A power module and an electrical apparatus

Abstract

This application relates to the field of power module technology, and provides a power module and electrical device. The power module includes: a cooling plate, a substrate assembly, a lower bridge assembly, and an upper bridge assembly. The substrate assembly is disposed on the cooling plate, and at least two substrate assemblies are provided. The at least two substrate assemblies are spaced apart and symmetrically arranged along a thickness direction intersecting the cooling plate. The lower bridge assembly is disposed on one of the at least two substrate assemblies, and the upper bridge assembly is disposed on the other of the at least two substrate assemblies and is electrically connected to the lower bridge assembly. This application can solve the problem that the risk of thermal stress concentration in the insulating substrate leads to a reduction in the service life of the power module.

Description

Technical Field

[0001] This application relates to the field of power module technology, and in particular to a power module and electrical equipment. Background Technology

[0002] A power module is an integrated module that encapsulates multiple high-power power electronic devices (such as IGBTs, MOSFETs, diodes, etc.) together through an insulating substrate, housing, terminals, etc., to achieve specific circuit functions (such as rectification, inversion, frequency conversion, etc.).

[0003] Furthermore, the power electronic devices are integrated on an insulating substrate, the terminals are electrically connected to the power electronic devices, and the housing is used to provide protection for the power electronic devices.

[0004] In related technologies, there is a risk of thermal stress concentration on the insulating substrate, which can lead to a reduction in the lifespan of the power module. Utility Model Content

[0005] This application provides a power module and electrical equipment that can solve the problem that thermal stress concentration on the insulating substrate can lead to a reduction in the service life of the power module.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In the first direction, this application provides a power module, including:

[0008] Cooling plate;

[0009] A substrate assembly is disposed on a cooling plate. At least two substrate assemblies are provided, and the at least two substrate assemblies are spaced apart and symmetrically arranged along the thickness direction intersecting the cooling plate.

[0010] The lower bridge assembly is located in one of at least two substrate assemblies;

[0011] An upper bridge assembly is disposed on another of at least two substrate assemblies and is electrically connected to a lower bridge assembly.

[0012] In some embodiments, the substrate assembly has a first groove and a second groove, which are spaced apart along the thickness direction intersecting the cooling plate.

[0013] In the first and second slots, the first slot is used to accommodate the first switching element of the lower bridge assembly, and the second slot is used to accommodate the first diode of the lower bridge assembly.

[0014] Alternatively, in the first and second slots, the first slot is used to accommodate the second switching element of the upper bridge assembly, and the second slot is used to accommodate the second diode of the upper bridge assembly.

[0015] In some embodiments, the substrate assembly includes:

[0016] Insulating components are installed on the cooling plate;

[0017] The first conductive element is disposed on the insulating element along the thickness direction of the cooling plate, and the first conductive element is located on the side of the insulating element away from the cooling plate.

[0018] The insulating component has a first groove and a second groove respectively.

[0019] Alternatively, a portion of the insulating element and a portion of the cooling plate may be combined to form a first groove, while another portion of the insulating element and another portion of the cooling plate may be combined to form a second groove.

[0020] In some embodiments, it further includes: an auxiliary conductive component disposed on the first conductive element and electrically connected to the first conductive element;

[0021] The auxiliary conductive component is used to electrically connect the first switching element and the first diode;

[0022] And / or, auxiliary conductive components are used for electrical connection of the second switching element and the second diode;

[0023] And / or, auxiliary conductive components are used to electrically connect two adjacent first conductive elements.

[0024] In some embodiments, the auxiliary conductive component includes:

[0025] A rigid conductive element is disposed on the first conductive element and electrically connected to the first switching element and the first diode. Along the thickness direction of the cooling plate, the rigid conductive element is located on the side of the first conductive element away from the insulating element.

[0026] And / or, a flexible conductive element, which is electrically connected to two adjacent first conductive elements and electrically connected to a second switching element and a second diode.

[0027] In some implementations, the lower bridge assembly includes:

[0028] The first switch element is disposed in the first groove of the first substrate assembly;

[0029] The first diode is disposed in the second groove of the first substrate assembly. The first diode and the first switching element are electrically connected through a rigid conductive element, which forms either a negative electrode or a positive electrode.

