A novel ultrasonic delivery device for silicon wafer cleaning

Abstract

The utility model belongs to the technical field of silicon wafer cleaning in photovoltaic industry, disclose a novel ultrasonic conveying device for silicon wafer cleaning. Including the front and rear both ends of cleaning tank each setting one baffle, set up long through -hole for the silicon wafer conveying on the baffle, set up spray zone and cleaning zone in the cleaning tank, set up baffle between cleaning zone and spray zone, set up passageway groove for the silicon wafer through on the baffle, set up spray assembly for carrying out the spray to the silicon wafer in the spray zone, the silicon wafer after spraying enters into the cleaning zone and realizes cleaning / oxidation / rinsing, both in the cleaning zone and in the spray zone set up two layers of conveying roller, the front and rear end in the cleaning zone all set up water -resisting subassembly, and the silicon wafer passes through the interval of two layers of conveying roller and circulates, set up side groove in the cleaning tank, and the side groove is located at the side of spray zone and cleaning zone, the upper part in the side groove is used for placing the guiding transmission assembly, and its bottom is used for draining and backwater, set up ultrasonic assembly vertically in the cleaning tank. Greatly reduced the silicon wafer loss, greatly improved the work efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer cleaning technology in the photovoltaic industry, and relates to a novel ultrasonic conveying device for silicon wafer cleaning. Background Technology

[0002] Currently, silicon wafer cleaning machines use the following methods: The first method involves placing silicon wafers into cleaning baskets. A translation and lifting mechanism within the machine connects to these baskets, sequentially placing them into various cleaning tanks for immersion and cleaning. The disadvantages of this method are that the cleaning baskets are consumables requiring regular replacement, low cleaning output, and a high wafer breakage rate. The second method uses roller conveyor cleaning. The machine uses roller conveyors to immerse the silicon wafers in the cleaning solution and transport them. Ultrasonic cleaning is used above and below the rollers to remove surface contaminants. However, because the wafers are transported between the rollers, the rollers can obstruct the ultrasonic cleaning, affecting the cleaning effect. Furthermore, the cleaning agent generates a large amount of foam that accumulates inside the machine. When the wafers enter the cleaning tank and are immersed in the cleaning agent, small air bubbles adhere to the bottom of the wafers, affecting contact with the cleaning agent and preventing effective removal of contaminants. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, this invention provides a novel ultrasonic conveying device for silicon wafer cleaning, which greatly reduces silicon wafer wear and significantly improves work efficiency.

[0004] The above-mentioned objective of this utility model is achieved through the following technical solution: A novel ultrasonic conveying device for silicon wafer cleaning includes a cleaning tank with a partition at each end. The partitions have elongated through holes for silicon wafer conveying. The cleaning tank contains a spray zone and a cleaning zone, separated by a partition with channel slots for silicon wafer passage. The spray zone is equipped with a spray assembly to spray the silicon wafers. After spraying, the wafers enter the cleaning zone for cleaning / oxidation / rinsing. Both the cleaning and spray zones have upper and lower layers of conveying rollers. Water-blocking components are installed at the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveying rollers. The cleaning tank also includes side channels located to the sides of the spray and cleaning zones. The upper part of the side channels houses guiding and conveying components, while the bottom is used for drainage and return water. An ultrasonic component is vertically mounted within the cleaning tank. The upper and lower conveyor rollers are respectively set at both ends on the vertical support limit plate. One end of the upper and lower conveyor rollers is connected to the bearing, and the other end is inserted through the vertical support limit plate and connected to the main drive hexagonal shaft in the guide transmission assembly to realize transmission.

[0005] The ultrasonic components are positioned on the left and right sides of the silicon wafer's forward direction. The structural design of the ultrasonic components ensures that the ultrasonic transducer box does not interfere with the roller conveyor and that the ultrasonic waves emitted by the transducer are not obstructed. Furthermore, a spray system is installed on the side of the cleaning zone where foam is generated, flushing the foam into the side return water tank to prevent foam accumulation within the cleaning tank. A bottom spray system is also installed at the bottom of the cleaning zone to remove air bubbles adhering to the bottom surface.

[0006] The advantages of this utility model compared with the prior art are: A novel ultrasonic conveying device for silicon wafer cleaning utilizes a unique structure with a single hexagonal main drive shaft to power the upper and lower layers of conveying rollers. This design ensures more stable transmission, significantly reduces wafer wear, and greatly improves work efficiency. The working cycle time is significantly increased, allowing for continuous, uninterrupted operation. The inclusion of water-blocking components, partitions, and side grooves enables precise separation. The innovative water flow direction during rinsing is reversed via the special structure of the water-blocking components, resulting in better rinsing and shorter rinsing time. During cleaning, the special structure of the vertical support limiting plate, its height setting, and the side and bottom spray systems eliminate interference from surfactant foam, greatly improving cleaning efficiency and reducing manual operation. No manual removal or machine downtime is required, and the cleaning effect is excellent. The upper and lower conveying rollers, through a specially developed structure, achieve floating transmission, preventing excessive pressure that could cause fragmentation, while also ensuring stable transport due to insufficient lightness, thus solving the problem of high fragmentation rates in existing conveying systems. Furthermore, the innovative vertically positioned ultrasonic component differs from the existing horizontally positioned ultrasonic components. Horizontal positioning requires two layers, increasing overall cost due to higher water surface requirements, higher losses, and lower ultrasonic efficiency. The vertically positioned ultrasonic component solves these problems, and its continuous structure results in better ultrasonic performance. Attached Figure Description

[0007] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0008] Figure 1 This is a front view of the application status of the novel ultrasonic conveying device for silicon wafer cleaning according to this utility model.

