Automated conveyor line for substrate bonding

Abstract

An automatic conveying line for substrate bonding includes a conveying line body, one end of the conveying line body is connected to a feeding station; a rotating mechanism is arranged on the conveying line body, the number of the rotating mechanism is one or more, one bonding equipment is arranged on both sides or one side of the conveying line body corresponding to each rotating mechanism, the rotating mechanism is used for docking with the feeding and discharging port of the bonding equipment, and the tray is conveyed between the bonding equipment and the conveying line body; a first blowing mechanism is located between the feeding station and the feeding station; a second blowing mechanism is located downstream of the last rotating mechanism along the conveying direction of the conveying line body; a first information detection device is arranged on the conveying line body and located between the first blowing mechanism and the feeding station, and is used for acquiring information of a substrate on a tray entering the conveying line body; a second information detection device is arranged on the rotating mechanism and is used for detecting whether the substrate in the tray on the rotating mechanism is bonded, the full-process automatic operation of the substrate from feeding to bonding is realized, and the bonding efficiency of the substrate is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device manufacturing technology, and in particular to an automated conveyor line for substrate bonding. Background Technology

[0002] IGBT (Insulated Gate Bipolar Transistor) is a core device for energy conversion and transmission, widely used in rail transportation, smart grids, aerospace, electric vehicles, and new energy equipment. In the manufacturing process of IGBT modules, the bonding step involves wire bonding to connect the chips on the substrate to each other and to each substrate, forming a complete circuit structure.

[0003] Substrate bonding processes have extremely high precision requirements. Multiple processes are needed to complete substrate bonding before and after bonding. Currently, most bonding conveyor lines are semi-automatic or manual, and they mostly use simple conveyor belt structures to complete substrate transportation and post-bonding transportation. This cannot meet the growing production needs of semiconductor devices. Utility Model Content

[0004] In response to the shortcomings of the existing production technology, the applicant provides an automated conveyor line for substrate bonding, thereby realizing the fully automated operation of the substrate from feeding to bonding and improving the bonding efficiency of the substrate.

[0005] The technical solution adopted in this utility model is as follows:

[0006] An automated conveyor line for substrate bonding includes,

[0007] A conveyor line for conveying trays that carry substrates, with one end of the conveyor line connected to a loading station;

[0008] A rotating mechanism is provided on the conveyor line, and there are one or more units. A bonding device is provided on both sides or one side of the conveyor line corresponding to a single rotating mechanism. The rotating mechanism is used to connect with the inlet and outlet of the bonding device to transport the tray between the bonding device and the conveyor line.

[0009] A first purging mechanism is provided on the conveyor line, located at the loading station and between the loading station, and is used to purge the substrate on the tray.

[0010] The second purging mechanism is located on the conveyor line, downstream of the last rotating mechanism along the conveying direction of the conveyor line, and is used to purge the substrate on the tray.

[0011] A first information detection device is installed on the conveyor line, located between the first blowing mechanism and the loading station, and is used to acquire information about the substrate on the tray entering the conveyor line.

[0012] A second information detection device, located on the rotating mechanism, is used to detect whether the substrate in the tray on the rotating mechanism is bonded.

[0013] As a further improvement to the above technical solution:

[0014] The rotating mechanism includes a rotating bracket rotatably mounted on the frame of the conveyor line, a first conveyor fixedly mounted at the upper end of the rotating bracket, and a first driver fixedly mounted on the frame. The first driver is pulsatorically connected to the rotating bracket and is used to drive the rotating bracket to rotate, so that the first conveyor is connected to the conveyor line or to the bonding device. The second information detection device is fixedly mounted on the rotating bracket.

[0015] A connecting lifting mechanism is provided between the rotating mechanism and the bonding device, and the connecting lifting mechanism connects the rotating mechanism and the bonding device.

[0016] The connecting lifting mechanism includes:

[0017] A lifting drive assembly is fixedly connected to the frame of the conveyor line;

[0018] The second and third conveyors are fixedly installed on the movable end of the lifting drive assembly. The second and third conveyors have opposite conveying directions and are horizontal. The second conveyor is located directly above the third conveyor.

[0019] The lifting drive assembly is used to drive the second conveyor and the third conveyor to rise or fall together, so that the second conveyor can be connected to the feed inlets of the rotating mechanism and the bonding equipment respectively, and the third conveyor can be connected to the feed inlets of the rotating mechanism and the bonding equipment respectively.

[0020] Adsorption fixtures are provided in the bonding equipment, the first purging mechanism, and the second purging mechanism. The adsorption fixtures include:

[0021] Lifting mechanism;

[0022] A suction cup mounting base is fixed to the moving end of the lifting mechanism;

[0023] A suction cup assembly is fixed on a suction cup mounting base. The suction cup assembly is provided with multiple adsorption parts corresponding to the substrate, and each adsorption part is provided with a suction port.

[0024] A vacuum system is connected to the suction port;

[0025] The lifting mechanism drives the suction cup assembly to rise and fall. The suction part passes through the through hole on the tray and contacts the substrate. Under the action of the vacuum system, the substrate is vacuum-adsorbed through the suction port, and the substrate is fixed on the suction part.

[0026] The first information detection device includes:

[0027] Material inspection equipment is used to inspect whether the substrates on the trays from the loading station meet the bonding requirements;

[0028] A robotic arm, positioned on one side of the conveyor line, is used to remove substrates that do not meet bonding requirements from the tray;

[0029] Before bonding, the vacuum pump of the vacuum system is connected to the suction port of the adsorption part with the substrate on the tray, according to the position of the substrate on the tray.

[0030] Each adsorption part on the suction cup assembly is connected to an adsorption channel, and the adsorption channel is connected to the suction port on the corresponding adsorption part.

