Silicon wafer vacuum suction device

Abstract

The utility model relates to a kind of suction device technical field, especially a kind of silicon wafer vacuum suction device.Its technical scheme, including placing table, the upper surface of the placing table is fixedly provided with support, the upper surface of the support is fixedly provided with pneumatic cylinder;Fixedly set in the connecting plate of pneumatic cylinder output end, the lower end of the connecting plate is fixedly provided with multiple connecting rods, the lower end of the connecting rod is fixedly provided with suction assembly for the suction of silicon wafer;The upper surface of placing table is fixedly provided with placing assembly for the limiting of silicon wafer, and placing assembly is located the directly below of suction assembly.The utility model can flexibly control adsorption force size, effectively avoid the damage such as silicon wafer microcrack due to local stress concentration and adsorption force too large, greatly improve the safety and reliability in the process of silicon wafer suction.

Description

Technical Field

[0001] This utility model relates to the field of suction device technology, and in particular to a vacuum suction device for silicon wafers. Background Technology

[0002] In modern semiconductor manufacturing, silicon wafers are a key basic material, and the precision and efficiency of their processing and handling play a decisive role in product quality and production efficiency. As the semiconductor industry moves towards higher integration and smaller chip sizes, the requirements for handling silicon wafers are becoming increasingly stringent. Existing silicon wafer pick-and-place devices use vacuum chucks to pick up and place them; ordinary vacuum chucks have a grooved bottom surface, as shown in the attached image. Figure 1 As shown, not only is the adsorption force unadjustable, but when the silicon wafer surface contacts the suction cup, the vacuum suction causes damage to the silicon wafer surface. Furthermore, it cannot adapt to the microscopic undulations of the silicon wafer surface, causing localized stress concentration during the suction process, leading to damage such as microcracks in the silicon wafer. Therefore, this invention proposes a silicon wafer vacuum suction device. Utility Model Content

[0003] The purpose of this invention is to address the problem in the background technology that silicon wafer picking devices use vacuum chucks to pick up and place silicon wafers. Ordinary vacuum chucks have grooved bottom surfaces, which not only make it impossible to adjust the adsorption force, but also cause damage to the silicon wafer surface when it comes into contact with the chuck due to vacuum adsorption. Furthermore, they cannot adapt to the micro-undulations of the silicon wafer surface, causing local stress concentration during the picking process, resulting in damage such as micro-cracks on the silicon wafer. Therefore, this invention proposes a silicon wafer vacuum picking device.

[0004] The technical solution of this utility model is as follows: A vacuum suction device for silicon wafers, comprising: a placement stage, a support fixedly mounted on the upper surface of the placement stage, and a cylinder fixedly mounted on the upper surface of the support; a connecting plate fixedly mounted on the output end of the cylinder, a plurality of connecting rods fixedly mounted on the lower end of the connecting plate, and a suction component for suctioning silicon wafers fixedly mounted on the lower end of the connecting rods; and a placement component for limiting the silicon wafers fixedly mounted on the upper surface of the placement stage, and the placement component is located directly below the suction component.

[0005] Optionally, the suction assembly includes a sealed outer shell fixedly disposed at the lower end of the connecting rod. A base plate is fixedly disposed on the bottom surface of the sealed outer shell. Multiple annular tubes are disposed inside the base plate. Multiple suction tubes are disposed through the bottom surface of the base plate. A suction head is disposed at the lower end of each suction tube. The upper end of each suction tube is connected to the annular tube.

[0006] Optionally, a spring is fitted onto the outer wall of the suction tube, one end of the spring is fixedly connected to the base plate, and the other end of the spring is fixedly connected to the suction head. A multi-way air valve is fixedly inserted through the sealed outer shell, the output end of the multi-way air valve is connected to the annular tube through a connecting pipe, and the input end of the multi-way air valve is connected to a first connecting pipe.

[0007] Optionally, the placement assembly includes a support base fixedly disposed on the upper surface of the placement platform, the upper surface of the support base having multiple air intake holes, and a second connecting pipe being connected to one side of the support base.

[0008] Optionally, the bracket is configured with an "L" shaped structure.

[0009] Optionally, the annular tubes are nested together.

[0010] Optionally, the suction tube is a telescopic tube.

[0011] Optionally, the opposing surfaces of the base plate and the support seat are either rubber surfaces or resin surfaces, respectively.

[0012] In summary, this application includes at least one of the following beneficial technical effects:

[0013] This invention achieves precise and non-destructive suction of silicon wafers through the cooperation of a telescopic suction tube, spring, multi-way air valve, and annular tube in the suction assembly. The telescopic suction tube and spring enable the suction head to adapt to the microscopic undulations of the silicon wafer surface, ensuring that the suction head is fully and tightly attached to the silicon wafer surface. The multi-way air valve can adjust the gas flow rate of each annular tube as needed, flexibly controlling the magnitude of the adsorption force, effectively avoiding damage to the silicon wafer's microcracks caused by local stress concentration and excessive adsorption force, and greatly improving the safety and reliability of the silicon wafer suction process.

