Pressing apparatus

Abstract

The utility model relates to a compression equipment, be applicable to the compression of the integrated circuit element covered with upper cover, and the compression equipment is equipped with: a lower mould device is equipped with the lower mould module that can hold the integrated circuit element, an upper die device is equipped with the upper module that can press the upper cover, the upper die device can be driven and make up and down displacement relative to the lower mould device, the lower mould module and the upper module are constituted with the ceramic material of different hardness, since ceramic material not only low thermal expansion, but also high temperature resistance and have antistatic property, indeed can improve the shortcoming of prior art.

Description

Technical Field

[0001] This utility model relates to a pressing device, and more particularly to a pressing device for pressing integrated circuit components covered with a top cover. Background Technology

[0002] In the packaging process of integrated circuit components, there is often a need for a lower mold device and an upper mold device of a pressing equipment to jointly press an integrated circuit component (IC) covered with a lid. The lower mold device has a lower module that can hold the integrated circuit component, and the upper mold device has an upper module that can press against the lid. The lower module and the upper module can be made of metal materials such as aluminum (Al) or plastic materials such as polyetherimide (PEI). Because the lower module and / or the upper module need to heat the integrated circuit component and / or the lid during the pressing process, the lower module and / or the upper module need to be equipped with multiple heating elements, and the heat generated by the heating elements is conducted to the integrated circuit component and / or the lid through the aluminum or polyetherimide material.

[0003] However, although aluminum has good thermal conductivity, it also has high thermal expansion. Therefore, temperature changes will cause deformation of the lower module and / or the upper module, thus affecting the lamination accuracy. Furthermore, aluminum requires super-hard anodizing and surface treatment to generate an antistatic film. Even a slight scratch on the film will increase the risk of electrostatic breakdown of the integrated circuit component. Although polyetherimide has lower thermal expansion than aluminum, it may soften or melt at temperatures above 200 degrees Celsius. Therefore, at temperatures above 200 degrees Celsius, the lower module and / or the upper module will also deform, affecting the lamination accuracy. It is evident that the existing technology still needs improvement. Utility Model Content

[0004] Therefore, one object of this invention is to provide a pressing device that can overcome at least one disadvantage of the prior art.

[0005] The pressing device disclosed in this utility model is suitable for pressing integrated circuit components covered with a top cover. The pressing device includes: a lower mold device with a lower module for holding the integrated circuit component; an upper mold device with an upper module for pressing the top cover; the upper mold device is driven to move up and down relative to the lower mold device; the lower module and the upper module are made of ceramic materials with different hardness.

[0006] According to another pressing device disclosed in this utility model, it is suitable for pressing integrated circuit components covered with a top cover. The pressing device includes: a lower mold device with a lower module for holding the integrated circuit component; an upper mold device with an upper module for pressing the top cover; the upper mold device is driven to move up and down relative to the lower mold device; the lower module is made of ceramic material.

[0007] According to another pressing device disclosed in this utility model, it is suitable for pressing integrated circuit components covered with a top cover. The pressing device includes: a lower mold device with a lower module for holding the integrated circuit component; an upper mold device with an upper module for pressing the top cover; the upper mold device is driven to move up and down relative to the lower mold device; the upper module is made of ceramic material.

[0008] The pressing device of this utility model uses ceramic material to construct the lower module and the upper module. Ceramic material not only has low thermal expansion, but also high temperature resistance and antistatic properties, which can indeed improve the shortcomings of the prior art. Attached Figure Description

[0009] The shape of this application can be better understood from the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the features are not drawn to scale. In fact, the dimensions of each feature can be arbitrarily increased or decreased for clarity of discussion.

[0010] Figure 1 This is a perspective view of an integrated circuit element covered with a top cover in an embodiment of the present invention.

[0011] Figure 2 This is an incompletely decomposed three-dimensional exploded view of the compound to be compressed in this invention, which is arranged in a plurality of matrices on a carrier disk and transported.

[0012] Figure 3 This is a perspective view of the pressing equipment of this utility model, which includes a lower mold device and an upper mold device.

[0013] Figure 4 This is an incompletely exploded perspective view of the lower mold device of this utility model, which has a plurality of lower modules.

[0014] Figure 5 This is an incompletely exploded perspective view of the upper mold device of this utility model, which has a plurality of upper modules.

[0015] Figure 6 This is a perspective view of the carrier plate containing the compound to be compressed, placed on the lower mold device.

