Bottom fill process high efficiency substrate carrier

Abstract

The utility model discloses a kind of bottom filling process high-efficiency substrate carriers, comprising: carrier body, the carrier body is equipped with placement area at interval;A group of glue guide areas are equipped at interval in the placement area, positioning mechanism is equipped with in the side of glue guide area, the both sides of the placement area are equipped with tablet, the end of positioning mechanism is pressed by tablet, and the upper portion of glue guide area is equipped with glue guide clamping piece.The utility model discloses a kind of bottom filling process high-efficiency substrate carriers, by optimizing the structure of carrier, the setting of positioning mechanism, product is well positioned, ensure the stability and accurate positioning of substrate on carrier;The setting of tablet, the both ends of positioning mechanism can be pressed from top, prevent its movement, further improve its processing stability, make it better satisfy the needs of processing.

Description

Technical Field

[0001] This utility model belongs to the field of electronic manufacturing auxiliary equipment technology, and specifically relates to a high-efficiency substrate carrier for bottom filling process. Background Technology

[0002] In current underfill processes, traditional substrate carriers suffer from poor positioning accuracy due to positioning issues. Even when some carriers incorporate positioning mechanisms, their positions are fixed and cannot be adjusted, making them unsuitable for various substrate sizes. This increases manufacturers' carrier production costs. Furthermore, many current carriers operate at a single station, resulting in low processing efficiency. Additionally, their flawed structural design hinders the uniform distribution of filler material. Therefore, existing carriers require further improvement. Utility Model Content

[0003] Purpose of the utility model: In order to overcome the above shortcomings, the purpose of this utility model is to provide a high-efficiency substrate carrier for bottom filling process. By optimizing the structure of the carrier and setting the positioning mechanism, the product is well positioned to ensure the stability and accurate positioning of the substrate on the carrier. At the same time, the setting of the pressing plate can press down the two ends of the positioning mechanism from above to prevent it from moving, further improving the stability of its processing.

[0004] Technical solution: In order to achieve the above objectives, the present invention provides a high-efficiency substrate carrier for bottom filling process, comprising: a carrier body, wherein placement areas are provided at intervals on the carrier body; A set of adhesive guiding areas is provided at intervals in the placement area. A positioning mechanism is provided on one side of the adhesive guiding area. Pressure plates are provided on both sides of the placement area. The pressure plates press the ends of the positioning mechanism. An adhesive guiding clamp is provided above the adhesive guiding area.

[0005] The present invention discloses a high-efficiency substrate carrier for bottom filling process. By optimizing the structure of the carrier and setting the positioning mechanism, the product is well positioned, ensuring the stability and precise positioning of the substrate on the carrier. At the same time, the setting of the pressing plate can press down the two ends of the positioning mechanism from above to prevent it from moving, further improving the processing stability and allowing it to better meet the processing needs.

[0006] The carrier body is provided with a set of first grooves, the end of the positioning mechanism extends into the first grooves, and the pressure plate is disposed in the first grooves and presses down on the end of the positioning mechanism. The setting of the first grooves further optimizes the structure of the carrier, facilitates the installation of the pressure plate, and allows it to better meet the limiting requirements at both ends of the positioning mechanism.

[0007] Furthermore, a second groove is provided on one side of the adhesive guiding area on the carrier body, the positioning mechanism is located in the second groove, and a first adhesive guiding groove is provided on the side of the adhesive guiding area away from the positioning mechanism on the carrier body.

[0008] Preferably, the positioning mechanism has a second adhesive guiding groove on the side near the adhesive guiding area. Further optimization of the carrier structure makes it more compact and rational.

[0009] Preferably, a limiting protrusion is provided on the side of the second groove away from the adhesive guiding area, and the surface of the limiting protrusion is a sloped surface.

[0010] Furthermore, the positioning mechanism includes a spring clip and a spring. The spring clip has a set of mounting holes on the side away from the adhesive guiding area. One end of the spring is located in the mounting hole, and the other end abuts against the side wall of the second groove. The spring's design provides a certain degree of self-adaptability, allowing it to meet the processing needs of different types of products.

[0011] Furthermore, a push block is provided on the upper part of the side of the spring clip away from the adhesive guiding area, and a slanted hook groove is provided on the lower part of the side of the push block away from the spring clip. The limiting protrusion is located in the slanted hook groove, and the lower end surface of the outer wall of the slanted hook groove is slanted, which cooperates with the sloping surface on the limiting protrusion. The cooperation between the limiting protrusion and the push block structure prevents slippage, and at the same time enables quick loading and unloading, greatly shortening the substrate loading and unloading time and significantly improving production efficiency.

