An ultrasonic-assisted device for additive manufacturing in machining centers

Abstract

This utility model relates to the field of additive manufacturing technology, specifically to an ultrasonic auxiliary device for additive manufacturing in a machining center. It includes an ultrasonic pre-tightening assembly and a chip removal assembly. The ultrasonic pre-tightening assembly comprises a body, a powder bed storage frame, a base plate, side plates, a threaded rod, a fixing block, bolts, and a first vibrator. In this ultrasonic auxiliary device for additive manufacturing in a machining center, the powder bed storage frame, fixed to the body, stores the powder bed. The base plate is connected to the side plates, and rotating the threaded rod allows it to pass through the base plate and side plates, ensuring a stable connection. The bottom end of the base plate is connected to the discharge nozzle. After connection, rotating the bolts fixes the fixing block to the top of the base plate. The first vibrator is externally connected to a 20kHz ultrasonic generator, which outputs a high-frequency power supply. After tuning with a matching inductor, the power is fed through a shielded cable. Micron-level electrostriction amplifies the ultrasonic waves to tens of microns in the longitudinal direction and effectively transmits them into the base plate, thereby applying 20kHz longitudinal ultrasound to the powder bed.

Description

Technical Field

[0001] This utility model relates to the field of additive manufacturing technology, specifically to an ultrasonic-assisted device for additive manufacturing in machining centers. Background Technology

[0002] Additive manufacturing is a process that uses three-dimensional model data as a basis to manufacture parts by adding materials point by point, line by line, or layer by layer. In contrast to traditional subtractive or equal-material processing, materials are added only at the required locations without the need for molds or blank removal.

[0003] However, existing ultrasonic-assisted additive manufacturing devices for machining centers have the following drawbacks:

[0004] (1) In existing additive manufacturing, powder bed material is required to be laser melted to manufacture additive parts. The powder bed is not ultrasonically pre-compacted, resulting in low loose density and insufficient actual powder amount under the same layer thickness. Local collapse may occur after laser melting.

[0005] (2) Existing additive manufacturing cannot remove chips during manufacturing. The chips are partially melted by the next laser and "welded" to the layer being formed, forming a "bulge" that is 30–80 µm higher than the surface, affecting the overall quality of the additive part and making it difficult to scrape them off. Utility Model Content

[0006] The purpose of this invention is to provide an ultrasonic-assisted device for additive manufacturing in machining centers to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an ultrasonic auxiliary device for additive manufacturing in a machining center, comprising an ultrasonic pre-tightening assembly and a chip removal assembly. The ultrasonic pre-tightening assembly consists of a body, a powder bed storage frame, a base plate, a side plate, a threaded rod, a fixing block, bolts, and a first vibrator. The powder bed storage frame is provided on the inner top wall of the body, and a base plate is provided on the inner wall of the powder bed storage frame. Side plates are installed between the base plates, and a threaded rod is installed on one side of the base plate. A fixing block is provided at the top of the base plate, and a bolt is provided at the top of the fixing block. A first vibrator is installed on the surface of the fixing block.

[0008] The chip removal assembly consists of a base plate, a chip removal groove, a bottom block, a rubber pad, and a second vibrator. The bottom block is provided on the inner bottom wall of the machine body, the base plate is installed on the top of the bottom block, the chip removal groove is opened on the top of the bottom plate, the rubber pad is provided on the inner wall of the bottom block, and the second vibrator is provided on the inner wall of the rubber pad.

[0009] Optionally, a transmission module is provided at the bottom of the storage frame, and a discharge nozzle is provided on the surface of the transmission module. The installation of the transmission module is used to drive the discharge nozzle to manufacture additive parts at the top of the base plate. The discharge nozzle is connected to the inside of the powder bed storage frame and is used to melt the powder bed with a laser after the powder bed is ultrasonically pre-tightened, so as to facilitate its output for shaping additive parts.

