A positioning device for semiconductor processing

Abstract

The utility model discloses a positioning device for semiconductor processing, it mainly comprises a bottom fixed platform. Above this bottom fixed platform, a positioning table is carefully designed and installed. A placing groove for placing semiconductors is arranged on the positioning table, and a rectangular semiconductor is placed in the placing groove to facilitate accurate positioning and processing. Through the design of the positioning table and the placing groove, it can be ensured that the rectangular semiconductor is accurately placed at the predetermined position. The setting of the supporting plate and the bearing plate provides a stable supporting platform for the hydraulic cylinder, ensuring the stable operation of the hydraulic cylinder. The combination of the hydraulic cylinder and the hydraulic rod allows the accurate pressure to be applied to the rectangular semiconductor, realizing the flexible adjustment and fixation of the semiconductor. The design of the arc-shaped down pressure plate can effectively clamp the corners of the rectangular semiconductor, ensuring that the semiconductor does not move during the processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a positioning device for semiconductor processing. Background Technology

[0002] In the semiconductor processing field, precise positioning devices are crucial for ensuring processing accuracy and efficiency. Traditional semiconductor processing equipment typically includes various robotic arms, fixtures, and positioning systems designed to ensure the stability and accuracy of semiconductor chips or wafers during processing. However, due to the fragility of semiconductor materials and the high precision requirements of the processing, traditional positioning devices often fall short of the needs of modern semiconductor processing.

[0003] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art: Poor stability: Semiconductor materials are easily affected by vibration and movement during processing, which may lead to processing defects and a decrease in yield.

[0004] Inconvenient loading and unloading: In the semiconductor processing, frequent loading and unloading operations require the positioning device to be able to be adjusted quickly and conveniently, while traditional devices are often complicated to operate and time-consuming. Utility Model Content

[0005] The purpose of this invention is to provide a positioning device for semiconductor processing to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a positioning device for semiconductor processing, which mainly consists of a bottom fixed platform. A positioning platform is carefully designed and installed above this bottom fixed platform. A placement slot specifically for placing semiconductors is provided on the positioning platform, and a rectangular semiconductor is placed in this placement slot for precise positioning and processing.

[0007] To further ensure the stability and accuracy of semiconductor processing, two support plates are specially installed above the positioning stage. These two support plates are located on the front and rear sides of the positioning stage, forming a symmetrical support structure that provides more stable support for the semiconductors. Each support plate is equipped with a carrier plate, and on the carrier plate, a hydraulic cylinder is mounted. The hydraulic cylinder is designed to perform precise lifting and positioning operations, thus providing more precise control over semiconductor processing.

[0008] Each hydraulic cylinder is connected to a hydraulic rod at its base, which transmits the cylinder's motion to the semiconductor. Below the hydraulic rod is a connecting plate, which distributes the motion evenly across the entire semiconductor surface. An arc-shaped pressure plate is mounted at the lower end of the connecting plate. This arc-shaped pressure plate design ensures that the rectangular semiconductor is pressed down evenly, guaranteeing that the semiconductor remains in a fixed position during processing and preventing movement or vibration from affecting processing accuracy. This carefully designed positioning device significantly improves the accuracy and efficiency of semiconductor processing.

[0009] More specifically, a movable baffle and a fixed baffle are also installed on the bottom fixed platform. These two baffles are located on the left and right sides of the positioning platform, respectively. A slide rail is slidably mounted on the bottom end of the movable baffle, and the bottom end of the slide rail is fixed to the bottom fixed platform. In addition, an elbow clamp is also installed on the bottom fixed platform, the end of which abuts against the movable baffle when pressed.

[0010] More specifically, the curved section of the bow-shaped pressure plate can press down on the corners of the rectangular semiconductor. The two bow-shaped pressure plates work together to compress and fix the four corners of the rectangular semiconductor, ensuring its stability during processing.

[0011] Compared with the prior art, the advantages of this utility model are: the design of the positioning stage and the placement groove can ensure that the rectangular semiconductor is accurately placed in the predetermined position; the setting of the support plate and the carrier plate provides a stable support platform for the hydraulic cylinder, ensuring the stable operation of the hydraulic cylinder.

[0012] The combination of hydraulic cylinder and hydraulic rod allows for precise pressure to be applied to rectangular semiconductors, enabling flexible adjustment and fixation of the semiconductors; the design of the bow-shaped lower pressure plate can effectively clamp the corners of the rectangular semiconductors, ensuring that the semiconductors do not move during processing.

[0013] The design of the movable baffle and the fixed baffle makes the loading and unloading of semiconductors more convenient, while ensuring stability during the processing; the slide rail and elbow clamp can prevent the movable baffle from sliding during operation, ensuring the stability and reliability of the positioning device.

[0014] Two bow-shaped pressure plates press and fix the four corners of the rectangular semiconductor, achieving multi-point fixation and improving the fixation effect and processing accuracy. Attached Figure Description

[0015] Figure 1 This is a front view schematic diagram of the present invention; Figure 2 This is a top view of the present invention.

[0016] In the diagram: 1. Bottom fixed platform; 2. Positioning platform; 3. Placement slot; 4. Support plate; 5. Bearing plate; 6. Hydraulic cylinder; 7. Hydraulic rod; 8. Connecting plate; 9. Bow-shaped lower pressure plate; 10. Rectangular semiconductor; 11. Moving baffle; 12. Fixed baffle; 13. Slide rail; 14. Elbow clamp. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-2 This utility model provides a technical solution: a positioning device for semiconductor processing, which mainly consists of a bottom fixed platform 1. Above this bottom fixed platform 1, a positioning platform 2 is carefully designed and installed. The positioning platform 2 is provided with a placement groove 3 specifically for placing semiconductors, and a rectangular semiconductor 10 is placed in this placement groove 3 for precise positioning and processing.