[0014] Furthermore, this invention achieves stable positioning and fixation of the silicon wafer through the support base, suction holes, and second connecting tube in the placement assembly. Multiple suction holes on the support base are connected to an external vacuum device via the second connecting tube. When the silicon wafer is placed on the support base, a uniform suction force is generated to fix it in place, preventing displacement and shaking during the suction process. Compared to ordinary placement methods, this design better ensures the positional accuracy of the silicon wafer, providing a stable foundation for subsequent suction operations and improving the overall efficiency and accuracy of the vacuum suction device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a grooved vacuum suction cup structure in the prior art;

[0016] Figure 2 A schematic diagram of a vacuum pick-up device for silicon wafers is provided.

[0017] Figure 3 for Figure 2 A schematic diagram of the internal cross-sectional structure of the component placed in the middle;

[0018] Figure 4 for Figure 2 A bottom-view structural diagram of the central absorption component;

[0019] Figure 5 for Figure 4 A schematic diagram of the split structure;

[0020] Figure 6 for Figure 4 A cross-sectional structural diagram of the absorption component.

[0021] Figure label:

[0022] 1. Placement platform; 2. Support frame; 3. Cylinder; 4. Connecting plate; 5. Connecting rod;

[0023] 6. Suction assembly; 61. Sealed housing; 62. Base plate; 63. Annular tube; 64. Suction tube; 65. Suction head; 66. Spring; 67. Multi-way air valve; 68. Connecting tube; 69. First connecting tube;

[0024] 7. Placement component; 71. Support base; 72. Air intake port; 73. Second connecting pipe. Detailed Implementation

[0025] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0026] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0027] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] Example

[0031] like Figure 2 As shown, this utility model proposes a silicon wafer vacuum suction device, including a placement stage 1. The placement stage 1 is cast from high-strength aluminum alloy and its surface is anodized, which not only provides good wear resistance and corrosion resistance but also effectively prevents static electricity accumulation, avoiding damage to the silicon wafer. A support 2 is vertically fixed on the upper surface of the placement stage 1. The support 2 is designed with an "L" shape and is precision-machined from high-strength stainless steel to ensure stability and prevent deformation when subjected to the weight of the cylinder 3 and its subsequent components, as well as the forces generated during operation. The cylinder 3 is fixedly mounted on the upper surface of the support 2, and the cylinder 3 can precisely control the lifting and lowering of the suction component 6.

[0032] Furthermore, a connecting plate 4 is fixedly connected to the output end of the cylinder 3, and multiple connecting rods 5 are evenly distributed and fixedly arranged at the lower end of the connecting plate 4, and the multiple connecting rods 5 are arranged in a circular array.

[0033] like Figures 3 to 6As shown, a suction assembly 6 for picking up silicon wafers is fixedly installed at the lower end of the connecting rod 5. The suction assembly 6 includes a sealed outer shell 61 fixedly installed at the lower end of the connecting rod 5. A base plate 62 is fixedly installed on the bottom surface of the sealed outer shell 61. The bottom surface of the base plate 62 is made of highly elastic resin or rubber material, which can ensure a tight fit with the surface of the silicon wafer without scratching it. Multiple annular tubes 63 are arranged inside the base plate 62. The annular tubes 63 are interlocked to ensure uniform gas distribution. Multiple suction tubes 64 are provided through the bottom surface of the base plate 62. The suction tubes 64 are telescopic tubes with good flexibility and resilience, and can freely extend and retract within a certain range. A suction head 65 is connected to the lower end of the suction tube 64. The end face of the suction head 65 is mirror polished to ensure a good fit with the surface of the silicon wafer.

[0034] Furthermore, a spring 66 is fitted onto the outer wall of the suction tube 64. The spring 66 has a high elastic limit and fatigue strength. One end of the spring 66 is fixed to the base plate 62 via a threaded connection, and the other end is welded to the suction head 65. This connection method ensures the stability of the spring 66 during operation. A multi-way air valve 67 is fixedly threaded through the sealed outer shell 61. The multi-way air valve 67 adopts an electromagnetic control structure, possessing rapid opening and closing and precise flow control functions, with a response time of less than 0.1 seconds. The output end of the multi-way air valve 67 is connected to the annular tube 63 via a connecting pipe 68. The connecting pipe 68 is made of flexible silicone tubing, possessing good flexibility and corrosion resistance, and can adapt to the movement of the suction assembly 6. The input end of the multi-way air valve 67 is connected to a first connecting pipe 69, which is used to connect to an external vacuum source, ensuring sufficient gas flow.