[0030] AC copper busbar, electrically connected to the first conductive element of the first substrate assembly;

[0031] The first gate signal pin is located on the cooling plate and is electrically connected to the first switching element;

[0032] The first emitter signal pin is located on the cooling plate and is electrically connected to the first switch.

[0033] Among them, the rigid conductive element is electrically connected to the first conductive element of the first substrate assembly.

[0034] In some implementations, the upper bridge assembly includes:

[0035] The second switch is disposed in the first groove of the second substrate assembly;

[0036] The second diode is disposed in the second groove of the second substrate assembly, and the second diode and the second switching element are electrically connected through a flexible conductive element.

[0037] The second gate signal pin is located on the cooling plate and is electrically connected to the second switch.

[0038] The second emitter signal pin is located on the cooling plate and is electrically connected to the second switch.

[0039] The lead-out component is electrically connected to the first conductive component of the second substrate assembly, and the lead-out component is used to form the other of the negative electrode or the positive electrode.

[0040] The flexible conductive element is electrically connected to the first conductive element of the first substrate assembly and the first conductive element of the second substrate assembly.

[0041] In some embodiments, four substrate assemblies are provided, arranged in an array along the thickness direction intersecting the cooling plate.

[0042] In some implementations, it also includes:

[0043] A housing is provided on a cooling plate. The housing has a receiving cavity and an opening communicating with the receiving cavity. A substrate assembly is disposed inside the housing. The opening is used to receive at least one of the following: an AC copper busbar, a rigid conductive element, a first gate signal pin, a first emitter signal pin, a second gate signal pin, a second emitter signal pin, and a lead-out element.

[0044] A capacitor is mounted on a cooling plate. One end of the capacitor is electrically connected to a rigid conductive element, and the other end of the capacitor is electrically connected to an output element.

[0045] Secondly, this application provides an electrical device, including a power module.

[0046] This power module structure, by incorporating a cooling plate, can cool the lower and upper bridge components, reducing heat accumulation and thus ensuring more stable temperatures. It also reduces thermal stress concentration in the lower and upper bridge components. Furthermore, it provides a mounting base for the substrate assembly. The substrate assembly supports and protects the lower and upper bridge components. In some embodiments, electrical isolation can be established between the lower and upper bridge components and the cooling plate to ensure the safety of the power module. By incorporating and electrically connecting the lower and upper bridge components, direct current can be converted into a specific waveform of alternating current. By setting at least two baseboard assemblies and separating the lower bridge assembly and the upper bridge assembly onto two separate baseboard assemblies, the area of ​​a single baseboard assembly can be reduced while providing separate support and protection for the lower bridge assembly and the upper bridge assembly. When the temperature of the power module rises, the thermal expansion stress of the smaller baseboard assembly is lower, and the risk of damage is lower. At the same time, the risk of breakage of the connection between the baseboard assembly and the cooling plate is also reduced. As a result, the installation of the power module can be more stable, and the service life of the power module can be extended.

[0047] Therefore, this application can solve the problem that thermal stress concentration in the insulating substrate can lead to a reduction in the service life of the power module. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 One of the schematic diagrams of the main structure of the power module provided in the embodiments of this application;

[0050] Figure 2 A second schematic diagram of the main structure of the power module provided in the embodiments of this application;

[0051] Figure 3 The third schematic diagram of the main structure of the power module provided in the embodiments of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 100 - Cooling plate;

[0054] 200 - Substrate assembly; 201 - Insulating component; 202 - First conductive component;

[0055] 300 - Lower bridge assembly; 301 - First switching element; 302 - First diode; 303 - AC copper busbar; 304 - First gate signal pin; 305 - First emitter signal pin;

[0056] 400 - Upper bridge assembly; 401 - Second switch; 402 - Second diode; 403 - Second gate signal pin; 404 - Second emitter signal pin; 405 - Outgoing part;

[0057] 500 - Auxiliary conductive component; 501 - Rigid conductive component; 502 - Flexible conductive component;

[0058] 600 - Housing;

[0059] 700 - Capacitor; 701 - Second conductive component; 702 - Third conductive component. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0061] In existing technologies, full-bridge or half-bridge power modules use large ceramic substrates as insulating substrates, typically placing the upper and lower bridges of a single phase on one ceramic substrate. The larger the ceramic substrate area, the greater the thermal expansion stress, and the greater the risk of damage to the ceramic layer during use. Furthermore, the larger area of ​​the connection layer between the ceramic substrate and the cooling plate also makes it more prone to failure during aging tests.

