Wafer ultrasonic cleaning machine with self-cleaning function

Abstract

The utility model relates to wafer cleaning equipment field especially, relates to a kind of wafer ultrasonic cleaning machine with self-cleaning function, including ultrasonic box and transmission belt, motor is installed on the outside of ultrasonic box, two reciprocating screw rods are rotatably connected in ultrasonic box, reciprocating screw rod end portion passes through ultrasonic box side wall and is connected synchronously by transmission belt, one reciprocating screw rod end portion is connected with the output shaft of motor, slidingly connected with moving plate in ultrasonic box, moving plate both ends are all with reciprocating screw rod screw connection, cleaning brush is slidingly connected in moving plate bottom, cleaning brush is contacted with the bottom surface in ultrasonic box, wave component for pushing cleaning brush sliding is set in ultrasonic box. By the cooperation of wave plate and sliding rod, spring set in ultrasonic box, cleaning brush is slid along wave plate surface in transverse moving process, forms reciprocating motion, to reduce the amount of stain deposited in bottom when draining, make stain all drain in drainage stage, reach the purpose of automatic cleaning.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning equipment, and in particular to a wafer ultrasonic cleaner with self-cleaning function. Background Technology

[0002] As a core component of the semiconductor industry, the surface cleanliness of wafers directly affects device performance and reliability. In the field of microelectronics manufacturing, micron-sized particles, organic contaminants, and metal ions inevitably adhere to wafers during processing, which traditional cleaning methods struggle to remove completely. Ultrasonic cleaning technology, leveraging the cavitation effect generated by high-frequency vibrations, can efficiently remove minute contaminants from wafer surfaces and has become one of the key processes in semiconductor cleaning.

[0003] Existing ultrasonic cleaning equipment for wafers mainly converts electrical energy into high-frequency mechanical vibrations, typically 20-100kHz, through transducers. These vibrations create microjets and shock waves in the cleaning fluid, causing contaminants to separate from the wafer surface. During operation, the cleaning fluid circulates under the influence of ultrasound, carrying the dislodged contaminants away from the wafer surface.

[0004] However, during operation, the time spent picking up and placing the wafers allows suspended contaminants to naturally settle to the bottom of the equipment. When the water outlet valve is opened during the drainage stage, the contaminants deposited at the bottom are difficult to be discharged all at once. As a result, existing processes often require additional pure water rinsing or even manual wiping steps, which reduces production efficiency. Utility Model Content

[0005] To overcome the drawbacks of stain buildup and manual cleaning, this invention provides a chip ultrasonic cleaner with a self-cleaning function, aiming to solve the aforementioned shortcomings.

[0006] An ultrasonic cleaner for wafers with self-cleaning function includes an ultrasonic chamber and a transmission belt. A motor is installed on the outside of the ultrasonic chamber. Two reciprocating lead screws are rotatably connected inside the ultrasonic chamber. The ends of the reciprocating lead screws pass through the side wall of the ultrasonic chamber and are synchronously connected through the transmission belt. One end of the reciprocating lead screw is connected to the output shaft of the motor. A movable plate is slidably connected inside the ultrasonic chamber. Both ends of the movable plate are threaded to the reciprocating lead screws. A cleaning brush is slidably connected to the bottom of the movable plate. The cleaning brush contacts the bottom surface of the ultrasonic chamber. A undulating component for pushing the cleaning brush to slide is provided inside the ultrasonic chamber.

[0007] To further explain, the wave assembly includes a wave plate, a fixed block connected to the bottom of the movable plate, a sliding rod connected to the end of the cleaning brush, the sliding rod being slidably connected within the fixed block, the wave plate being connected inside the ultrasonic chamber, the end of the sliding rod being slidably connected to the wave plate, and a spring being sleeved on the sliding rod, one end of the spring being connected to the fixed block and the other end being connected to the cleaning brush.

[0008] To further explain, a cleaning rake is connected to the bottom of the ultrasonic chamber, and the cleaning rake is in frictional engagement with the cleaning brush.

[0009] To further explain, a scale bar is embedded inside the ultrasonic chamber.

[0010] To further explain, an isolation plate is slidably connected to the bottom of the ultrasonic chamber, and the isolation plate is located above the movable plate.

[0011] To further explain, the bottom of the ultrasonic chamber is equipped with several casters.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. Through the cooperation of the wave plate, sliding rod, and spring installed inside the ultrasonic chamber, the cleaning brush slides along the surface of the wave plate during the lateral movement, forming a back-and-forth reciprocating motion. This reduces the amount of dirt deposited at the bottom during drainage, allowing all dirt to be discharged during the drainage stage, thus achieving the purpose of automatic cleaning.

[0014] 2. Through the frictional cooperation between the rigid sweeping rake and the flexible cleaning brush, when the moving plate drives the cleaning brush to the left limit position, the elastic deformation of the bristles automatically removes the dust attached to it, ensuring the cleaning effect of the cleaning brush and extending the effective time of self-cleaning. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a cross-sectional view of the overall structure of this utility model.

