A heating device for a reflow soldering oven

Abstract

This application relates to a heating device for a reflow oven, specifically within the technical field of electronic component soldering equipment. It includes a movable air vane, a transmission component, a partition, and a heating element. The partition is fixedly connected to the bottom plate and side walls of the reflow oven. A heating area is enclosed between adjacent partitions and the side walls of the reflow oven. The heating element is placed within this heating area. The transmission component is fixed to the bottom plate of the reflow oven and located below the heating element. The movable air vane is connected to the transmission component and is positioned above the heating element. The transmission component drives the movable air vane to reciprocate within the heating area. Electronic components and conveyor lines are located above the partition. This application effectively accelerates airflow and heat transfer within the air, resulting in a more uniform temperature increase within the heating area of ​​the reflow oven.

Description

Technical Field

[0001] This application relates to the technical field of electronic component welding equipment, and in particular to a heating device for a reflow oven. Background Technology

[0002] Soldering electronic components is one of the core processes in the electronics manufacturing industry. Especially in products with extremely high reliability requirements, such as automotive signal lights, the quality of the soldering between the circuit board and the solder directly determines the product's stability, lifespan, and safety. During the soldering process, the full adhesion of the solder and the uniformity of the solder joints are crucial. Problems such as cold solder joints, solder oxidation, or solder joint detachment will lead to safety hazards such as circuit failure and abnormal signal transmission.

[0003] Currently, reflow ovens are commonly used equipment for heat treatment of electronic components during soldering. Existing reflow ovens typically have heating zones set along the length of the conveyor line, and a stepped temperature distribution is formed by segmented temperature control to meet the heat treatment requirements of electronic components at different stages such as preheating, heat preservation, soldering, and cooling. This segmented heating design can ensure sufficient solder adhesion and improve product quality.

[0004] Regarding the aforementioned technologies, traditional reflow ovens often use fixed heating elements, resulting in slow gas flow within the oven during the heating process. This leads to uneven temperature distribution within the same heating area, which can easily cause solder joint defects, circuit failures, abnormal signal transmission, and even safety hazards. Utility Model Content

[0005] In view of the shortcomings of the existing technology, one of the objectives of this utility model is to provide a heating device for a reflow oven.

[0006] This application provides a heating device for a reflow oven, which adopts the following technical solution: A heating device for a reflow oven includes a movable air plate, a transmission component, a partition, and a heating element. The partition is fixedly connected to the bottom plate and side walls of the reflow oven. A heating area is enclosed between adjacent partitions and the side walls of the reflow oven. The heating element is placed in the heating area. The transmission component is fixed to the bottom plate of the reflow oven and located below the heating element. The movable air plate is connected to the transmission component and is located above the heating element. The transmission component drives the movable air plate to reciprocate within the heating area. Electronic components and conveyor lines are located above the partition.

[0007] By adopting the above technical solution, the heating element continuously heats the air, and with the reciprocating motion of the moving fan plate, the high-temperature airflow is made to flow rapidly in the heating area, which effectively eliminates the uneven temperature in the heating area caused by the slow flow of hot air in the traditional heating method. This allows each solder joint area on the surface of the electronic component to obtain uniform heat, and significantly reduces the defects of cold solder joints caused by insufficient local temperature.

[0008] Preferably, the heating element is provided with bolts on both sides, and the heating element is detachably connected to the inner walls of both sides of the reflow oven by the bolts. There are at least two heating elements, and at least two heating elements are distributed along the length of the conveyor line.

[0009] By adopting the above technical solution, when the heating element ages or partially melts due to long-term use, it is not necessary to disassemble the entire reflow oven. Only the corresponding bolts of the heating element need to be removed for individual replacement, making the heating device easier to maintain. In different areas of the reflow oven, the temperature of the heating device increases along the conveying direction of the conveyor line. Multiple heating elements can be set according to the temperature increase to meet the temperature requirements of different areas.

[0010] Preferably, there is an assembly gap between adjacent heating elements, the transmission element is located below the assembly gap between adjacent heating elements, the transmission element is provided with a slider, the slider is slidably engaged with the transmission element, a connecting rod is provided above the slider, the end of the connecting rod away from the transmission element passes through the assembly gap between adjacent heating elements and is connected to the movable air plate.