[0010] Optionally, a chip collection frame is provided on the inner bottom wall of the machine body on the side of the bottom plate. A handle is provided on one side of the chip collection frame. The chip collection frame is used to collect chips. By holding the handle, the chip collection frame can be pulled out for separate cleaning of chips.

[0011] Optionally, there are four base blocks, which are symmetrically distributed to support the base plate.

[0012] Optionally, there are four first oscillators, which are symmetrically distributed. The symmetrical distribution of the first oscillators allows for ultrasonic vibration of the substrate when ultrasound is applied.

[0013] Optionally, six discharge nozzles are provided, and the discharge nozzles are arranged at equal intervals. The equal-interval arrangement of the discharge nozzles can improve the efficiency of forming additive parts.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The ultrasonic auxiliary device for additive manufacturing in this machining center, through the setting of ultrasonic pre-tightening components, allows for the storage of the powder bed in the fixed powder bed frame of the machine body during use. The base plate is connected to the side plate, and the rotating threaded rod can pass through the connection between the base plate and the side plate to stably fix them together. The bottom end of the base plate is connected to the discharge nozzle. After connection, rotating the bolt can fix the fixing block to the top of the base plate. The first vibrator is connected to a 20kHz ultrasonic generator to output high-frequency power. After being tuned by a matching inductor, it is fed into the shielded cable. The micron-level electrostriction is amplified into tens of micron longitudinal ultrasound and effectively transmitted into the base plate, thereby applying 20kHz longitudinal ultrasound to the powder bed, making the grains finer, the interlayer stronger, and the warpage smaller. The additive parts can be directly sent for inspection without additional stress relief or rework.

[0016] 2. The ultrasonic-assisted additive manufacturing device in this machining center, through the setting of the chip removal component, is used such that the base block is connected to the base plate, and the second vibrator is connected to the base plate. After the additive part is printed, it is removed, and some chips will fall onto the surface of the base plate. There are also chips during the processing. The second vibrator is connected to an external ultrasonic generator to output high-frequency power, which generates ultrasonic vibration on the base plate. The chips are discharged outward from the chip removal groove, which can discharge the chips at the top of the base plate. The rubber pad is used to fix the second vibrator to prevent surface damage caused by the vibration of the second vibrator. The semi-molten particles generated during the additive manufacturing process can be pushed away from the processing area in time by ultrasonic vibration to avoid secondary sintering. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall appearance of the present utility model;

[0018] Figure 2 This is a side sectional view of the body of this utility model;

[0019] Figure 3 For the present utility model Figure 2 Enlarged detail diagram at point A;

[0020] Figure 4 For the present utility model Figure 2 Enlarged view of details at point B.

[0021] In the diagram: 1. Ultrasonic pre-tightening assembly; 101. Machine body; 102. Powder bed storage frame; 103. Base plate; 104. Side plate; 105. Threaded rod; 106. Fixing block; 107. Bolt; 108. First vibrator; 2. Chip removal assembly; 201. Base plate; 202. Chip removal trough; 203. Base block; 204. Rubber pad; 205. Second vibrator; 3. Transmission module; 4. Discharge nozzle; 5. Chip collection frame; 6. Handle. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4As shown, this utility model provides a technical solution: an ultrasonic auxiliary device for additive manufacturing in a machining center, comprising an ultrasonic pre-tightening assembly 1 and a chip removal assembly 2. The ultrasonic pre-tightening assembly 1 consists of a body 101, a powder bed storage frame 102, a base plate 103, a side plate 104, a threaded rod 105, a fixing block 106, bolts 107, and a first vibrator 108. The powder bed storage frame 102 is provided on the inner top wall of the body 101, and the base plate 103 is provided on the inner wall of the powder bed storage frame 102. The side plate 104 is installed between the base plates 103, and the threaded rod 105 is installed on one side of the base plate 103. The fixing block 106 is provided at the top of the base plate 103, and the bolt 107 is provided at the top of the fixing block 106. The first vibrator 108 is installed on the surface of the fixing block 106. 101 The fixed powder bed storage frame 102 is used to store the powder bed. The substrate 103 is connected to the side plate 104. The rotating threaded rod 105 can pass through the substrate 103 and the side plate 104 to connect them stably and securely. The bottom end of the substrate 103 is connected to the discharge nozzle 4. After connection, the rotating bolt 107 can fix the fixing block 106 to the top of the substrate 103. The first oscillator 108 is connected to a 20kHz ultrasonic generator to output high-frequency power. After being tuned by a matching inductor, it is fed in through a shielded cable. The micron-level electrostriction is amplified into tens of micron longitudinal ultrasound and effectively transmitted into the substrate 103, thereby applying 20kHz longitudinal ultrasound to the powder bed, making the grains finer, the interlayer stronger, and the warpage smaller. The additive parts can be directly sent for inspection without additional stress relief or rework.