[0062] To overcome the shortcomings of existing technologies, a cooling plate can be installed to cool the lower and upper bridge components, reducing heat accumulation and thus making their temperatures more stable. This also reduces thermal stress concentration in the lower and upper bridge components. Furthermore, it provides a mounting base for the substrate assembly. The substrate assembly provides support and protection for the lower and upper bridge components. In some embodiments, electrical isolation can be established between the lower and upper bridge components and the cooling plate to ensure the safety of the power module. By installing and electrically connecting the lower and upper bridge components, direct current can be converted into a specific waveform of alternating current. By setting at least two baseboard assemblies and separating the lower bridge assembly and the upper bridge assembly onto two separate baseboard assemblies, the area of ​​a single baseboard assembly can be reduced while providing separate support and protection for the lower bridge assembly and the upper bridge assembly. When the temperature of the power module rises, the thermal expansion stress of the smaller baseboard assembly is lower, and the risk of damage is lower. At the same time, the risk of breakage of the connection between the baseboard assembly and the cooling plate is also reduced. As a result, the installation of the power module can be more stable, and the service life of the power module can be extended.

[0063] Therefore, this application can solve the problem that thermal stress concentration in the insulating substrate can lead to a reduction in the service life of the power module.

[0064] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0065] like Figure 1 and Figure 2 As shown, this application provides a power module including: a cooling plate 100, a substrate assembly 200, a lower bridge assembly 300, and an upper bridge assembly 400. The substrate assembly 200 is disposed on the cooling plate 100, and at least two substrate assemblies 200 are provided. The at least two substrate assemblies 200 are spaced apart and symmetrically arranged along the thickness direction intersecting the cooling plate 100. The lower bridge assembly 300 is disposed on one of the at least two substrate assemblies 200, and the upper bridge assembly 400 is disposed on the other of the at least two substrate assemblies 200 and is electrically connected to the lower bridge assembly 300.

[0066] The following sections provide detailed descriptions of the specific structures of the power modules and electrical equipment, as well as various possible implementation methods.

[0067] It should be noted that the material of the cooling plate 100 can be aluminum alloy, copper alloy, aluminum silicon carbide composite material, metal matrix composite material, engineering plastic, or other high heat rate material. There are no restrictions here, and it can be selected according to the actual use requirements.

[0068] It should be noted that the substrate assembly 200 and the cooling plate 100 can be fixed by adhesive or welding, and there is no restriction. The choice can be made according to the actual use requirements.

[0069] In one embodiment, the substrate assembly 200 and the cooling plate 100 are fixed together by welding. Further, the substrate assembly 200 and the cooling plate 100 can be welded together first, and then the lower bridge assembly 300 and the upper bridge assembly 400 can be installed on two different substrate assemblies 200.

[0070] It is understood that the above-described embodiments can improve the connection strength between the substrate assembly 200 and the cooling plate 100, thereby increasing the service life of the power module. In addition, it can also facilitate the installation of the power module.

[0071] It should be noted that the substrate assembly 200 has a first groove and a second groove. The first groove and the second groove are spaced apart along the thickness direction intersecting the cooling plate 100. In the first groove and the second groove, the first groove is used to accommodate the first switch 301 of the lower bridge assembly 300, and the second groove is used to accommodate the first diode 302 of the lower bridge assembly 300. Alternatively, in the first groove and the second groove, the first groove is used to accommodate the second switch 401 of the upper bridge assembly 400, and the second groove is used to accommodate the second diode 402 of the upper bridge assembly 400.

[0072] It is understood that, through the above embodiments, the first and second tanks can support and protect the first switch 301 and the first diode 302, as well as the second switch 401 and the second diode 402, and can also...