[0031] The vacuum system includes the vacuum pump, as well as connecting pipes corresponding to the adsorption channels and two-position five-way solenoid valves.

[0032] The connecting pipeline connects the adsorption channel to port B of the two-position five-way solenoid valve. Ports A and R of the two-position five-way solenoid valve are normally closed. Port P of the two-position five-way solenoid valve is connected to the air inlet of the vacuum pump, and port S of the two-position five-way solenoid valve is connected to the atmosphere.

[0033] The first information detection device also includes a positioning mechanism, which includes a second linear driver. A lifting positioning structure is fixedly installed at the output end of the second linear driver, and the second linear driver is used to drive the lifting positioning structure to move up and down.

[0034] The lifting and positioning structure rises and cooperates with the pallet located above it, causing the pallet to detach from the conveyor line and determining the relative position of the pallet and the robotic arm. After the lifting and positioning structure descends and detaches from the pallet, the pallet is located on the conveyor line.

[0035] The first purging mechanism and the second purging mechanism have the same structure.

[0036] The first purging mechanism includes:

[0037] An air knife is fixedly mounted on one side of the conveyor line.

[0038] A dust suction port is fixedly located on the other side of the conveyor line, and a dust suction port is connected to a vacuum cleaner.

[0039] The tray is located between the air knife and the suction port. When the substrate is fixed to the adsorption part, the air knife blows the surface of the substrate, and the suction port absorbs the air passing through the substrate.

[0040] A shaping mechanism is installed at the conveyor line corresponding to the first purging mechanism, the shaping mechanism comprising:

[0041] A shaping plate is located above the conveyor line and is fixedly connected to the frame of the conveyor line.

[0042] After the substrate is fixed on the adsorption part, the lifting mechanism continues to drive the suction cup mounting base to move upward, so that the upper surface of the substrate comes into contact with the shaping pressure plate, and the substrate is clamped and shaped from both sides by the shaping pressure plate and the adsorption part.

[0043] The beneficial effects of this utility model are as follows:

[0044] This utility model features a compact and reasonable structure and is easy to operate. By arranging bonding equipment opposite to each other on both sides of the conveyor line and connecting the bonding equipment and the conveyor line through a rotating mechanism, a second information detection device is installed on the rotating mechanism. A first purging mechanism and the first information detection device are installed upstream of the multiple bonding equipment, and a second purging mechanism is installed downstream of the multiple bonding equipment. This achieves fully automated operation of auxiliary processes and bonding in the substrate bonding production line, optimizes the layout of the bonding production line, integrates multiple bonding equipment, and improves the bonding efficiency of the substrate.

[0045] This utility model also has the following advantages:

[0046] (1) By setting up a connecting lifting mechanism with two layers of conveyors between the rotating mechanism and the bonding equipment, the conveying of the already bonded pallets and the pallets waiting to be bonded can be realized in layers, and the pallets can be temporarily stored on the connecting lifting mechanism, thereby improving the pallet handling cycle of the conveyor line and improving the production efficiency of the production line.

[0047] (2) The tray with the hollow structure is used to fix the substrate on the adsorption part of the adsorption fixture by vacuum adsorption from below. The substrate is fixed by utilizing the space below the conveyor line. The operation is convenient and easy to automate.

[0048] (3) Set up material detection equipment and robotic arms at the conveyor line in front of the bonding equipment. Before the tray enters the bonding equipment, the substrates that do not meet the bonding requirements are rejected. Before bonding, control the vacuum pump of the vacuum system to only connect to the suction port of the adsorption part with the substrate above, and selectively vacuum adsorb and fix it. This realizes the automatic rejection of substrates that do not meet the requirements before bonding, and the tray can enter the bonding equipment in a state of not being full. No manual intervention is required, which improves automation efficiency and production efficiency.

[0049] (4) By closing two positions of the two-position five-way solenoid valve (ports A and R are normally closed) and connecting the remaining three positions to the adsorption channel, the atmosphere and the vacuum pump, the two-position five-way solenoid valve is activated so that ports P and S are intermittently connected to port B, thereby switching the connection between the adsorption channel and the atmosphere and the vacuum pump. At the same time, the vacuum pump's evacuation effect is not affected when the adsorption channel is connected to the atmosphere. A single solenoid valve is used to control the suction port for different vacuum adsorption requirements, thereby selectively evacuating the suction port of different adsorption parts. This allows for selective vacuum adsorption and fixation based on the position of the substrate on the tray. It also enables the switching between evacuation and evacuation states of the suction port, eliminating the need for frequent start-stop of the vacuum pump and simplifying the control pipeline. This reduces the number of moving parts and improves the reliability of the vacuum system. Attached Figure Description

[0050] Figure 1 This is a schematic diagram of the structure of this utility model.

[0051] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0052] Figure 3 This is a schematic diagram of the rotating mechanism of this utility model.

[0053] Figure 4 This is a schematic diagram of the connecting lifting mechanism of this utility model.

[0054] Figure 5 This is the front view of the connecting lifting mechanism of this utility model.

[0055] Figure 6 This is a schematic diagram of the structure of the first information detection device of this utility model.

[0056] Figure 7 This is the front view of the first information detection device of this utility model.

[0057] Figure 8 This is a schematic diagram of the adsorption fixture of this utility model.

[0058] Figure 9 This is a schematic diagram of the vacuum system of this utility model.

[0059] Figure 10 This is a schematic diagram of the structure of the second purging mechanism of this utility model.

[0060] Figure 11 This is a top view of the second purging mechanism of this utility model.

[0061] Figure 12 This is a schematic diagram of the structure of the first purging mechanism of this utility model.

[0062] Figure 13 This is a front view of the first purging mechanism of this utility model.

[0063] Figure 14 This is a schematic diagram of the structure of the shaping pressure plate of this utility model.

