1332a) and a limiting seat (1332b). One end of the limiting post (1332a) is limited and connected to the carrier substrate (131), and the other end is connected to the limiting seat (1332b). The limiting seat (1332b) protrudes outward along the radial direction of the limiting post (1332a) to form the limiting boss.

8. The transfer shuttle according to claim 7, characterized in that, The supporting base plate (131) is provided with an assembly groove (1311) for accommodating the floating block (132) and a connecting groove (1312) communicating with the assembly groove (1311). The connecting groove (1312) is located on the outer periphery of the assembly groove (1311), and the bottom of the connecting groove (1312) is provided with a connecting hole (1313) for connecting the limiting post (1332a).

9. The transfer shuttle according to claim 1, characterized in that, The positioning component (134) includes a positioning hole and a positioning post (1341) that is inserted into the positioning hole. One of the positioning hole and the positioning post (1341) is located on the carrier substrate (131), and the other is located on the floating block (132).

10. A sorting device, characterized in that, The device includes a testing machine (200), a testing structure (300), and a transfer shuttle as described in any one of claims 1 to 9. The testing machine (200) is provided with an inlet position (210), a testing position (220), and an outlet position (230) arranged at intervals. There are at least two transfer shuttles (100), one of which is located at the inlet position (210) and the other is located at the outlet position (230). The testing structure (300) is located at the testing position (220). The robotic arm in the testing structure (300) can move between the inlet position (210) and the testing position (220), and between the testing position (220) and the outlet position (230).

Images