Wafer calibrator based on image processing

Abstract

The utility model discloses a wafer calibrator based on image processing, including vacuum chuck module and up and down camera module, vacuum chuck module sets up at the front of up and down camera module, is used for adsorbing wafer, and drives wafer to move and rotate between up and down camera module, up and down camera module includes the upper camera module and lower camera module of up and down arrangement, and up and down camera module takes the picture to the front and back of wafer respectively, and through software module carries out image processing, completes the center calculation of wafer, angle calculation and wafer ID identification of wafer front and back, the wafer calibrator of the utility model, through CCD image processing replaces traditional mechanical calibration and photoelectric sensor calibration, can effectively cope with the calibration problem of different material of existing wafer, different technology, through adopting double camera system, carries out double -sided edge positioning to wafer, can efficiently accurate completion wafer's positioning function, greatly reduced the problem of edge -finding failure.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing and testing technology, and specifically to a wafer calibrator based on image processing. Background Technology

[0002] Wafer calibrators are critical pieces of equipment in semiconductor manufacturing, used to precisely position and orient the wafer before photolithography, inspection, and other process steps. The function of a wafer calibrator is to adjust the wafer's position and angle by detecting its edges or notches / flats, aligning it with the process coordinate system.

[0003] Defects and shortcomings of existing technology:

[0004] Mechanical contact calibration: can easily lead to wafer edge damage, especially for ultra-thin wafers or large wafers (such as 12-inch wafers) at higher risk.

[0005] Poor compatibility: It has poor adaptability to new transparent edge wafers or bonding wafers and is prone to misidentification.

[0006] Cost and maintenance: The complex internal structure design makes it prone to failure or difficult to repair.

[0007] Insufficient intelligence: unable to perform wafer ID recognition. Utility Model Content

[0008] The technical problem solved by this invention is to provide a wafer calibrator based on image processing that can perform double-sided edge-finding and positioning, with fast positioning speed and high accuracy.

[0009] The technical solution adopted by this utility model to solve its technical problem is:

[0010] A wafer calibrator based on image processing includes a vacuum chuck module and upper and lower camera modules.

[0011] The vacuum chuck module includes a moving platform, a motor bracket, a rotating platform, and a vacuum chuck. The vacuum chuck is mounted on the upper end of the rotating platform for adsorption and fixation of the wafer. The rotating platform is fixedly mounted on the upper end of the motor bracket for driving the vacuum chuck to rotate. The motor bracket is fixedly mounted on the upper end of the moving platform, and the moving platform drives the vacuum chuck to move via the motor bracket to adapt to the calibration of wafers of different sizes.

[0012] The upper and lower camera module includes upper and lower cameras for imaging, upper and lower lenses for adjusting focal length and magnification, and upper and lower light source components for adjusting the illumination angle and brightness of the light source.

[0013] The vacuum suction cup module is located in front of the upper and lower camera modules and is used to adsorb the wafer and drive the wafer to move and rotate between the upper and lower camera modules. The upper and lower camera modules include an upper camera module and a lower camera module arranged vertically. The upper and lower camera modules respectively capture images of the front and back of the wafer, and the software module performs image processing to complete the calculation of the wafer's center, angle calculation, and wafer ID recognition of the front and back of the wafer.

[0014] Furthermore, the mobile platform includes an upper mobile platform and a lower mobile platform, which cooperate to drive the vacuum suction cup to move back and forth.

[0015] Preferably, the mobile platform is a cylinder slide.

[0016] Furthermore, the rotating platform is mounted and fixed on the upper end of the motor bracket via a motor adapter plate. The upper end of the motor bracket is regularly provided with a motor mounting slot for accommodating and installing the rotating platform. The rotating platform is mounted and fixed on the lower end of the motor adapter plate and is fixedly installed in the motor mounting slot via the motor adapter plate.

[0017] Furthermore, the rotating platform is a hollow rotating platform, with through holes regularly arranged in the middle to facilitate the passage of vacuum pipelines or vacuum adapters.

[0018] Furthermore, the upper end of the vacuum chuck is regularly provided with a vacuum adsorption channel for adsorbing wafers, and a vacuum pipeline is regularly provided inside it. The lower end of the chuck is connected to the pipeline through a vacuum adapter and is connected to a vacuum solenoid valve through the pipeline.

[0019] Furthermore, the vacuum suction cup module is mounted and fixed on the upper surface of the base plate, and the upper and lower camera modules are located behind the vacuum suction cup module and are mounted and fixed on the front side of the rear mounting bracket by a camera bracket. The rear mounting bracket is vertically fixed on the upper surface of the base plate.

[0020] Furthermore, the base plate and the rear mounting bracket are encapsulated with several panels to form the outer shell of the wafer calibrator, which encapsulates the vacuum chuck module, the upper and lower camera modules, and other accessories and pipelines.