[0064] in:

[0065] 1. Material loading station;

[0066] 2. First information detection equipment; 21. Robotic arm; 22. Material detection equipment; 23. Limiting plate; 24. Material rack; 25. Lifting and positioning structure; 26. Second linear actuator;

[0067] 3. First blowing mechanism; 31. Air knife; 32. Dust suction port; 33. Clearance passage; 34. Shaping pressure plate; 342. Pressure point;

[0068] 4. Rotating mechanism; 41. Second information detection equipment; 42. First conveyor; 43. Rotating bracket;

[0069] 5. Connecting lifting mechanism; 51. Second conveyor; 52. Third conveyor; 53. Lifting drive assembly; 531. Sliding frame; 532. Lead screw; 533. Second driver;

[0070] 6. Bonding equipment; 7. Second purging mechanism; 8. Conveyor line;

[0071] 9. Adsorption fixture; 91. Lifting mechanism; 911. Lifting bracket; 912. First linear actuator;

[0072] 92. Suction cup mounting base;

[0073] 93. Suction cup assembly; 931. Adsorption section; 9310. Suction port; 9311. Adsorption channel;

[0074] 94. Vacuum system;

[0075] 941, connecting pipes; 9411, vacuum gauge;

[0076] 942, Two-position five-way solenoid valve; 9421, Port B; 9422, Port A; 9423, Port S; 9424, Port P; 9425, Port R;

[0077] 943. Gas source; 944. Sealing end; 945. Vacuum pump; 946. Branch pipe; 947. Silencer; 948. Air venting pipeline. Detailed Implementation

[0078] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0079] Example 1:

[0080] like Figures 1-3 As shown, the automatic conveyor line for substrate bonding in this embodiment includes a conveyor line body 8, a rotating mechanism 4, a first blowing mechanism 3, a second blowing mechanism 7, a first information detection device 2, and a second information detection device 41.

[0081] The conveyor line 8 is used to convey the trays that carry the substrates. One end of the conveyor line 8 is connected to the loading station 1, which is used to store the trays and place them on the conveyor line 8.

[0082] Rotating mechanism 4 is provided on conveyor line 8, and there are one or more units. A bonding device 6 is provided on both sides or one side of the conveyor line 8 corresponding to a single rotating mechanism 4. The rotating mechanism 4 is used to connect with the inlet and outlet of the bonding device 6 to transport the pallet between the bonding device 6 and the conveyor line 8.

[0083] The first purging mechanism 3 is located on the conveyor line 8, between the loading station 1 and the loading station 1, and is used to purge the substrate on the tray.

[0084] The second purging mechanism 7 is located on the conveyor line 8, downstream of the last rotating mechanism 4 along the conveying direction of the conveyor line 8, and is used to purge the substrate on the tray.

[0085] The first information detection device 2 is installed on the conveyor line 8, located between the first blowing mechanism 3 and the loading station 1, and is used to obtain information on the substrate on the tray entering the conveyor line 8.

[0086] The second information detection device 41 is located on the rotating mechanism 4 and is used to detect whether the substrate in the tray on the rotating mechanism 4 is bonded.

[0087] Specifically, loading station 1 is used to buffer trays containing substrates. The trays are not shown in the figure. According to the requirements, trays full of substrates are placed on conveyor line 8. The substrates currently commonly used are DBC substrates. DBC substrates are formed by directly bonding copper foil onto alumina or aluminum nitride ceramic substrates. The substrates are planar plates, usually rectangular. Chips can be soldered onto the substrates before bonding.

[0088] A first purging mechanism 3 is set up to purge the substrate before bonding to ensure the cleanliness of the substrate surface before bonding and to ensure the bonding effect. A second purging mechanism 7 is set up to clean the substrate after bonding to remove aluminum wire debris generated after bonding.

[0089] For a rotating mechanism 4, when a bonding device 6 is provided on one side of the rotating mechanism 4, the bonding device 6 is located on one side of the conveyor line 8; when a bonding device 6 is provided on both sides of the rotating mechanism 4, the bonding devices 6 on both sides are arranged opposite to each other, such as... Figure 1As shown, a rotating mechanism 4 is provided on the conveyor line 8 to selectively transport the tray from the loading station 1 to a certain bonding equipment 6. When the substrate in a bonding equipment 6 is bonded, the tray is returned to the conveyor line 8 by the rotating mechanism 4 and then transported by the conveyor line 8 to the second purging mechanism 7.

[0090] For multiple rotating mechanisms 4, the multiple rotating mechanisms 4 are spaced apart in the conveyor line 8 along the conveying direction of the conveyor line 8, such as... Figure 1 As shown, two bonding devices 6 correspond to one rotating mechanism 4. When there are multiple rotating mechanisms 4, the number of bonding devices 6 is twice that of rotating mechanisms 4.

[0091] Before the first purging mechanism 3 purifies, the first information detection device 2 records and / or verifies the information of the substrate entering the bonding production line. When the substrate enters the bonding equipment 6, it is marked with the information "bonded". The second information detection device 41 is located on the rotating mechanism 4. The conveyor line control system obtains the information of the substrate on the rotating mechanism 4 based on the second information detection device 41, and then determines whether the current tray needs to enter the bonding equipment 6 or enter the downstream of the conveyor line 8. The second information detection device 41 can be a barcode scanner.

[0092] By arranging bonding devices 6 opposite to each other on both sides of the conveyor line 8, and connecting the bonding devices 6 and the conveyor line 8 through a rotating mechanism 4, a second information detection device 41 is installed on the rotating mechanism 4, a first purging mechanism 3 and a first information detection device 2 are installed upstream of the multiple bonding devices 6, and a second purging mechanism 7 is installed downstream of the multiple bonding devices 6, thereby realizing the fully automated operation of auxiliary processes and bonding in the substrate bonding production line, optimizing the layout of the bonding production line, integrating multiple bonding devices 6, and improving the bonding efficiency of the substrate.