[0009] Figure 2 This is a top view of the application state of the novel ultrasonic conveying device for silicon wafer cleaning according to this utility model.

[0010] Figure 3 yes Figure 2 AA sectional view.

[0011] Figure 4This is a perspective view of the application state of the novel ultrasonic conveying device for silicon wafer cleaning in Embodiment 2 of this utility model.

[0012] Figure 5 yes Figure 2 The 3D image after removing the top frame.

[0013] Figure 6 yes Figure 5 A magnified schematic diagram of region I in the image.

[0014] Figure 7 yes Figure 2 Another 3D view after removing the top frame.

[0015] Figure 8 This is a schematic diagram of the cleaning tank structure of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0016] Figure 9 yes Figure 8 The diagrams show enlarged views of certain areas, with Figure A showing an enlarged view of area I and Figure B showing an enlarged view of area II.

[0017] Figure 10 This is a perspective view of the cleaning tank of this utility model.

[0018] Figure 11 This is a structural diagram of the cleaning tank.

[0019] Figure 12 Figure A is a structural schematic diagram of the vertical support limiting plate of this utility model, and Figure B is a structural schematic diagram of the vertical support limiting plate A.

[0020] Figure 13 This is a schematic diagram of the structure of the guide and transmission component of this utility model.

[0021] Figure 14 Figure A is a schematic diagram of the structure of the ultrasonic component of this utility model, wherein Figure B is a schematic diagram of the structure after removing one side of the ultrasonic baffle, and Figure B is a schematic diagram of the structure after removing the ultrasonic baffle.

[0022] Figure 15 This is a schematic diagram of the structure of the spray assembly of this utility model, wherein Figure A is a perspective view, Figure B is a perspective view after removing the dust cover, and Figure C is a perspective view after removing the dust cover and the vertical baffle.

[0023] Figure 16 This is a structural diagram of the cleaning inlet water tank, where Figure A is a 3D view and Figure B is a 3D view of the cleaning inlet water tank after the water tank baffle is removed.

[0024] Figure 17This is a structural diagram of the cleaning spray tank, where Figure A is a three-dimensional view and Figure B is a cross-sectional view of Figure A.

[0025] In the diagram: 101. Cleaning inlet water tank, 102. Cleaning spray water tank, 103. Spray assembly, 104. Cleaning spray area inlet pipe, 105. Cleaning spray side pipe, 106. Cleaning spray drain pipe, 107. Ultrasonic support, 108. Cleaning water pump, 109. Ultrasonic groove, 110. Upper cleaning water-blocking roller A, 111. Upper cleaning water-blocking roller B, 112. Cleaning inlet water valve, 113. Auxiliary spray water valve, 114. Upper conveyor roller, 115. Lower conveyor roller, 116. Lower cleaning water-blocking roller, 117. Water-blocking plate, 118. Liquid level float switch A, 119. Liquid level float switch B, 120. Cleaning tank outlet, 121. Cleaning frame, 122. Main inlet pipe, 123. 124. Pneumatic diaphragm valve A; 125. Cleaning tank drain pipe; 126. Main drive support base; 127. Main drive hexagonal shaft; 128. Driving bevel gear; 129. Driven gear; 130. Drive motor mounting plate; 131. Drive driving sprocket; 132. Drive chain; 133. Drive driven sprocket; 134. Sprocket fixing support plate; 135. Overflow guide pipe; 136. Temperature sensor A; 137. Ultrasonic transducer; 138. Drive motor A; 139. Ultrasonic transducer; 140. Driving gear; 141. Temperature sensor fixing bracket; 142. Liquid level float switch C; 143. Side groove; 144. Cleaning drain outlet A; 145. Cleaning spray drain outlet; 146. Lower upright plate; 147. Upper upright plate; 148. 149. Block, Adjusting bolt hole, 150. Cleaning drain outlet B, 151. Ultrasonic connecting pipe, 152. Cleaning pipe clamp, 153. Cleaning tank bottom plate, 154. Cleaning bottom nozzle, 155. Cleaning bottom spray pipe, 156. Insert block, 10101. Heating rod A, 10102. Cleaning inlet water tank drain outlet, 10103. Overflow drain pipe A, 10104. Pneumatic diaphragm valve B, 10105. Return pipe, 10106. Top cover A, 10107. Temperature and level sensor, 10108. Return chamber A, 10109. Pressure ring, 10110. Filter bag A, 10111. Cleaning inlet tank body, 10112. Water tank baffle, 10201. Overflow drain pipe B, 10202. Top cover B, 10203. Vertical pump mounting base, 10204. Return chamber B, 10205. Vertical pump outlet pipe, 10206. Pneumatic diaphragm valve C, 10207. Liquid level switch, 10208. Filter bag B, 10209. Filter basket, 10301. Cleaning tank inlet, 10302. Spray hood, 10303. Nozzle A, 10304. Upper spray pipe, 10305. Spray pipe mounting base, 10306. Lower spray pipe, 10307.Sensor mounting bracket, 10308. Fiber optic sensor, 10309. U-shaped pipe clamp, 10310. Lower spray baffle, 10311. Pressure gauge, 10312. Temperature sensor B, 10313. Manual ball valve, 10314. Spray pipe inlet connector, 10315. Cleaning spray drain connector hole, 10316. Water baffle, 10317. Spray pipe bracket, 10501. Nozzle B, 11501. Mandrel, 11502. Conveyor pressure ring, 11503. Limit ring. Detailed Implementation