[0012] Preferably, the vehicle body is made of aluminum alloy, which effectively prevents deformation, has a long service life, and is easy to manufacture.

[0013] As can be seen from the above technical solution, this utility model has the following beneficial effects: 1. The high-efficiency substrate carrier for bottom filling process described in this utility model optimizes the carrier structure and sets up a positioning mechanism to accurately position the product, ensuring the stability and precise positioning of the substrate on the carrier. At the same time, the setting of the pressure plate can press down both ends of the positioning mechanism from above to prevent its movement, further improving the stability of the processing. The positioning accuracy error can be controlled within ±0.1mm, the substrate size adaptation range is increased to 3 times the original, and the production efficiency is increased by about 40% compared with traditional carriers, which fully proves the reliability and practicality of its technical solution.

[0014] 2. The spring in the positioning mechanism provides a certain degree of self-adaptability, enabling it to meet the processing needs of different types of products and reduce the cost of carriers for enterprises. Furthermore, the positioning mechanism and the adhesive guide clip are easy to operate and allow for quick loading and unloading. The silicone material on its surface can improve its tightness with the substrate, prevent adhesive leakage during the underfill process, and improve capillary action.

[0015] 3. In this utility model, the optimization of the structure on the carrier body facilitates the flow of filling material; and the multi-station setting can greatly improve the production efficiency of the product, offsetting the disadvantage of slow capillary filling of the glue.

[0016] 4. The carrier described in this utility model also shows great potential in reducing production costs and improving product yield. Its modular design facilitates later maintenance and upgrades, providing strong support for enterprises to continuously optimize production processes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the high-efficiency substrate carrier for the bottom filling process described in this utility model; Figure 2 This is a schematic diagram of the structure of the vehicle body in this utility model; Figure 3 This is a structural schematic diagram of the spring installation in this utility model; Figure 4 This is a schematic diagram of the spring clip structure in this utility model; Figure 5 A partial perspective view of the positioning mechanism installation in this utility model; Figure 6 This is a partial perspective view of the positioning mechanism and the tablet assembly in this utility model; In the figure: 1. Carrier body, 2. Pressure plate, 3. Adhesive guiding area, 4. Positioning mechanism, 11. First groove, 12. Second groove, 121. Limiting protrusion, 31. Through hole, 41. Spring clip, 42. Spring, 43. Push block, 431. 431. Adhesive guiding clip, 5. Detailed Implementation

[0018] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments.

[0019] Example 1 like Figures 1 to 4 The high-efficiency substrate carrier for underfilling process shown includes: a carrier body 1, wherein placement areas are spaced apart on the carrier body 1; A set of adhesive guiding areas 3 are provided at intervals in the placement area. A positioning mechanism 4 is provided on one side of the adhesive guiding area 3. Pressure plates 2 are provided on both sides of the placement area. The pressure plates 2 press the end of the positioning mechanism 4, and an adhesive guiding clamp 5 is provided above the adhesive guiding area 3.

[0020] As shown in the figure, the carrier body 1 is provided with a set of first grooves 11, the end of the positioning mechanism 4 extends into the first groove 11, and the pressure plate 2 is provided in the first groove 11 and presses the end of the positioning mechanism 4.

[0021] The carrier body 1 has a second groove 12 on one side of the adhesive guiding area 3, the positioning mechanism 4 is located at the second groove 12, and the carrier body 1 has a first adhesive guiding groove 301 on the side of the adhesive guiding area 3 away from the positioning mechanism 4.

[0022] like Figure 4 The positioning mechanism 4 shown has a second adhesive guide groove 401 on the side near the adhesive guide area 3.

[0023] like Figure 2 The vehicle body 1 shown has a perforation 31 located in the adhesive guiding area 3.

[0024] like Figure 2 and Figure 4 The second groove 12 shown is provided with a limiting protrusion 121 on the side away from the adhesive guiding area 3, and the surface of the limiting protrusion 121 is a sloping surface.

[0025] like Figure 1 and Figure 4 The positioning mechanism 4 shown includes a spring clip 41 and a spring 42. The spring clip 41 has a set of mounting holes on the side away from the adhesive guiding area 3. One end of the spring 42 is located in the mounting hole, and the other end abuts against the side wall of the second groove 12.