[0093] Specifically, such as Figure 3 As shown, the rotating mechanism 4 includes a rotating bracket 43 rotatably mounted on the frame of the conveyor line 8, a first conveyor 42 fixedly mounted on the upper end of the rotating bracket 43, and a first driver fixedly mounted on the frame. The first driver is connected to the rotating bracket 43 for driving the rotating bracket 43 to rotate, so that the first conveyor 42 is connected to the conveyor line 8 or to the bonding device 6. A second information detection device 41 is fixedly mounted on the rotating bracket 43.

[0094] Example 2:

[0095] Based on Example 1, such as Figures 1-3 As shown, a connecting lifting mechanism 5 is provided between the rotating mechanism 4 and the bonding device 6, and the connecting lifting mechanism 5 connects the rotating mechanism 4 and the bonding device 6.

[0096] The connecting lifting mechanism 5 includes a lifting drive assembly 53, a second conveyor 51, and a third conveyor 52.

[0097] The lifting drive assembly 53 is fixedly connected to the frame of the conveyor line 8;

[0098] The second conveyor 51 and the third conveyor 52 are fixedly installed on the movable end of the lifting drive assembly 53. The conveying directions of the second conveyor 51 and the third conveyor 52 are opposite and horizontal. The second conveyor 51 is located directly above the third conveyor 52.

[0099] The lifting drive assembly 53 is used to drive the second conveyor 51 and the third conveyor 52 to rise or fall together, so that the second conveyor 51 can be connected to the feed inlets of the rotating mechanism 4 and the bonding device 6 respectively, and the third conveyor 52 can be connected to the feed inlets of the rotating mechanism 4 and the bonding device 6 respectively.

[0100] Specifically, such as Figure 4 , Figure 5 As shown, the lifting drive assembly 53 includes a second driver 533 fixedly mounted on a bracket and a sliding frame 531 slidably connected to the bracket. The second driver 533 can be a motor, and a lead screw 532 is mounted on the output shaft of the motor. The lead screw 532 is connected to the sliding frame 531 in a transmission manner. The upper end of the sliding frame 531 (i.e., the movable end of the lifting drive assembly 53) is fixedly mounted with a second conveyor 51 and a third conveyor 52. The second driver 533 drives the lead screw 532 to rotate, thereby driving the sliding frame 531 to lift the second conveyor 51 and the third conveyor 52.

[0101] One specific application scenario is:

[0102] like Figure 5 As shown, A is the feeding plane of the bonding equipment 6, and B is the conveying plane of the conveyor line 8. A and B are at the same height.

[0103] When the lifting drive assembly 53 drives the sliding frame 531 to the lower position, the feeding plane of the second conveyor 51, the bonding equipment 6 and the conveying plane of the conveyor line 8 are level. At this time, the second conveyor 51 located on the upper layer is used to receive the pallet from the rotating mechanism 4 and convey it to the feeding port of the bonding equipment 6. Finally, the pallet is conveyed to the conveying mechanism inside the bonding equipment 6 and located directly above the adsorption fixture 9.

[0104] When the lifting drive assembly 53 drives the sliding frame 531 to the upper position, the feeding plane of the second conveying mechanism 51, the bonding device 6 and the conveying plane of the conveyor line 8 are level. At this time, the second conveyor 51 located at the lower level is used to receive the pallet from the conveying mechanism of the bonding device 6 and convey it to the rotating mechanism 4.

[0105] Additionally, it should be noted that the receiving and conveying of pallets by the second conveyor 51 and the second conveying mechanism 51 are not necessarily continuous. The pallets can be buffered on the second conveyor 51 and the second conveying mechanism 51, thereby shortening the production cycle. When there are pallets that need to be bonded, the pallets are first conveyed to the second conveyor 51. After the substrate bonding in the bonding equipment 6 is completed, the pallets in the bonding equipment 6 are first transferred to the second conveyor 51 and conveyed to the rotating mechanism 4. Then, the second conveyor 51 is lowered to the feed port of the bonding equipment 6 and then conveyed to the bonding equipment 6.

[0106] By setting a connecting lifting mechanism 5 with two layers of conveyors between the rotating mechanism 4 and the bonding equipment 6, the conveying of the already bonded pallets and the pallets waiting to be bonded can be realized in layers. The pallets can also be temporarily stored on the connecting lifting mechanism 5, which improves the pallet handling cycle of the conveyor line 8 and increases the production efficiency of the production line.

[0107] If four bonding devices 6 are integrated in the conveyor line 8, a maximum of eight trays can be stored on both sides of the conveyor line 8. When one of the trays is bonded, it is conveyed by the conveyor line 8 to the second purging mechanism 7. The conveyor line 8 can then convey a new tray that needs to be bonded to the corresponding connecting lifting mechanism 5.

[0108] Example 3:

[0109] Based on the above embodiments, such as Figure 8 , Figure 9 As shown, the bonding device 6, the first purging mechanism 3 and the second purging mechanism 7 are all equipped with adsorption fixtures 9. The adsorption fixtures 9 include a lifting mechanism 91, a suction cup mounting base 92, a suction cup assembly 93 and a vacuum system 94.

[0110] The suction cup mounting base 92 is fixed to the moving end of the lifting mechanism 91;

[0111] The suction cup assembly 93 is fixed on the suction cup mounting base 92. The suction cup assembly 93 is provided with a plurality of adsorption parts 931 corresponding to the substrate, and each adsorption part 931 is provided with a suction port 9310.