[0073] It should be noted that the first switching element 301 can be a first thyristor, i.e., SCR, or a first gate turn-off thyristor, i.e., GTO, or a first insulated gate bipolar transistor, i.e., IGBT. There are no restrictions here, and it can be selected according to the actual application requirements.

[0074] Understandably, the first switching element 301 is used to turn on and off high-power current according to the instructions of the control signal, thereby realizing the conversion and control of electrical energy.

[0075] It should be noted that the first diode 302 can be a first PN junction diode, i.e., PiN Diode, or a first fast recovery diode, i.e., FRD, or a first Schottky barrier diode, i.e., SBD, or a first silicon carbide Schottky diode, i.e., SiC SBD. There are no restrictions here, and it can be selected according to the actual application requirements.

[0076] Understandably, the first diode 302 is used to prevent extremely high voltage spikes from breaking down the first switching element 301 and to ensure that the output voltage is strictly limited within the DC bus voltage range, thereby protecting the power module.

[0077] In one embodiment, the first switching element 301 is a first insulated gate bipolar transistor, and the first diode 302 is a first fast recovery diode.

[0078] It is understandable that the above implementation method can reduce the total switching loss of the power module, increase the switching frequency of the power module, and improve the reliability of the power module.

[0079] It should be noted that the second switching element 401 can be a second thyristor, i.e., SCR, or a second gate turn-off thyristor, i.e., GTO, or a second insulated gate bipolar transistor, i.e., IGBT. There are no restrictions here, and it can be selected according to the actual application requirements.

[0080] Understandably, the second switch 401 is used to turn on and off high-power current according to the instructions of the control signal, thereby realizing the conversion and control of electrical energy.

[0081] It should be noted that the second diode 402 can be a second PN junction diode, i.e., PiN Diode, or a second fast recovery diode, i.e., FRD, or a second Schottky barrier diode, i.e., SBD, or a second silicon carbide Schottky diode, i.e., SiC SBD. There are no restrictions here, and it can be selected according to the actual application requirements.

[0082] Understandably, the second diode 402 is used to prevent extremely high voltage spikes from breaking down the second switch 401 and to ensure that the output voltage is strictly limited within the DC bus voltage range, thereby protecting the power module.

[0083] In one embodiment, the second switching element 401 is a second insulated gate bipolar transistor, and the second diode 402 is a second fast recovery diode.

[0084] It is understandable that the above implementation method can reduce the total switching loss of the power module, increase the switching frequency of the power module, and improve the reliability of the power module.

[0085] The substrate assembly 200 provided in the embodiments of this application includes: an insulating member 201 and a first conductive member 202. The insulating member 201 is disposed on the cooling plate 100, and the first conductive member 202 is disposed on the insulating member 201. Along the thickness direction of the cooling plate 100, the first conductive member 202 is located on the side of the insulating member 201 away from the cooling plate 100. A first groove and a second groove are respectively formed on the insulating member 201. Alternatively, a part of the insulating member 201 and a part of the cooling plate 100 are enclosed to form a first groove, and another part of the insulating member 201 and another part of the cooling plate 100 are enclosed to form a second groove.

[0086] It is understood that, through the above-described embodiments, the insulating component 201 can support and protect the lower bridge assembly 300 and the upper bridge assembly 400, and can also form an electrical isolation between the lower bridge assembly 300 and the upper bridge assembly 400 and the cooling plate 100 to ensure the safety of the power module. By setting the first conductive component 202, a precise circuit pattern can be formed on the upper surface of the first conductive component 202, thereby realizing the electrical connection between the first switch 301 and the first diode 302, the electrical connection between the second switch 401 and the second diode 402, the electrical connection between the first switch 301 and the first gate signal pin 304 and the first emitter signal pin 305, and the electrical connection between the second switch 401 and the second gate signal pin 403 and the second emitter signal pin 404, thereby constructing the required circuit topology, such as half-bridge, full-bridge, three-phase full-bridge, etc.

[0087] It should be noted that the insulating component 201 has a variety of different configuration shapes, and the configuration shapes of the insulating component 201 will be illustrated with examples below.