[0026] The present invention is described in detail below through specific embodiments, but this does not limit the scope of protection of the present invention. Unless otherwise specified, the experimental methods used in the present invention are all conventional methods, and the experimental equipment, materials, reagents, etc. used can all be obtained commercially.

[0027] Example 1 A novel ultrasonic conveying device for silicon wafer cleaning includes a partition plate at each end of a cleaning tank, with elongated through holes for silicon wafer conveying on the partition plate. The cleaning tank contains a spray zone and a cleaning zone, separated by a partition plate with channel slots for silicon wafer passage. The spray zone is equipped with a spray assembly 103 for spraying the silicon wafers. After spraying, the silicon wafers enter the cleaning zone for cleaning / oxidation / rinsing. Both the cleaning zone and the spray zone have upper and lower layers of conveying rollers. Water-blocking components are installed at both the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveying rollers. A side groove 143 is located on the side of the spray zone and the cleaning zone. The upper part of the side groove 143 is used to place a guiding and conveying assembly, and its bottom is used for drainage and return water. An ultrasonic assembly is vertically installed within the cleaning tank. The upper and lower conveyor rollers are respectively set at both ends on the vertical support limit plate. One end of the upper and lower conveyor rollers is connected to the bearing, and the other end is inserted through the vertical support limit plate and connected to the main drive hexagonal shaft in the guide transmission assembly to realize transmission.

[0028] The cleaning tank uses a main drive hexagonal shaft 126. The two ends of the main drive hexagonal shaft 126 are connected to the output ends of drive motor A138 and drive motor B, respectively. Drive motor A138 and drive motor B are respectively located outside the two ends of the cleaning tank.

[0029] The drive motor A138 is mounted below the cleaning tank via the drive motor mounting plate 130. The output end of the drive motor A138 is connected to the drive sprocket 131. The drive sprocket 131 and the drive driven sprocket 133 are connected via the drive chain 132. The drive driven sprocket 133 is mounted on the outer wall of the cleaning tank via the sprocket fixing support plate 134. The drive driven sprocket 133 is connected to the main drive hexagonal shaft 126.

[0030] Drive motor B is mounted below the cleaning tank via a drive motor mounting plate. The output end of drive motor B is connected to the drive drive wheel. The drive drive wheel and the driven drive wheel are connected via a chain. The driven drive wheel is mounted on the outer wall of the cleaning tank via a sprocket mounting plate. The driven drive wheel is connected to the main drive hexagonal shaft 126.

[0031] The upper and lower conveyor rollers are an upper conveyor roller 114 and a lower conveyor roller 115, respectively. The upper conveyor roller 114 is located above the lower conveyor roller 115. The guiding and transmission assembly includes a main drive hexagonal shaft 126, on which several driving bevel gears 127 are mounted. The driving bevel gears 127 mesh with driven bevel gears 128. The driving bevel gears 127 and driven bevel gears 128 are arranged perpendicularly to each other, with the driving bevel gears 127 vertically positioned and the driven bevel gears 128 horizontally positioned. One end of the upper conveyor roller 114 is connected to the driven gear 129, and one end of the lower conveyor roller 115 is connected to the driving gear 140. The driven gear 129 meshes with the driving gear 140, and the driven bevel gear 128 is located at the front end of the driving gear 140. The driving gear 140 and the driven bevel gear 128 are mounted on a spindle 11501.

[0032] The main drive hexagonal shaft 126 is set in the side groove 143 through several main drive support seats 125, and the two ends of the main drive hexagonal shaft 126 extend out of the two ends of the cleaning groove.