[0112] Vacuum system 94 is connected to suction port 9310;

[0113] The lifting mechanism 91 drives the suction cup assembly 93 to rise and fall. The adsorption part 931 passes through the through hole on the tray and contacts the substrate. Under the action of the vacuum system 94, the substrate is vacuum adsorbed through the suction port 9310, and the substrate is fixed on the adsorption part 931.

[0114] Specifically, the lifting mechanism 91 includes a first linear driver 912 and a lifting bracket 911. The lifting bracket 911 is slidably arranged relative to the frame of the conveyor line 8. The lifting bracket 911 is connected to the output end of the first linear driver 912. The first linear driver 912 can be a cylinder. The lifting bracket 911 is the moving end of the lifting mechanism 91.

[0115] Specifically, the shape and structure of the adsorption part 931 are adapted to the substrate. The suction port 9310 can be multiple holes or other groove-like structures. The adsorption part 931 only needs to meet the support and fixation requirements of the substrate. The structure of the tray is not shown in the figure. The tray is plate-shaped and has multiple through holes corresponding to the substrate. The substrate is placed directly above the through holes. When the tray is transported to the top of the adsorption fixture 9, the lifting mechanism 91 drives the suction cup assembly 93 to rise. During the rising process, the suction cup assembly 93 uses the structure of positioning pins and positioning holes to connect the tray and the suction cup assembly. The components 93 are aligned vertically. Before the adsorption part 931 contacts the substrate, the vacuum system 94 evacuates the suction port 9310. When the adsorption part 931 contacts the substrate, a negative pressure is formed between the suction port 9310 and the lower surface of the substrate, which adsorbs and fixes the substrate on the adsorption part 931. When it is necessary to place the substrate back on the tray, the suction port 9310 is connected to the atmosphere. The lifting mechanism 91 drives the suction cup assembly 93 to descend, and the substrate falls back onto the corresponding tray position on the tray. According to specific needs, the conveyor line 8 then transports the tray to the next station.

[0116] The tray with a hollow structure is used to fix the substrate on the adsorption part 931 of the adsorption fixture 9 by vacuum adsorption from below. The substrate is fixed by utilizing the space below the conveyor line, which is convenient to operate and easy to automate.

[0117] In another embodiment, such as Figure 6 , Figure 7 As shown, the first information detection device 2 includes a material detection device 22 and a robotic arm 21.

[0118] Material inspection equipment 22 is used to inspect whether the substrate on the tray from the loading station 1 meets the bonding requirements;

[0119] A robotic arm 21 is located on one side of the conveyor line 8 and is used to remove substrates that do not meet the bonding requirements from the tray.

[0120] Before bonding, the vacuum pump 945 of the vacuum system 94 is connected to the suction port 9310 of the adsorption part 931 on which the substrate is located, according to the position of the substrate on the tray.

[0121] Specifically, the material inspection equipment 22 can be one or both of a barcode scanner and a vision camera, used to detect whether the substrate's model and / or orientation are normal, thereby determining whether the bonding requirements are met; the robotic arm 21 can be an XYZ three-axis robotic arm, such as... Figure 6 As shown, a gripper can be set at the operating end of the robotic arm 21 to pick up substrates that do not meet the requirements. The gripper can be a claw or a suction cup. A material rack 24 is also set on one side of the conveyor line 8. The robotic arm 21 transports the substrates that do not meet the requirements to the material rack 24. The system realizes the scanning and verification of the pallet and the substrate, and automatically sorts the unqualified substrates to the material rack 24 (NG pallet).

[0122] After the material inspection equipment 22 and the robotic arm 21 complete their work, the conveyor control system acquires the position information of the substrates on the tray and transmits the position information to the control system of the bonding equipment 6. Specifically, the position information can be obtained by the material inspection equipment 22 after removing substrates that do not meet the requirements based on the inspection results, or it can be obtained by the control system of the robotic arm 21 after removing substrates that do not meet the requirements. Finally, the position information is sent to the control system of the bonding equipment 6, which in turn controls the vacuum pump 945 of the vacuum system 94 to selectively connect with the suction ports 9310 of different adsorption sections 931.

[0123] When the bonding operation begins, the control system of the bonding equipment 6 first controls the adsorption fixture 9 located inside the bonding equipment 6 and directly below the tray to operate. The working process of the adsorption fixture 9 is as follows:

[0124] The first linear driver 912 of the lifting mechanism 91 drives the suction cup assembly 93 to rise, and the suction part 931 lifts the substrate through the through hole on the tray.

[0125] Before the adsorption section 931 comes into contact with the substrate, the vacuum pump 945 of the vacuum system 94 is connected to the suction port 9310 of the adsorption section 931 with the substrate on it, based on the position of the substrate on the tray, i.e., based on the position information of the substrate on the tray.

[0126] When the vacuum pump 945 of the vacuum system 94 is started, a negative pressure is generated at the suction port 9310 connected to the vacuum pump 945. After the adsorption part 931 comes into contact with the substrate, the substrate is vacuum adsorbed through the suction port 9310 and fixed on the adsorption part 931.

[0127] Then, the control system of bonding equipment 6 performs bonding on the substrate sequentially according to the substrate's position information;

[0128] After bonding is completed, the suction port 9310 is no longer connected to the vacuum pump 945 of the vacuum system 94, but is connected to the atmosphere and returns to normal pressure;

[0129] The first linear driver 912 of the lifting mechanism 91 drives the suction cup assembly 93 to descend, and the suction part 931 moves to below the through hole, so that the substrate falls back onto the tray.

[0130] Material detection equipment 22 and robotic arm 21 are installed at the conveyor line 8 before the bonding equipment 6. Before the tray enters the bonding equipment 6, substrates that do not meet the bonding requirements are rejected. Before bonding, the vacuum pump 945 of the vacuum system 94 is connected only to the suction port 9310 of the adsorption part 931 with the substrate above, and selective vacuum adsorption and fixation are performed. This realizes the automatic rejection of substrates that do not meet the requirements before bonding, and the tray can enter the bonding equipment 6 in a state of not being full, without the need for manual intervention, thereby improving automation efficiency and production efficiency.