[0088] In one embodiment, the insulating member 201 has a ring structure, the cooling plate 100 is made of insulating material, a portion of the insulating member 201 and a portion of the cooling plate 100 enclose a first groove, and another portion of the insulating member 201 and another portion of the cooling plate 100 enclose a second groove.

[0089] It is understood that, through the above implementation method, the heat conduction path between the lower bridge assembly 300 and the upper bridge assembly 400 and the cooling plate 100 can be reduced, thereby facilitating heat dissipation of the lower bridge assembly 300 and the upper bridge assembly 400, and also enabling the insulating member 201 to support and protect the lower bridge assembly 300 and the upper bridge assembly 400.

[0090] In one embodiment, the insulating member 201 has a groove-shaped structure, and a first groove and a second groove are respectively formed on the insulating member 201.

[0091] It is understood that, through the above implementation method, the insulating component 201 can bear and protect the lower bridge assembly 300 and the upper bridge assembly 400, and can also form an electrical isolation between the lower bridge assembly 300 and the upper bridge assembly 400 and the cooling plate 100 respectively, so as to ensure the safety of the power module.

[0092] It is understandable that the shape of the insulating component 201 is not limited and can be selected according to actual usage requirements.

[0093] It should be noted that the material of the insulating component 201 can be ceramic or plastic, and there are no restrictions. It can be selected according to the actual use requirements.

[0094] It should be noted that the material of the first conductive component 202 can be aluminum, aluminum alloy, copper, copper alloy, or other highly conductive materials. There are no restrictions here, and it can be selected according to the actual use requirements.

[0095] In one embodiment, the insulating element 201 is ceramic, and the first conductive element 202 is copper, with the copper covering the ceramic surface on the side facing away from the cooling plate 100.

[0096] It is understood that, through the above implementation method, ceramics can protect the lower bridge assembly 300 and the upper bridge assembly 400, and copper can electrically connect the lower bridge assembly 300 and the upper bridge assembly 400.

[0097] The power module provided in the embodiments of this application further includes: an auxiliary conductive component 500, which is disposed on and electrically connected to the first conductive element 202. The auxiliary conductive component 500 is used to electrically connect the first switching element 301 and the first diode 302, and / or, the auxiliary conductive component 500 is used to electrically connect the second switching element 401 and the second diode 402, and / or, the auxiliary conductive component 500 is used to electrically connect two adjacent first conductive elements 202.

[0098] It is understood that, through the above implementation method, the electrical connection between the first switch 301 and the first diode 302, the electrical connection between the second switch 401 and the second diode 402, and the electrical connection between two adjacent first conductive elements 202 can be realized, thereby forming the required circuit topology, such as half-bridge, full-bridge, three-phase full-bridge, etc.

[0099] Furthermore, in one embodiment, the auxiliary conductive component 500 includes a rigid conductive member 501, which is disposed on the first conductive member 202 and electrically connected to the first switching member 301 and the first diode 302. Along the thickness direction of the cooling plate 100, the rigid conductive member 501 is located on the side of the first conductive member 202 away from the insulating member 201.

[0100] It is understandable that by providing the rigid conductive element 501, an electrical connection can be made between the first switch element 301, the first diode 302, and the first conductive element 202.

[0101] It should be noted that the rigid conductive component 501 can be a copper block, a copper alloy block, an aluminum block, or an aluminum alloy block. There are no restrictions here, and it can be selected according to the actual use requirements.

[0102] In one embodiment, the auxiliary conductive component 500 includes a flexible conductive element 502, which is electrically connected to two adjacent first conductive elements 202 and electrically connected to a second switching element 401 and a second diode 402.

[0103] It is understandable that by setting the flexible conductive element 502, an electrical connection can be achieved between two adjacent first conductive elements 202, second switching element 401, and second diode 402.

[0104] It should be noted that the flexible conductive component 502 can be a flexible printed circuit board, a metal foil, or a bonding wire; there are no restrictions, and it can be selected according to actual usage requirements.

