Suction cup assembly and bonding tool

Abstract

The utility model relates to a kind of chuck assembly and bonding tool, for fixed substrate, chuck assembly is equipped with corresponding adsorption part with substrate, the adsorption part includes: support body;Adsorption pad, be equipped in the one side of support body towards substrate, for contact support substrate, the adsorption pad is rubber material;Suction port, located on the adsorption pad, multiple and along the plane direction array of substrate is uniformly distributed;Suction hole, multiple and with the suction port one-to-one correspondence, one end of a suction hole is communicated one suction port, the other end of all suction holes is used to connect vacuum system;Wherein, the vacuum system is pumped by the suction hole to the suction port, negative pressure is generated at the blind hole formed by the substrate contacted with the adsorption pad and the suction port, the substrate is fixed on the adsorption pad, so as to play the protective effect to substrate, while guaranteeing that substrate is fixed firm no displacement.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a suction cup assembly and bonding tooling. Background Technology

[0002] Wire bonding is the most widely used chip interconnection technology in semiconductor packaging. It uses fine metal wires to electrically connect and mechanically fix the electrode pads on the surface of the semiconductor chip to the pads on the packaging carrier (substrate).

[0003] Because the substrate position is critical during bonding, it needs to be secured to the bonding fixture before bonding. Current securing methods include clamping bonding fixtures and chuck bonding fixtures. Since substrates are typically made of fragile materials, clamping bonding fixtures can easily damage the product. Therefore, chuck fixing is usually used during bonding. However, chuck bonding fixtures can easily scratch the chuck during contact between the substrate and the chuck, and cannot guarantee a proper seal between the chuck and the substrate, thus affecting the chuck's securing effect. Utility Model Content

[0004] In response to the shortcomings of the existing production technology, the applicant provides a suction cup assembly and bonding fixture, which protects the substrate while ensuring that the substrate is firmly fixed without displacement.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A suction cup assembly for fixing a substrate, the suction cup assembly having an adsorption portion corresponding to the substrate, the adsorption portion comprising:

[0007] Support structure;

[0008] An adsorption pad is disposed on the side of the support facing the substrate and is used to contact and support the substrate. The adsorption pad is made of rubber.

[0009] The suction ports are located on the adsorption pad, and there are multiple ports that are evenly distributed in an array along the plane of the substrate.

[0010] There are multiple suction holes, each corresponding to a suction port. One end of each suction hole is connected to a suction port, and the other end of all suction holes is used to connect to a vacuum system.

[0011] The vacuum system draws air from the suction port through the suction hole, generating negative pressure at the blind hole formed by the substrate in contact with the adsorption pad and the suction port, thereby fixing the substrate onto the adsorption pad.

[0012] As a further improvement to the above technical solution:

[0013] The adsorption pad is fixed to the support by adhesive bonding.

[0014] The thickness of the adsorption pad is M, 0.4mm≤M≤0.6mm, and the Shore hardness of the adsorption pad is HS, 50HA<HS≤60HA.

[0015] The adsorption pad includes a sheet-like substrate, which is sealed and fixedly disposed on the side of the support facing the substrate. The surface of the sheet-like substrate is provided with multiple first strip-shaped protrusions and multiple second strip-shaped protrusions. The first strip-shaped protrusions and the second strip-shaped protrusions intersect to form a uniformly distributed grid-like area on the surface of the sheet-like substrate. The center of the suction port is located at the intersection of adjacent grid-like areas. The suction port is connected to the adjacent grid-like areas. The total area of ​​the grid-like areas adjacent to the suction port is greater than the cross-sectional area of ​​the suction port.

[0016] The area of ​​a single lattice region is S1, 14.13 mm. 2 ≤S1≤28.26mm 2 .

[0017] The first strip-shaped protrusion and the second strip-shaped protrusion protrude from the surface of the sheet-like substrate at the same height as N along the thickness direction of the adsorption pad. The width of the first strip-shaped protrusion and the second strip-shaped protrusion is W, where 0.4≤N / W≤0.5 and 0.4≤N / M≤0.6.

[0018] A bonding fixture includes any of the suction cup assemblies described above, and also includes the vacuum system, which is connected to the suction hole.

[0019] As a further improvement to the above technical solution:

[0020] The number of substrates to be fixed is multiple, and the substrates are placed on a tray, which has multiple perforations that correspond one-to-one with the substrates.

[0021] The number of supports is the same as the number of substrates, and the supports are boss structures.

[0022] When the tray is positioned directly above the suction cup assembly, the tray moves relative to the suction cup assembly, and the suction part passes through the perforation to lift the substrate, so that the suction pad contacts the substrate.

[0023] The bonding fixture also includes a lifting mechanism, which includes a linear driver and a suction cup mounting base. The suction cup mounting base is slidably connected to the frame of the bonding equipment. The linear driver is driven to the suction cup mounting base to drive the suction cup mounting base to lift. The suction cup assembly is fixedly mounted on the suction cup mounting base.

[0024] The suction cup assembly is provided with a plurality of first insertion parts, each of the first insertion parts having a first through hole, and each first through hole communicating with all the suction holes on a support body;

[0025] The suction cup mounting base includes multiple second insertion parts, each of which has a second through hole, and the second through hole is connected to the vacuum system;

[0026] When the suction cup assembly is fixedly installed on the suction cup mounting base, the first insertion part is inserted into the second insertion part and the first through hole is connected to the second through hole.

[0027] The suction cup assembly includes:

[0028] A suction cup base plate, wherein the first insertion part is provided on the suction cup base plate;

[0029] A suction cup mounting plate, wherein the lower surface of the suction cup mounting plate is provided with multiple grooves;

[0030] Multiple supports are fixedly disposed on the upper surface of the suction cup mounting plate, and multiple grooves correspond one-to-one with the supports. Each groove is connected to all the suction holes on one of the supports.

[0031] The number of first through holes is greater than or equal to the number of supports, the suction cup mounting plate is sealed and installed on the suction cup base plate, and the suction hole is connected to a corresponding first through hole through a corresponding groove.

[0032] The second plug-in part is a protrusion structure, the first plug-in part is a recess structure, the number of the second plug-in parts is at least one row, the cross-sectional shape of adjacent second plug-in parts in each row is different along the perpendicular to the plug-in direction, and the cross-sectional shape is either circular or oblong, and the arrangement direction of each row of second plug-in parts is consistent with the major axis direction of the oblong.