[0017] Figure 3 This is a schematic diagram showing the connection relationship between the sliding rod, spring, and wave plate of this utility model.

[0018] The markings in the attached diagram are as follows: 1: Ultrasonic chamber, 2: Motor, 3: Drive belt, 4: Reciprocating screw, 5: Moving plate, 6: Cleaning brush, 601: Fixed block, 7: Sliding rod, 8: Spring, 9: Wave plate, 10: Sweeping rake, 11: Scale bar, 12: Isolation plate, 13: Caster wheel. Detailed Implementation

[0019] The present invention will now be described more fully below with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. However, the present invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and to fully convey the scope of the invention to those skilled in the art.

[0020] Example: A wafer ultrasonic cleaner with self-cleaning function, such as... Figures 1-3 As shown, the ultrasonic chamber includes an ultrasonic housing 1, a motor 2, a transmission belt 3, a reciprocating lead screw 4, a moving plate 5, a cleaning brush 6, and a wave assembly. The motor 2 is installed on the outer right side of the ultrasonic housing 1. Two reciprocating lead screws 4 are rotatably connected inside the ultrasonic housing 1. The transmission belt 3 is a toothed belt to prevent sliding friction during transmission. The right end of the reciprocating lead screw 4 passes through the side wall of the ultrasonic housing 1 and is synchronously connected through the transmission belt 3. The toothed transmission belt 3 ensures that the two reciprocating lead screws 4 rotate at the same speed. The end of one of the reciprocating lead screws 4 is connected to the output shaft of the motor 2. The moving plate 5 is slidably connected inside the ultrasonic housing 1. Both ends of the moving plate 5 are threadedly connected to the reciprocating lead screw 4. The cleaning brush 6 is slidably connected to the bottom of the moving plate 5 in the front-back direction. The cleaning brush 6 contacts the bottom surface inside the ultrasonic housing 1. A wave assembly for pushing the cleaning brush 6 to slide is provided inside the ultrasonic housing 1.

[0021] like Figure 2 and Figure 3 As shown, the oscillating component includes a fixed block 601, a sliding rod 7, a spring 8, and a wave plate 9. The fixed block 601 is connected to the bottom front end of the moving plate 5, and the sliding rod 7 is connected to the end of the cleaning brush 6. The sliding rod 7 is slidably connected inside the fixed block 601. The wave plate 9 is connected inside the ultrasonic chamber 1. The end of the sliding rod 7 is slidably connected to the rear side of the wave plate 9. The cleaning brush 6 generates a back-and-forth reciprocating motion during the lateral movement, forming a compound oscillating trajectory, which enhances the ability to peel off stubborn stains. The sliding rod 7 is fitted with a spring 8. One end of the spring 8 is connected to the fixed block 601, and the other end is connected to the cleaning brush 6.

[0022] like Figure 2 As shown, it also includes a cleaning rake 10. The cleaning rake 10 is connected to the bottom left end of the ultrasonic housing 1. The cleaning rake 10 and the cleaning brush 6 are in frictional cooperation. The rigid cleaning rake 10 will not undergo elastic deformation. The flexible cleaning brush 6 bends when passing through the cleaning rake 10. Through physical contact, the cleaning brush 6 is forced to bend and spring back, automatically removing the dust attached between the bristles.

[0023] like Figure 2 As shown, it also includes a scale bar 11. A vertically set scale bar 11 is embedded in the ultrasonic chamber 1. The scale bar 11 displays the correspondence between the basic water volume and the cleaning quantity or volume, so as to avoid the ultrasonic energy being dispersed due to excessive water volume or affected by insufficient water volume, which would affect the cleaning effect.

[0024] like Figure 1 and Figure 2As shown, it also includes an isolation plate 12. The isolation plate 12 is slidably connected to the bottom of the ultrasonic chamber 1. The isolation plate 12 is located above the moving plate 5. The isolation plate 12 consists of a frame and a filter screen in the middle. There are perforated mounting blocks connected to the corners inside the ultrasonic chamber 1. The frame of the isolation plate 12 is designed with round rods that can be inserted into the mounting blocks to form a detachable structure, which makes it easy to remove the isolation plate 12 periodically to rinse or wipe the particles remaining on the surface of the filter screen, and prevent the filter screen from clogging and affecting the cleaning efficiency.

[0025] like Figure 1 and Figure 2 As shown, it also includes casters 13. Several casters 13 are installed at the bottom of the ultrasonic housing 1. In the unlocked state, the device can be flexibly moved to different working positions to adapt to the needs of multiple scenarios.

