A packaging positioning device for memory chips

Abstract

The utility model relates to a kind of encapsulation positioning device of memory chip, belong to memory chip technical field.The encapsulation positioning device of memory chip, comprising: workbench, the middle part of the workbench top is fixedly connected with conveying track, the top of the conveying track is installed with placing plate, the top of the placing plate is provided with positioning mechanism;Two limit plates on placing plate can be centered clamped to the two sides of memory card, positioning block and two limit rods can be positioned to memory chip, positioning block can be positioned to the two sides of memory chip, the end of limit rod is arc and can be positioned to memory chip, mounting ring can drive positioning block to slide on limit plate by sliding block, second electric pushrod can drive fixed block to move to one side and align with memory chip, first electric pushrod can drive fixed block to move downward and position to memory chip, can be positioned to memory chip quickly and accurately, improve the encapsulation effect of memory chip.

Description

Technical Field

[0001] This utility model relates to the field of memory chip technology, and in particular to a packaging and positioning device for memory chips. Background Technology

[0002] Memory chips (or memory chips in general) refer to memory particles, specifically storage units used in memory modules. They are formed into independent particles through wafer dicing and packaging processes. Core parameters include capacity, data bandwidth, and operating speed, which are defined by segmentation rules in chip coding. When packaging memory chips onto memory cards, positioning devices are required for the packaging process.

[0003] As shown in the reference case "A Packaging and Positioning Mechanism for Memory Chips" (publication number CN222653932U), the memory chip is placed on the upper surface of the placement stage, and then the mounting block is moved to the rear by an electric push rod. When the mounting block moves sequentially, the two displacement blocks are moved synchronously by the drive component. When the displacement blocks move, their inclined surfaces and the inclined surfaces of the edge guard plate make the two displacement blocks move closer to each other. At the same time, when the displacement blocks move, the placement stage is moved synchronously by the first connecting plate and the second connecting plate. When the displacement blocks move closer to each other, the memory chip is clamped by the clamping component.

[0004] According to the above reference materials, when the two displacement blocks in the above device move, their inclined surfaces and the inclined surfaces of the edge guard plate make the two displacement blocks move closer to each other. At the same time, when the displacement blocks move, the first connecting plate and the second connecting plate will drive the placement stage to move. When the displacement blocks move closer to each other, the clamping component will clamp the memory chip. However, when the memory chip is sealed together with the memory module, the positioning effect of the memory module and the memory chip is poor. It is easy to block the edge of the memory chip, which affects the packaging of the memory chip. It is inconvenient to position and package the memory chip, which reduces the effectiveness of the packaging and positioning device. Utility Model Content

[0005] Therefore, it is necessary to provide a memory chip packaging and positioning device to address the problem of inconvenience in positioning and packaging memory chips.

[0006] The device includes a workbench, with a conveyor rail fixedly connected to the center of the top of the workbench. A placement plate is mounted on the top of the conveyor rail, and a positioning mechanism is provided on the top of the placement plate. The positioning mechanism includes limiting plates slidably connected to both sides of the top of the placement plate. A mounting block is provided on one side of the top of the limiting plate. A first electric push rod is mounted on the top of the mounting block. One end of the first electric push rod passes through the mounting block and is fixedly connected to the positioning block. Two limiting rods are fixedly connected to one side of the inner wall of the positioning block.

[0007] In one embodiment, the positioning mechanism further includes a mounting ring slidably connected to the top of the limiting plate, and a second electric push rod is fixedly connected to the inner wall of the mounting ring.

[0008] In one embodiment, one end of the second electric actuator is fixedly connected to the mounting block.

[0009] In one embodiment, a slider is fixedly connected to the bottom end of the mounting ring, and the slider is slidably connected to the inner wall of the limiting plate.

[0010] In one embodiment, a lead screw is rotatably connected to the inner wall of the limiting plate, and one end of the lead screw is threadedly connected to the slider.

[0011] In one embodiment, a connecting block is fixedly connected to one side of the limiting plate, and two electric slide rails are installed at the rear end of the placement plate, with the connecting block fixedly connected to the electric slide rails.

[0012] In one embodiment, a calibration plate is fixedly connected to one end of the top of the placement plate, and the calibration plate is disposed on one side of the electric slide rail.

[0013] In one embodiment, the top of the correction plate is provided with a groove, and the connecting block is fitted into the groove.