[0033] The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B. Vertical support limiting plate B is located on the side adjacent to the guide and transmission assembly. Vertical support limiting plates A and B face each other. Vertical support limiting plate A includes a lower upright plate 146 and an upper upright plate 147. The upper upright plate 147 is located above the lower upright plate 146 and has several grooves. The distance between any two adjacent grooves is the same as the width of the ultrasonic transducer 137. Insert blocks 156 and blocking blocks 148 are installed in the grooves. Insert blocks 156 are located above the blocking blocks 148. The circular channel formed between the insert blocks 156 and the grooves allows the spindle 11501 of the lower conveying roller 115 to pass through. The circular channel formed between the bottom of the blocking blocks 148 and the insert blocks 156 allows the spindle 11501 of the lower conveying roller 115 to pass through. The upper plate is adjusted and connected to the lower plate by several adjusting bolts.

[0034] Drainage openings are provided on the lower upright plate 146 of vertical support limit plate A and vertical support limit plate B according to specific working conditions.

[0035] When the ultrasonic conveying device is used for surfactant cleaning of silicon wafers, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. When the ultrasonic conveying device is used for oxidation cleaning and rinsing cleaning of silicon wafers, the height of the vertical support limiting plate A is the same as the height of the vertical support limiting plate B.

[0036] A temperature sensor A136 and a liquid level float switch C142 are also installed on the vertical support limiting plate B. The temperature sensor A136 and the liquid level float switch C142 are arranged side by side. The temperature sensor A136 is connected to the vertical support limiting plate B through the temperature sensor fixing bracket 141, and the liquid level float switch C142 is connected to the vertical support limiting plate B through the liquid level float switch C142 fixing bracket.

[0037] The upper conveyor roller 114 includes a spindle 11501, on which several pressure components are arranged at equal intervals. Each pressure component includes a conveyor pressure ring 11502 and a limiting ring 11503, with a limiting ring 11503 at each end of the conveyor pressure ring 11502. The spindle 11501 is made of stainless steel. The conveyor pressure ring 11502 is made of PVDF material.

[0038] The lower conveyor roller 115 is a PP roller with an internal spindle 11501 and an outer circumference made of PP material. The spindle 11501 is a stainless steel shaft.

[0039] The ultrasonic component is located inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets 107, and several ultrasonic transducers 137 are arranged on the ultrasonic brackets 107. The ultrasonic transducers 137 are arranged continuously, and an ultrasonic groove 109 is arranged between two adjacent ultrasonic transducers 137. The spindles 11501 of the upper conveying roller 114 and the lower conveying roller 115 pass through the ultrasonic grooves 109 and are inserted into the vertical support limiting plate A or the vertical support limiting plate B.

[0040] A commercially available ultrasonic transducer 139 is installed inside the ultrasonic transducer box 137; an ultrasonic connecting tube 151 is preferably also provided on the top of the ultrasonic transducer box 137 for connection with an ultrasonic generator.

[0041] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. The water-blocking components near the spray zone include an upper water-blocking roller A110 and a lower water-blocking roller 116. The upper water-blocking roller A110 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank. The water-blocking components at the other end include an upper water-blocking roller B111 and a lower water-blocking roller 116. The upper water-blocking roller B111 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank.

[0042] The upper water-blocking rollers A110 and B111 are made of stainless steel mandrels with polypropylene sleeves on the outside, and PP sponge is then placed on the outside of the polypropylene sleeves. The lower water-blocking roller 116 is made of stainless steel mandrels with polypropylene sleeves on the outside.

[0043] The outer diameters of the upper water-blocking rollers A110 and B111 are larger than the outer diameter of the upper conveying roller 114, and the outer diameter of the lower water-blocking roller 116 is larger than the outer diameter of the lower conveying roller 115.

[0044] When the cleaning tank is used for cleaning silicon wafers with surfactants or oxidation with oxidants, the upper water-blocking rollers A110 and B111 are set at the same height. When the cleaning tank is used for rinsing, the height of the upper water-blocking roller A110 is lower than the height of the upper water-blocking roller B111.

[0045] The spray assembly 103 is connected to the cleaning spray water tank 102 via the cleaning spray area inlet pipe 104.

[0046] In the cleaning tank, among the two water-blocking plates 117 located in the opposite direction of the spray zone, the water-blocking area formed by the water-blocking plate 117 and the partition has a cleaning drain outlet B150 at its bottom. Near the spray assembly 103, in the water-blocking area formed by the water-blocking plate 117 and the partition, a cleaning drain outlet A144 is provided at its bottom. Cleaning drain outlets B150 and A144 are connected to the side groove 143.

[0047] A cleaning tank outlet 120 is installed on the partition plate away from the spray area on the cleaning tank.

