Wafer carrier

Abstract

The utility model relates to wafer processing technical field, concretely disclose a wafer carrier in particular, in this wafer carrier, first support has at least two first pedestals of interval arrangement along the length direction, and first pedestal has at least two insertion slots, and two insertion slots are interval arrangement along the width direction, first support has a corresponding first upper concave groove and a plurality of first lower concave grooves, and first lower concave groove is located below corresponding first upper concave groove, second support has at least two second pedestals of interval arrangement along the length direction and is placed on at least two first pedestals one by one, and the side of second pedestal towards first pedestal has insertion projection, and insertion projection chooses and inserts in two insertion slots, and second support has a corresponding second upper concave groove and a plurality of second lower concave grooves, and second lower concave groove is located below corresponding second upper concave groove, and second upper concave groove and first upper concave groove correspond one by one. The above-mentioned setting saves processing cost, and improves cleaning effect.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer carrier. Background Technology

[0002] As the core component of semiconductor manufacturing, wafers have extremely high requirements for precision and environment in their production process. During the manufacturing process, wafers are often placed on quartz boats and then sent into a heat treatment furnace for a series of heat treatments.

[0003] Existing quartz boats are mostly one-piece molded structures. When dealing with various types of wafers during processing, it is necessary to frequently change to different types of quartz boats, which leads to an increase in the number of quartz boats and thus a larger footprint and higher processing costs. At the same time, the grooves at the bottom of the quartz boat are difficult to clean, resulting in a poor user experience and long cleaning time, which in turn increases time costs.

[0004] Therefore, it is urgent to study a wafer carrier to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a wafer carrier to solve the problems in the prior art where quartz boats need to be frequently replaced according to the wafer size, the quantity increases in batches, resulting in a large footprint, increased time and processing costs, and the small gap between the bottom grooves makes it difficult to place the wafers and clean them.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Wafer carrier, including:

[0008] The first bracket has at least two first bases spaced apart along the length direction, each first base having at least two insertion slots, the two insertion slots being spaced apart along the width direction; the first bracket has a plurality of first upper grooves and a plurality of first lower grooves corresponding to each other, the first lower grooves being located below the corresponding first upper grooves;

[0009] The second bracket has at least two second bases arranged at intervals along the length direction and placed on at least two first bases in a one-to-one correspondence. The second base has a plugging protrusion on the side facing the first base. One of the plugging protrusions is plugged into one of the two plugging slots. The second bracket has a plurality of second upper grooves and a plurality of second lower grooves that correspond to each other. The second lower groove is located below the corresponding second upper groove. The second upper groove and the first upper groove correspond to each other.

[0010] As an optional technical solution for a wafer carrier, the first support further includes a first mounting arm disposed on the first base, and a first upper support rod and a first lower support rod extending along the length direction and disposed between each of the first mounting arms. In the height direction, the first upper support rod and the first lower support rod are spaced apart; in the width direction, the first upper support rod and the first lower support rod are spaced apart; a first upper groove is disposed on the first upper support rod, and a first lower groove is disposed on the first lower support rod; and / or,

[0011] The second bracket further includes a second mounting arm disposed on the second base, and a second upper support rod and a second lower support rod extending along the length direction and disposed between each of the second mounting arms. In the height direction, the second upper support rod and the second lower support rod are spaced apart, and in the width direction, the second upper support rod and the second lower support rod are spaced apart. A second upper groove is disposed on the second upper support rod, and a second lower groove is disposed on the second lower support rod.

[0012] As an alternative technical solution for a wafer carrier, the first support further includes a first reinforcing member, which connects a plurality of the first mounting arms; and / or,

[0013] The second bracket also includes a second reinforcing member, which connects to several of the second mounting arms.

[0014] As an optional technical solution for a wafer carrier, the insertion slot has a bottom wall, a first side wall, and a second side wall. Along the width direction, the first side wall and the second side wall are located on opposite sides of the bottom wall. From bottom to top, the first side wall is inclined towards the direction close to the first mounting arm; and / or,

[0015] The shape of the insertion protrusion is similar to the shape of the insertion slot.

[0016] As an alternative technology for wafer carriers, the second sidewall is inclined towards the first mounting arm from bottom to top.

[0017] As an alternative technical solution for wafer carriers, the second sidewall is an arc-shaped surface.

[0018] As an alternative technology for wafer carriers, the dimensions of the interposer slot gradually increase along the width direction from bottom to top.