[0105] The lower bridge assembly 300 provided in the embodiments of this application includes: a first switch 301, a first diode 302, an AC copper busbar 303, a first gate signal pin 304, and a first emitter signal pin 305. The first switch 301 is disposed in a first groove of the first substrate assembly 200, and the first diode 302 is disposed in a second groove of the first substrate assembly 200. The first diode 302 and the first switch 301 are electrically connected through a rigid conductive member 501. The rigid conductive member 501 forms either a negative electrode or a positive electrode. The AC copper busbar 303 is electrically connected to the first conductive member 202 of the first substrate assembly 200. The first gate signal pin 304 is disposed on a cooling plate 100 and is electrically connected to the first switch 301. The first emitter signal pin 305 is disposed on a cooling plate 100 and is electrically connected to the first switch 301. The rigid conductive member 501 is electrically connected to the first conductive member 202 of the first substrate assembly 200.

[0106] It is understood that, through the above implementation method, the first gate signal pin 304 can receive pulse control signals from the external drive circuit to control the conduction and cutoff of the first switch 301, and the first emitter signal pin 305 can provide a stable reference potential and return path for the power module. By setting the AC copper busbar 303 and the rigid conductive element 501, the power module can be electrically connected to an external load.

[0107] It should be noted that the first gate signal pin 304 and the first switch 301 can be connected by a flexible printed circuit board, metal foil, or bonding wire. There are no restrictions here, and the appropriate method can be selected according to actual usage requirements.

[0108] It should be noted that the first emitter signal pin 305 and the first switch 301 can be connected by a flexible printed circuit board, metal foil, or bonding wire. There are no restrictions here, and the appropriate method can be selected according to actual usage requirements.

[0109] The upper bridge assembly 400 provided in the embodiments of this application includes: a second switch 401, a second diode 402, a second gate signal pin 403, a second emitter signal pin 404, and a lead-out member 405. The second switch 401 is disposed in the first groove of the second substrate assembly 200, the second diode 402 is disposed in the second groove of the second substrate assembly 200, and the second diode 402 and the second switch 401 are electrically connected through a flexible conductive member 502. The second gate signal pin 403 is disposed on the cooling plate 100 and is electrically connected to the second switch 401. The second emitter signal pin 404 is disposed on the cooling plate 100 and is electrically connected to the second switch 401. The lead-out member 405 is electrically connected to the first conductive member 202 of the second substrate assembly 200 and is used to form either a negative electrode or a positive electrode. The flexible conductive member 502 is electrically connected to the first conductive member 202 of the first substrate assembly 200 and the first conductive member 202 of the second substrate assembly 200.

[0110] It is understood that, through the above implementation, the second gate signal pin 403 can receive pulse control signals from the external drive circuit to control the conduction and cutoff of the second switch 401, and the second emitter signal pin 404 can provide a stable reference potential and return path for the power module. By providing the output pin 405, the power module can be electrically connected to an external load.

[0111] It should be noted that the second gate signal pin 403 and the second switch 401 can be connected by a flexible printed circuit board, metal foil, or bonding wire. There are no restrictions here, and the appropriate method can be selected according to actual usage requirements.

[0112] It should be noted that the second emitter signal pin 404 and the second switch 401 can be connected by a flexible printed circuit board, metal foil, or bonding wire. There are no restrictions here, and the appropriate method can be selected according to actual usage requirements.

[0113] It should be noted that the material of the lead-out part 405 can be copper, copper alloy, aluminum, or aluminum alloy. There are no restrictions here, and it can be selected according to the actual use requirements.

[0114] It should be noted that when the rigid conductive element 501 forms the negative electrode, the lead-out element 405 forms the positive electrode, or when the rigid conductive element 501 forms the positive electrode, the lead-out element 405 forms the negative electrode. There is no restriction here, and the selection can be made according to the actual use requirements.

[0115] In one embodiment, the rigid conductive element 501 is a negative copper busbar, and the conductive element 405 is a positive copper busbar.

[0116] It is understood that the above implementation method allows the power module to be connected to an external DC power supply.

[0117] The embodiments of this application provide four substrate assemblies 200, which are arranged in an array along the thickness direction intersecting the cooling plate 100.