[0014] Beneficial effects 1. The above-mentioned memory chip packaging and positioning device has two limiting plates on the placement plate that can center and clamp the two sides of the memory card, improving the placement effect of the memory chip. The positioning block and two limiting rods can position the memory chip on the memory card. The positioning block has an L-shaped structure, which can limit the two sides of the memory chip. One end of the limiting rod is arc-shaped, which can support and position the memory chip and reduce contact with the memory chip. The mounting ring can drive the positioning block to slide on the limiting plate through the slider. The second electric push rod can drive the fixing block to move to one side to align with the memory chip. The first electric push rod can drive the fixing block to move downward to position the memory chip. It can quickly and accurately position the memory chip and improve the packaging effect of the memory chip. 2. When packaging memory chips, two electric slide rails can drive two limit plates to move simultaneously through the connecting block to limit and fix the memory card. The position of the memory card is calibrated by the calibration plate. The slide groove on the calibration plate can guide the movement of the connecting block, which can ensure the accuracy of the memory chip installation on the memory card and facilitate the packaging of the memory chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the external structure of the present utility model; Figure 2 This is a schematic diagram of the positioning mechanism structure of this utility model; Figure 3 This utility model Figure 2 Enlarged view of point A in the middle; Figure 4 This utility model Figure 2 Enlarged view of point B in the middle; Figure 5 This is a partial structural diagram of the positioning mechanism of this utility model.

[0017] Figure label: 100. Workbench; 200. Conveyor rail; 300. Placement plate; 400. Positioning mechanism; 410. Limiting plate; 420. Mounting block; 430. First electric push rod; 440. Positioning block; 450. Limiting rod; 460. Mounting ring; 461. Second electric push rod; 462. Slider; 470. Lead screw; 471. Connecting block; 472. Electric slide rail; 473. Correction plate; 474. Slide groove. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0019] The following is combined with Figure 1 - Figure 5 This invention describes a packaging and positioning device for a memory chip.

[0020] In one embodiment, a memory chip packaging and positioning device includes a worktable 100, a conveyor rail 200 fixedly connected to the middle of the top of the worktable 100, a placement plate 300 mounted on the top of the conveyor rail 200, and a positioning mechanism 400 provided on the top of the placement plate 300; wherein, the positioning mechanism 400 includes a limiting plate 410 slidably connected to both sides of the top of the placement plate 300, a mounting block 420 provided on one side of the top of the limiting plate 410, a first electric push rod 430 mounted on the top of the mounting block 420, one end of the first electric push rod 430 passing through the mounting block 420 and fixedly connected to a positioning block 440, and two limiting rods 450 fixedly connected to one side of the inner wall of the positioning block 440.

[0021] It should be noted that the packaging positioning device with model number "SPS-313D" typically consists of control components, moving components, and adhesive supply components. Control unit: Responsible for receiving instructions and controlling the operation of the entire device. It includes components such as the motherboard, touch screen, and various sensors, and uses precise algorithms to achieve accurate control of the glue application.

[0022] Moving parts: Responsible for the overall movement and positioning of the device, including movement in the X, Y, and Z directions, to ensure that the adhesive can be accurately applied to the target location.

[0023] Adhesive supply components: The flow of adhesive is controlled by a dispensing valve and a needle. They are mostly made of stainless steel, which can ensure a stable supply of adhesive and prevent contamination or air from entering the pipeline.

[0024] When packaging memory chips, the positioning mechanism 400 can position the memory module by cooperating with the correction plate 473 through two limiting plates 410. The second electric push rod 461 can drive the positioning block 440 and the limiting rod 450 at the bottom of the mounting block 420 to move to one side and align with the edge of the memory chip on the memory card. The first electric push rod 430 can position and package the memory chip through the positioning block 440 and the limiting rod 450. This can optimize the positioning effect of the air device positioning device and will not affect the normal use of the packaging positioning device.

[0025] like Figure 2 , Figure 3 and Figure 4 As shown, the positioning mechanism 400 also includes a mounting ring 460 slidably connected to the top of the limiting plate 410. A second electric push rod 461 is fixedly connected to the inner wall of the mounting ring 460. One end of the second electric push rod 461 is fixedly connected to the mounting block 420. A slider 462 is fixedly connected to the bottom end of the mounting ring 460. The slider 462 is slidably connected to the inner wall of the limiting plate 410.

[0026] In this embodiment, the two limiting plates 410 can clamp and position the memory card. The second electric push rod 461 drives the positioning block 440 at the bottom of the mounting block 420 and the two limiting rods 450 to move above the memory chip. Then, the first electric push rod 430 drives the positioning block 440 and the limiting rods 450 to move downward. The positioning block 440 can limit the two sides of the memory chip, and the limiting rods 450 can squeeze and fix the top of the two sides of the memory chip, improving the packaging accuracy of the device. The mounting ring 460 can slide on the limiting plate 410 through the slider 462, which can quickly position and package the memory chip and improve the packaging effect of the packaging positioning device.