[0021] Furthermore, the panel at the upper end of the lower camera module forms a worktable, and the worktable is regularly provided with suction cup movement ports in the moving area of ​​the vacuum suction cup to facilitate the passage and movement of the vacuum suction cup; the worktable is regularly provided with image capture ports at the position of the lower light source assembly to facilitate light source transmission and image capture.

[0022] Furthermore, a dustproof plate is provided at the image acquisition port for dust prevention.

[0023] Furthermore, the upper and lower camera modules are arranged horizontally, and the upper and lower light source components are internally regularly configured with reflective lenses that change the path of the light source.

[0024] The beneficial effects of this utility model are:

[0025] 1. This wafer calibrator, through CCD image processing, replaces traditional mechanical and photoelectric sensor calibration, effectively addressing calibration challenges arising from different wafer materials and processes. By employing a dual-camera system for double-sided edge-finding positioning of the wafer, it efficiently and accurately completes the wafer positioning function, significantly reducing edge-finding failures. Simultaneously, CCD image processing is adaptable to wafers of different materials and processes, effectively improving the equipment's compatibility with various wafers. Furthermore, this wafer calibrator can read the double-sided ID of the wafer during calibration using a CCD camera, replacing wafer ID reading devices, further improving equipment efficiency and reducing costs.

[0026] 2. This utility model adopts a unique programmable light source, which can control the illumination angle and brightness of the light source. Various combinations can effectively improve the imaging quality of the camera and further improve the speed and accuracy of wafer positioning.

[0027] 3. This invention employs a dual-moving platform for rapid switching between wafers of different sizes, compatible with wafers ranging from 4 inches to 12 inches, effectively improving the equipment's compatibility with different wafer sizes. It also reduces the complexity of the equipment's internal structure, lowers the frequency of equipment failures, and reduces maintenance costs. Attached Figure Description

[0028] Figure 1 This is a diagram showing the internal structure of the concealed panel and structure of this utility model.

[0029] Figure 2 This is a diagram showing the internal structure behind the hidden panel of this utility model;

[0030] Figure 3 for Figure 1 Detailed structural diagram of the vacuum suction cup module;

[0031] Figure 4 This is an overall structural diagram of the present invention;

[0032] The diagram is marked as follows:

[0033] 1. Outer shell; 11. Base plate; 12. Rear mounting bracket; 13. Front panel; 14. Workbench surface; 141. Suction cup movable port; 142. Image pickup port; 15. Dustproof plate.

[0034] 2. Vacuum suction cup module; 21. Moving platform; 22. Motor bracket; 23. Rotating platform; 24. Vacuum suction cup; 211. Lower moving platform; 212. Upper moving platform; 221. Motor mounting slot; 231. Motor adapter plate; 241. Vacuum adsorption channel; 242. Vacuum adapter.

[0035] 3. Install the camera module; 31. Install the camera; 32. Install the lens; 33. Install the light source assembly.

[0036] 4. Lower camera module; 41. Lower camera; 42. Lower lens; 43. Lower light source assembly;

[0037] 5. Camera tripod;

[0038] 6. Vacuum solenoid valve. Detailed Implementation

[0039] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] like Figures 1-4 As shown, this utility model provides a wafer calibrator based on image processing, including a vacuum chuck module 2, an upper camera module 3, and a lower camera module 4. The vacuum chuck module 2 is positioned in front of the upper and lower camera modules (3, 4) to adsorb and fix the wafer, and to drive the wafer to move and rotate between the upper and lower camera modules (3, 4). The upper camera module 3 and the lower camera module 4 are positioned vertically to capture images of the front and back of the wafer, respectively. Image processing is performed by a software module to complete wafer center calculation, angle calculation, and wafer ID identification of the front and back sides of the wafer.

[0042] The working principle of this utility model is as follows:

[0043] The wafer handling robot moves the wafer to the vacuum chuck module 2, where it is held in place by the vacuum chuck module 2. The vacuum chuck module 2 drives the wafer to rotate between the upper and lower camera modules (3, 4). The upper and lower camera modules (3, 4) scan the entire circumference of the wafer and use image processing software to calculate the wafer center and angle, as well as the wafer ID for the front or back of the wafer. The wafer has notch ports or flat edges; after locating these feature points, the wafer mounting angle is calculated based on these feature points to ensure that the wafer can be placed at the desired position and angle when placed in other workstations.

[0044] like Figure 1 As shown, the upper and lower camera modules (3 and 4) are respectively equipped with a camera, lens and light source components.

[0045] The camera is used for imaging, with a CCD camera being the preferred choice. The lens is used to adjust and control the focal length and magnification, with a zoom lens being the preferred choice. The light source assembly is an adjustable light source assembly used to adjust and control the illumination angle and brightness of the light source to increase the image quality of the camera.