[0048] When the cleaning tank is used to clean silicon wafers with surfactants, the cleaning tank also includes a cleaning tank bottom plate 153. A bottom water inlet pipe is installed on the cleaning tank bottom plate 153, which is connected to the cleaning water inlet tank 101. The bottom water inlet pipe is connected to several bottom cleaning nozzles 155, which are perpendicular to the bottom water inlet pipe. Several bottom cleaning nozzles 154 are installed on the bottom cleaning nozzles 155, which are mounted on the cleaning tank bottom plate 153 by cleaning pipe clamps 152. The bottom cleaning nozzles 155 are arranged parallel to the partition, and the nozzles of the bottom cleaning nozzles 155 are positioned with the gap between the upper conveying roller 114 and the lower conveying roller 115. The cleaning tank bottom plate 153 is also provided with a main cleaning water inlet, which is connected to the cleaning water inlet tank 101 through a bottom main water inlet pipe. A cleaning water inlet valve 112 is installed on the bottom main water inlet pipe. The bottom main water inlet pipe is connected to the cleaning water inlet tank 101 via the main water inlet pipe 122. The bottom cleaning water inlet main pipe is connected to the cleaning water inlet tank 101 via the auxiliary spray branch pipe. The cleaning water inlet tank 101 is connected to the bottom cleaning water inlet main pipe in sequence via the main water inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray branch pipe.

[0049] When the cleaning tank is used for oxidation / rinsing, the bottom cleaning nozzle 155 and the side cleaning spray pipe 105 are not installed on the bottom plate 153 of the cleaning tank.

[0050] The bottom plate 153 of the cleaning tank is also connected to a drain pipe 124 for drainage. A pneumatic diaphragm valve A123 is installed on the drain pipe 124.

[0051] The upper conveying roller 114 and the lower conveying roller 115 do not contact the ultrasonic component.

[0052] A through hole is provided in the middle of the partition in the side groove 143 area of ​​the spray zone and the cleaning zone to guide the transmission component through.

[0053] The spray assembly 103 is disposed between two partitions. The outer partition has a cleaning tank inlet 10301, and the inner partition has a spray assembly 103 outlet. The inner partition is used to separate the spraying area and the cleaning area. The spray assembly 103 is separated from the lower part of the side groove 143 by a vertical support limiting plate B. However, a cleaning spray drain outlet 145 is provided below the vertical support limiting plate B in the area of ​​the spray assembly 103. A cleaning spray drain pipe is provided on the outer wall of the side groove 143 corresponding to the spray assembly 103. The cleaning spray drain pipe is connected to the cleaning spray drain pipe 106 to realize drainage in the area of ​​the spray assembly 103.

[0054] The spray assembly 103 includes an upper spray pipe 10304 and a lower spray pipe 10306. The upper spray pipe 10304 is positioned above the lower spray pipe 10306. The upper spray pipe 10304 and the lower spray pipe 10306 are connected by a spray connecting pipe. Both the upper spray pipe 10304 and the lower spray pipe 10306 are provided with a plurality of nozzles A10303. A baffle plate 10316 is provided at the front end of the upper spray pipe 10304. A plurality of fiber optic sensors 10308 are provided on the baffle plate 10316. A lower spray baffle plate 10310 is provided at the front end of the lower spray pipe 10306.

[0055] Several fiber optic sensors 10308 are mounted on the baffle plate 10316 via sensor mounting brackets 10307.

[0056] The water baffle 10316 is connected to the spray pipe bracket 10317. The water baffle 10316 has a Z-shaped structure, with its bottom and top plates angled for waterproofing. The lower spray baffle 10310 is installed on the bottom surface of the spray zone floor plate. The lower spray baffle 10310 has a Z-shaped structure, with its bottom and top plates angled for waterproofing.

[0057] The lower spray pipe 10306 is mounted on the bottom surface of the spray area base plate via the lower spray pipe mounting base 10305. The upper spray pipe 10304 is fixed to the spray pipe bracket 10317 above it via U-shaped pipe clamps 10309. The nozzle A10303 on the upper spray pipe 10304 is set downwards, and the nozzle A10303 on the lower spray pipe 10306 is set upwards.

[0058] The top of the spray assembly 103 is covered with a spray hood 10302, and a spray gripper is provided on the top surface of the spray hood 10302.

[0059] The spray pipe bracket 10317 is fixed on the cleaning frame.

[0060] The upper spray pipe 10304, the lower spray pipe 10306, and the spray connecting pipe are in a U-shaped structure. The upper spray pipe 10304 is also provided with a spray pipe water inlet pipe 10314 at the end that is not connected to the spray connecting pipe. The spray pipe water inlet pipe 10314 is set vertically and is connected to the water inlet pipe 104 of the cleaning spray area.

[0061] A manual ball valve 10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the water inlet pipe 104 of the cleaning spray area, in the direction of water inlet.

[0062] In practical applications, a cleaning inlet water tank 101 and a cleaning spray water tank 102 are also provided to achieve cleaning of the cleaning tank. An overflow guide pipe 135 is also provided at the front end of the side tank 143 located in the cleaning area. The overflow guide pipe 135 is connected to the return pipe 10105 of the cleaning inlet water tank 101 to achieve water return. The overflow guide pipe 135 and the return pipe 10105 together form a return flow guide component, ensuring stable water return.

[0063] When used in the cleaning tank, surface additives are added for cleaning the silicon wafers of workpiece 7. During actual cleaning, the cleaning spray side pipe 105 is set above the vertical support limiting plate A. The cleaning spray side pipe 105 sprays water, spraying the foam floating on the upper layer toward the side of the vertical support limiting plate B. The vertical support limiting plate A is higher than the vertical support limiting plate B. The foam is washed into the side groove 143 by the spray, thus removing the foam.

