A clamping device for semiconductor wafer production

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment discloses a clamping equipment for semiconductor wafer production, the equipment includes base, rotating component, push mechanism, transmission assembly and clamping plate, the base is hollow structure, built -in rotating component, it drives driving wheel through rotating motor, through transmission belt driving driven wheel and rotating disc rotation, realizes integral horizontal rotation, push mechanism is located on the rotating disc, drives transmission link by push motor, and cooperation connecting rod and rotating rod drive push rod to go up and down, and the clamping height is adjusted, transmission assembly contains transmission case and screw rod, and driving motor drives screw rod rotation, makes the ball nut drive clamping plate horizontal movement, the vacuum suction hole is established on the clamping plate surface, realizes wafer stable adsorption, and the equipment passes through the cooperation of multiple components, realizes wafer rotation, lifting, translation and lossless clamping, compact structure, accurate operation, is applicable to semiconductor wafer production scene.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a clamping device for semiconductor wafer production. Background Technology

[0002] In the semiconductor manufacturing industry, wafers are the core processing substrate. Their production process involves multiple steps such as cutting, coating, and testing. Each step places extremely high demands on the positioning accuracy and clamping stability of the wafers.

[0003] However, the transmission structure design of current semiconductor wafer clamping equipment can only achieve position adjustment in one direction. Even if some equipment has multi-directional adjustment functions, its transmission components mostly use ordinary gear meshing or belt drive, which do not form a rigid transmission system. For example, in the gear transmission system used for horizontal angle adjustment, there is a lack of precise meshing structure between the driving wheel, driven wheel and transmission belt, which can easily cause angle deviation due to transmission gaps. The mechanism used for height lifting mostly relies on cylinder drive, which cannot achieve smooth linear adjustment. The wafer clamping method of traditional equipment is mainly based on chuck clamping. The chuck contacts the edge of the wafer, and the clamping force is difficult to control evenly, which can easily form scratches on the wafer surface or cause edge breakage. Although some equipment attempts to use vacuum adsorption, the adsorption structure is disconnected from the transmission components. After adsorption, the fine adjustment of the wafer position depends on manual assistance, which is not only cumbersome to operate, but also easy to cause wafer position deviation due to external force intervention, further aggravating processing deviations.

[0004] Therefore, there is an urgent need for a clamping device for semiconductor wafer production that has multi-dimensional precise transmission and can achieve stable, non-destructive clamping of wafers. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a clamping device for semiconductor wafer production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a clamping device for semiconductor wafer production, comprising a base, the base being hollow inside, and a rotating component disposed inside the base, the rotating component being used to drive the rotation of a mechanism, one upper surface of the rotating component being connected to the lower end of the driving mechanism, the driving mechanism being used to drive a transmission component and a clamping plate, the upper end of the driving mechanism being connected to the lower surface of the transmission component, the transmission component being used to move the clamping plate, the upper part of the transmission component being connected to the lower end of the clamping plate, the upper surface of the clamping plate away from the transmission component being provided with a plurality of vacuum suction holes, the clamping plate being used to clamp the wafer.

[0007] As a further description of the above technical solution:

[0008] The rotating assembly includes a rotary motor, which is placed on one side of the upper surface of the base. The output shaft of the rotary motor is connected to the upper surface of the drive wheel. The drive wheel is rotatably connected to one side of the inner bottom surface of the base. The lower end of the driven wheel is rotatably connected to the side of the base away from the drive wheel.

[0009] As a further description of the above technical solution:

[0010] The driving wheel and the driven wheel are connected by a transmission belt. The outer walls of the driving wheel and the driven wheel and the inner wall of the transmission belt are provided with protrusions. The upper surface of the driven wheel is connected to the lower surface of the rotating disk.

[0011] As a further description of the above technical solution:

[0012] The pushing mechanism includes a pushing cylinder, the lower end of which is connected to the upper surface of a rotating disk. A pushing motor is placed on one side of the upper surface of the rotating disk, and the output shaft of the pushing motor is connected to the lower end of a transmission rod. The upper end of the transmission rod is rotatably connected to the lower end of a first connecting rod, and the other end of the first connecting rod is rotatably connected to one side of a rotating rod. The middle of the rotating rod is rotatably connected to the inner wall of the pushing cylinder through a rotating shaft.

[0013] As a further description of the above technical solution:

[0014] The two ends of the rotating rod are rotatably connected to one end of the second connecting rod on opposite sides, and the other end of the second connecting rod is rotatably connected to the lower end of the push rod. The upper end of the push rod slides above the push cylinder, and the upper end of the push rod is connected to the lower surface of the transmission box.