[0033] The shape of the first through hole matches the cross-sectional shape of the second plug part. The second through hole is located at the center of the cross-section of the second plug part. The second through hole is a circular through hole. The projected area of ​​each groove along the plugging direction covers one of the first through holes.

[0034] The beneficial effects of this utility model are as follows:

[0035] This utility model has a compact and reasonable structure and is easy to operate. By setting a rubber adsorption pad on the suction cup assembly to contact the substrate, it protects the substrate and forms a good seal between the substrate and the suction port of the suction cup assembly. Combined with the point-dispersed vacuum adsorption method, it ensures that the substrate is firmly fixed without displacement.

[0036] This utility model also has the following advantages:

[0037] (1) The thickness of the adsorption pad is M, 0.4mm≤M≤0.6mm, and the Shore hardness of the adsorption pad is HS, 50HA<HS≤60HA, to ensure that the substrate will not bounce at high frequency during the bonding process, to ensure the quality of lead wire welding, and to have a good adsorption and fixation effect.

[0038] (2) By setting multiple first strip-shaped protrusions and second strip-shaped protrusions on the adsorption pad, a grid surface is formed on the adsorption pad. During the change of suction pressure, elastic deformation occurs. When the strip-shaped protrusions are compressed, the contact area between the adsorption pad and the substrate is increased, ensuring bonding under good support and fixation, thereby ensuring bonding quality. During the process of the strip-shaped protrusions returning to their original shape, the substrate and the adsorption pad are separated by elasticity, reducing the contact area between the adsorption pad and the substrate, facilitating the separation of the substrate and the adsorption pad. In the automated production process, the adsorption pad can simultaneously meet the requirements of bonding stability and separation stability, ensuring bonding quality and automated production efficiency of the bonding production line.

[0039] (3) By controlling the area S1 of the grid region, 14.13 mm 2 ≤S1≤28.26mm 2 The ratio of the height N to the width W of the strip-shaped protrusions and the ratio of the height N to the thickness M are controlled, with 0.4≤N / W≤0.5 and 0.4≤N / M≤0.6. This ensures that the substrate is in contact with the surface of the sheet substrate in each grid area, and the contact area is greater than or equal to ‰ of the area of ​​each grid area. This ensures that the bottom of the substrate is well supported and fixed during bonding, and that the elastic recovery force in the thickness direction of the adsorption pad after the first and second strip-shaped protrusions are compressed is sufficient to overcome the adhesive force generated by the close contact between the substrate and the sheet substrate, allowing the substrate to detach smoothly from the adsorption pad.

[0040] (4) By setting a first insertion part on the suction cup assembly and a second insertion part on the suction cup mounting seat of the lifting mechanism, a first through hole communicating with the suction port is set in the first insertion part, and a second through hole communicating with the vacuum system is set in the second insertion part. By inserting the first insertion part and the second insertion part, the suction cup assembly can be quickly replaced and installed.

[0041] (5) The suction cup assembly is set as a separate structure of suction cup base plate and suction cup mounting plate. An adsorption part is set on the suction cup mounting plate. The number and size of the adsorption part can be changed by changing the suction cup mounting plate, which facilitates the adjustment of the substrate model and placement method in the production line.

[0042] (6) By setting the second insertion part as a protrusion structure and the first insertion part as a recess structure, and the cross sections of adjacent second insertion parts are circular and oblong respectively, the coverage area of ​​the first through hole is extended by the oblong shape, so that the corresponding groove can be connected with the second through hole after the position of the adsorption part is moved, so that the same suction cup base plate can be adapted to multiple suction cup base plates with different numbers of adsorption parts, reducing the cost increase of suction cup components due to production line change, and facilitating the rapid change of production line. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the bonding tooling of this utility model.

[0044] Figure 2 This is a schematic diagram of the support and conveying mechanism in the bonding equipment of this utility model.

[0045] Figure 3 This is a schematic diagram of the suction cup assembly of this utility model.

[0046] Figure 4 This is a schematic diagram of the structure of the adsorption pad of this utility model.

[0047] Figure 5 This is the front view of the adsorption pad of this utility model.

[0048] Figure 6 This is a side view of the adsorption pad of this utility model.

[0049] Figure 7 This is a schematic diagram of the lifting mechanism of this utility model.

[0050] Figure 8 This is an exploded view of the suction cup assembly of this utility model.

[0051] Figure 9 This is a schematic diagram of the suction cup assembly of this utility model (bottom view).

[0052] Figure 10 This is an exploded view (bottom view) of the suction cup assembly of this utility model.

[0053] Figure 11 This is a top view of the suction cup assembly of this utility model (various specifications).

[0054] Figure 12 This is a schematic diagram of the vacuum system of this utility model.

[0055] in:

[0056] 1. Tray; 10. Perforation;

[0057] 2. Suction cup assembly;

[0058] 21. Adsorption section;

[0059] 210. Suction port; 211. Adsorption pad; 2111. First strip-shaped protrusion; 2112. Second strip-shaped protrusion; 2113. Sheet-like substrate; 2114. Grid-like area; 2115. Intersection point; 212. Support; 2120. Suction hole;

[0060] 22. Suction cup mounting plate; 23. Suction cup base plate; 24. Pallet positioning pin;

[0061] 25. First insertion part; 250. First through hole;

[0062] 26. Sealing gasket; 27. Groove; 28. Suction cup positioning hole;

[0063] 3. Lifting mechanism; 31. Suction cup positioning pin; 32. Suction cup mounting base; 33. Second insertion part; 330. Second through hole; 34. Linear actuator;

[0064] 4. Vacuum system; 41. Connecting pipeline; 411. Vacuum gauge; 42. Two-position five-way solenoid valve; 421. Port B; 422. Port A; 423. Port S; 424. Port P; 425. Port R; 43. Control gas source; 44. Sealing end; 45. Vacuum pump; 46. Branch pipe; 47. Silencer; 48. Air rupture pipeline;

[0065] 101. Stop mechanism; 102. Conveyor; 103. Position sensor; 104. Frame; 105. Outflow sensor; 106. Feed / outflow sensor. Detailed Implementation

[0066] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0067] In one exemplary embodiment, such as Figure 1 , Figure 3 The suction cup assembly 2 shown is used to fix the substrate. The suction cup assembly 2 is provided with an adsorption part 21 corresponding to the substrate. The adsorption part 21 includes a support body 212 and an adsorption pad 211.

[0068] The support 212 can be made of steel or other rigid materials such as aluminum;

[0069] An adsorption pad 211 is disposed on the side of the support 212 facing the substrate and is used to contact the support substrate. The adsorption pad 211 is made of rubber.