[0046] Furthermore, the upper camera module 3 includes an upper camera 31, an upper lens 32, and an upper light source assembly 33, while the lower camera module 4 includes a lower camera 41, a lower lens 42, and a lower light source assembly 43. The upper light source assembly 33 and the lower light source assembly 43 are positioned vertically, and the two camera modules can operate synchronously or independently.

[0047] This wafer calibrator utilizes CCD image processing to replace traditional mechanical and photoelectric sensor calibration, effectively addressing calibration challenges arising from different wafer materials and processes. By employing a dual-camera system for double-sided edge-finding and positioning, it efficiently and accurately completes wafer positioning, significantly reducing edge-finding failures. Furthermore, CCD image processing adapts to wafers of different materials and processes, effectively improving the device's compatibility with various wafer types. Additionally, this wafer calibrator can read the double-sided ID of the wafer during calibration using a CCD camera, replacing traditional wafer ID reading devices and further improving efficiency while reducing costs.

[0048] This invention employs a unique programmable light source, which can control the illumination angle and brightness of the light source. Various combinations can effectively improve the imaging quality of the camera and further enhance the speed and accuracy of wafer positioning.

[0049] like Figure 1 and Figure 3As shown, the vacuum chuck module 2 includes a moving platform 21, a motor bracket 22, a rotating platform 23, and a vacuum chuck 24. The vacuum chuck 24, used for adsorbing and fixing the wafer, is mounted on the upper end of the rotating platform 23. The rotating platform 23, used to drive the vacuum chuck 24 to rotate, is fixedly mounted on the upper end of the motor bracket 22. The motor bracket 22 is fixedly mounted on the upper end of the moving platform 21. The moving platform 21 drives the vacuum chuck 24 to move horizontally via the motor bracket 22, thereby adjusting the position of the wafer.

[0050] Furthermore, such as Figure 3 As shown, the moving platform 21 includes a lower moving platform 211 and an upper moving platform 212. Through the cooperation of the upper and lower moving platforms (211, 212), the front and rear positions of the wafer can be quickly and accurately adjusted to adjust the distance from the wafer rotation center to the lens, thereby adapting to wafers of different sizes. The travel of a single moving platform is limited. The design of dual moving platforms can quickly and accurately adjust the front and rear positions of the vacuum chuck 24, thus being compatible with 4-inch, 6-inch, 8-inch, and 12-inch wafers.

[0051] Furthermore, the vertical moving platforms (211, 213) preferably use cylinder slides or lead screw slides.

[0052] This invention employs a dual-moving platform for rapid switching between wafers of different sizes, compatible with wafers ranging from 4 inches to 12 inches, effectively improving the equipment's compatibility with different wafer sizes. It also reduces the complexity of the equipment's internal structure, lowers the frequency of equipment failures, and reduces maintenance costs.

[0053] Furthermore, such as Figure 3 As shown, the rotating platform 23 is mounted and fixed on the upper end of the motor bracket 22 via the motor adapter plate 231. The upper end of the motor bracket 22 is regularly provided with a motor mounting slot 221 to facilitate the installation and accommodation of the rotating platform 23. The rotating platform 23 is mounted and fixed on the lower end of the motor adapter plate 231 and is fixedly installed in the motor mounting slot 221 on the upper end of the motor bracket 22 via the motor adapter plate 231.

[0054] Furthermore, the rotating platform 23 is a hollow rotating platform with a through hole in the middle to facilitate the passage of vacuum pipelines or vacuum adapters.

[0055] Furthermore, such as Figure 3 and Figure 1 As shown, the upper end of the vacuum suction cup 24 is regularly provided with a vacuum adsorption channel 241, and a vacuum pipeline is regularly provided inside it. The lower end of the vacuum suction cup 24 is connected to the pipeline through a vacuum adapter 242 and then connected to the vacuum solenoid valve 6 through the pipeline.

[0056] like Figure 1As shown, the vacuum suction cup module 2 is installed and fixed on the upper surface of the base plate 11. The upper and lower camera modules (3, 4) are vertically arranged and located behind the vacuum suction cup module 2. They are installed and fixed on the front side of the rear mounting bracket 12 through the camera bracket 5. The rear mounting bracket 12 is vertically fixed on the upper surface of the base plate 11.

[0057] like Figure 4 As shown, the wafer calibrator of this utility model is encapsulated by several panels 13. The panels 13 are regularly assembled and fixed together around the base plate 11 and the rear mounting bracket 12 to form the outer shell of the wafer calibrator, thereby encapsulating the vacuum suction cup module 2, the upper and lower camera modules (3, 4), the vacuum solenoid valve, and other accessories and pipelines.