[0131] For example, such as Figure 8 , Figure 9 As shown, each suction part 931 on the suction cup assembly 93 is connected to a suction channel 9311, and the suction channel 9311 is connected to the suction port 9310 on the corresponding suction part 931.

[0132] The vacuum system 94 includes a vacuum pump 945, and connecting pipes 941 corresponding to the adsorption channels 9311 and two-position five-way solenoid valves 942.

[0133] Connecting pipe 941 connects adsorption channel 9311 to port B 9421 of two-position five-way solenoid valve 942. Port A 9422 and port R 9425 of two-position five-way solenoid valve 942 are normally closed. Port P 9424 of two-position five-way solenoid valve 942 is connected to the air inlet of vacuum pump 945. Port S 9423 of two-position five-way solenoid valve 942 is connected to the atmosphere.

[0134] Specifically, the adsorption channel 9311 can be a pipe or a through hole. Each adsorption unit 931 corresponds to one adsorption channel 9311 and one two-position five-way solenoid valve 942. The two-position five-way solenoid valve 942 is an externally pilot-operated type, specifically model SY5140RT-5LZD, and the number is the same as the number of adsorption channels 9311. The pilot valve of the two-position five-way solenoid valve 942 is connected to the control gas source 943. Port A 9422 is externally sealed to achieve a normally closed state. The R ports 9425 of multiple two-position five-way solenoid valves 942 are connected through a pipe. The paths converge at a sealing end 944 for sealing, achieving a normally closed state. The P ports 9424 of multiple two-position five-way solenoid valves 942 converge through branch pipe 946 to connect to the main pipeline of the vacuum pump 945 inlet. The S ports 9423 of multiple two-position five-way solenoid valves 942 converge through venting pipe 948 to connect to a silencer 947, which connects to the atmosphere. Each adsorption unit 931 is connected to a connecting pipe 941, and a vacuum gauge 9411 is installed on the connecting pipe 941. After the vacuum negative pressure meets the requirements, the bonding equipment 6 is notified to perform bonding.

[0135] When the two-position five-way solenoid valve 942 loses power, such as Figure 9 As shown, the vacuum pump 945 is connected to the connecting pipe 941 through the two-position five-way solenoid valve 942. When the two-position five-way solenoid valve 942 is energized, the connecting pipe 941 is connected to the atmosphere through the two-position five-way solenoid valve 942, thereby disconnecting the connection with the vacuum pump 945 by blocking the corresponding branch pipe 946, so as to ensure that the vacuum pump 945 can act on other adsorption parts 931.

[0136] The following section describes the working principle of controlling the connection between the suction port 9310 / adsorption channel 9311 and the vacuum pump 945, using the automated substrate wire bonding production line as an example:

[0137] During normal operation of the bonding production line, vacuum pump 945 is kept running continuously;

[0138] Before bonding, the control system of bonding equipment 6 controls the operation of all two-position five-way solenoid valves 942 according to the position information:

[0139] The two-position five-way solenoid valve 942 corresponding to the position without substrate is always energized during the bonding process. Port B 9421 and Port S 9423 are connected to keep the suction port 9310 at normal pressure. At the same time, Port P 9424 and Port A 9422 are connected to block the corresponding branch pipe 946.

[0140] The two-position five-way solenoid valve 942 corresponding to the position of the substrate is energized. When the drive suction cup assembly 93 rises, before the suction part 931 contacts the substrate, the two-position five-way solenoid valve 942 is de-energized, as shown below. Figure 9As shown, port B 9421 is connected to port P 9424, so that the air inlet of vacuum pump 945 is connected to suction port 9310 and adsorption channel 9311. Port S 9423 is blocked. After the substrate comes into contact with the adsorption part 931, a negative pressure is generated at suction port 9310. The substrate is vacuum adsorbed and fixed on the adsorption part 931 through suction port 9310.

[0141] Perform bonding;

[0142] After bonding is completed, all two-position five-way solenoid valves 942 are energized, making the suction port 9310 and the adsorption channel 9311 connected to the atmosphere. After the suction cup assembly 93 descends, the substrate falls back onto the tray.

[0143] By keeping two positions of the two-position five-way solenoid valve 942 normally closed (port A 9422 and port R 9425 normally closed), and connecting the remaining three positions to the adsorption channel 9311, the atmosphere, and the vacuum pump 945, when the two-position five-way solenoid valve 942 is activated, ports P 9424 and S 9423 are intermittently connected to port B 9421. This allows for switching between the adsorption channel 9311 and the atmosphere and the vacuum pump 945. Simultaneously, the connection between the adsorption channel 9311 and the atmosphere does not affect the vacuum pump 945's evacuation effect. A single solenoid valve controls the suction ports 9310 for different vacuum adsorption requirements, enabling selective evacuation of the suction ports 9310 of different adsorption sections 931. This allows for selective vacuum adsorption and fixation based on the position of the substrate on the tray. It also allows for switching between evacuation and evacuation states of the suction ports 9310, reducing the need for frequent start-stop of the vacuum pump 945, simplifying the control pipeline, reducing the number of moving parts, and improving the reliability of the vacuum system 94.

[0144] In another embodiment, such as Figure 7 As shown, the first information detection device 2 also includes a positioning mechanism, which includes a second linear driver 26. A lifting positioning structure 25 is fixedly installed at the output end of the second linear driver 26. The second linear driver 26 is used to drive the lifting positioning structure 25 to rise and fall.

