A stress-reducing metal frame, rectifier bridge diode

Abstract

A stress-reducing metal frame and rectifier bridge diode are disclosed, relating to the field of semiconductor technology. The frame body of this invention has a chip mounting position; within the chip mounting position are several evenly distributed and fixed protrusions; the area enclosed by the protrusions accounts for more than 80% of the area of ​​the chip mounting position; by covering the chip mounting position with protrusions covering more than 80% of the area, stress is dispersed to multiple contact points, avoiding concentrated stress that could cause chip cracking, while maintaining soldering stability. The rectifier bridge diode chip mounting position has a chip connected to the protrusions; the chip is electrically connected to a second pin via a jumper. Direct connection of the protrusions to the chip, combined with the jumper to the second pin, shortens the current path and reduces conduction losses; the dispersed protrusion structure reduces thermal resistance and improves heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a stress-reducing metal frame and rectifier bridge diode. Background Technology

[0002] The metal frame of a rectifier bridge device (often called the lead frame or heat dissipation frame) is an important component of its packaging structure, primarily serving three functions: electrical connection, mechanical support, and heat dissipation. It is typically made of conductive and thermally conductive materials such as copper or aluminum, and is processed into a specific shape through stamping or etching processes. It is then soldered to the diode chip inside the rectifier bridge, and finally encapsulated using molding compound.

[0003] Semiconductor packaging involves metal frames, which offer advantages such as good electrical and thermal conductivity. However, the different coefficients of thermal expansion between various materials can cause stress, a prevalent issue in semiconductor packaging. This stress, transmitted through the metal frame, can damage the chip and ultimately lead to product failure. Therefore, designing a semiconductor metal frame that reduces stress is a critical technical problem that needs to be addressed in this case. Utility Model Content

[0004] To address the above problems, this utility model provides a stress-reducing metal frame and rectifier bridge diode that reduce stress while maintaining the original metal frame specifications.

[0005] The technical solution of this utility model is: A stress-reducing metal frame, comprising a frame body; The frame body is provided with chip mounting positions; The chip mounting position is provided with several evenly distributed and fixed protrusions. The area enclosed by the aforementioned protrusions accounts for more than 80% of the chip mounting area.

[0006] Specifically, the cross-section of the boss is circular or polygonal.

[0007] Specifically, the diameter of the boss decreases sequentially from bottom to top.

[0008] Specifically, the diameter of the boss is 0.05-0.1mm.

[0009] Specifically, the height of the boss is 30-50 μm.

[0010] Specifically, the distance between adjacent bosses is 0.1~0.2mm.

[0011] Specifically, the outermost protrusions form a rectangular structure.

[0012] A rectifier bridge diode, wherein the chip mounting position is provided with a chip connected to several bosses; The chip is electrically connected to the second pin via a jumper.

[0013] Specifically, the chip mounting position is located at one end of the frame body; The other end of the frame body is the first pin extending from the plastic encapsulation body.

[0014] Specifically, one end of the second pin is located inside the plastic package, and the other end extends out of the plastic package.

[0015] The frame of this utility model has a chip mounting position; within the chip mounting position are several evenly distributed and fixed protrusions; the area enclosed by the protrusions accounts for more than 80% of the area of ​​the chip mounting position; by covering the chip mounting position with protrusions covering more than 80% of the area, stress is distributed to multiple contact points, avoiding concentrated stress that could cause chip cracks, while maintaining soldering stability. The rectifier bridge diode chip mounting position has a chip connected to the protrusions; the chip is electrically connected to a second pin via a jumper. Direct connection of the protrusions to the chip, combined with the jumper to the second pin, shortens the current path and reduces conduction losses; the distributed protrusion structure reduces thermal resistance and improves heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the metal frame structure; Figure 2 This is a top view of the metal frame and the location of the second pin; Figure 3 This is a side view of the metal frame and the location of the second pin; In the diagram, 100 is the frame body, 110 is the chip mounting position, and 111 is the boss. 200 is the second pin. 300 is a plastic encapsulated form. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0018] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," and "horizontal," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The following is for reference. Figure 1-3 Describe this utility model; A stress-reducing metal frame, comprising a frame body 100; The frame body 100 is provided with a chip mounting position 110; The chip mounting position 110 is provided with a plurality of evenly distributed and fixed protrusions 111. In this case, the protrusions are formed by stamping one side and protruding to the other side. The area enclosed by the aforementioned bosses 111 accounts for more than 80% of the area of ​​the chip mounting position 110. This invention uses boss height design and mechanical limiting to control the minimum solder layer thickness and uniformity. The area enclosed by the bosses 111 accounts for 80% to 90% of the area of ​​the chip mounting position 110.