[0011] By adopting the above technical solution, the assembly gap setting provides space for the reciprocating motion of the connecting rod, enabling the moving air plate to reciprocate. At the same time, the assembly gap is located between adjacent heating elements, avoiding direct contact between the connecting rod and the heating elements.

[0012] Preferably, the surface of the movable air plate is arranged parallel to the length of the conveyor line, and the length of the movable air plate is less than the spacing between adjacent partitions.

[0013] By adopting the above technical solution, the length of the movable air vane is less than the distance between the two partitions. On the one hand, a gap is formed between the movable air vane and the partitions, allowing hot air to flow rapidly through the gap when the air vane moves, further enhancing the mixing of hot air. At the same time, this gap provides space for the reciprocating motion of the movable air vane, avoiding collisions between the movable air vane and the partitions during movement, and ensuring the stability of equipment operation.

[0014] Preferably, the surface of the movable air plate is provided with a plurality of guide holes.

[0015] By adopting the above technical solution, when the moving air vane moves forward, the air in front of the guide hole is compressed due to the forward movement of the air vane, thus forming a local high-pressure zone. The area behind the guide hole forms a low-pressure zone because the air cannot fill the space left by the moving air vane in time. The hot air at the bottom of the high-pressure zone is forced to pass through the guide hole. At the same time, the hot air at the bottom, due to its lower density, will naturally rise, while the relatively cooler air at the top will naturally fall. Under the combined action of the moving air vane and the guide hole, the hot air in the high-pressure zone enters the top layer of the low-pressure zone, and the relatively cooler air at the top of the low-pressure zone will fall to the vicinity of the heating element. When the moving air vane moves in the opposite direction, this process is repeated, ensuring that the air in the reflow oven heating zone is fully heated.

[0016] Preferably, the movable air deflector is made of stainless steel.

[0017] By adopting the above technical solution, the rigidity of stainless steel provides sufficient structural strength for the wind vane, making it less prone to deformation during high-speed movement or impact with hot air, thus ensuring that it maintains a stable disturbance effect during high-frequency reciprocating motion.

[0018] Preferably, the adjacent partitions are arranged in parallel, and their top middle positions are bent to one side to form a supporting plane, and the supporting plane is higher than the top of the movable air plate.

[0019] By adopting the above technical solution, the support plane formed by the bending at the top of the partition eliminates the need for a separate support frame. This avoids the problem of the traditional conveyor line's support structure being independent of the heating device and occupying extra space, making the heating area and conveyor line more compact and ensuring that electronic components are fully heated.

[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. The heating element continuously heats the air, and the reciprocating motion of the moving fan plate promotes the rapid flow of high-temperature air in the heating area. This effectively eliminates the uneven temperature in the heating area caused by the slow flow of hot air in traditional heating methods, so that each solder joint area on the surface of electronic components receives uniform heat, significantly reducing the defects of cold solder joints caused by insufficient local temperature. 2. The assembly gap provides space for the reciprocating motion of the connecting rod, allowing the moving air plate to reciprocate. At the same time, the assembly gap is located between adjacent heating elements, avoiding direct contact between the connecting rod and the heating elements. 3. As the moving fan plate moves forward, the air in front of the guide hole is compressed, creating a localized high-pressure zone. The area behind the guide hole becomes a low-pressure zone because air cannot quickly fill the space left by the moving fan plate. Hot air at the bottom of the high-pressure zone is forced through the guide hole, while the lower-density air at the bottom naturally rises, and the relatively cooler air at the top naturally falls. Under the combined action of the moving fan plate and the guide hole, the hot air from the high-pressure zone enters the top of the low-pressure zone, and the relatively cooler air at the top of the low-pressure zone descends to the vicinity of the heating element. When the moving fan plate moves in the opposite direction, this process is repeated, ensuring that the air in the reflow oven heating zone is fully heated. Attached Figure Description

[0021] Figure 1 This is a schematic diagram illustrating a portion of the structure of a reflow oven, as shown in this embodiment of the application. Figure 2 This is an isometric view of an embodiment of this application; Figure 3 This is a schematic diagram illustrating the transmission component in an embodiment of this application.

[0022] Reference numerals: 01, reflow oven; 02, conveyor line; 03, electronic component; 1, partition; 2, heating element; 3, heating zone; 4, moving air vane; 5, transmission component; 6, bolt; 7, assembly gap; 8, slider; 9, connecting rod; 10, guide hole; 11, support plane. Detailed Implementation

[0023] The following is in conjunction with the appendix Figure 1 - Appendix Figure 3 This application will be described in further detail.