[0070] Suction ports 210 are located on the adsorption pad 211, and there are multiple of them, which are evenly distributed in an array along the plane direction of the substrate.

[0071] There are multiple suction holes 2120, each corresponding to a suction port 210. One end of each suction hole 2120 is connected to a suction port 210, and the other end of all suction holes 2120 is used to connect to the vacuum system 4.

[0072] The vacuum system 4 evacuates air from the suction port 210 through the suction hole 2120, generating negative pressure at the blind hole formed by the substrate in contact with the adsorption pad 211 and the suction port 210, thus fixing the substrate onto the adsorption pad 211.

[0073] Specifically, the suction port 210 has a perforated structure, and its cross-section is circular, square, or triangular, etc. These shapes are highly symmetrical (axially symmetric and rotationally symmetric) and have a relatively uniform distribution characteristic on the plane; the number of suction ports 210 is multiple and evenly distributed, i.e. Figure 5 The array method in the middle realizes the uniform dispersion of vacuum adsorption at multiple points of suction port 210; the substrate currently commonly used is DBC substrate, which is formed by directly bonding copper foil to alumina or aluminum nitride ceramic substrate. The substrate is planar plate, usually rectangular, and is made of fragile material, lightweight. Chips can be soldered onto the substrate before bonding; the substrate fixed on suction cup assembly 2 can be one or multiple substrates fixed at the same time, depending on the specific production needs; in addition, the contact between the adsorption pad 211 and the substrate can be achieved by manually placing the substrate or by automation.

[0074] Taking manual placement of the substrate as an example, when bonding is required, the substrate is placed on the adsorption pad 211. The vacuum system 4 evacuates the suction port 210 and fixes the substrate on the suction cup assembly 2 by vacuum adsorption to meet the process requirements of copper wire bonding and aluminum wire bonding. After bonding is completed, the vacuum system 4 connects the suction port 210 to the atmosphere, and the substrate and the suction cup assembly 2 are then disconnected.

[0075] Compared with the rigid structure of the suction cup assembly 2 in the prior art that contacts the substrate, this embodiment divides the part that supports and fixes the substrate into upper and lower parts. By setting a rubber adsorption pad 211 on the suction cup assembly 2 to contact the substrate, the substrate is protected while the substrate and the suction port 210 of the suction cup assembly 2 are well sealed. Combined with the point-dispersed vacuum adsorption method, the substrate is firmly fixed without displacement.

[0076] For example, the adsorption pad 211 is fixed to the support 212 by adhesive bonding. This facilitates the replacement of the adsorption pad 211.

[0077] Regarding the selection of the adsorption pad 211, if the material of the adsorption pad 211 is too soft, it will cause the substrate to bounce frequently along the Z direction of the bonding equipment during bonding, resulting in the connection performance between the wires and the substrate after soldering not meeting the requirements, and the wires on the bonded substrate becoming loose. If the rubber material is too hard, the adsorption and fixation effect will be poor, causing slight movement of the substrate along the XY direction of the bonding equipment. Both will affect the bonding quality. The direction is illustrated in the diagram below. Figure 1 As shown.

[0078] In an exemplary embodiment, the thickness of the adsorption pad 211 is M, where 0.4mm ≤ M ≤ 0.6mm, and the Shore hardness of the adsorption pad 211 is HS, where 50HA < HS ≤ 60HA. This ensures that the substrate does not bounce at high frequencies during the bonding process, guarantees the quality of wire bonding, and provides good adsorption and fixation effects.

[0079] To ensure good adsorption effect after the adsorption pad 211 contacts the substrate, the adsorption pad 211 is preferably made of fluororubber and silicone, so that the surface of the adsorption pad 211 can be a smooth surface to ensure vacuum adsorption effect. The adsorption pad 211 can be molded separately and then sealed and pasted on the steel or aluminum support 212.

[0080] If the contact surface between the adsorption pad 211 and the substrate is smooth, the substrate cannot automatically detach from the adsorption pad 211 after the suction port 210 returns to normal pressure. When the substrate is placed manually, after bonding is completed, the vacuum system 4 connects the suction port 210 to the atmosphere. At this time, after the substrate is decoupled from the suction cup assembly 2, the substrate needs to be manually removed from the suction cup assembly 2. When the contact and separation between the substrate and the adsorption pad 211 are achieved automatically, the bonded substrate often bounces after contacting the tray 1 after the suction cup assembly 2 moves relative to the tray 1 on which the substrate is placed. This prevents the substrate from accurately returning to its initial position on the tray 1. Since the substrate is made of fragile material, the substrate may be damaged, affecting the quality of the bonded product.

[0081] When automating the contact and separation of the substrate and the adsorption pad 211, for a substrate with dimensions of 63.5mm × 44.5mm, a thickness of 1.12mm, and a ceramic substrate with copper plating on both sides, adsorption pads 211 with different materials, thicknesses, hardnesses, and contact surface states were designed. The stability of the substrate during bonding and the stability of separation from the adsorption pad 211 were tested. The test results are shown in Table 1. In the bonding stability test, loose wire bonding was detected by manual quality inspection of the bonded substrate. Slight movement in the bonding stability test was detected by sensors (vision system) in the bonding equipment. The sensors are standard configurations of the bonding equipment. In the separation stability test, bouncing can be observed visually.

[0082] Table 1

[0083]

[0084]

[0085] As can be seen from Table 1, the minimum thickness of EVA is 1mm and the material has a rough contact surface, which cannot achieve a good adsorption and fixation effect and does not meet the requirements.

[0086] When the thickness of the adsorption pad 211 is greater than or equal to 1 mm, the bonding stability requirements cannot be met under different hardness conditions and the contact surface is smooth.

[0087] When the thickness of the adsorption pad 211 is 0.5mm, the contact surface is smooth and the hardness meets the requirements of 50HA<HS≤60HA, which can meet the bonding stability requirements. However, the adsorption pad 211 bounces when it is separated from the substrate.

[0088] The cause of the bouncing phenomenon was analyzed. Under the action of vacuum adsorption fixation, the adsorption pad 211 was tightly attached to the substrate. In addition, the pressure applied to the substrate by the bonding machine during the bonding process caused the substrate and the smooth surface of the adsorption pad 211 to stick together. In order to change the surface state of the adsorption pad 211, the adsorption pad 211 with a grid surface was tested again. As shown in Table 1, when the adsorption pad 211 has a grid surface, the adsorption pad 211 can be successfully separated from the substrate. The specific structure of the grid surface of the adsorption pad 211 needs to be further studied when setting it.