[0019] To further ensure the stability and accuracy of the semiconductor 10 during processing, two support plates 4 are specially installed above the positioning stage 2. These two support plates 4 are located on the front and rear sides of the positioning stage 2, forming a symmetrical support structure, thus providing more stable support for the semiconductor 10. Each support plate 4 is equipped with a carrier plate 5, and a hydraulic cylinder 6 is mounted on the carrier plate 5. The design of the hydraulic cylinder 6 enables precise lifting and positioning operations, thereby providing more refined control for the processing of the semiconductor 10.

[0020] Each hydraulic cylinder 6 is connected to a hydraulic rod 7 below it. The function of the hydraulic rod 7 is to transmit the movement of the hydraulic cylinder 6 to the semiconductor 10. Below the hydraulic rod 7 is a connecting plate 8, which distributes the movement of the hydraulic rod 7 evenly across the entire surface of the semiconductor 10. An arc-shaped pressure plate 9 is installed at the lower end of the connecting plate 8. The design of the arc-shaped pressure plate 9 allows it to press down evenly on the rectangular semiconductor 10, ensuring that the semiconductor 10 remains in a fixed position during processing and preventing movement or vibration from affecting processing accuracy. This carefully designed positioning device can greatly improve the accuracy and efficiency of semiconductor processing.

[0021] More specifically, a movable baffle 11 and a fixed baffle 12 are also installed on the bottom fixed platform 1. These two baffles are located on the left and right sides of the positioning platform 2, respectively. A slide rail 13 is slidably installed at the bottom end of the movable baffle 11, and the bottom end of the slide rail 13 is fixed to the bottom fixed platform 1. In addition, an elbow clamp 14 is also installed on the bottom fixed platform 1, the end of which abuts against the movable baffle 11 when pressed.

[0022] More specifically, the curved section of the arc-shaped pressure plate 9 can press down on the corners of the rectangular semiconductor 10. The two arc-shaped pressure plates 9 work together to compress and fix the four corners of the rectangular semiconductor 10, ensuring its stability during processing.

[0023] Working principle: When this utility model is in operation, the bottom fixed platform 1 serves as the foundation of the entire device, providing stable support; the positioning platform 2 is installed on the bottom fixed platform and is used to place the rectangular semiconductor 10.

[0024] The placement slot 3 is located on the positioning stage and is used to precisely place the rectangular semiconductor 10; the support plate 4 is installed on the front and rear sides of the positioning stage 2 to provide additional support and stability.

[0025] The bearing plate 5 is mounted on the support plate 4, and the hydraulic cylinder 6 is mounted on the bearing plate 5; the hydraulic cylinder 6 is pushed downward by the hydraulic rod 7, and the hydraulic rod 7 is connected to the connecting plate 8.

[0026] The lower end of the connecting plate 8 is connected to the bow-shaped pressure plate 9. The bow-shaped pressure plate 9 moves downward under the action of the hydraulic cylinder 6, thereby pressing down the corners of the rectangular semiconductor 10. The curved section of the bow-shaped pressure plate 9 is designed to precisely clamp the corners of the rectangular semiconductor 10, ensuring its stability during processing.

[0027] The bottom fixed platform 1 is also provided with a movable baffle 11 and a fixed baffle 12, which are located on the left and right sides of the positioning platform 2, respectively, for further fixing and positioning the rectangular semiconductor 10; the bottom end of the movable baffle 11 is provided with a slide rail 13, which can slide on the bottom fixed platform 1 to adjust the position; the elbow clamp 14 is installed on the bottom fixed platform to provide additional clamping force when the movable baffle 11 is pressed.

[0028] With the above structure, the positioning device can accurately position and fix the rectangular semiconductor 10, ensuring stability and accuracy during semiconductor processing. The use of the hydraulic cylinder 6 provides flexible control force, allowing the bow-shaped lower pressure plate 9 to adjust the pressure as needed to accommodate rectangular semiconductors 10 of different sizes and types.

[0029] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for semiconductor processing, characterized by: Includes a bottom fixing platform (1), a positioning platform (2) is provided on the bottom fixing platform (1), a placement groove (3) is provided on the positioning platform (2), and a rectangular semiconductor (10) is provided in the placement groove (3). The positioning platform (2) is also provided with a support plate (4). There are two support plates (4) located on the front and rear sides of the positioning platform (2). The support plate (4) is provided with a bearing plate (5). The bearing plate (5) is provided with a hydraulic cylinder (6). The hydraulic cylinder (6) has a hydraulic rod (7) on its lower side, a connecting plate (8) on its lower side, and an arc-shaped pressure plate (9) at the lower end of the connecting plate (8). The arc-shaped pressure plate (9) presses down against the rectangular semiconductor (10).

2. The positioning device for semiconductor processing according to claim 1, wherein: The bottom fixed platform (1) is provided with a movable baffle (11) and a fixed baffle (12), which are located on the left and right sides of the positioning platform (2), respectively.

3. The positioning device for semiconductor processing of claim 2, wherein: The bottom end of the movable baffle (11) is provided with a slide rail (13), the bottom end of the slide rail (13) is fixedly provided on the bottom fixed platform (1), and the bottom fixed platform (1) is provided with an elbow clamp (14), the end of which abuts against the movable baffle (11) when pressed.

4. The positioning device of claim 1, wherein: The curved section of the bow-shaped pressure plate (9) presses down and clamps the corners of the rectangular semiconductor (10), and the two bow-shaped pressure plates (9) squeeze and fix all four corners of the rectangular semiconductor (10).

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