[0027] like Figure 3 and Figure 5 As shown, a lead screw 470 is rotatably connected to the inner wall of the limiting plate 410. One end of the lead screw 470 is threadedly connected to the slider 462. A connecting block 471 is fixedly connected to one side of the limiting plate 410. Two electric slide rails 472 are installed at the rear end of the placement plate 300. The connecting block 471 is fixedly connected to the electric slide rail 472. A correction plate 473 is fixedly connected to one end of the top of the placement plate 300. The correction plate 473 is located on one side of the electric slide rail 472. A groove 474 is opened at the top of the correction plate 473. The connecting block 471 is fitted into the groove 474.

[0028] In this embodiment, the moving block on the electric slide rail 472 cooperates with the connecting block 471 to drive the limiting plate 410 to move towards the center, which can limit and clamp the two sides of the memory card, facilitating the packaging of the memory chip. The electric slide rail 472, the rotating screw 470 and the slider 462 are threadedly connected, which can drive the mounting ring 460 to slide on the limiting plate 410, adjusting the position of the positioning block 440 and the limiting rod 450. The connecting block 471 slides along the inner wall of the slide groove 474, improving the movement stability of the limiting plate 410. The correction plate 473 can correct and align one side of the memory card, and can position and clamp the memory card and memory chip, which can improve the packaging effect of the memory chip.

[0029] Working principle: The memory card is placed on the placement plate 300, with one side of the memory card aligned with the calibration plate 473. The memory chip is then placed on the memory card. The control unit drives two electric slide rails 472, which in turn drive two connecting blocks 471 to slide along the inner wall of the slide groove 474 to one side. Simultaneously, the two connecting blocks 471 drive two limiting plates 410 to move from both sides towards the center, clamping and limiting the memory card. Manually rotating the lead screw 470, which is threadedly connected to the slider 462, causes the mounting ring 460 to adjust and move according to the position of the memory chip. The control unit then drives two second electric... One end of the push rod 461 moves the mounting block 420 to one side near the memory chip. The control unit drives the first electric push rod 430 to move the positioning block 440 and the two limit rods 450 downward to position the two sides of the memory chip. The conveying track 200 moves the placement plate 300 below the needle, so that the needle can apply glue to the other two sides of the memory chip to fix the memory chip. The control of the second electric push rod 461 moves the positioning block 440 and the limit rods 450 away from the restriction on the memory chip, so that the needle can encapsulate the entire memory chip.

[0030] It should be noted that the first electric push rod 430, the second electric push rod 461, and the electric slide rail 472 mentioned above are all devices with relatively mature existing technology. The specific model can be selected according to actual needs. At the same time, the first electric push rod 430, the second electric push rod 461, and the electric slide rail 472 can be powered by the built-in power supply or by the mains power. The specific power supply method is selected according to the situation and will not be elaborated here.

[0031] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A packaging and positioning device for a memory chip, characterized in that, include: A workbench (100) is provided with a conveying rail (200) fixedly connected to the middle of the top of the workbench (100), a placement plate (300) is installed at the top of the conveying rail (200), and a positioning mechanism (400) is provided at the top of the placement plate (300). The positioning mechanism (400) includes a limiting plate (410) slidably connected to both sides of the top of the placement plate (300). A mounting block (420) is provided on one side of the top of the limiting plate (410). A first electric push rod (430) is installed at the top of the mounting block (420). One end of the first electric push rod (430) passes through the mounting block (420) and is fixedly connected to a positioning block (440). Two limiting rods (450) are fixedly connected to one side of the inner wall of the positioning block (440).

2. The memory chip packaging and positioning device according to claim 1, characterized in that, The positioning mechanism (400) further includes a mounting ring (460) slidably connected to the top of the limiting plate (410), and a second electric push rod (461) is fixedly connected to the inner wall of the mounting ring (460).

3. The memory chip packaging and positioning device according to claim 2, characterized in that, One end of the second electric push rod (461) is fixedly connected to the mounting block (420).

4. The memory chip packaging and positioning device according to claim 2, characterized in that, The bottom end of the mounting ring (460) is fixedly connected to a slider (462), which is slidably connected to the inner wall of the limiting plate (410).

5. The packaging and positioning device for a memory chip according to claim 1, characterized in that, The inner wall of the limiting plate (410) is rotatably connected to a lead screw (470), and one end of the lead screw (470) is threadedly connected to the slider (462).

6. The packaging and positioning device for a memory chip according to claim 1, characterized in that, A connecting block (471) is fixedly connected to one side of the limiting plate (410), and two electric slide rails (472) are installed at the rear end of the placement plate (300). The connecting block (471) is fixedly connected to the electric slide rails (472).

7. The memory chip packaging and positioning device according to claim 6, characterized in that, A calibration plate (473) is fixedly connected to one end of the top of the placement plate (300), and the calibration plate (473) is located on one side of the electric slide rail (472).

8. The memory chip packaging and positioning device according to claim 7, characterized in that, The top of the correction plate (473) is provided with a groove (474), and the connecting block (471) is fitted into the groove (474).

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