[0015] As a further description of the above technical solution:

[0016] The transmission assembly includes a transmission box, a drive motor is provided on one side of the transmission box, and the output shaft of the drive motor is connected to one end of a lead screw, the other end of the lead screw is rotatably connected to the inner wall of the transmission box.

[0017] As a further description of the above technical solution:

[0018] A ball nut is slidably connected to the lead screw, and one end of the ball nut is bolted to the lower end of the clamping plate.

[0019] This utility model has the following beneficial effects:

[0020] I. Structural Design of Rotating Components, Pushing Mechanism, and Transmission Components: The equipment achieves horizontal angle adjustment through a rotary motor-driven wheel system transmission. The push motor drives the linkage mechanism to complete height lifting and lowering. The drive motor, in conjunction with the lead screw and nut structure, enables the horizontal movement of the clamping plate. All three levels of transmission adopt rigid transmission, and the driving wheel, driven wheel, and transmission belt are engaged by convex engagement, while the lead screw and ball nut slide together, effectively avoiding positioning errors caused by transmission backlash. It can accurately adjust the parameters of the wafer in horizontal angle, height, and horizontal position, meeting the high-precision position requirements of semiconductor wafer multi-process processing.

[0021] 2. The clamping plate is equipped with multiple vacuum suction holes on its surface and is driven by ball nuts. The equipment adopts a vacuum adsorption and precise translation clamping mode. Compared with traditional chuck clamping, the vacuum suction holes can uniformly adsorb the wafer through negative pressure, avoiding scratches, cracks and other damage to the wafer edge or surface caused by force. At the same time, the transmission component drives the clamping plate to move smoothly, ensuring the wafer position is stable during the clamping process, reducing processing deviations caused by unstable clamping, and ensuring the production quality of semiconductor wafers. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a cross-sectional view of the rotating component structure of this utility model;

[0024] Figure 3 This is a cross-sectional view of the propulsion mechanism of this utility model;

[0025] Figure 4 This is a cross-sectional view of the transmission component structure of this utility model.

[0026] Legend:

[0027] 1. Base; 2. Rotating assembly; 3. Pushing mechanism; 4. Transmission assembly; 5. Clamping plate; 201. Rotary motor; 202. Driving wheel; 203. Driven wheel; 204. Transmission belt; 205. Rotary disk; 301. Pushing cylinder; 302. Pushing motor; 303. Transmission rod; 304. First connecting rod; 305. Rotating rod; 306. Second connecting rod; 307. Pushing rod; 401. Transmission box; 402. Drive motor; 403. Lead screw; 404. Ball nut. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 4 As shown, this embodiment provides a clamping device for semiconductor wafer production, including: a base 1, the base 1 being hollow, and a rotating component 2 disposed inside the base 1. The rotating component 2 is used to drive the rotation of a driving mechanism 3. One upper surface of the rotating component 2 is connected to the lower end of the driving mechanism 3. The driving mechanism 3 is used to drive a transmission component 4 and a clamping plate 5. The upper end of the driving mechanism 3 is connected to the lower surface of the transmission component 4. The transmission component 4 is used to move the clamping plate 5. The upper part of the transmission component 4 is connected to the lower end of the clamping plate 5. The upper surface of the clamping plate 5 away from the transmission component 4 is provided with a plurality of vacuum suction holes. The clamping plate 5 is used for clamping wafers.

[0033] In this embodiment, the rotating component 2, the pushing mechanism 3, and the transmission component 4 constitute a clamping device for semiconductor wafer production according to this application.

[0034] It should also be noted that the semiconductor wafer in this application can be a silicon-based wafer, a silicon carbide wafer, a gallium nitride wafer, etc. Figure 1 In this embodiment, a silicon-based semiconductor wafer is used as an example for description. Of course, other types of semiconductor wafers can also adopt a similar structure, which will not be described in detail below.

[0035] Understandable, Figure 1 The clamping device is shown only schematically, and the actual shape, size, position, and construction of these components are not subject to change. Figure 1 Due to limitations, clamping devices can also include those that are more advanced than... Figure 1 More or fewer parts.

[0036] In addition, in this embodiment, the base 1 provides support, the rotating component 2 drives the pushing mechanism 3 to rotate around the central axis of the base 1, the pushing mechanism 3 drives the transmission component 4 to move in the vertical direction, the transmission component 4 drives the clamping plate 5 to move in the horizontal direction, and the clamping plate 5 generates negative pressure through the vacuum suction hole to adsorb the wafer, forming a multi-component collaborative clamping system to realize the adjustment of wafer angle, height and horizontal position and stable clamping, adapting to the basic requirements of wafer processing.