[0064] Several nozzles B10501 are installed on the cleaning spray side pipe 105.

[0065] The cleaning spray side pipe 105 is connected to the cleaning inlet water tank 101 via an auxiliary spray side pipe. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 in sequence via the main inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray side pipe. An auxiliary spray water valve 113 is installed on the auxiliary spray pipe.

[0066] The cleaning inlet water tank 101 and the cleaning spray water tank 102 are located below the cleaning tank. The cleaning inlet water tank 101 is connected to the bottom of the cleaning tank to supply water to the cleaning tank. The cleaning inlet water tank 101 is connected to the side of the cleaning tank to allow water to flow back. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 on the side of the cleaning tank to enable side spraying. The cleaning spray water tank 102 is connected to the spray assembly to supply water to the spray area. The cleaning tank is mounted on the cleaning frame 121.

[0067] The cleaning water inlet tank 101 includes a cleaning water inlet tank body 10111. A heating rod A10101 is installed at the bottom of the cleaning water inlet tank body 10111. A return chamber A10108 is installed above the heating rod A10101. The upper part of one end of the return chamber A10108 is connected to the return pipe 10105. The bottom of the other end of the return chamber A10108 is connected to the bottom of the cleaning water inlet tank body 10111 through a filter bag A10110. The filter bag A10110 is installed on the bottom surface of the return chamber A10108 through a pressure ring 10109.

[0068] A cleaning water pump 108 is installed on the side of the cleaning water inlet tank 101, and the cleaning water pump 108 is connected to the water outlet of the cleaning water inlet tank 101. The cleaning water pump 108 is installed on the main water inlet pipe 122.

[0069] A removable water tank baffle 10112 is also installed on the side wall of the cleaning water inlet tank 10111.

[0070] The cleaning water inlet tank 101 is also equipped with a temperature and liquid level sensor 10107. The temperature and liquid level sensor 10107 is inserted from the top of the cleaning water inlet tank 10111 and is located in the lower part of the cleaning spray water tank 102, but does not contact the bottom surface. A liquid level float switch A118 is also installed in the lower part of the cleaning water inlet tank 101.

[0071] The top surface of the cleaning inlet tank 10111 is also provided with a top cover A10106, which is located above the filter bag A10110 in the return chamber A10108.

[0072] A cleaning water inlet tank drain port 10102 is provided on the bottom side of the cleaning water inlet tank body 10111. The cleaning water inlet tank drain port 10102 is connected to the cleaning water inlet tank drain pipe. A pneumatic diaphragm valve B10104 is provided on the cleaning water inlet tank drain pipe.

[0073] An overflow drain pipe A10103 is also connected to the upper side of the cleaning inlet tank 10111.

[0074] The cleaning spray tank 102 includes a cleaning spray tank body, on which a cleaning spray water pump is installed. The cleaning spray water pump is vertically mounted and partially inserted into the cleaning spray tank body. The cleaning spray water pump is connected to a vertical pump outlet pipe 10205 within the cleaning spray tank body. The vertical pump outlet pipe 10205 extends out of the top surface of the cleaning spray tank body and is configured to connect to the cleaning spray zone inlet pipe 104. A return chamber B10204 is also provided at the upper part of the cleaning spray tank body. A return water inlet is provided on the upper side of the return chamber B10204 for water return. The bottom of the return chamber B10204 is connected to the bottom of the cleaning spray tank body through a filter bag B10208. The filter bag B10208 is mounted on the bottom surface of the return chamber B10204 through a pressure ring 10109. A filter basket 10209 is fitted over the filter bag. The upper part of the filter basket 10209 is set on the bottom surface of the reflux chamber B10204 via a pressure ring 10109.

[0075] The top surface of the cleaning spray box is also equipped with a top cover B10202, which is located above the filter bag B10208 in the return chamber B10204.

[0076] The lower part of the cleaning spray tank 102 is also equipped with two liquid level switches 10207, which are liquid level float switches B119.

[0077] The cleaning spray water pump is connected to the cleaning spray box via a vertical pump mounting base 10203.

[0078] A cleaning spray tank drain outlet is provided on the bottom side of the cleaning spray tank. The cleaning spray tank drain outlet is connected to the cleaning spray tank drain pipe. A pneumatic diaphragm valve C10206 is installed on the cleaning spray tank drain pipe.

[0079] An overflow drain pipe B10201 is also connected to the upper side of the cleaning spray tank 102.

[0080] Example 2 Two devices can be set up in Embodiment 1, either side by side or in an upper and lower layer. When the upper and lower layers are set up, the cleaning inlet water tank 101 and the cleaning spray water tank 102 can share the lower layer.