[0026] The staff first pushes the isolation plate 12 into the bottom of the ultrasonic chamber 1, and positions it by cooperating with the frame rod and the perforated mounting block. Based on the number or volume of the wafers to be cleaned, the staff observes the scale strip 11 embedded in the inner wall of the ultrasonic chamber 1 to determine the water volume, and fills the chamber with clean water up to the corresponding mark. The wafer is then placed vertically into the ultrasonic chamber 1, and it naturally falls above the filter screen of the isolation plate 12. The filter screen's pores allow the cleaning fluid to pass through but prevent the wafer from falling. The ultrasonic wave generator module of the ultrasonic chamber 1 is activated; the high-frequency vibration causes the cleaning fluid to generate a cavitation effect, peeling away dirt from the wafer surface. Simultaneously, the liquid level inside the chamber fluctuates slightly due to the vibration.

[0027] After ultrasonic cleaning, close the ultrasonic chamber 1 and remove the wafer vertically to avoid secondary adhesion of stains due to tilting. Start the motor 2, whose output shaft synchronously drives two reciprocating screws 4 to rotate via the transmission belt 3. The reciprocating screws 4 drive the moving plate 5 to move laterally along the inner wall of the ultrasonic chamber 1. The cleaning brush 6, which is slidably connected to the bottom of the moving plate 5, moves laterally accordingly. At the same time, the sliding rod 7 at the end of the cleaning brush 6 slides along the wavy surface of the corrugated plate 9. After the spring 8 is stretched, it immediately pulls the cleaning brush 6 back to its original position, pushing the cleaning brush 6 to reciprocate back and forth at the bottom of the moving plate 5, forming a bidirectional compound oscillating trajectory. The reciprocating screws 4 cause the moving plate 5 to slide continuously left and right.

[0028] When the moving plate 5 reaches its leftmost extreme position, the cleaning brush 6 comes into contact with the rigid sweeping rake 10. The flexible cleaning brush 6 is bent and deformed by the sweeping rake 10, and then shakes off the dust adhering to the bristles during its rebound. The shaken-off dust is carried to the bottom by the residual liquid flow in the tank. At this time, the water outlet valve is opened, and the sediment is discharged from the tank during the drainage process. After the water outlet valve is closed, clean water is refilled, and the next cleaning cycle begins.

[0029] During regular cleaning, staff slide out the isolation plate 12 to rinse or wipe away any residual particles on the filter surface. When moving the equipment, unlock the casters 13 at the bottom of the ultrasonic chamber 1 and push the chamber to the target position. Before cleaning, lock the casters 13 to prevent the equipment from sliding and affecting operational stability.

[0030] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation in order to cover all variations and equivalent structures and functions.

Claims

1. A wafer ultrasonic cleaner with self-cleaning function, characterized in that: The device includes an ultrasonic housing (1) and a transmission belt (3). A motor (2) is installed on the outside of the ultrasonic housing (1). Two reciprocating screws (4) are rotatably connected inside the ultrasonic housing (1). The ends of the reciprocating screws (4) pass through the side wall of the ultrasonic housing (1) and are synchronously connected through the transmission belt (3). One end of the reciprocating screw (4) is connected to the output shaft of the motor (2). A moving plate (5) is slidably connected inside the ultrasonic housing (1). Both ends of the moving plate (5) are threaded to the reciprocating screws (4). A cleaning brush (6) is slidably connected to the bottom of the moving plate (5). The cleaning brush (6) contacts the bottom surface inside the ultrasonic housing (1). A undulating component for pushing the cleaning brush (6) to slide is provided inside the ultrasonic housing (1).

2. A wafer ultrasonic cleaner with self-cleaning function according to claim 1, characterized in that: The wave assembly includes a wave plate (9), a fixed block (601) is connected to the bottom of the movable plate (5), a sliding rod (7) is connected to the end of the cleaning brush (6), the sliding rod (7) is slidably connected inside the fixed block (601), the wave plate (9) is connected inside the ultrasonic chamber (1), the end of the sliding rod (7) is slidably connected to the wave plate (9), and a spring (8) is sleeved on the sliding rod (7). One end of the spring (8) is connected to the fixed block (601), and the other end is connected to the cleaning brush (6).

3. A wafer ultrasonic cleaner with self-cleaning function according to claim 2, characterized in that: The bottom of the ultrasonic chamber (1) is connected to a cleaning rake (10), and the cleaning rake (10) is in frictional engagement with the cleaning brush (6).

4. The wafer ultrasonic cleaning machine with self-cleaning function according to claim 3, characterized in that: The ultrasonic chamber (1) has a scale strip (11) embedded inside.

5. A wafer ultrasonic cleaner with self-cleaning function according to claim 4, characterized in that: An isolation plate (12) is slidably connected to the bottom of the ultrasonic chamber (1), and the isolation plate (12) is located above the movable plate (5).

6. A wafer ultrasonic cleaner with self-cleaning function according to claim 5, characterized in that: The bottom of the ultrasonic enclosure (1) is equipped with several casters (13).

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