[0035] like Figure 2 and Figure 3 As shown, a placement component 7 for limiting the silicon wafer is fixedly installed on the upper surface of the placement stage 1, and the placement component 7 is located directly below the suction component 6. The core component of the placement component 7 is a support base 71 fixedly installed on the upper surface of the placement stage 1. The bottom surface of the support base 71 is also made of resin material, the same resin material as the bottom surface of the base plate 62, ensuring safety when in contact with the silicon wafer. Multiple suction holes 72 are formed on the upper surface of the support base 71, arranged in a matrix, with a diameter of 0.8 mm. These suction holes 72 can create a uniform negative pressure on the surface of the support base 71, firmly adsorbing and fixing the silicon wafer. A second connecting pipe 73 is connected to one side of the support base 71. The second connecting pipe 73 is used to connect to external vacuum equipment and can withstand high negative pressure without deformation.

[0036] In this embodiment, the silicon wafer is placed on the placement assembly 7. Multiple suction holes 72 on the upper surface of the support base 71 in the placement assembly 7 are connected to an external vacuum source through the second connecting pipe 73. The suction holes 72 generate suction force, which firmly adsorbs the silicon wafer onto the support base 71, thus completing the limiting and fixing of the silicon wafer and ensuring that the silicon wafer remains stable in subsequent operations.

[0037] The cylinder 3 is activated, and its output pushes the connecting plate 4 downwards. The connecting plate 4 then lowers multiple connecting rods 5 and the lower suction assembly 6 together. As the suction assembly 6 descends, the suction head 65 at the lower end of the suction tube 64 gradually approaches the silicon wafer surface. The suction tube 64 is a telescopic tube, and one end of the spring 66 sleeved on its outer wall is fixedly connected to the base plate 62, while the other end is fixedly connected to the suction head 65. When the suction head 65 contacts the silicon wafer surface, the spring 66 is compressed, causing the suction head 65 to fit tightly against the silicon wafer surface, ensuring a sealing effect.

[0038] An external vacuum source is connected through the first connecting pipe 69. The suction force of the vacuum source is transmitted to the suction head 65 through the multi-way air valve 67, connecting pipe 68, annular pipe 63 and suction pipe 64, so that the suction head 65 generates a strong suction force to adsorb the silicon wafer.

[0039] Once the suction head 65 successfully picks up the silicon wafer, the support base 71 of the placement component 7 stops working, and the suction port 72 no longer generates suction. Subsequently, the output end of the cylinder 3 retracts upward, driving the connecting plate 4, connecting rod 5, and suction component 6 to rise, picking up the silicon wafer from the support base 71 of the placement component 7.

[0040] Upon reaching the designated position, the connection between the vacuum source and the suction assembly 6 is cut off by controlling the multi-way air valve 67, and gas at a certain pressure is introduced to restore the pressure inside the suction head 65 to normal pressure. The silicon wafer loses suction and detaches from the suction head 65, completing the release process. Throughout the process, the opposing surfaces of the sealing shell 61 and the support base 71 are made of resin material, effectively preventing hard friction and scratches on the silicon wafer surface and protecting the surface quality of the silicon wafer.

[0041] The above specific embodiments are merely optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A vacuum suction device for silicon wafers, characterized in that, include: A placement platform, wherein a support is fixedly mounted on the upper surface of the placement platform, and a cylinder is fixedly mounted on the upper surface of the support. A connecting plate is fixedly installed at the output end of the cylinder. Multiple connecting rods are fixedly installed at the lower end of the connecting plate. A suction component for suctioning silicon wafers is fixedly installed at the lower end of the connecting rods. A placement component for limiting the silicon wafer is fixedly installed on the upper surface of the placement stage, and the placement component is located directly below the pick-up component.

2. The silicon wafer vacuum suction device according to claim 1, characterized in that, The suction assembly includes a sealed outer shell fixedly disposed at the lower end of the connecting rod. A base plate is fixedly disposed on the bottom surface of the sealed outer shell. Multiple annular tubes are disposed inside the base plate. Multiple suction tubes are disposed through the bottom surface of the base plate. A suction head is disposed at the lower end of each suction tube. The upper end of each suction tube is connected to the annular tube.

3. The silicon wafer vacuum suction device according to claim 2, characterized in that, A spring is fitted around the outer wall of the suction tube. One end of the spring is fixedly connected to the base plate, and the other end of the spring is fixedly connected to the suction head. A multi-way air valve is fixedly inserted through the sealed outer shell. The output end of the multi-way air valve is connected to the annular tube through a connecting pipe, and the input end of the multi-way air valve is connected to a first connecting pipe.

4. The silicon wafer vacuum suction device according to claim 3, characterized in that, The placement assembly includes a support base fixedly mounted on the upper surface of the placement platform. The upper surface of the support base has multiple air intake holes, and a second connecting pipe is connected to one side of the support base.

5. A silicon wafer vacuum suction device according to any one of claims 1 to 4, characterized in that, The bracket is designed with an "L" shape.

6. A silicon wafer vacuum suction device according to any one of claims 2 to 4, characterized in that, The annular tubes are nested together.

7. A silicon wafer vacuum suction device according to claim 6, characterized in that, The suction tube is a telescopic tube.

8. A silicon wafer vacuum suction device according to claim 4, characterized in that, The opposing surfaces of the base plate and the support base are either rubber or resin surfaces, respectively.

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