[0081] This utility model also includes a PLC control system. The cleaning inlet water tank 101, cleaning spray water tank 102, spray assembly 103, cleaning water pump 108, cleaning spray water pump, cleaning inlet water valve 112, auxiliary spray water valve 113, level float switch A118, level float switch B119, pneumatic diaphragm valve A123, temperature sensor A136, ultrasonic generator, drive motor A138, level float switch C142, cleaning bottom nozzle 154, drive motor B, heating rod A10101, pneumatic diaphragm valve B10104, temperature and level sensor 10107, pneumatic diaphragm valve C10206, nozzle A10303, fiber optic sensor 10308, pressure gauge 10311, temperature sensor B10312, and nozzle B10501 are all connected to the PLC control system. None of these components are limited to a specific model; the goal is to achieve their intended function.

[0082] In practice, the silicon wafers are fed into the cleaning tank from the existing feeding device. Driven by motors A138 and B, the main drive hexagonal shaft 126 is driven simultaneously, which in turn sequentially rotates the driving bevel gear 127, driven bevel gear 128, driving gear 140, and driven gear 129. This, in turn, drives the silicon wafers 7 through the gap between the upper and lower conveyor rollers. Meanwhile, a vertically positioned ultrasonic component performs ultrasonic cleaning. The silicon wafers are cleaned, oxidized, or rinsed in the cleaning tank. For cleaning, the silicon wafers first enter the spray assembly 103 in the spray zone, and the fiber optic sensor 10308 provides feedback on the silicon wafer's arrival signal. The PLC control system issues a working command to the cleaning spray tank 102. Nozzles 10303 spray water onto the silicon wafer from both above and below. The sprayed water drains along the bottom of the side groove 143 corresponding to the spray area, passing through the cleaning spray drain pipe and cleaning spray drain pipe 106 located on the outer wall. After spraying, the silicon wafer passes through a two-layer conveyor roller, between the upper cleaning water-blocking roller A110 and the lower cleaning water-blocking roller 116, and then enters the cleaning area for cleaning. The surfactant solution in the cleaning area cleans the silicon wafer. The height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. The side spraying device in the cleaning tank blows the top layer of foam towards the side groove 143. The foam flows into the side groove and back into the cleaning inlet water tank 101, where it can be discharged through the overflow drain pipe A10103. The spraying device at the bottom of the cleaning mechanism 1 removes small air bubbles from the silicon wafer. During oxidation, side spraying and bottom spraying are not involved. The spray assembly performs the spraying, and its conveying, ultrasonic, and water-blocking functions are integrated with the cleaning process. During rinsing, the water flow direction is opposite to the silicon wafer flow direction, and the height of the upper water-blocking roller B111 during rinsing is greater than the height of the upper water-blocking roller A110. This reverse rinsing method ensures better rinsing results.

[0083] The embodiments described above are merely preferred embodiments of this utility model, and not all feasible embodiments of this utility model. For those skilled in the art, any obvious modifications made without departing from the principles and spirit of this utility model should be considered to be included within the scope of protection of the claims of this utility model.

Claims

1. A novel ultrasonic conveying device for silicon wafer cleaning, characterized in that, The system includes a cleaning tank with a partition at each end. The partition has a long through hole for transporting silicon wafers. The cleaning tank contains a spray zone and a cleaning zone. A partition is set between the cleaning zone and the spray zone. The partition has a channel groove for the silicon wafers to pass through. The spray zone is equipped with a spray assembly (103) for spraying the silicon wafers. After spraying, the silicon wafers enter the cleaning zone for cleaning / oxidation / rinsing. Both the cleaning zone and the spray zone are equipped with upper and lower layers of conveying rollers. Water blocking components are set at the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveying rollers. The cleaning tank is equipped with a side groove (143) located on the side of the spray zone and the cleaning zone. The upper part of the side groove (143) is used to place the guide and transfer assembly, and the bottom is used for drainage and return water. An ultrasonic assembly is vertically installed in the cleaning tank. The upper and lower conveyor rollers are respectively set at both ends on the vertical support limit plate. One end of the upper and lower conveyor rollers is connected to the bearing, and the other end is inserted through the vertical support limit plate and connected to the main drive hexagonal shaft in the guide transmission assembly to realize transmission.

2. The novel ultrasonic conveying device for silicon wafer cleaning as described in claim 1, characterized in that, The cleaning tank uses a main drive hexagonal shaft (126). The two ends of the main drive hexagonal shaft (126) are connected to the output ends of drive motor A (138) and drive motor B, respectively. Drive motor A (138) and drive motor B are respectively set outside the two ends of the cleaning tank. Drive motor A (138) is set below the cleaning tank through drive motor mounting plate (130). The output end of drive motor A (138) is connected to drive drive sprocket (131). Drive drive sprocket (131) and drive driven sprocket (133) are connected through drive chain (132). Drive driven sprocket (133) is set on the outer wall of the cleaning tank through sprocket fixing support plate (134). Drive driven sprocket (133) is connected to the main drive hexagonal shaft (126). The drive motor B is mounted below the cleaning tank via a drive motor mounting plate. The output end of the drive motor B is connected to the drive drive wheel. The drive drive wheel and the driven wheel are connected via a chain. The driven wheel is mounted on the outer wall of the cleaning tank via a sprocket mounting plate. The driven wheel is connected to the main drive hexagonal shaft (126).