[0058] Furthermore, such as Figure 1 and Figure 4 As shown, the panel at the upper end of the lower camera module 4 forms a worktable 14. The worktable 14 is located in the moving area of ​​the vacuum suction cup 24 and is regularly provided with suction cup access ports 141 to facilitate the passage and movement of the vacuum suction cup 24. At the position of the lower light source assembly 43, the worktable 141 is regularly provided with an image capture port 142 to facilitate light source transmission and image capture by the lower camera.

[0059] Furthermore, the image capture port 142 adopts a stepped opening design and is equipped with a dustproof plate 15. The dustproof plate 15 is installed and fixed on the step of the image capture port 142, thereby sealing the image capture port 142 and preventing dust and other foreign objects from falling into the lower light source assembly 43 and affecting the image capture operation of the lower camera.

[0060] Furthermore, such as Figure 1 As shown, in order to reduce the size of the wafer calibrator and effectively utilize the space inside the wafer calibrator housing, the upper and lower camera modules (3, 4) are arranged horizontally. To facilitate the upper camera 31 to capture images downwards and the lower camera 41 to capture images upwards, the upper and lower light source assemblies (33, 43) are equipped with reflective lenses that change the light source path.

[0061] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above are only specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer calibrator based on image processing, characterized in that: Includes a vacuum suction cup module and upper and lower camera modules. The vacuum chuck module includes a moving platform, a motor bracket, a rotating platform, and a vacuum chuck. The vacuum chuck is mounted on the upper end of the rotating platform for adsorption and fixation of the wafer. The rotating platform is fixedly mounted on the upper end of the motor bracket for driving the vacuum chuck to rotate. The motor bracket is fixedly mounted on the upper end of the moving platform, and the moving platform drives the vacuum chuck to move via the motor bracket to adapt to the calibration of wafers of different sizes. The upper and lower camera module includes upper and lower cameras for imaging, upper and lower lenses for adjusting focal length and magnification, and upper and lower light source components for adjusting the illumination angle and brightness of the light source. The vacuum suction cup module is located in front of the upper and lower camera modules and is used to adsorb the wafer and drive the wafer to move and rotate between the upper and lower camera modules. The upper and lower camera modules include an upper camera module and a lower camera module arranged vertically. The upper and lower camera modules respectively capture images of the front and back of the wafer, and the software module performs image processing to complete the calculation of the wafer's center, angle calculation, and wafer ID recognition of the front and back of the wafer.

2. The wafer calibrator based on image processing according to claim 1, characterized in that: The mobile platform includes an upper mobile platform and a lower mobile platform, which work together to drive the vacuum suction cup to move back and forth.

3. A wafer calibrator based on image processing according to claim 1, characterized in that: The rotating platform is mounted and fixed on the upper end of the motor bracket via a motor adapter plate. The upper end of the motor bracket is regularly provided with motor mounting slots to facilitate the accommodation and installation of the rotating platform. The rotating platform is mounted and fixed on the lower end of the motor adapter plate and is fixedly set in the motor mounting slot via the motor adapter plate.

4. A wafer calibrator based on image processing according to claim 1, characterized in that: The rotating platform is a hollow rotating platform, with regular through holes in the middle to facilitate the passage of vacuum pipelines or vacuum adapters.

5. A wafer calibrator based on image processing according to claim 4, characterized in that: The upper end of the vacuum chuck is regularly provided with a vacuum adsorption channel for adsorbing wafers, and a vacuum pipeline is regularly provided inside it. The lower end of the chuck is connected to the pipeline through a vacuum adapter and is connected to a vacuum solenoid valve through the pipeline.

6. A wafer calibrator based on image processing according to any one of claims 1-5, characterized in that: The vacuum suction cup module is mounted and fixed on the upper surface of the base plate. The upper and lower camera modules are located behind the vacuum suction cup module and are mounted and fixed on the front side of the rear mounting bracket via a camera bracket. The rear mounting bracket is vertically fixed on the upper surface of the base plate.

7. A wafer calibrator based on image processing according to claim 6, characterized in that: The base plate and the rear mounting bracket are encapsulated with several panels to form the outer shell of the wafer calibrator, which encapsulates the vacuum chuck module, the upper and lower camera modules, and other accessories and pipelines.

8. A wafer calibrator based on image processing according to claim 7, characterized in that: The panel at the upper end of the lower camera module forms a worktable. The worktable is regularly provided with suction cup openings in the moving area of ​​the vacuum suction cup to facilitate the passage and movement of the vacuum suction cup. At the position of the lower light source assembly, the worktable is regularly provided with image capture openings to facilitate light source transmission and image capture.

9. A wafer calibrator based on image processing according to claim 8, characterized in that: A dustproof plate is provided at the image acquisition port for dust prevention.

10. A wafer calibrator based on image processing according to claim 6, characterized in that: The upper and lower camera modules are arranged horizontally, and the upper and lower light source components are internally regularly configured with reflective lenses that change the path of the light source.

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