[0024] This application discloses a heating device for a reflow oven, referring to... Figure 1 The reflow oven 01 has several heating devices, which are evenly distributed in the preheating, heat preservation and welding areas. In the preheating area of ​​the reflow oven 01, the temperature of the heating devices increases along the conveying direction of the conveyor line 02. In the heat preservation area, the flux is fully activated at a constant temperature. Welding is carried out in the welding area.

[0025] Reference Figure 2 A heating device for a reflow oven includes a partition 1 and a heating element 2. The partition 1 is fixedly connected to the bottom plate and side wall of the reflow oven 01. The adjacent partitions 1 and the side walls of the reflow oven 01 together enclose a heating zone 3. The heating element 2 is located in the bottom area of ​​the heating zone 3, and the electronic component 03 and the conveyor line 02 are located above the partition 1. When the electronic component 03 passes through the heating zone 3 via the conveyor line 02, the heating element 2 heats the air in the heating zone 3, creating a high-temperature environment that allows the solder at the solder joint of the electronic component 03 to adhere fully.

[0026] Reference Figure 2 and Figure 3 The heating device for a reflow oven disclosed in this application embodiment further includes a movable air plate 4 and a transmission component 5. The transmission component 5 is fixed to the bottom plate of the reflow oven 01 and located below the heating element 2. The movable air plate 4 is connected to the transmission component 5 and is located above the heating element 2. When the heating element 2 heats the air in the heating zone 3, the transmission component 5 drives the movable air plate 4 to move back and forth. The disturbance of the movable air plate 4 causes the hot air in the heating zone 3 to flow, accelerates heat transfer, and makes the temperature in the heating zone 3 rise evenly, thereby reducing the cold solder joint defects of the electronic component 03.

[0027] Furthermore, bolts 6 are provided on both sides of the heating element 2. Preferably, the bolts 6 are high-temperature resistant, and the heating element 2 is detachably connected to the inner walls of both sides of the reflow oven 01 via the bolts 6. Preferably, the heating element 2 is made of resistance wire, which is long and thin. The heating element 2 is connected to the power supply and temperature control system of the reflow oven 01 via wires to generate heat and raise the temperature of the heating zone 3.

[0028] This application discloses two heating elements 2, which are distributed along the length of the conveyor line 02. In some embodiments, the number of heating elements 2 is at least two. In different zones of the reflow oven, the temperature of the heating device increases along the conveying direction of the conveyor line, and multiple heating elements can be set according to the temperature increase to meet the temperature requirements of different zones.

[0029] Furthermore, there is an assembly gap 7 between adjacent heating elements 2, and the transmission element 5 is located below the assembly gap 7 between adjacent heating elements 2. In this embodiment, the transmission element 5 adopts a linear module. The transmission element 5 is provided with a slider 8, which slides in conjunction with the transmission element 5. A connecting rod 9 is provided above the slider 8. The slider 8 and the connecting rod 9 move along the width direction of the conveyor line 02. The end of the connecting rod 9 away from the slider 8 passes through the assembly gap 7 between adjacent heating elements 2 and is connected to the movable air plate 4.

[0030] The movable air plate 4 is arranged parallel to the length of the conveyor line 02, and its length is less than the distance between adjacent partitions 1. The linear module drives the movable air plate 4 to move back and forth along the width of the conveyor line 02, avoiding friction between the movable air plate 4 and the adjacent partitions 1 during reciprocating motion, thus improving the service life of the movable air plate 4. At the same time, the fact that the length of the movable air plate 4 is less than the distance between the two partitions 1 allows a small amount of air to flow through the gaps during the movement of the movable air plate 4, thereby accelerating the gas flow in the heating zone 3 and promoting uniform heat diffusion.

[0031] Further, refer to Figure 3The surface of the movable air plate 4 is provided with several guide holes 10. When the movable air plate 4 reciprocates under the drive of the linear module, the guide holes 10 move with the movable air plate 4, and a low-pressure zone is briefly formed in the area behind the guide holes 10. At this time, the air with a relatively lower temperature in the upper layer moves downward, while the pressure in the area in front of the guide holes 10 is relatively high. The hot air at the bottom layer moves at high speed through the guide holes 10 to the top of the low-pressure zone behind the guide holes 10, thereby enhancing the intensity of vertical convection. This allows the hot air at the bottom layer generated by the heating element 2 to be further mixed with the relatively low-temperature air in the upper layer within the heating area 3, making the temperature of the heating area 3 more uniform.