3. The novel ultrasonic conveying device for silicon wafer cleaning as described in claim 1, characterized in that, The upper and lower conveyor rollers are an upper conveyor roller (114) and a lower conveyor roller (115), respectively. The upper conveyor roller (114) is located above the lower conveyor roller (115). The guide transmission assembly includes a main drive hexagonal shaft (126), on which several driving bevel gears (127) are mounted. The driving bevel gears (127) mesh with driven bevel gears (128). The driving bevel gears (127) and driven bevel gears (128) are arranged perpendicular to each other. The bevel gear (127) is set vertically, and the driven bevel gear (128) is set horizontally; one end of the upper conveying roller (114) is connected to the driven gear (129), and one end of the lower conveying roller (115) is connected to the driving gear (140). The driven gear (129) meshes with the driving gear (140), and the driven bevel gear (128) is set at the front end of the driving gear (140). The driving gear (140) and the driven bevel gear (128) are set on a mandrel (11501).

4. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 1, characterized in that, The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B; vertical support limiting plate B is disposed on the side adjacent to the guide transmission component, and vertical support limiting plate A and vertical support limiting plate B are disposed facing each other. Vertical support limiting plate A includes a lower upright plate (146) and an upper upright plate (147); the upper upright plate (147) is disposed above the lower upright plate (146), and a plurality of grooves are provided on the upper upright plate (147), the distance between each two adjacent grooves being equal to the distance between the grooves. The ultrasonic transducer (137) has the same width; a plug (156) and a block (148) are provided in the groove; the plug (156) is located above the block (148), and the circular channel formed between the plug (156) and the groove is used for the passage of the spindle (11501) of the lower conveying roller (115); the circular channel formed between the bottom of the block (148) and the plug (156) is used for the passage of the spindle (11501) of the lower conveying roller (115).

5. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 3, characterized in that, The outer side of each water-blocking component is provided with an upper conveying roller (114) and a lower conveying roller (115); the water-blocking components near the spray area include an upper water-blocking roller A (110) and a lower water-blocking roller (116). The upper water-blocking roller A (110) is positioned above the lower water-blocking roller (116), and a water-blocking plate (117) is tangentially positioned below the lower water-blocking roller (116). The water-blocking plate (117) is vertically positioned on the bottom plate (153) of the cleaning tank; the water-blocking components at the other end include an upper water-blocking roller B (111) and a lower water-blocking roller (116). The upper water-blocking roller B (111) is positioned above the lower water-blocking roller (116), and a water-blocking plate (117) is tangentially positioned below the lower water-blocking roller (116). The water-blocking plate (117) is vertically positioned on the bottom plate (153) of the cleaning tank.

6. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 3, characterized in that, The upper conveying roller (114) includes a spindle (11501), and a number of pressing components are arranged on the spindle (11501). The pressing components are arranged at equal intervals. The pressing components include a conveying pressure ring (11502) and a limiting ring (11503). A limiting ring (11503) is arranged at each end of the conveying pressure ring (11502).

7. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 4, characterized in that, When the ultrasonic conveying device is used for cleaning silicon wafers with surfactants, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B; when the ultrasonic conveying device is used for oxidative cleaning and rinsing cleaning of silicon wafers, the height of the vertical support limiting plate A is the same as the height of the vertical support limiting plate B.

8. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 4, characterized in that, Temperature sensor A (136) and liquid level float switch C (142) are also installed on the vertical support limiting plate B. Temperature sensor A (136) and liquid level float switch C (142) are arranged side by side. Temperature sensor A (136) is connected to vertical support limiting plate B through temperature sensor fixing bracket (141). Liquid level float switch C (142) is connected to vertical support limiting plate B through liquid level float switch C (142) fixing bracket.

9. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 4, characterized in that, The ultrasonic component is set inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets (107), and several ultrasonic transducers (137) are set on the ultrasonic brackets (107). The several ultrasonic transducers (137) are set continuously. An ultrasonic groove (109) is set between two adjacent ultrasonic transducers (137). The spindles (11501) of the upper conveying roller (114) and the lower conveying roller (115) pass through the ultrasonic groove (109) and are inserted into the vertical support limiting plate A or the vertical support limiting plate B.

10. A novel ultrasonic conveying device for silicon wafer cleaning as described in claim 5, characterized in that, The outer diameters of the upper water-blocking rollers A (110) and B (111) are larger than the outer diameter of the upper conveying roller (114), and the outer diameter of the lower water-blocking roller (116) is larger than the outer diameter of the lower conveying roller (115). When the cleaning tank is used for cleaning silicon wafers with surfactants and oxidation with oxidants, the upper water-blocking rollers A (110) and B (111) are set at the same height. When the cleaning tank is used for rinsing, the height of the upper water-blocking rollers A (110) is lower than the height of the upper water-blocking rollers B (111).

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