[0024] The chip removal assembly 2 consists of a base plate 201, a chip removal groove 202, a base block 203, a rubber pad 204, and a second vibrator 205. The base block 203 is located on the inner bottom wall of the machine body 101. The base plate 201 is mounted on the top of the base block 203, and the chip removal groove 202 is formed at the top of the base plate 201. A rubber pad 204 is located on the inner wall of the base block 203, and a second vibrator 205 is located on the inner wall of the rubber pad 204. The base block 203 is connected to the base plate 201, and the second vibrator 205 is also connected to the base plate 201. After the additive manufacturing process is completed... When the chipping is removed, some debris will fall onto the surface of the base plate 201. There are also chips during the processing. The second vibrator 205 is connected to an external ultrasonic generator to output high-frequency power, which generates ultrasonic vibration on the base plate 201. The chips are discharged outward from the chip discharge groove 202, which can discharge the chips from the top of the base plate 201. The rubber pad 204 is used to fix the second vibrator 205 to prevent surface damage when the second vibrator 205 vibrates. The semi-molten particles generated during the additive manufacturing process can be pushed away from the processing area in time by ultrasonic vibration to avoid secondary sintering.

[0025] A transmission module 3 is provided at the bottom of the storage frame, and a discharge nozzle 4 is provided on the surface of the transmission module 3. The installation of the transmission module 3 is used to drive the discharge nozzle 4 to perform additive manufacturing on the top of the base plate 201. The discharge nozzle 4 is connected to the inside of the powder bed storage frame 102 and is used to melt the powder bed with a laser after the powder bed is ultrasonically pre-tightened, so that it can be output to shape additive parts.

[0026] The inner bottom wall of the body 101 is provided with a chip collection frame 5 on the side of the base plate 201. A handle 6 is provided on one side of the chip collection frame 5. The chip collection frame 5 is used to collect debris. By holding the handle 6, the chip collection frame 5 can be pulled out for separate cleaning of debris.

[0027] There are four base blocks 203, which are symmetrically distributed and used to support the base plate 201.

[0028] There are four first oscillators 108, which are symmetrically distributed. The symmetrical distribution of the first oscillators 108 allows for ultrasonic vibration of the substrate 103 when ultrasonic waves are applied.

[0029] There are six discharge nozzles 4, which are arranged at equal intervals. The equal interval arrangement of the discharge nozzles 4 can improve the efficiency of forming additive parts.

[0030] In this invention, the working steps of the device are as follows:

[0031] First step: The powder bed storage frame 102 fixed to the body 101 is used to store the powder bed. The base plate 103 is connected to the side plate 104. The rotating threaded rod 105 can pass through the base plate 103 and the side plate 104 to connect them stably. The bottom end of the base plate 103 is connected to the discharge nozzle 4. After connection, the rotating bolt 107 can fix the fixing block 106 to the top of the base plate 103. The first oscillator 108 is connected to a 20kHz ultrasonic generator to output high-frequency power. After being tuned by a matching inductor, it is fed in through a shielded cable. The micron-level electrostriction is amplified into tens of micron longitudinal ultrasound and effectively transmitted into the base plate 103, thereby applying 20kHz longitudinal ultrasound to the powder bed, making the grains finer, the interlayer stronger, and the warpage smaller. The additive parts can be directly sent for inspection without additional stress relief or rework.