[0032] Preferably, the movable air plate 4 is made of stainless steel. During operation, the reflow oven 01 needs to create a high-temperature working environment, and there are also corrosive media such as solder vapor and flux volatiles inside. The high temperature resistance and corrosion resistance of stainless steel can extend the service life of the air plate, while its rigidity can meet the structural stability during reciprocating movement.

[0033] Adjacent partitions 1 are arranged in parallel, and their top middle position is bent to one side to form a support plane 11. The width of the support plane 11 is adapted to the bottom width of the conveying structure of the conveying line 02, and the support plane 11 is higher than the top of the moving air plate 4 to ensure that the moving air plate 4 can operate normally during the conveying process of electronic components 03.

[0034] The implementation principle of this application embodiment is as follows: Several partitions 1 are fixed parallel to each other on the bottom plate of the reflow oven 01, and the supporting plane 11 formed by bending the top of the partitions 1 faces the same side. Then, in the bottom area between adjacent partitions 1, a linear module is fixed to the bottom plate of the reflow oven 01, and the movement direction of the linear module slider 8 is adjusted so that it is consistent with the width direction of the conveyor line 02. Next, at least two heating elements 2 are detachably fixed to the inner walls on both sides of the reflow oven 01 by high-temperature resistant bolts 6, and a pre-reserved assembly gap 7 is maintained between adjacent heating elements 2 to ensure that the linear module is directly below the assembly gap 7 between adjacent heating elements 2. After that, a connecting rod 9 is vertically installed above the slider 8, so that its top end passes through the assembly gap 7 between the heating elements 2 and its one end extends above the heating element 2. Then, a moving air plate 4 is horizontally fixed to the top of the connecting rod 9, ensuring that the moving air plate 4 is parallel to the length direction of the conveyor line 02.

[0035] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heating device for a reflow soldering furnace, characterized in that The reflow oven includes a partition (1), a heating element (2), a movable air plate (4), and a transmission element (5). The partition (1) is fixedly connected to the bottom plate and side wall of the reflow oven (01). The adjacent partitions (1) and the two side walls of the reflow oven (01) together enclose a heating area (3). The heating element (2) is placed in the heating area (3). The transmission element (5) is fixed to the bottom plate of the reflow oven (01) and located below the heating element (2). The movable air plate (4) is connected to the transmission element (5) and is located above the heating element (2). The transmission element (5) drives the movable air plate (4) to move back and forth within the heating area (3). The electronic components (03) and the conveyor line (02) are located above the partition (1).

2. The heating apparatus for a reflow soldering furnace according to claim 1, wherein The heating element (2) is provided with bolts (6) on both sides. The heating element (2) is detachably connected to the inner walls of both sides of the reflow oven (01) by the bolts (6). There are at least two heating elements (2), and at least two heating elements (2) are distributed along the length of the conveyor line (02).

3. A heating device for a reflow oven according to claim 2, characterized in that, There is an assembly gap (7) between adjacent heating elements (2). The transmission element (5) is located below the assembly gap (7) between adjacent heating elements (2). The transmission element (5) is provided with a slider (8). The slider (8) is slidably engaged with the transmission element (5). A connecting rod (9) is provided above the slider (8). The end of the connecting rod (9) away from the transmission element (5) passes through the assembly gap (7) between adjacent heating elements (2) and is connected to the movable air plate (4).

4. A heating device for a reflow oven according to claim 3, characterized in that, The movable air plate (4) is arranged parallel to the length of the conveyor line (02), and the length of the movable air plate (4) is less than the distance between adjacent partitions (1).

5. A heating device for a reflow oven according to claim 4, characterized in that, The surface of the movable air deflector (4) is provided with several guide holes (10).

6. A heating device for a reflow oven according to claim 1, characterized in that, The movable air deflector (4) is made of stainless steel.

7. The heating apparatus for a reflow soldering furnace according to claim 1, wherein The adjacent partitions (1) are arranged in parallel, and their top middle position is bent to one side to form a support plane (11), and the support plane (11) is higher than the top of the movable air plate (4).

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