[0089] In another exemplary embodiment, such as Figures 3-6 As shown, the adsorption pad 211 includes a sheet-like substrate 2113, which is sealed and fixedly disposed on the side of the support 212 facing the substrate. The surface of the sheet-like substrate 2113 is provided with multiple first strip-shaped protrusions 2111 and multiple second strip-shaped protrusions 2112. The first strip-shaped protrusions 2111 and the second strip-shaped protrusions 2112 intersect to form a uniformly distributed grid-like area 2114 on the surface of the sheet-like substrate 2113. The center of the suction port 210 is located at the intersection point 2115 of the adjacent grid-like area 2114. The suction port 210 is connected to the adjacent grid-like area 2114. The total area of ​​the grid-like area 2114 adjacent to the suction port 210 is greater than the cross-sectional area of ​​the suction port 210.

[0090] like Figure 5 As shown, the area of ​​a single lattice region 2114 is S1, and the area of ​​the sheet-like substrate 2113 is S2, 14.13 mm. 2 ≤S1≤28.26mm 2 .

[0091] Specifically, multiple first strip-shaped protrusions 2111 and multiple second strip-shaped protrusions 2112 are provided on the sheet-like substrate 2113. The first strip-shaped protrusions 2111 and the second strip-shaped protrusions 2112 intersect, forming a grid surface on the surface of the sheet-like substrate 2113. The grid-shaped region 2114 is the smallest unit of the grid surface. When the grid-shaped region 2114 has a square structure, each suction port 210 is located at the center of four grid-shaped regions 2114, expanding the adsorption range of the suction port 210 to the adjacent grid-shaped regions 2114, improving the adsorption effect. Furthermore, the diameter of the suction port 210 is smaller than the diameter of the total area of ​​the grid-shaped regions 2114 adjacent to and connected to the suction port 210. Figure 5 As shown, the suction port 210 is circular, and the grid area 2114 is square. The diameter of the suction port 210 is equal to the side length of a single grid area 2114, so that the outer periphery and the interior of the adsorption range are supported by the first strip protrusion 2111 and the second strip protrusion 2112.

[0092] Since the adsorption pad 211 is made of rubber with a certain hardness (50HA<HS≤60HA), and the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 also have a certain compressibility and elasticity, the adsorption pad 211 with a grid surface in this embodiment satisfies 14.13mm. 2 ≤S1≤28.26mm 2 At work:

[0093] After the suction cup assembly 2 rises, the suction part 21 passes through the perforation 10 to lift the substrate, so that the suction pad 211 contacts the substrate. At this time, the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 of the suction pad 211 contact the substrate.

[0094] After the vacuum system 4 is started, a negative pressure is generated within the adsorption range corresponding to each suction port 210 to uniformly adsorb and fix the substrate on the adsorption pad 211. At the same time, the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 on the adsorption pad 211 are compressed, and the substrate contacts the smooth surface of the sheet-like substrate 2113 in each grid area 2114. The total contact area is greater than or equal to 0.1% of the area of ​​each grid area 2114, which ensures the adhesion between the substrate and the surface of the adsorption pad 211 after the substrate is vacuum adsorbed, ensuring a good fixing effect of the substrate and preventing the substrate from moving slightly during the bonding process.

[0095] After bonding is completed, during the process of the suction port 210 being connected to the atmosphere and returning to normal pressure, the substrate overcomes the adhesive force of the sheet substrate 2113 under the elastic restoring force of the first strip protrusion 2111 and the second strip protrusion 2112, and returns to the state where only the first strip protrusion 2111 and the second strip protrusion 2112 are in contact with the substrate. At this time, the adhesive force is small, which can ensure that the substrate does not bounce when it is separated from the adsorption pad 211, and the tension on the substrate when it is in contact with the tray 1 is small, so as not to damage the substrate. The elastic restoring force of the first strip protrusion 2111 and the second strip protrusion 2112 is sufficient to overcome the adhesive force, so that the substrate is separated from the smooth surface of the sheet substrate 2113 in each grid area 2114.

[0096] Driven by the lifting mechanism 3, the suction cup assembly 2 descends, the substrate successfully detaches from the suction pad 211, and falls back onto the tray 1.

[0097] The mesh surface reduces the direct contact area between the substrate and the adsorption pad 211, and also changes the contact method. In a specific embodiment, such as... Figure 6 As shown, preferably, the portion of the cross section of the first strip protrusion 2111 and the second strip protrusion 2112 perpendicular to the length direction facing the substrate is an arc protruding towards the substrate. When the substrate is placed on the adsorption pad 211, the first strip protrusion 2111 and the second strip protrusion 2112 are in line contact with the substrate, making the direct contact area between the adsorption pad 211 and the substrate smaller.

[0098] For a substrate with dimensions of 63.5mm × 44.5mm, a thickness of 1.12mm, and a ceramic substrate with copper cladding on both sides, an adsorption pad 211 was designed with silicone material, a thickness M of 0.5mm, a strip protrusion height N of 0.2mm, a strip protrusion width W of 0.4mm, and a silicone hardness of 50HA < HS ≤ 60HA, but with different S1 areas. The stability of the substrate during bonding and the stability of the substrate when detached from the adsorption pad 211 were tested. The test results are shown in Table 2.

[0099] Table 2

[0100]

[0101] As shown in Table 2, when S1 is less than 14.13 mm 2 When the mesh is too small, after the adsorption pad 211 fixes the substrate in the vacuum, the substrate and the sheet substrate 2113 cannot make good contact, and the adhesion force provided to the substrate is insufficient. Therefore, the substrate moves slightly during the bonding process. At the same time, after the suction port 210 returns to normal pressure after the bonding is completed, the substrate and the adsorption pad 211 separate smoothly because of the small adhesion force.

[0102] When S1 is greater than 28.26 mm 2When the grid is too large, the adhesion force provided by the adsorption pad 211 to the substrate after vacuum adsorption and fixation of the substrate is large enough, so there is no slight movement of the substrate during the bonding process. At the same time, after the bonding is completed, when the suction port 210 is connected to the atmosphere and restored to normal pressure, the elastic recovery force provided by the strip protrusion is not enough to overcome the adhesion force. As the suction cup assembly 2 descends, the substrate bounces because of the adhesion between the substrate and the sheet substrate 2113 in each grid area 2114.