[0145] The lifting and positioning structure 25 rises and cooperates with the pallet located above it, causing the pallet to detach from the conveyor line 8 and determining the relative position of the pallet and the robotic arm 21. After the lifting and positioning structure 25 descends and detaches from the pallet, the pallet is located on the conveyor line 8.

[0146] Specifically, the lifting and positioning structure 25 of the positioning mechanism and the pallet are positioned in a horizontal direction by means of positioning pin holes. In order to further ensure the accuracy of the longitudinal position of the pallet, a limiting plate 23 is set above the conveyor line 8. After the lifting and positioning structure 25 lifts the pallet, it contacts the limiting plate 23 to determine the longitudinal position of the pallet.

[0147] Example 4:

[0148] Based on the above embodiment three, such as Figures 10-13 As shown, the first purging mechanism 3 and the second purging mechanism 7 have the same structure.

[0149] The first blowing mechanism 3 includes an air knife 31 and a dust suction port 32.

[0150] Air knife 31 is fixedly installed on one side of the conveyor line 8;

[0151] A vacuum port 32 is fixed on the other side of the conveyor line 8, and a vacuum cleaner is connected to the vacuum port 32.

[0152] The tray is located between the air knife 31 and the suction port 32. When the substrate is fixed to the adsorption part 931, the air knife 31 blows the surface of the substrate, and the suction port 32 absorbs the air passing through the substrate.

[0153] Specifically, the air knife 31 is an ion air knife. The size of the air knife 31 and the dust suction port 32 are adapted to the size of the corresponding tray so that the airflow can cover all the substrates. The conveyor line 8 passes through the clearance channel 33 between the first blowing mechanism 3 and the second blowing mechanism 7.

[0154] In another embodiment, such as Figure 12 As shown, a shaping mechanism is installed at the conveyor line 8 corresponding to the first purging mechanism 3. The shaping mechanism includes:

[0155] The shaping plate 34 is located above the conveyor line 8 and is fixedly connected to the frame of the conveyor line 8.

[0156] After the substrate is fixed on the adsorption part 931, the lifting mechanism 91 continues to drive the suction cup mounting base 92 to move upward, so that the upper surface of the substrate comes into contact with the shaping pressure plate 34, and the substrate is clamped and shaped from both sides by the shaping pressure plate 34 and the adsorption part 931.

[0157] Specifically, such as Figure 13 As shown, the first linear driver 912 of the lifting mechanism 91 is a servo motor, and the lifting bracket 911 is connected to the servo motor via a lead screw drive; as Figure 4 As shown, the shaping plate 34 is made of acrylic and has a plate-like structure. The side of the shaping plate 34 facing the substrate has multiple pressure points 342. Each substrate corresponds to a set of pressure points 342. By contacting the upper surface of the substrate with the pressure points 342 while avoiding the circuit structure on the upper surface of the substrate, pressure is applied evenly to the substrate, so that the lower surface of the substrate is shaped by the plane on the adsorption part 931.

[0158] A shaping mechanism is integrated at the first purging mechanism 3. The lifting function of the adsorption fixture 9 is used to physically shape the substrate before bonding, ensuring the success rate of vacuum adsorption of the substrate before bonding.

[0159] The workflow of the first purging mechanism at point 3 is as follows:

[0160] After the tray is in place, the first linear actuator 912 lifts the adsorption part 931 to perform vacuum adsorption and fixation on the substrate;

[0161] Then, the first linear actuator 912 lifts the adsorption part 931 to the shaping position so that the substrate comes into contact with the shaping pressure plate 34 for physical shaping.

[0162] After successful shaping, the first linear actuator 912 drives the adsorption unit 931 to descend between the air knife 31 and the dust suction port 32, and starts the ion air knife 31 to blow away impurities and dust on the substrate surface.

[0163] Post-bonding cleaning mechanism: The bonding substrate is cleaned by opening the ion air knife 31 and the vacuum cleaner to remove aluminum wire debris generated after bonding.

[0164] The second blowing mechanism 7 is used to blow the substrate after bonding is completed. After the tray is in place, the first linear driver 912 lifts the adsorption part 931 to vacuum adsorb and fix the substrate. After the tray is located between the air knife 31 and the dust suction port 32, the ion air knife 31 and the vacuum cleaner are turned on to blow the bonded substrate and remove the debris on the substrate.

[0165] This embodiment provides an automated conveyor line that integrates barcode scanning, shaping, vacuum adsorption, and multi-station bonding equipment for collaborative operation. Each module is controlled collaboratively by a PLC, enabling fully automated loading and unloading of materials. The fully automated process significantly reduces manual intervention and improves production efficiency.

[0166] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. An automated conveyor line for substrate bonding, characterized in that: include, A conveyor line (8) is used to convey a tray carrying a substrate, and one end of the conveyor line (8) is connected to the loading station (1); A rotating mechanism (4) is provided on the conveyor line (8), and there are one or more of them. A bonding device (6) is provided on both sides or one side of the conveyor line (8) corresponding to a single rotating mechanism (4). The rotating mechanism (4) is used to dock with the inlet and outlet of the bonding device (6) to transport the tray between the bonding device (6) and the conveyor line (8). The first purging mechanism (3) is provided on the conveyor line (8) and located between the loading station (1) and the loading station (1), and is used to purge the substrate on the tray. The second purging mechanism (7) is provided on the conveyor line (8) and is located downstream of the last rotating mechanism (4) along the conveying direction of the conveyor line (8). It is used to purge the substrate on the tray. The first information detection device (2) is installed on the conveyor line (8) and located between the first blowing mechanism (3) and the loading station (1) to obtain information on the substrate on the tray entering the conveyor line (8). The second information detection device (41) is located on the rotating mechanism (4) and is used to detect whether the substrate in the tray located on the rotating mechanism (4) is bonded.