[0019] As an optional technical solution for a wafer carrier, the first base further includes a stop block, which is located on one side of the insertion slot along its length and abuts against the second base; and / or,

[0020] The bottom of the first base is provided with two support legs, which are arranged at intervals along the width direction.

[0021] As an optional technical solution for a wafer carrier, the height of the first upper groove is greater than one-quarter of the wafer diameter and less than or equal to one-half of the wafer diameter; and / or,

[0022] Along the length direction, the distance between two adjacent first upper grooves is 4mm-6mm.

[0023] As an alternative technical solution for a wafer carrier, the first support has three supports, which are arranged at intervals along the length direction, and the second support has three supports, which are placed on the first supports in a one-to-one correspondence.

[0024] This utility model has at least the following beneficial effects:

[0025] This utility model provides a wafer carrier, which includes a first support and a second support. The first support has at least two first bases spaced apart along the length direction, and each first base has at least two insertion slots spaced apart along the width direction. The first support has a plurality of first upper grooves and a plurality of first lower grooves that correspond one-to-one, with the first lower grooves located below the corresponding first upper grooves. The second support has at least two second bases spaced apart along the length direction and placed on at least two first bases that correspond one-to-one. Each second base has an insertion protrusion on the side facing the first base, and one of the insertion protrusions is inserted into one of the two insertion slots. The second support has a plurality of second upper grooves and a plurality of second lower grooves that correspond one-to-one, with the second lower grooves located below the corresponding second upper grooves. The second upper grooves and the first upper grooves correspond one-to-one.

[0026] By inserting the protrusions into different insertion slots, the wafer carrier can have varying widths, thus accommodating wafers of different sizes. This reduces the frequency and total number of quartz boat replacements, saving floor space and processing costs. Furthermore, the detachable first and second supports facilitate cleaning of the various grooves when they are separated, improving cleaning efficiency.

[0027] By setting the distance between two adjacent first upper grooves to 4mm-6mm, the spacing is increased, improving the convenience of wafer placement. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of the wafer carrier in an embodiment of the present invention;

[0030] Figure 2 This is a schematic cross-sectional view of the wafer carrier in an embodiment of the present invention;

[0031] Figure 3 This is a top view of the wafer carrier in an embodiment of the present invention.

[0032] In the picture:

[0033] 100. First bracket; 110. First base; 111. Insertion slot; 1111. Bottom wall; 1112. First side wall; 1113. Second side wall; 120. First mounting arm; 130. First upper support rod; 131. First upper groove; 140. First lower support rod; 141. First lower groove; 150. First reinforcing member; 160. Stop block; 170. Support leg;

[0034] 200, Second bracket; 210, Second base; 211, Insertion protrusion; 220, Second mounting arm; 230, Second upper support rod; 231, Second upper groove; 240, Second lower support rod; 241, Second lower groove; 250, Second reinforcing member. Detailed Implementation

[0035] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0036] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0037] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0038] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0039] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms may include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0040] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0041] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0042] like Figures 1 to 3As shown, this embodiment provides a wafer carrier, which includes a first support 100 and a second support 200. The first support 100 has at least two first bases 110 spaced apart along its length, and each first base 110 has at least two insertion slots 111 spaced apart along its width. The first support 100 has a plurality of corresponding first upper recesses 131 and a plurality of first lower recesses 141, with the first lower recesses 141 located below the corresponding first upper recesses 131. The second support 200... The second bracket 200 has at least two second bases 210 arranged at intervals along the length direction and placed on at least two first bases 110 in a one-to-one correspondence. The side of the second base 210 facing the first base 110 has a plugging protrusion 211, and one of the plugging protrusions 211 is selectively plugged into the two plugging slots 111. The second bracket 200 has a plurality of second upper grooves 231 and a plurality of second lower grooves 241 that correspond to each other. The second lower grooves 241 are located below the corresponding second upper grooves 231. The second upper grooves 231 and the first upper grooves 131 correspond to each other.

[0043] By inserting the protrusions 211 into different insertion slots 111, the width of the wafer carrier can vary, thus enabling it to support wafers of different sizes, reducing the total number of wafer carriers, saving floor space and processing costs. Furthermore, the detachably connected first support 100 and second support 200 facilitate cleaning of each groove when they are separated, improving cleaning efficiency.

[0044] In some embodiments, the first support 100 further includes a first mounting arm 120 disposed on the first base 110, and a first upper support rod 130 and a first lower support rod 140 extending along the length direction and disposed between the first mounting arms 120. The first upper support rod 130 and the first lower support rod 140 are spaced apart in the height direction and in the width direction. A first upper groove 131 is disposed on the first upper support rod 130, and a first lower groove 141 is disposed on the first lower support rod 140. This configuration makes the entire wafer carrier a hollow structure, i.e., a hollow area is formed between the first upper support rod 130 and the first lower support rod 140, facilitating heat transfer.