[0103] 14.13mm 2 ≤S1≤28.26mm 2 During the process, after the adsorption pad 211 fixes the substrate in the vacuum, the adsorption pad 211 provides appropriate adhesion to the substrate, ensuring effective fixation of the substrate during the bonding process and preventing movement along the substrate plane. At the same time, after the bonding is completed, the elastic recovery force of the strip-shaped protrusions overcomes the adhesion force, causing the substrate to separate from the sheet-like substrate 2113 in each grid area 2114. As the suction cup assembly 2 descends, the adhesion force of the adsorption pad 211 to the substrate is greatly reduced, and the substrate and the adsorption pad 211 are smoothly separated.

[0104] By setting multiple first strip-shaped protrusions 2111 and second strip-shaped protrusions 2112 on the adsorption pad 211, a grid surface is formed on the adsorption pad 211. During the pressure change of the suction port 210, elastic deformation occurs. When the strip-shaped protrusions are compressed, the contact area between the adsorption pad 211 and the substrate is increased, ensuring bonding under good support and fixation, thereby ensuring bonding quality. During the process of the strip-shaped protrusions returning to their original shape, the elastic action helps to separate the substrate from the adsorption pad 211, reducing the contact area between the adsorption pad 211 and the substrate, facilitating the separation of the substrate from the adsorption pad 211. In the automated production process, the adsorption pad 211 simultaneously meets the requirements of bonding stability and separation stability, ensuring bonding quality and the automated production efficiency of the bonding production line.

[0105] like Figure 6 As shown, the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 protrude from the surface of the sheet-like substrate 2113 at equal heights (N) along the thickness direction of the adsorption pad 211. The widths of both the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 are W, where 0.4 ≤ N / W ≤ 0.5 and 0.4 ≤ N / M ≤ 0.6. This ensures a match between the compressive deformation and elastic recovery force along the thickness direction of the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 after compression. Preferably, as... Figure 6 As shown, the portion of the cross section of the first strip protrusion 2111 and the second strip protrusion 2112 perpendicular to the length direction and facing the substrate is an arc shape protruding towards the substrate, which facilitates the compression deformation of the second strip protrusion 2112.

[0106] For a ceramic substrate with dimensions of 63.5mm × 44.5mm, a thickness of 1.12mm, and copper clad on both sides, a silicone material with a thickness M of 0.5mm, a strip-shaped protrusion height N of 0.2mm, and S1 of 28.26mm is designed. 2 The silicone hardness meets the requirement of 50HA<HS≤60HA, but the width W of the strip protrusions is different. The stability of the substrate during bonding and the stability when detached from the adsorption pad 211 are tested. The test results are shown in Table 3.

[0107] Table 3

[0108]

[0109] As shown in Table 3, when the width W of the strip protrusion is too wide, N / W < 0.4, the compression deformation of the strip protrusion is small, which results in insufficient adhesion between the substrate and the smooth surface of the sheet substrate 2113 in each grid area 2114 after the adsorption pad 211 is vacuum adsorbed and fixed to the substrate. In other words, the adhesion is insufficient, which causes the substrate to move slightly during the bonding process. Because of the insufficient adhesion, the adsorption pad 211 can be easily separated from the substrate when it is separated from the substrate.

[0110] When the width W of the strip protrusion is too narrow, N / W > 0.5. After the adsorption pad 211 is vacuum adsorbed and fixed to the substrate, the strip protrusion tilts down, which can achieve good adhesion to the smooth surface of the sheet substrate 2113 in each grid area 2114. However, after the bonding is completed, when the adsorption pad 211 is separated from the substrate, the strip protrusion cannot apply elastic restoring force to separate the substrate from the smooth surface of the sheet substrate 2113 in the grid area 2114, so a bouncing phenomenon will occur.

[0111] When the strip-shaped protrusion satisfies 0.4≤N / W≤0.5, the matching of the compression deformation and elastic recovery force along the thickness direction after the strip-shaped protrusion is compressed, after the adsorption pad 211 vacuum adsorbs and fixes the substrate, the adhesion between the substrate and the smooth surface of the sheet substrate 2113 in each grid region 2114 is sufficient to ensure that the bottom of the substrate is well supported and fixed during bonding. After the bonding is complete, the elastic recovery force provided by the strip-shaped protrusion can separate the substrate from the smooth surface of the sheet substrate 2113 in the grid region 2114.

[0112] For a ceramic substrate with dimensions of 63.5mm × 44.5mm, a thickness of 1.12mm, and copper clad on both sides, a silicone substrate with a thickness M of 0.5mm, N / W of 0.5, and S1 of 28.26mm is designed. 2 The silicone hardness meets the requirement of 50HA<HS≤60HA, but the N / M of the strip-shaped protrusions are different. The stability during substrate bonding and the stability when detached from the adsorption pad 211 are tested. The test results are shown in Table 4.

[0113] Table 4

[0114]

[0115] As shown in Table 4, when the height of the strip protrusions is too small and N / M < 0.4, after the substrate is fixed by vacuum adsorption, the substrate and the smooth surface of the sheet substrate 2113 in each grid area 2114 have good adhesion and meet the requirements of bonding stability. However, during the process of the suction port 210 returning to normal pressure after being connected to the atmosphere, the strip protrusions do not have enough restoring force to separate the substrate from the smooth surface of the sheet substrate 2113 in the grid area 2114. Therefore, a bouncing phenomenon occurs when the adsorption pad 211 detaches from the substrate.

[0116] When the height of the strip protrusion is high and N / M > 0.6, after the substrate is fixed by vacuum adsorption, the compression deformation of the strip protrusion cannot meet the contact area requirements between the substrate and the adsorption pad 211, and cannot provide sufficient adhesion. Therefore, during the bonding process, the substrate moves slightly relative to the adsorption pad 211, but the adsorption pad 211 can be easily separated from the substrate.

[0117] When 0.4≤N / M≤0.6, the matching of the compressive deformation and elastic recovery force of the strip protrusions, after the adsorption pad 211 fixes the substrate in vacuum adsorption, the adhesion between the substrate and the smooth surface of the sheet substrate 2113 in each grid region 2114 is sufficient to ensure that the bottom of the substrate is well supported and fixed during bonding. After the bonding is complete, the elastic recovery force provided by the strip protrusions can separate the substrate from the smooth surface of the sheet substrate 2113 in the grid region 2114.