[0037] Specifically, the rotating assembly 2 includes a rotating motor 201, which is placed on one side of the upper surface of the base 1. The output shaft of the rotating motor 201 is connected to the upper surface of the drive wheel 202. The drive wheel 202 is rotatably connected to one side of the inner bottom surface of the base 1. The lower end of the driven wheel 203 is rotatably connected to the side of the inner surface of the base 1 away from the drive wheel 202.

[0038] In this embodiment, the output shaft of the rotary motor 201 drives the drive wheel 202 to rotate around its own central axis. The drive wheel 202 drives the driven wheel 203 to rotate synchronously through the transmission belt 204, providing horizontal rotation power for subsequent components and realizing wafer horizontal angle adjustment.

[0039] Specifically, the driving wheel 202 and the driven wheel 203 are connected by a transmission belt 204. The outer walls of the driving wheel 202 and the driven wheel 203 and the inner wall of the transmission belt 204 are provided with protrusions. The upper surface of the driven wheel 203 is connected to the lower surface of the rotating disk 205.

[0040] In a preferred embodiment, when the drive wheel 202 rotates, the groove on its outer wall engages with the protrusion on the inner wall of the transmission belt 204, causing the transmission belt 204 to move. The transmission belt 204 engages with the groove of the driven wheel 203 through the protrusion, causing the driven wheel 203 to rotate. The driven wheel 203 causes the rotating disk 205 to rotate around its own central axis, thus avoiding transmission slippage, ensuring stable transmission of rotational power, and controlling the angle adjustment precision.

[0041] Example 2:

[0042] A push mechanism 3 is provided based on embodiment 1.

[0043] Specifically, the pushing mechanism 3 includes a pushing cylinder 301. The lower end of the pushing cylinder 301 is connected to the upper surface of the rotating disk 205. A pushing motor 302 is placed on one side of the upper surface of the rotating disk 205, and the output shaft of the pushing motor 302 is connected to the lower end of the transmission rod 303. The upper end of the transmission rod 303 is rotatably connected to the lower end of the first connecting rod 304. The other end of the first connecting rod 304 is rotatably connected to one side of the rotating rod 305. The rotating rod 305 is rotatably connected to the inner wall of the pushing cylinder 301 through a rotating shaft in the middle.

[0044] In this embodiment, the output shaft of the drive motor 302 drives the transmission rod 303 to rotate around its own central axis. The transmission rod 303 drives the first connecting rod 304 to swing back and forth. The first connecting rod 304 drives the rotating rod 305 to swing back and forth around the central axis, thus converting the rotational motion of the motor into the swinging motion of the rotating rod, providing a power basis for the subsequent lifting action.

[0045] Specifically, the two ends of the rotating rod 305 are rotatably connected to one end of the second connecting rod 306 on opposite sides, and the other end of the second connecting rod 306 is rotatably connected to the lower end of the push rod 307. The upper end of the push rod 307 slides above the push cylinder 301, and the upper end of the push rod 307 is connected to the lower surface of the transmission box 401.

[0046] With this configuration, when the rotating rod 305 swings, its two ends respectively drive the corresponding second connecting rod 306 to move up and down. The second connecting rod 306 pushes the push rod 307 to slide up and down along the hole on the upper surface of the push cylinder 301. The push rod 307 drives the transmission box 401 to rise and fall in the vertical direction, so as to realize the smooth rise and fall of the transmission box 401.

[0047] Example 3:

[0048] A transmission component 4 is provided based on embodiment 2.

[0049] Specifically, the transmission assembly 4 includes a transmission box 401, a drive motor 402 is provided on one side of the transmission box 401, and the output shaft of the drive motor 402 is connected to one end of a lead screw 403, the other end of the lead screw 403 is rotatably connected to the inner wall of the transmission box 401.

[0050] Among them, the output shaft of the drive motor 402 drives the lead screw 403 to rotate around its own central axis. The lead screw 403 transmits power through the surface thread, providing precise power for the horizontal movement of the clamping plate. Each time the motor rotates, the distance the lead screw drives the component to move is consistent with the pitch, ensuring displacement accuracy.

[0051] Specifically, a ball nut 404 is slidably connected to the lead screw 403, and one end of the ball nut 404 is bolted to the lower end of the clamping plate 5.

[0052] In this embodiment, when the lead screw 403 rotates, it engages with the ball nut 404 through the thread, causing the ball nut 404 to slide along the axial direction of the lead screw 403. The ball nut 404 drives the clamping plate 5 to move synchronously in the horizontal direction through the connecting block and bolts, converting the rotational motion of the lead screw into the horizontal motion of the clamping plate. The bolt connection ensures that the clamping plate and the ball nut are firmly connected, avoiding displacement deviation.