[0045] The second support 200 also includes a second mounting arm 220 disposed on the second base 210, and a second upper support rod 230 and a second lower support rod 240 extending along the length direction and disposed between each of the second mounting arms 220. The second upper support rod 230 and the second lower support rod 240 are spaced apart in the height direction and in the width direction. A second upper groove 231 is disposed on the second upper support rod 230, and a second lower groove 241 is disposed on the second lower support rod 240. This arrangement makes the entire wafer carrier a hollow structure, forming a hollow area between the second upper support rod 230 and the second lower support rod 240, facilitating heat transfer.

[0046] It should be noted that the first lower support rod 140 and the second lower support rod 240 are arranged at intervals in the width direction, and the first lower groove 141 and the second lower groove 241 are arranged opposite each other in the width direction. The first upper support rod 130 and the second upper support rod 230 are arranged at intervals in the width direction, and the first upper groove 131 and the second upper groove 231 are arranged opposite each other in the width direction. In the width direction, the first lower support rod 140 and the second lower support rod 240 are located between the first upper support rod 130 and the second upper support rod 230. The first upper support rod 130 and the second upper support rod 230 support the middle part of the wafer, and the first lower support rod 140 and the second lower support rod 240 support the bottom of the wafer.

[0047] In some embodiments, the first bracket 100 further includes a first reinforcing member 150, which connects a plurality of first mounting arms 120 to increase the connection strength between adjacent first mounting arms 120, thereby increasing the overall strength of the first bracket 100. The first reinforcing member 150 is a rod-shaped structure and extends along its length.

[0048] The second bracket 200 also includes a second reinforcing member 250, which connects several second mounting arms 220 to increase the connection strength between adjacent second mounting arms 220, thereby increasing the overall strength of the second bracket 200. The second reinforcing member 250 is a rod-shaped structure and extends along its length.

[0049] To prevent the second bracket 200 from flipping under gravity and causing the insertion protrusion 211 to be pulled out of the insertion slot 111, in some embodiments, the insertion slot 111 has a bottom wall 1111, a first side wall 1112, and a second side wall 1113. Along the width direction, the first side wall 1112 and the second side wall 1113 are located on both sides of the bottom wall 1111. From bottom to top, the first side wall 1112 is inclined towards the first mounting arm 120. The shape of the insertion protrusion 211 is similar to the shape of the insertion slot 111. The first side wall 1112 is located on the side of the second side wall 1113 away from the first mounting arm 120.

[0050] From bottom to top, the second sidewall 1113 is inclined toward the first mounting arm 120 so that the insertion protrusion 211 can be inserted into the insertion groove 111 from top to bottom.

[0051] To improve the assembly and disassembly efficiency of the insertion protrusion 211 and the insertion groove 111, in some embodiments, the second sidewall 1113 is an arc-shaped surface to form a guide structure. Furthermore, from bottom to top, the dimension of the insertion groove 111 gradually increases along its width. This arrangement makes the entire insertion groove 111 a flared structure, facilitating the insertion of the insertion protrusion 211. The insertion protrusion 211 has a first insertion sidewall and a second insertion sidewall. The first insertion sidewall is parallel to the first sidewall 1112, and the second insertion sidewall is arc-shaped, with the same curvature as the second sidewall 1113.

[0052] The first upper groove 131 and the second upper groove 231 need to be aligned in the length direction. For this purpose, the first base 110 is also provided with a stop block 160. Along the length direction, the stop block 160 is located on one side of the insertion groove 111 and abuts against the second base 210. In use, the insertion protrusion 211 is inserted into the insertion groove 111, and then the second bracket 200 is pushed in the length direction so that one end of the second bracket 200 abuts against the stop block 160, thereby achieving positioning between the two in the length direction and ensuring that the first upper groove 131 and the second upper groove 231 are aligned in the length direction.

[0053] In some embodiments, the bottom of the first base 110 is provided with two legs 170, which are arranged at intervals along the width direction.

[0054] The height of the first upper groove 131 is greater than one-quarter of the wafer diameter and less than or equal to one-half of the wafer diameter, so as to increase the fixing height of the wafer and reduce the degree of warping or deformation of the upper part of the wafer.