[0118] By controlling the area S1 of the grid region 2114, 14.13 mm 2 ≤S1≤28.26mm 2 The ratio of the height N to the width W of the strip-shaped protrusions and the ratio of the height N to the thickness M are controlled, with 0.4≤N / W≤0.5 and 0.4≤N / M≤0.6. This ensures that the substrate is in contact with the surface of the sheet substrate 2113 in each grid area 2114, and the contact area is greater than or equal to 0.5‰ of the area of ​​each grid area 2114. This ensures that the bottom of the substrate is well supported and fixed during bonding, and that the elastic recovery force in the thickness direction of the adsorption pad 211 after the first strip-shaped protrusion 2111 and the second strip-shaped protrusion 2112 are sufficient to overcome the adhesive force generated by the close contact between the substrate and the sheet substrate 2113, allowing the substrate to detach smoothly from the adsorption pad 211.

[0119] In one exemplary embodiment, this application provides a bonding fixture, including a suction cup assembly 2 of any of the above embodiments, and a vacuum system 4 connected to a suction hole 2120.

[0120] In another exemplary embodiment, there are multiple substrates that need to be fixed. The substrates are placed on a tray 1, and the tray 1 has multiple through holes 10 that correspond one-to-one with the substrates.

[0121] The number of supports 212 is the same as the number of substrates, and the supports 212 are boss structures;

[0122] When the tray 1 is directly above the suction cup assembly 2, the tray 1 and the suction cup assembly 2 move relative to each other, and the adsorption part 21 passes through the perforation 10 to lift the substrate, so that the adsorption pad 211 contacts the substrate.

[0123] The bonding equipment's support and conveying mechanism is automated to ensure that the adsorption pad 211 contacts the substrate. Figure 2 As shown, the system includes a frame 104, a conveyor 102 mounted on the frame 104, and a stopping mechanism 101. When the pallet 1 is conveyed by the conveyor line to the conveyor 102 inside the bonding equipment, it is stopped by the stopping mechanism 101. At the same time, the position sensing sensor 103 detects that the pallet 1 has reached its position, and the bonding operation can begin. To facilitate the detection of the pallet 1, the frame 104 is also equipped with an outflow sensing sensor 105 for detecting the reverse movement of the pallet 1 out of the bonding equipment, and an inflow / outflow sensing sensor 106 for detecting the pallet 1 entering and leaving the conveyor 102.

[0124] like Figure 1 , Figure 7 As shown, the bonding fixture also includes a lifting mechanism 3, which includes a linear driver 34 and a suction cup mounting base 32. The suction cup mounting base 32 is slidably connected to the frame 104 of the bonding equipment. The linear driver 34 is driven to drive the suction cup mounting base 32 to lift. The suction cup assembly 2 is fixedly installed on the suction cup mounting base 32.

[0125] The suction cup assembly 2 is provided with a plurality of first insertion parts 25, and a first through hole 250 is provided in one first insertion part 25. The first through hole 250 is connected to all the suction holes 2120 on a support body 212.

[0126] The suction cup mounting base 32 includes a plurality of second insertion parts 33, each second insertion part 33 having a second through hole 330, the second through hole 330 being connected to the vacuum system 4;

[0127] When the suction cup assembly 2 is fixedly installed on the suction cup mounting base 32, the first insertion part 25 and the second insertion part 33 are inserted into each other and the first through hole 250 and the second through hole 330 are connected.

[0128] Specifically, one of the first insertion part 25 and the second insertion part 33 is a raised structure and the other is a recessed structure. A sealing ring is provided at the contact part of the first insertion part 25 and the second insertion part 33 to realize the connection between the first through hole 250 and the second through hole 330 for vacuuming of the vacuum system 4 pairs of suction ports 210; the linear driver 34 can be a cylinder and is fixedly installed on the frame 104.

[0129] The suction cup mounting base 32 is provided with a suction cup positioning pin 31, and the suction cup assembly 2 is provided with a suction cup positioning hole 28. The insertion and engagement of the suction cup positioning pin 31 and the suction cup positioning hole 28 are used for positioning the suction cup assembly 2 during installation.

[0130] By providing a first insertion part 25 on the suction cup assembly 2 and a second insertion part 33 on the suction cup mounting base 32 of the lifting mechanism 3, the first insertion part 25 is provided with a first through hole 250 communicating with the suction port 210, and the second insertion part 33 is provided with a second through hole 330 communicating with the vacuum system 4. The quick replacement and installation of the suction cup assembly 2 can be achieved by inserting the first insertion part 25 and the second insertion part 33.

[0131] This embodiment allows for quick replacement of the suction cup assembly 2, shortening downtime during automated production. The replacement can even be completed within the conveying interval of the pallet 1 during automated production, with a replacement time of less than 30 seconds.

[0132] This embodiment illustrates the structure of a vacuum system 4, such as... Figure 12 As shown, the vacuum system 4 includes a vacuum pump 45, a connecting pipe 41 connected to the second through hole 330, and a two-position five-way solenoid valve 42. The figure shows that the vacuum pump 45 simultaneously evacuates all suction ports 210 or simultaneously connects suction ports 210 to the atmosphere. The connecting pipe 41 connects the second through hole 330 to port B 421 of the two-position five-way solenoid valve 42. Ports A 422 and R 425 of the two-position five-way solenoid valve 42 are normally closed. Port P 424 of the two-position five-way solenoid valve 42 is connected to the air inlet of the vacuum pump 45, and port S 423 of the two-position five-way solenoid valve 42 is connected to the atmosphere.

[0133] Specifically, the two-position five-way solenoid valve 42 is an externally piloted type, model SY5140RT-5LZD. The pilot valve of the two-position five-way solenoid valve 42 is connected to the control air source 43. Port A 422 is externally sealed to achieve a normally closed state. Port R 425 of the two-position five-way solenoid valve 42 is sealed by connecting a sealing end 44 through a pipeline to achieve a normally closed state. Port P 424 of the two-position five-way solenoid valve 42 is connected to the air inlet of the vacuum pump 45 through a branch pipe 46. Port S 423 of the two-position five-way solenoid valve 42 is connected to a silencer 47 through a venting pipeline 48, and is connected to the atmosphere through the silencer 47. A vacuum gauge 411 is installed on the connecting pipeline 41.

[0134] When the two-position five-way solenoid valve 42 is de-energized, such as Figure 12 As shown, the vacuum pump 45 is connected to the connecting pipe 41 through the two-position five-way solenoid valve 42. When the two-position five-way solenoid valve 42 is energized, the connecting pipe 41 is connected to the atmosphere through the two-position five-way solenoid valve 42, thereby disconnecting the connection with the vacuum pump 45 by blocking the corresponding branch pipe 46.