[0118] Understandably, by trying the above methods, the power modules can be configured into a full-bridge circuit, thereby improving the flexibility of power module configuration.

[0119] like Figure 3 As shown, the power module provided in the embodiments of this application further includes: a housing 600 and a capacitor 700. The housing 600 covers the cooling plate 100 and has a receiving cavity and an opening communicating with the receiving cavity. The substrate assembly 200 is disposed in the housing 600. The opening is used to accommodate at least one of the following: AC copper busbar 303, rigid conductive member 501, first gate signal pin 304, first emitter signal pin 305, second gate signal pin 403, second emitter signal pin 404, and outlet member 405. The capacitor 700 is disposed on the cooling plate 100. One end of the capacitor 700 is electrically connected to the rigid conductive member 501, and the other end of the capacitor 700 is electrically connected to the outlet member 405.

[0120] Understandably, by providing the housing 600, the baseboard assembly 200 can be protected, and external interference to the power module can be reduced, thereby extending the service life of the power module. By providing the capacitor 700, large pulse currents can be provided or absorbed to maintain the stability of the DC bus voltage on the power module. By providing the opening, the AC copper busbar 303, rigid conductive member 501, first gate signal pin 304, first emitter signal pin 305, second gate signal pin 403, second emitter signal pin 404, and outlet member 405 can be accommodated, so that the power module can be electrically connected to external electrical equipment.

[0121] In one embodiment, the housing 600 includes an outer peripheral wall and a top wall, which intersect each other. The outer peripheral wall is arranged around the outer periphery of the top wall and extends toward the side near the cooling plate 100, connecting with the cooling plate 100. The top wall and the upper surface of the cooling plate 100 are spaced apart along the thickness direction of the cooling plate 100. Furthermore, multiple openings are provided, with some openings located on the outer peripheral wall and others on the top wall. A rigid conductive member 501 passes through the opening in the top wall, while an AC copper busbar 303, a first gate signal pin 304, a first emitter signal pin 305, a second gate signal pin 403, a second emitter signal pin 404, and a guide member 405 pass through the opening in the outer peripheral wall.

[0122] It is understood that the above-described implementation method facilitates the electrical connection between the rigid conductive element 501 and the capacitor 700.

[0123] In one embodiment, capacitor 700 is electrically connected to rigid conductive member 501 via a second conductive member 701, and capacitor 700 is electrically connected to lead member 405 via a third conductive member 702.

[0124] It is understood that, through the above implementation method, the capacitor 700 can be electrically connected to the rigid conductive member 501 and the lead-out member 405 respectively.

[0125] It should be noted that the material of the second conductive component 701 can be aluminum, aluminum alloy, copper, copper alloy, or other highly conductive materials. There are no restrictions here, and it can be selected according to the actual use requirements.

[0126] It should be noted that the material of the third conductive component 702 can be aluminum, aluminum alloy, copper, copper alloy, or other highly conductive materials. There are no restrictions here, and it can be selected according to the actual use requirements.

[0127] This application provides an electrical device, including the power module provided in any of the above embodiments.

[0128] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0129] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0130] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0131] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power module, characterized in that, include: Cooling plate (100); A substrate assembly (200) is disposed on the cooling plate (100). At least two substrate assemblies (200) are provided, and at least two substrate assemblies (200) are spaced apart and symmetrically arranged along the thickness direction intersecting the cooling plate (100). A lower bridge assembly (300) is disposed in one of at least two said substrate assemblies (200); The upper bridge assembly (400) is disposed in another of at least two said substrate assemblies (200) and is electrically connected to the lower bridge assembly (300).

2. The power module according to claim 1, characterized in that, The substrate assembly (200) has a first groove and a second groove, which are spaced apart along the thickness direction intersecting the cooling plate (100). In the first slot and the second slot, the first slot is used to accommodate the first switch (301) of the lower bridge assembly (300), and the second slot is used to accommodate the first diode (302) of the lower bridge assembly (300). Alternatively, in the first and second slots, the first slot is used to accommodate the second switch (401) of the upper bridge assembly (400), and the second slot is used to accommodate the second diode (402) of the upper bridge assembly (400).