[0026] like Figure 3 The spring clip 41 shown has a push block 43 on its upper part on the side away from the adhesive guiding area 3. The push block 43 has a slanted hook groove 431 on its lower part on the side away from the spring clip 41. The limiting protrusion 121 is located within the slanted hook groove 431, and the lower end face of the outer wall of the slanted hook groove 431 is slanted, which cooperates with the sloping surface on the limiting protrusion 121. The cooperation between the limiting protrusion and the push block structure prevents slippage and enables rapid loading and unloading, greatly shortening the substrate loading and unloading time and significantly improving production efficiency.

[0027] The vehicle body 1 is made of aluminum alloy, which effectively prevents deformation, has a long service life, and is easy to manufacture.

[0028] The working principle of the high-efficiency substrate carrier for bottom filling process described in this embodiment is as follows: First, check if the positioning mechanism 4 on the carrier is at the origin. The bottom inclined hook groove 431 cooperates with the limiting protrusion to fix it at the origin, which is convenient for loading. After loading, lift the spring clip 41 and push it forward so that it fits tightly with the product. Place the carrier on the dispensing platform (not shown in the existing equipment diagram), set the dispensing program, and inject the glue into the first and second glue guide grooves in each station of the carrier in sequence. According to the product size, adjust the amount of glue dispensed each time by dispensing air pressure, speed, needle diameter, and single dispensing interval to achieve the best filling effect. After dispensing, remove the tool, pull the spring clip 41 back to the original position, and then remove the product.

[0029] This carrier also demonstrates significant potential in reducing production costs and improving product yield. Its modular design facilitates future maintenance and upgrades, providing strong support for enterprises to continuously optimize production processes. In the future, as the electronics manufacturing industry moves towards greater precision and efficiency, this substrate carrier can further optimize material performance and integrate intelligent technologies. For example, by introducing intelligent sensors to monitor substrate status in real time, or by using new composite materials to enhance carrier durability, it can continuously meet the industry's ever-evolving production needs, helping the electronics manufacturing industry reach new heights. Simultaneously, the widespread application of this substrate carrier is expected to promote collaborative innovation across the upstream and downstream supply chains, drive the research and development of related supporting technologies and equipment, form a more complete electronics manufacturing process ecosystem, and inject new momentum into the industry's development.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements can be made without departing from the principle of the present utility model, and these improvements should also be considered within the protection scope of the present utility model.

Claims

1. A high throughput substrate carrier for a bottom fill process, comprising: include: The vehicle body (1) has placement areas spaced apart on it; A set of adhesive guiding areas (3) are provided at intervals in the placement area. A positioning mechanism (4) is provided on one side of the adhesive guiding area (3). Pressure plates (2) are provided on both sides of the placement area. The pressure plates (2) press the end of the positioning mechanism (4). Adhesive guiding clips (5) are provided above the adhesive guiding area (3).

2. The process high efficiency substrate carrier of claim 1, wherein: The vehicle body (1) is provided with a set of first grooves, the end of the positioning mechanism (4) extends into the first groove (11), and the pressure plate (2) is provided in the first groove (11) and presses the end of the positioning mechanism (4).

3. The process efficient substrate carrier for a bottom fill process of claim 1, wherein: The carrier body (1) has a second groove (12) on one side of the adhesive guiding area (3), the positioning mechanism (4) is located in the second groove (12), and the carrier body (1) has a first adhesive guiding groove (301) on the side of the adhesive guiding area (3) away from the positioning mechanism (4).

4. The process high efficiency substrate carrier of claim 3, wherein: The positioning mechanism (4) is provided with a second adhesive guide groove (401) on the side near the adhesive guide area (3).

5. The process high efficiency substrate carrier of claim 4, wherein: The second groove (12) has a limiting protrusion (121) on the side away from the adhesive guiding area (3), and the surface of the limiting protrusion (121) is a slope surface.

6. The process high efficiency substrate carrier of claim 5, wherein: The positioning mechanism (4) includes a spring clip (41) and a spring (42). The spring clip (41) has a set of mounting holes on the side away from the adhesive guiding area (3). One end of the spring (42) is located in the mounting hole, and the other end abuts against the side wall of the second groove (12). The second adhesive guiding groove (401) is located on the spring clip (41).

7. The process high efficiency substrate carrier of claim 6, wherein: The upper part of the side of the spring clip (41) away from the adhesive guide area (3) is provided with a push block (43), and the lower part of the side of the push block (43) away from the spring clip (41) is provided with a slanted hook groove (431). The limiting protrusion (121) is located in the slanted hook groove (431), and the lower end surface of the outer wall of the slanted hook groove (431) is set as a slope, which cooperates with the slope surface on the limiting protrusion (121).

8. The process high efficiency substrate carrier of claim 1, wherein: The vehicle body (1) is made of aluminum alloy.

Images