[0135] The following section describes the working principle of controlling the connection between the second through-hole 330 and the vacuum pump 45, using the automated substrate wire bonding production line as an example:

[0136] During normal operation of the bonding production line, vacuum pump 45 is kept running continuously;

[0137] Before bonding, the two-position five-way solenoid valve 42 is energized. When the drive suction cup assembly 2 rises, before the suction part 21 contacts the substrate, the two-position five-way solenoid valve 42 is de-energized, as shown below. Figure 12 As shown, port B 421 is connected to port P 424, so that the air inlet of vacuum pump 45 is connected to the first through hole 250. Port S 423 is blocked. After the substrate comes into contact with the adsorption part 21, a negative pressure is generated at the suction port 210. The substrate is vacuum adsorbed and fixed on the adsorption part 21 through the suction port 210.

[0138] Perform bonding;

[0139] After bonding is completed, the two-position five-way solenoid valve 42 is energized, which connects the suction port 210 and the second through hole 330 to the atmosphere. After the suction cup assembly 2 descends, the substrate falls back onto the tray 1.

[0140] By closing two positions of the two-position five-way solenoid valve 42 (port A 422 and port R 425 are normally closed) and connecting the remaining three positions to the first through-hole 250, the atmosphere, and the vacuum pump 45, when the two-position five-way solenoid valve 42 is activated, ports P 424 and S 423 are intermittently connected to port B 421. This allows the second through-hole 330 to switch between the atmosphere and the vacuum pump 45, enabling the suction port 210 to switch between vacuuming and venting states. This eliminates the need for frequent start-stop of the vacuum pump 45, simplifies the control pipeline, reduces the number of moving parts, and improves the reliability of the vacuum system 4.

[0141] Replacing the suction cup assembly 2 typically occurs when the substrate layout on the tray 1 changes. To allow the suction cup assembly 2 structure to adapt to various substrate layouts, further, in an exemplary embodiment, such as... Figure 8 , Figure 10 As shown, the suction cup assembly 2 includes a suction cup base plate 23 and a suction cup mounting plate 22.

[0142] The suction cup base plate 23 is provided with a first insertion part 25;

[0143] The lower surface of the suction cup mounting plate 22 is provided with multiple grooves 27;

[0144] Multiple supports 212 are fixedly mounted on the upper surface of the suction cup mounting plate 22. Multiple grooves 27 correspond one-to-one with the supports 212, and the grooves 27 are connected to all the suction holes 2120 on a support 212.

[0145] The number of first through holes 250 is greater than or equal to the number of support bodies 212. The suction cup mounting plate 22 is sealed and installed on the suction cup base plate 23. The suction hole 2120 is connected to a corresponding first through hole 250 through the corresponding groove 27.

[0146] Specifically, the upper surface of the suction cup base plate 23 is provided with a tray positioning pin 24, which cooperates with the tray positioning hole at the bottom of the tray 1, so that the suction cup assembly 2 positions the tray 1 in the XY plane after contacting the tray 1; the support body 212 of the adsorption part 21 and the suction cup mounting plate 22 are integrally formed by machining, and both are made of steel or aluminum; an adsorption pad 211 is provided on the support body 212, and the suction hole 2120 on the support body 212 connects the suction port 210 on the adsorption pad 211 with the groove 27; a sealing gasket 26 is installed between the suction cup mounting plate 22 and the suction cup base plate 23, and the suction cup mounting plate 22 and the suction cup base plate 23 are fixedly connected by fasteners. The groove 27 is connected to the first through hole 250 through the sealing gasket 26, which is used by the vacuum system 4 to evacuate the suction port 210; any excess first through hole 250 can be sealed by plugging.

[0147] The suction cup assembly 2 is configured as a separate structure consisting of a suction cup base plate 23 and a suction cup mounting plate 22. An adsorption part 21 is provided on the suction cup mounting plate 22. The number and size of the adsorption parts 21 can be changed by replacing the suction cup mounting plate 22, which facilitates the adjustment of the substrate model and placement method in the production line.

[0148] In another exemplary embodiment, the second plug-in portion 33 is a protrusion structure, the first plug-in portion 25 is a recess structure, the number of second plug-in portions 33 is at least one row, the cross-sectional shape of adjacent second plug-in portions 33 in each row is different along the perpendicular to the plugging direction, and the types of cross-sectional shapes are circular and oblong, and the arrangement direction of each row of second plug-in portions 33 is consistent with the major axis direction of the oblong.

[0149] The shape of the first through hole 250 matches the cross-sectional shape of the second insertion part 33. The second through hole 330 is located at the center of the cross-section of the second insertion part 33. The second through hole 330 is a circular through hole. The projected area of ​​each groove 27 along the insertion direction covers a first through hole 250.

[0150] Specifically, the number of second connectors 33 can be two rows, such as... Figure 11As shown; the arrangement direction of the second insertion part 33 in each row is consistent with the direction of the major axis of the oblong shape.

[0151] When the size of the substrate to be bonded changes, the number of substrates arranged in the same specification suction cup assembly 2 needs to be changed. In the bonding fixture, the number and position of the second through hole 330 and the first through hole 250 remain unchanged. The center position of the adsorption part 21 is changed so that the groove 27 corresponding to the adsorption part 21 can still cover a second through hole 330 after moving along the long axis of the elongated oval. This ensures that each adsorption part 21 corresponds to a first through hole 250, and any excess first through holes 250 can be blocked.

[0152] like Figure 11 As shown in the figure, the number of suction parts 21 in each row in (a), (b), and (c) are five, four, and three, respectively. The red part in the figure represents the second through hole 330, and the green part represents the cross-sectional outline of the second insertion part 33, which also represents the shape of the first through hole 250. There are five second insertion parts 33, and the number of oblong second insertion parts 33 is one less than the number of circular second insertion parts 33. There are five second through holes 330 in each row. The number of grooves 27 in each row on the modified suction cup mounting plate 22 is five, four, and three, respectively. By misaligning the grooves 27 and the first through holes 250 in each row, the first through holes 250 and the grooves 27 can meet the requirement of partial overlap. The excess first through holes 250 are blocked, and the inventory of suction cup mounting plates 22 is increased. This allows the suction cup assembly 2 to be used with trays 1 with different numbers of substrates, and each suction cup assembly 2 can meet the requirement of being compatible with the same suction cup mounting base 32, which facilitates rapid changeover on the production line.