2. The automated conveyor line for substrate bonding as described in claim 1, characterized in that: The rotating mechanism (4) includes a rotating bracket (43) rotatably mounted on the frame of the conveyor line (8), a first conveyor (42) fixedly mounted on the upper end of the rotating bracket (43), and a first driver fixedly mounted on the frame. The first driver is connected to the rotating bracket (43) for driving the rotating bracket (43) to rotate, so that the first conveyor (42) is connected to the conveyor line (8) or to the bonding device (6). The second information detection device (41) is fixedly mounted on the rotating bracket (43).

3. The automated conveyor line for substrate bonding as described in claim 1, characterized in that: A connecting lifting mechanism (5) is provided between the rotating mechanism (4) and the bonding device (6), and the connecting lifting mechanism (5) connects the rotating mechanism (4) and the bonding device (6).

4. The automated conveyor line for substrate bonding as described in claim 3, characterized in that: The connecting lifting mechanism (5) includes: The lifting drive assembly (53) is fixedly connected to the frame of the conveyor line (8); The second conveyor (51) and the third conveyor (52) are fixedly installed on the movable end of the lifting drive assembly (53). The conveying directions of the second conveyor (51) and the third conveyor (52) are opposite and horizontal. The second conveyor (51) is located directly above the third conveyor (52). The lifting drive assembly (53) is used to drive the second conveyor (51) and the third conveyor (52) to rise or fall together, so that the second conveyor (51) can be connected to the feed inlets of the rotating mechanism (4) and the bonding device (6) respectively, and the third conveyor (52) can be connected to the feed inlets of the rotating mechanism (4) and the bonding device (6) respectively.

5. The automated conveyor line for substrate bonding as described in claim 1, characterized in that: An adsorption fixture (9) is provided in the bonding device (6), the first purging mechanism (3), and the second purging mechanism (7). The adsorption fixture (9) includes: Lifting mechanism (91); A suction cup mounting base (92) is fixed to the moving end of the lifting mechanism (91); A suction cup assembly (93) is fixed on a suction cup mounting base (92). The suction cup assembly (93) is provided with a plurality of adsorption parts (931) corresponding to the substrate, and each adsorption part (931) is provided with a suction port (9310). A vacuum system (94) is connected to the suction port (9310); The lifting mechanism (91) drives the suction cup assembly (93) to rise and fall. The adsorption part (931) passes through the through hole on the tray and contacts the substrate. Under the action of the vacuum system (94), the substrate is vacuum adsorbed through the suction port (9310) and the substrate is fixed on the adsorption part (931).

6. The automated conveyor line for substrate bonding as described in claim 5, characterized in that: The first information detection device (2) includes: Material inspection equipment (22) is used to inspect whether the substrates on the trays from the loading station (1) meet the bonding requirements; A robotic arm (21) is located on one side of the conveyor line (8) and is used to remove substrates that do not meet the bonding requirements from the tray. Before bonding, the vacuum pump (945) of the vacuum system (94) is connected to the suction port (9310) of the adsorption part (931) with the substrate on the tray, according to the position of the substrate on the tray.

7. The automated conveyor line for substrate bonding as described in claim 6, characterized in that: Each suction part (931) on the suction cup assembly (93) is connected to a suction channel (9311), and the suction channel (9311) is connected to the suction port (9310) on the corresponding suction part (931). The vacuum system (94) includes the vacuum pump (945), and connecting pipes (941) corresponding one-to-one with the adsorption channels (9311) and two-position five-way solenoid valves (942); The connecting pipe (941) connects the adsorption channel (9311) to the B port (9421) of the two-position five-way solenoid valve (942). The A port (9422) and the R port (9425) of the two-position five-way solenoid valve (942) are both normally closed. The P port (9424) of the two-position five-way solenoid valve (942) is connected to the air inlet of the vacuum pump (945). The S port (9423) of the two-position five-way solenoid valve (942) is connected to the atmosphere.

8. The automated conveyor line for substrate bonding as described in claim 6, characterized in that: The first information detection device (2) also includes a positioning mechanism, which includes a second linear driver (26). The output end of the second linear driver (26) is fixedly mounted with a lifting positioning structure (25). The second linear driver (26) is used to drive the lifting positioning structure (25) to rise and fall. When the lifting and positioning structure (25) rises, it cooperates with the pallet located above the lifting and positioning structure (25) to separate the pallet from the conveyor line (8) and determine the relative position of the pallet and the robotic arm (21). After the lifting and positioning structure (25) falls and separates from the pallet, the pallet is located on the conveyor line (8).

9. The automated conveyor line for substrate bonding as described in claim 5, characterized in that: The first purging mechanism (3) and the second purging mechanism (7) have the same structure. The first purging mechanism (3) includes: An air knife (31) is fixedly mounted on one side of the conveyor line (8); A vacuum port (32) is fixed on the other side of the conveyor line (8), and a vacuum cleaner is connected to the vacuum port (32); The tray is located between the air knife (31) and the suction port (32), and when the substrate is fixed to the adsorption part (931), the air knife (31) blows the surface of the substrate, and the suction port (32) absorbs the air passing through the substrate.

10. The automated conveyor line for substrate bonding as described in claim 9, characterized in that: A shaping mechanism is installed at the conveyor line (8) corresponding to the first purging mechanism (3), the shaping mechanism comprising: A shaping plate (34) is located above the conveyor line (8), and the shaping plate (34) is fixedly connected to the frame of the conveyor line (8); After the substrate is fixed on the adsorption part (931), the lifting mechanism (91) continues to drive the suction cup mounting base (92) to move upward, so that the upper surface of the substrate comes into contact with the shaping pressure plate (34), and the substrate is clamped and shaped from both sides by the shaping pressure plate (34) and the adsorption part (931).

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