[0016] Explanation of reference numerals in the attached figures: 10: Pressing equipment 1: Lower mold device 11: Next Module 111: Placement surface 112: Opposite side 113: Fixed surface 114: Air Gutter 115: Socket 12: Lower mold base 13: Fixed Group 131: Fastener 131A: Airway 132: Press-fit component TA1: Heating element TS1: Temperature sensing element 2: Upper mold device 21: Upper Module 22: Compression bar 23: Upper mold base TA2: Heating element TS2: Temperature sensing element A: Carrier disk A1: Placement Area A2: Cutout W: Compressible material W1: Integrated circuit components W2: Top cover. Detailed Implementation

[0017] Please see Figure 1 The pressing device of this utility model embodiment is suitable for pressing a composite material W as shown in the figure. The composite material W is an integrated circuit element W1 covered with a top cover W2. In this utility model embodiment, the integrated circuit element W1 is a substrate carrying a chip, and the top cover W2 is a heat sink that can assist in heat dissipation of the chip on the substrate. A thermal interface material (TIM) can be filled between the heat sink and the chip for heat conduction between the integrated circuit element W1 and the top cover W2. The thermal interface material can be, for example, a film, a metal, or a liquid metal. An adhesive can be filled between the heat sink and the substrate for bonding between the integrated circuit element W1 and the top cover W2.

[0018] Please see Figure 2 The compound W to be compressed can be carried in multiples on a carrier plate A and transported thereon; the carrier plate A has multiple placement areas A1 arranged in a matrix and multiple cutouts A2 corresponding to the placement areas A1 respectively, and each placement area A1 is used to place one of the compounds W to be compressed.

[0019] Please see Figure 3 The present invention can be illustrated by taking the pressing device 10 shown in the figure as an example. The pressing device 10 is provided with a lower mold device 1 and an upper mold device 2. The upper mold device 2 can be driven to move up and down relative to the lower mold device 1.

[0020] Please see Figure 2 , 3 4. The lower mold device 1 is provided with a plurality of lower modules 11, a lower mold base 12 for mounting the lower modules 11, and a plurality of fixing groups 13 for fixing the lower modules 11 on the lower mold base 12 respectively; Each of the lower modules 11 is adapted to place one of the compressibles W. Specifically, the lower module 11 is adapted to support the integrated circuit element W1 of the compressible W. Each of the lower modules 11 is block-shaped and is made of ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic. Ceramic material has low thermal expansion, can withstand high temperatures above 1000 degrees Celsius and has antistatic properties. In addition, the thermal conductivity of ceramic material is better than that of plastic material and close to that of metal material.

[0021] Please see Figure 2 , 3 And 4, the size of each of the lower modules 11 is set to be able to pass through the size of each of the cutouts A2 of the carrier plate A; each of the lower modules 11 is embedded with a heating element TA1 for heating, and a temperature sensing element TS1 for sensing the temperature of the lower module 11; Each of the lower modules 11 is provided with a placement surface 111 located on top and adapted to contact the substrate of the integrated circuit element W1, an opposite surface 112 opposite to the placement surface 111, two fixing surfaces 113 located between the placement surface 111 and the opposite surface 112, an air groove 114 formed on the placement surface 111, and an insertion hole 115 communicating with the air groove 114 and extending from the placement surface 111 to the opposite surface 112; The fixing surfaces 113 of each lower module 11 are located on opposite sides of each other placement surface 111, and the fixing surfaces 113 are lower than the working surface 21 in the height direction; the fixing group 13 includes a fixing member 131 and two pressing members 132. The lower module 11 can be fixed to the lower mold base 12 by passing through the insertion hole 115 through the fixing member 131 and pressing against the fixing surface 113 by the pressing members 132; the air groove 114 can introduce negative pressure, and the fixing member 131 is provided with an air passage 131A communicating with the air groove 114.

[0022] Please see Figure 2 and 5 The upper mold device 2 is provided with a plurality of upper modules 21, a plurality of pressure rods 22, and an upper mold base 23 for mounting the pressure rods 22; Each upper module 21 is correspondingly disposed at the bottom of each pressure rod 22 and is adapted to press against the object to be pressed W. Specifically, the upper module 21 is adapted to press against the upper cover W2 of the object to be pressed W. Each upper module 21 is block-shaped and is made of ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic. Ceramic material not only has low thermal expansion, but can withstand high temperatures above 1000 degrees Celsius and has antistatic properties. In addition, the thermal conductivity of ceramic material is better than that of plastic material and close to that of metal material. The size of the upper module 21 corresponds to the size of the upper cover W2; each upper module 21 is embedded with a heating element TA2 for heating and a temperature sensing element TS2 for sensing the temperature of the upper module 21.