[0153] By setting the second insertion part 33 as a protrusion structure and the first insertion part 25 as a recess structure, and the cross sections of adjacent second insertion parts 33 being circular and oblong respectively, the coverage area of ​​the first through hole 250 is extended by the oblong shape, which makes it easier to move the position of the adsorption part 21 so that the corresponding groove 27 connects with the second through hole 330. This allows the same suction cup base plate 23 to be adapted to multiple suction cup base plates 23 with different numbers of adsorption parts 21, reducing the cost increase of the suction cup assembly 2 due to production line changes, and facilitating rapid production line changes.

[0154] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A suction cup assembly, characterized in that: For fixing the substrate, the suction cup assembly (2) is provided with an adsorption part (21) corresponding to the substrate, the adsorption part (21) including: Support (212); An adsorption pad (211) is disposed on the side of the support (212) facing the substrate and is used to contact and support the substrate. The adsorption pad (211) is made of rubber. Suction ports (210) are located on the adsorption pad (211), and there are multiple of them, which are evenly distributed in an array along the plane direction of the substrate; There are multiple suction holes (2120) that correspond one-to-one with the suction ports (210). One end of each suction hole (2120) is connected to one suction port (210), and the other end of all suction holes (2120) is used to connect to the vacuum system (4). The vacuum system (4) evacuates air from the suction port (210) through the suction hole (2120), generating negative pressure at the blind hole formed by the substrate in contact with the adsorption pad (211) and the suction port (210), thereby fixing the substrate onto the adsorption pad (211).

2. The suction cup assembly as described in claim 1, characterized in that: The adsorption pad (211) is fixed to the support (212) by adhesive bonding.

3. The suction cup assembly as described in claim 1, characterized in that: The thickness of the adsorption pad (211) is M, 0.4mm≤M≤0.6mm, and the Shore hardness of the adsorption pad (211) is HS, 50HA<HS≤60HA.

4. The suction cup assembly as described in claim 1, characterized in that: The adsorption pad (211) includes a sheet-like substrate (2113), which is sealed and fixedly disposed on the side of the support (212) facing the substrate. The surface of the sheet-like substrate (2113) is provided with multiple first strip-shaped protrusions (2111) and multiple second strip-shaped protrusions (2112). The first strip-shaped protrusions (2111) and the second strip-shaped protrusions (2112) intersect to form a uniformly distributed grid-like area (2114) on the surface of the sheet-like substrate (2113). The center of the suction port (210) is located at the intersection point (2115) of the adjacent grid-like area (2114). The suction port (210) is connected to the adjacent grid-like area (2114). The total area of ​​the grid-like area (2114) adjacent to the suction port (210) is greater than the cross-sectional area of ​​the suction port (210). The area of ​​a single lattice region (2114) is S1, 14.13 mm. 2 ≤S1≤28.26mm 2 .

5. The suction cup assembly as described in claim 4, characterized in that: The first strip protrusion (2111) and the second strip protrusion (2112) protrude from the surface of the sheet substrate (2113) along the thickness direction of the adsorption pad (211) at the same height of N. The width of the first strip protrusion (2111) and the second strip protrusion (2112) is W, 0.4≤N / W≤0.5, 0.4≤N / M≤0.

6.

6. A bonding fixture, characterized in that: It includes the suction cup assembly (2) as described in any one of claims 1-5, and also includes the vacuum system (4) connected to the suction hole (2120).

7. The bonding fixture as described in claim 6, characterized in that: The number of substrates to be fixed is multiple, and the substrates are placed on a tray (1). The tray (1) has multiple perforations (10) that correspond one-to-one with the substrates. The number of the support (212) is the same as the number of the substrate, and the support (212) is a boss structure; When the tray (1) is directly above the suction cup assembly (2), the tray (1) moves relative to the suction cup assembly (2), and the adsorption part (21) passes through the perforation (10) to lift the substrate, so that the adsorption pad (211) contacts the substrate.

8. The bonding fixture as described in claim 7, characterized in that: The bonding fixture also includes a lifting mechanism (3), which includes a linear driver (34) and a suction cup mounting base (32). The suction cup mounting base (32) is slidably connected to the frame (104) of the bonding equipment. The linear driver (34) is drivenly connected to the suction cup mounting base (32) to drive the suction cup mounting base (32) to rise and fall. The suction cup assembly (2) is fixedly mounted on the suction cup mounting base (32). The suction cup assembly (2) is provided with a plurality of first plug-in portions (25), and each first plug-in portion (25) is provided with a first through hole (250), and each first through hole (250) is connected to all the suction holes (2120) on a support body (212); The suction cup mounting base (32) includes a plurality of second insertion parts (33), each of the second insertion parts (33) having a second through hole (330) therein, the second through hole (330) being connected to the vacuum system (4); When the suction cup assembly (2) is fixedly installed on the suction cup mounting base (32), the first insertion part (25) is inserted into the second insertion part (33) and the first through hole (250) is connected to the second through hole (330).

9. The bonding fixture as described in claim 8, characterized in that: The suction cup assembly (2) includes: A suction cup base plate (23) is provided with the first insertion part (25); A suction cup mounting plate (22) is provided with a plurality of grooves (27) on its lower surface; Multiple supports (212) are fixedly disposed on the upper surface of the suction cup mounting plate (22), and multiple grooves (27) correspond one-to-one with the supports (212). The grooves (27) are connected to all the suction holes (2120) on one of the supports (212). The number of the first through holes (250) is greater than or equal to the number of the support bodies (212), the suction cup mounting plate (22) is sealed and installed on the suction cup base plate (23), and the suction hole (2120) is connected to a corresponding first through hole (250) through a corresponding groove (27).

10. The bonding fixture as described in claim 9, characterized in that: The second plug-in part (33) is a protrusion structure, the first plug-in part (25) is a recess structure, the number of the second plug-in parts (33) is at least one row, the cross-sectional shape of adjacent second plug-in parts (33) in each row is different along the perpendicular plug-in direction, and the types of cross-sectional shapes are circular and oblong, and the arrangement direction of each row of second plug-in parts (33) is consistent with the major axis direction of the oblong; The shape of the first through hole (250) matches the cross-sectional shape of the second insertion part (33). The second through hole (330) is located at the center of the cross-section of the second insertion part (33). The second through hole (330) is a circular through hole. The projected area of ​​each groove (27) along the insertion direction covers one of the first through holes (250).

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