[0021] By covering the chip mounting position 110 with a boss 111 covering more than 80% of the area, stress is distributed to multiple contact points, avoiding concentrated stress that could cause chip cracks, while maintaining soldering stability.

[0022] The cross-section of boss 111 is circular or polygonal.

[0023] When the cross-section is circular, the diameter of the boss 111 decreases from bottom to top, starting from the end closest to the frame body 100.

[0024] The diameter of boss 111 is 0.05-0.1mm.

[0025] The height of boss 111 is 30-50um.

[0026] Circular or polygonal cross sections (such as hexagons) can reduce stress concentration; micro bosses 111 with a diameter of 0.05-0.1 mm and a height of 30-50 μm allow for slight deformation during molding and curing, alleviating stress caused by mismatch in thermal expansion coefficients.

[0027] The distance between adjacent bosses 111 is 0.1~0.2mm.

[0028] The outer perimeter has several protrusions forming a rectangular structure.

[0029] The 0.1~0.2mm spacing between adjacent bosses ensures uniform stress transfer, and the outer rectangular structure enhances the overall rigidity of the frame and prevents warping and deformation.

[0030] The rectifier bridge diode has a chip on the chip mounting position 110 that is connected to several bosses 111. The chip is electrically connected to the second pin 200 via a jumper (not shown in this case).

[0031] The boss 111 is directly connected to the chip and connected to the second pin 200 via a jumper, which shortens the current path and reduces conduction loss; the distributed boss structure reduces thermal resistance and improves heat dissipation efficiency.

[0032] The chip mounting position (110) is located at one end of the frame body 100; The other end of the frame body 100 is a first pin 120 extending from the encapsulation 300.

[0033] One end of the second pin 200 is located inside the encapsulation 300, and the other end extends out from the encapsulation 300.

[0034] Regarding the information disclosed in this case, the following points need to be clarified: (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design. (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments; The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A stress-reducing metal frame, characterized in that, Includes the framework body (100); The frame body (100) is provided with a chip mounting position (110). The chip mounting position (110) is provided with a plurality of evenly distributed and fixed protrusions (111). The area enclosed by several of the aforementioned bosses (111) accounts for more than 80% of the area of ​​the chip mounting position (110).

2. A stress-reducing metal frame according to claim 1, characterized in that, The cross-section of the boss (111) is circular or polygonal.

3. A stress-reducing metal frame according to claim 1, characterized in that, The diameter of the boss (111) decreases from bottom to top.

4. A stress-reducing metal frame according to claim 1, characterized in that, The diameter of the boss (111) is 0.05-0.1mm.

5. A stress-reducing metal frame according to claim 1, characterized in that, The height of the boss (111) is 30-50um.

6. A stress-reducing metal frame according to claim 1, characterized in that, The distance between adjacent bosses (111) is 0.1~0.2mm.

7. A stress-reducing metal frame according to claim 1, characterized in that, The outer perimeter of the aforementioned protrusions (111) forms a rectangular structure.

8. A rectifier bridge diode, comprising a stress-reducing metal frame as described in claim 1, characterized in that, The chip mounting position (110) is provided with a chip that is connected to a plurality of protrusions (111); The chip is electrically connected to the second pin (200) via a jumper.

9. The rectifier bridge diode according to claim 8, characterized in that, The chip mounting position (110) is located at one end of the frame body (100); The other end of the frame body (100) is a first pin (120) extending from the encapsulation body (300).

10. The rectifier bridge diode according to claim 8, characterized in that, One end of the second pin (200) is located inside the encapsulation (300), and the other end extends out from the encapsulation (300).

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