3. The power module according to claim 2, characterized in that, The substrate assembly (200) includes: An insulating element (201) is provided on the cooling plate (100); A first conductive element (202) is disposed on the insulating element (201) along the thickness direction of the cooling plate (100), and the first conductive element (202) is located on the side of the insulating element (201) away from the cooling plate (100). The insulating component (201) has the first groove and the second groove respectively. Alternatively, a portion of the insulating element (201) and a portion of the cooling plate (100) may be enclosed to form the first groove, and another portion of the insulating element (201) and another portion of the cooling plate (100) may be enclosed to form the second groove.

4. The power module according to claim 3, characterized in that, Also includes: An auxiliary conductive component (500) is disposed on the first conductive element (202) and electrically connected to the first conductive element (202); The auxiliary conductive component (500) is used to electrically connect the first switch (301) and the first diode (302). And / or, the auxiliary conductive component (500) is used to electrically connect the second switch (401) and the second diode (402). And / or, the auxiliary conductive component (500) is used to electrically connect two adjacent first conductive elements (202).

5. The power module according to claim 4, characterized in that, The auxiliary conductive component (500) includes: A rigid conductive element (501) is disposed on the first conductive element (202) and electrically connected to the first switching element (301) and the first diode (302). Along the thickness direction of the cooling plate (100), the rigid conductive element (501) is located on the side of the first conductive element (202) away from the insulating element (201). And / or, a flexible conductive element (502) is electrically connected to two adjacent first conductive elements (202) respectively, and is electrically connected to the second switch (401) and the second diode (402).

6. The power module according to any one of claims 1-5, characterized in that, The lower bridge assembly (300) includes: The first switch (301) is disposed in the first groove of the first substrate assembly (200); A first diode (302) is disposed in a second groove of the first substrate assembly (200). The first diode (302) and the first switch (301) are electrically connected through a rigid conductive member (501), which forms either a negative electrode or a positive electrode. AC copper busbar (303) is electrically connected to the first conductive element (202) of the first said substrate assembly (200). The first gate signal pin (304) is disposed on the cooling plate (100) and electrically connected to the first switch (301); The first emitter signal pin (305) is disposed on the cooling plate (100) and electrically connected to the first switch (301); The rigid conductive element (501) is electrically connected to the first conductive element (202) of the first substrate assembly (200).

7. The power module according to claim 6, characterized in that, The upper bridge assembly (400) includes: The second switch (401) is disposed in the first groove of the second substrate assembly (200); The second diode (402) is disposed in the second groove of the second substrate assembly (200), and the second diode (402) and the second switch (401) are electrically connected by a flexible conductive element (502). The second gate signal pin (403) is disposed on the cooling plate (100) and is electrically connected to the second switch (401); The second emitter signal pin (404) is disposed on the cooling plate (100) and is electrically connected to the second switch (401); The outlet (405) is electrically connected to the first conductive element (202) of the second substrate assembly (200), and the outlet (405) is used to form the other of the negative electrode or the positive electrode; The flexible conductive element (502) is electrically connected to the first conductive element (202) of the first substrate assembly (200) and the first conductive element (202) of the second substrate assembly (200).

8. The power module according to any one of claims 1-5, characterized in that, Four substrate assemblies (200) are provided, and the four substrate assemblies (200) are arranged in an array along the thickness direction intersecting the cooling plate (100).

9. The power module according to any one of claims 1-5, characterized in that, Also includes: A housing (600) is disposed over the cooling plate (100). The housing (600) has a receiving cavity and an opening communicating with the receiving cavity. The substrate assembly (200) is disposed within the housing (600). The opening is used to receive at least one of the following: AC copper busbar (303), rigid conductive element (501), first gate signal pin (304), first emitter signal pin (305), second gate signal pin (403), second emitter signal pin (404), and outlet element (405). A capacitor (700) is disposed on the cooling plate (100), one end of the capacitor (700) is electrically connected to the rigid conductive member (501), and the other end of the capacitor (700) is electrically connected to the guide member (405).

10. An electrical appliance, characterized in that, The power module includes any one of claims 1-9.

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