[0055] To improve the convenience of wafer handling, in some embodiments, the distance between two adjacent first upper grooves 131 along the length direction is 4mm-6mm. For example, the distance between two adjacent first upper grooves 131 is 5mm. Of course, in other embodiments, the distance between two adjacent first upper grooves 131 can be appropriately increased to 7mm or even 8mm.

[0056] To improve the structural strength of the entire wafer carrier, in some embodiments, there are three first supports 100, which are arranged at intervals along the length direction, and three second supports 200 are placed on the first supports 100 in a one-to-one correspondence.

[0057] Of course, in some embodiments, if the total length of the wafer carrier increases, the number of the first support 100 and the second support 200 can also be increased.

[0058] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer carrier, characterized in that, include: A first bracket (100) has at least two first bases (110) spaced apart along the length direction, each base (110) having at least two insertion slots (111) spaced apart along the width direction; the first bracket (100) has a plurality of first upper grooves (131) and a plurality of first lower grooves (141) corresponding to each other, the first lower grooves (141) being located below the corresponding first upper grooves (131); The second bracket (200) has at least two second bases (210) arranged at intervals along the length direction and placed on at least two first bases (110) in a one-to-one correspondence. The second base (210) has a plugging protrusion (211) on the side facing the first base (110). The plugging protrusion (211) is selectively plugged into the two plugging slots (111). The second bracket (200) has a plurality of second upper grooves (231) and a plurality of second lower grooves (241) that correspond to each other. The second lower grooves (241) are located below the corresponding second upper grooves (231). The second upper grooves (231) and the first upper grooves (131) correspond to each other.

2. The wafer carrier according to claim 1, characterized in that, The first bracket (100) further includes a first mounting arm (120) disposed on the first base (110) and a first upper support rod (130) and a first lower support rod (140) extending along the length direction and disposed between each of the first mounting arms (120). In the height direction, the first upper support rod (130) and the first lower support rod (140) are spaced apart. In the width direction, the first upper support rod (130) and the first lower support rod (140) are spaced apart. A first upper groove (131) is disposed on the first upper support rod (130), and a first lower groove (141) is disposed on the first lower support rod (140); and / or, The second bracket (200) further includes a second mounting arm (220) disposed on the second base (210) and a second upper support rod (230) and a second lower support rod (240) extending along the length direction and disposed between each of the second mounting arms (220). In the height direction, the second upper support rod (230) and the second lower support rod (240) are spaced apart. In the width direction, the second upper support rod (230) and the second lower support rod (240) are spaced apart. The second upper groove (231) is disposed on the second upper support rod (230), and the second lower groove (241) is disposed on the second lower support rod (240).

3. The wafer carrier according to claim 2, characterized in that, The first bracket (100) further includes a first reinforcing member (150) that connects to a plurality of the first mounting arms (120); and / or, The second bracket (200) also includes a second reinforcing member (250), which connects to a plurality of the second mounting arms (220).

4. The wafer carrier according to claim 2, characterized in that, The insertion slot (111) has a bottom wall (1111), a first side wall (1112), and a second side wall (1113). Along the width direction, the first side wall (1112) and the second side wall (1113) are located on both sides of the bottom wall (1111). From bottom to top, the first side wall (1112) is inclined towards the first mounting arm (120); and / or, The shape of the insertion protrusion (211) is similar to the shape of the insertion groove (111).

5. The wafer carrier according to claim 4, characterized in that, From bottom to top, the second sidewall (1113) is inclined toward the first mounting arm (120).

6. The wafer carrier according to claim 5, characterized in that, The second sidewall (1113) is an arc-shaped surface.

7. The wafer carrier according to claim 5, characterized in that, From bottom to top, the dimensions of the insertion slot (111) gradually increase along the width direction.

8. The wafer carrier according to claim 2, characterized in that, The first base (110) is further provided with a stop block (160), which is located on one side of the insertion slot (111) along the length direction and abuts against the second base (210); and / or, The bottom of the first base (110) is provided with two support legs (170), which are arranged at intervals along the width direction.

9. The wafer carrier according to any one of claims 1-8, characterized in that, The height of the first upper groove (131) is greater than one-quarter of the wafer diameter and less than or equal to one-half of the wafer diameter; and / or, Along the length direction, the distance between two adjacent first upper grooves (131) is 4mm-6mm.

10. The wafer carrier according to any one of claims 1-8, characterized in that, There are three first supports (100), which are arranged at intervals along the length direction. There are three second supports (200), which are placed on the first supports (100) in a one-to-one correspondence.

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