[0032] The second step: The base block 203 is connected to the base plate 201, and the second vibrator 205 is connected to the base plate 201. After the additive part is printed, it is removed. Some debris will fall onto the surface of the base plate 201, and there will also be debris during the processing. The second vibrator 205 is connected to an external ultrasonic generator to output high-frequency power, which generates ultrasonic vibration on the base plate 201. The debris is discharged outward from the chip discharge groove 202, which can discharge the debris from the top of the base plate 201. The rubber pad 204 is used to fix the second vibrator 205 to prevent surface damage when the second vibrator 205 vibrates. The semi-molten particles generated during the additive manufacturing process can be pushed away from the processing area in time by ultrasonic vibration to avoid secondary sintering.

[0033] The third step: The installation of the transmission module 3 is used to drive the discharge nozzle 4 to manufacture additive parts at the top of the base plate 201. The discharge nozzle 4 is internally connected to the powder bed storage frame 102. After the powder bed is ultrasonically pre-tightened, the powder bed is melted by laser to facilitate its output for shaping additive parts. The chip collection frame 5 is used to collect chips. The hand handle 6 can pull out the chip collection frame 5 to clean the chips separately.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An ultrasonic-assisted device for additive manufacturing in a machining center, comprising an ultrasonic pre-tightening assembly (1) and a chip removal assembly (2), characterized in that: The ultrasonic pre-tightening assembly (1) consists of a body (101), a powder bed storage frame (102), a base plate (103), a side plate (104), a threaded rod (105), a fixing block (106), a bolt (107), and a first vibrator (108). The powder bed storage frame (102) is provided on the inner top wall of the body (101). The base plate (103) is provided on the inner wall of the powder bed storage frame (102). The side plate (104) is installed between the base plates (103). The threaded rod (105) is installed on one side of the base plate (103). The fixing block (106) is provided at the top of the base plate (103). The bolt (107) is provided at the top of the fixing block (106). The first vibrator (108) is installed on the surface of the fixing block (106). The chip removal assembly (2) consists of a base plate (201), a chip removal groove (202), a base block (203), a rubber pad (204), and a second vibrator (205). The inner bottom wall of the machine body (101) is provided with a base block (203), the top of the base block (203) is provided with a base plate (201), the top of the base plate (201) is provided with a chip removal groove (202), the inner wall of the base block (203) is provided with a rubber pad (204), and the inner wall of the rubber pad (204) is provided with a second vibrator (205).

2. The ultrasonic-assisted device for additive manufacturing in a machining center according to claim 1, characterized in that: The storage box is provided with a transmission module (3) at the bottom, and the surface of the transmission module (3) is provided with a discharge nozzle (4).

3. The ultrasonic-assisted device for additive manufacturing in a machining center according to claim 1, characterized in that: The inner bottom wall of the machine body (101) is provided with a chip collection frame (5) on the side of the bottom plate (201), and a handle (6) is provided on one side of the chip collection frame (5).

4. The ultrasonic-assisted device for additive manufacturing in a machining center according to claim 1, characterized in that: There are four base blocks (203), and the base blocks (203) are symmetrically distributed.

5. The ultrasonic-assisted device for additive manufacturing in a machining center according to claim 1, characterized in that: There are four first oscillators (108), and the first oscillators (108) are symmetrically distributed.

6. The ultrasonic-assisted device for additive manufacturing in a machining center according to claim 2, characterized in that: There are six discharge nozzles (4), which are arranged at equal intervals.

Images