[0023] In this embodiment of the present invention, the lower module 11 and the corresponding upper module 21 have different hardnesses. For example, the lower module 11 is made of relatively soft alumina (Al2O3) ceramic, while the upper module 21 is made of relatively hard silicon carbide (SiC) ceramic. However, this is not a limitation. The lower module 11 can also be made of relatively hard silicon carbide (SiC) ceramic, and the upper module 21 can also be made of relatively soft alumina (Al2O3) ceramic. The purpose of pressing the material W with the lower module 11 and the upper module 21 of different hardnesses is to provide appropriate buffering to reduce the cracking of the material W or to reduce the horizontal displacement of the upper cover W2 and the integrated circuit element W1.

[0024] Please see Figure 6 The compound W to be pressed can be carried on the carrier A and transported between the lower mold device 1 and the upper mold device 2, and the carrier A carrying the compound W to be pressed is transported to the lower mold device 1, so that the carrier A is placed on the lower mold base 12 and each of the lower modules 11 passes through each of the cutouts A2 of the carrier A to support the integrated circuit element W1 of the compound W to be pressed.

[0025] In the implementation of this utility model, after the lower module 11 supports the integrated circuit element W1 of the compound to be pressed W, the upper mold device 2 is driven to move downward relative to the lower mold device 1, so that the upper module 21 presses against the upper cover W2 of the compound to be pressed W. Next, each of the pressure rods 22 is driven to move downward relative to the upper mold base 23, so as to cause each of the upper modules 21 to apply a force to press the upper cover W2 against the integrated circuit element W1, or the lower mold device 1 is driven to move upward relative to the upper mold device 2 to apply a force to press the integrated circuit element W1 against the upper cover W2.

[0026] The pressing device of this utility model embodiment uses ceramic material to construct the lower module 11 and the upper module 21. Ceramic material not only has low thermal expansion, but also high temperature resistance and antistatic properties, which can indeed improve the shortcomings of the prior art.

[0027] In other embodiments of this utility model, the ceramic material may be used only in either the lower module 11 or the upper module 21; For example, when the compressible W is filled with a film or liquid metal, since the compressible W mainly needs to be heated and cured by the lower module 11, the lower module 11 is still made of ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic, but the upper module 21 can be replaced by metal material such as aluminum (Al) or plastic material such as polyetherimide (PEI); For example, when the compound W is filled with a metal thermal interface material, since the metal thermal interface material mainly needs to be heated and melted by the upper module 21, the upper module 21 is still made of ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic, but the lower module 11 can be replaced by a metal material such as aluminum (Al) or a plastic material such as polyetherimide (PEI).

[0028] However, the above description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the present utility model. Any simple equivalent changes and modifications made based on the scope of the present utility model patent application and the description of the utility model shall still fall within the scope of the present utility model patent.

Claims

1. A pressing apparatus suitable for pressing integrated circuit components covered with a top cover, the pressing apparatus comprising: A lower mold device is provided with a lower module for holding the integrated circuit element; An upper mold device is provided with an upper module that presses against the upper cover; the upper mold device is driven to move up and down relative to the lower mold device. Its features are, The lower module and the upper module are made of ceramic materials with different hardness.

2. The pressing equipment as described in claim 1, characterized in that, The lower module is made of alumina ceramic, and the upper module is made of silicon carbide ceramic.

3. The pressing equipment as described in claim 1, characterized in that, The lower module is made of silicon carbide ceramic, and the upper module is made of alumina ceramic.

4. The pressing equipment as described in claim 1, characterized in that, The lower module is equipped with a heating element for heating and a temperature sensing element for sensing the temperature of the lower module.

5. The pressing equipment as described in claim 1, characterized in that, The upper module is equipped with a heating element for heating and a temperature sensing element for sensing the temperature of the upper module.

6. A pressing apparatus suitable for pressing integrated circuit components covered with a top cover, the pressing apparatus comprising: A lower mold device is provided with a lower module for holding the integrated circuit element; An upper mold device is provided with an upper module that presses against the upper cover; the upper mold device is driven to move up and down relative to the lower mold device. Its features are, The lower module is made of ceramic material.

7. The pressing equipment as described in claim 6, characterized in that, The lower module is made of silicon carbide ceramic or alumina ceramic.

8. The pressing equipment as described in claim 7, characterized in that, The upper module is made of metal or plastic.

9. A pressing apparatus suitable for pressing integrated circuit components covered with a top cover, the pressing apparatus comprising: A lower mold device is provided with a lower module for holding the integrated circuit element; An upper mold device is provided with an upper module that presses against the upper cover; the upper mold device is driven to move up and down relative to the lower mold device. Its features are, The upper module is made of ceramic material.

10. The pressing equipment as described in claim 9, characterized in that, The upper module is made of silicon carbide ceramic or alumina ceramic.

11. The pressing equipment as described in claim 10, characterized in that, The lower module is made of metal or plastic.

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