[0053] In actual use, the base 1 is first installed on the workbench. Then, the rotary motor 201 is started. The output of the rotary motor 201 drives the drive wheel 202 to rotate. Since the drive wheel 202 and the driven wheel 203 are connected by a transmission belt 204, and the drive wheel 202 and the driven wheel 203 are engaged with the transmission belt 204 by a protrusion, the drive wheel 202 drives the driven wheel 203 to rotate. The rotation of the driven wheel 203 drives the rotating disk 205 to rotate. Subsequently, the rotating disk 205 drives the push mechanism 3 to rotate. After adjusting to a suitable angle, the push motor 302 is started. The output shaft of the push motor 302 drives the transmission rod 303 to rotate. The rotation of the transmission rod 303 drives the first connecting rod 304 to pull the rotary mechanism 3. The rotating rod 305 swings, which drives the second connecting rods 306 at both ends to rise and fall respectively. The second connecting rods 306 push the push rod 307 to rise and fall respectively. The push rod 307 pushes the transmission box 401 to rise and fall respectively. After the transmission assembly 4 is adjusted to a suitable height, the drive motor 402 is started. The output shaft of the drive motor 402 drives the lead screw 403 to rotate. The lead screw 403 drives the ball nut 404 to slide. The ball nut 404 slides and drives the clamping plate 5 to move, so that the clamping plate 5 clamps the wafer. Then the drive motor 302 is started again. Then different transmission boxes 401 are adjusted to different heights. Then the clamping plate 5 is moved to drive the wafer for processing.

[0054] The rotary motor 201, the push motor 302, and the drive motor 402 are all electrically connected to the PLC controller. The PLC controller is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0055] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0056] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A clamping device for semiconductor wafer manufacturing, characterized in that: Includes a base (1), the base (1) is hollow inside, and a rotating component (2) is provided inside the base (1). The rotating component (2) is used to drive the rotation of the mechanism (3). The upper surface of one side of the rotating component (2) is connected to the lower end of the pushing mechanism (3). The pushing mechanism (3) is used to drive the transmission component (4) and the clamping plate (5). The upper end of the pushing mechanism (3) is connected to the lower surface of the transmission component (4). The transmission component (4) is used to move the clamping plate (5). The upper part of the transmission component (4) is connected to the lower end of the clamping plate (5). The upper surface of the clamping plate (5) away from the transmission component (4) is provided with multiple vacuum suction holes. The clamping plate (5) is used to clamp the wafer.

2. The clamping apparatus for semiconductor wafer production according to claim 1, characterized by: The rotating assembly (2) includes a rotating motor (201), which is placed on one side of the upper surface of the base (1). The output shaft of the rotating motor (201) is connected to the upper surface of the drive wheel (202). The drive wheel (202) is rotatably connected to one side of the inner bottom surface of the base (1). The side of the base (1) away from the drive wheel (202) is rotatably connected to the lower end of the driven wheel (203).

3. The clamping apparatus for semiconductor wafer production according to claim 2, wherein: The driving wheel (202) and the driven wheel (203) are connected by a transmission belt (204). The outer walls of the driving wheel (202) and the driven wheel (203) and the inner wall of the transmission belt (204) are provided with protrusions. The upper surface of the driven wheel (203) is connected to the lower surface of the rotating disk (205).

4. The clamping apparatus for semiconductor wafer production according to claim 3, wherein: The pushing mechanism (3) includes a pushing cylinder (301), the lower end of which is connected to the upper surface of a rotating disk (205). A pushing motor (302) is placed on one side of the upper surface of the rotating disk (205), and the output shaft of the pushing motor (302) is connected to the lower end of a transmission rod (303). The upper end of the transmission rod (303) is rotatably connected to the lower end of a first connecting rod (304), and the other end of the first connecting rod (304) is rotatably connected to one side of a rotating rod (305). The middle of the rotating rod (305) is rotatably connected to the inner wall of the pushing cylinder (301) through a rotating shaft.

5. The clamping apparatus for semiconductor wafer production according to claim 4, characterized by: The two ends of the rotating rod (305) are rotatably connected to one end of the second connecting rod (306) on opposite sides. The other end of the second connecting rod (306) is rotatably connected to the lower end of the push rod (307). The upper end of the push rod (307) slides above the push cylinder (301). The upper end of the push rod (307) is connected to the lower surface of the transmission box (401).

6. The clamping apparatus for semiconductor wafer production according to claim 5, wherein: The transmission assembly (4) includes a transmission box (401), a drive motor (402) is provided on one side of the transmission box (401), and the output shaft of the drive motor (402) is connected to one end of a lead screw (403), and the other end of the lead screw (403) is rotatably connected to the inner wall of the transmission box (401).

7. The clamping apparatus for semiconductor wafer production according to claim 6, wherein: A ball nut (404) is slidably connected to the lead screw (403), and one end of the ball nut (404) is connected to the lower end of the clamping plate (5) by bolts.

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