Dual station selective solder

Abstract

The utility model discloses a double position selects soldering machine, including the box, two -dimensional moving mechanism A, two -dimensional moving mechanism B, flux sprayer and soldering pump, the middle part of the box is equipped with PCB board incoming material guide device along the front and back direction, and the front middle part of the box is opened to make the operation mouth of PCB board incoming material guide device front end show, two -dimensional moving mechanism A and two -dimensional moving mechanism B are fixed in the lower part in the box from front to back, the flux sprayer is fixed upwards in two -dimensional moving mechanism A, and can move left and right, before and after under the control of two -dimensional moving mechanism A, the soldering pump is fixed upwards in two -dimensional moving mechanism B, and can move left and right, before and after under the control of two -dimensional moving mechanism B. The application integrates the flux spraying process and the welding process in a device, is convenient to use, and the PCB board incoming material is rotary operation, can greatly save the physical strength of operating personnel, and the application adopts double position, makes the operation efficiency high.

Description

Technical Field

[0001] This utility model relates to the field of soldering equipment technology, and in particular to a dual-station selective soldering machine. Background Technology

[0002] Selective soldering machines are indispensable key equipment in modern high-density, high-reliability electronic assembly. Through precise positioning and parameter control, they enable high-quality soldering only where incoming materials such as circuit boards require it, effectively overcoming many limitations of wave soldering and manual soldering. They are particularly suitable for double-sided mixed-assembly boards, production scenarios containing heat-sensitive components, and small-batch, multi-variety production scenarios, significantly improving soldering quality, production efficiency, and flexibility, while reducing overall costs.

[0003] "Selectivity" is its core feature. The equipment can precisely control the soldering position, solder amount, and soldering time, and only operate on the solder joints that need to be soldered (such as through-hole component leads, connectors, heat sinks, etc.), avoiding thermal damage or solder contamination to surrounding surface mount components or other sensitive areas.

[0004] Selective soldering machines replace the limitations of manual soldering and wave soldering, solving the challenges faced by traditional wave soldering when soldering double-sided mixed-assembly boards (SMT on side A, THT on side B) (requiring complex fixtures to mask SMT components), as well as the problems of low efficiency and poor consistency of manual soldering.

[0005] For existing selective soldering equipment, the pre-soldering process usually requires spraying flux onto the product surface to improve the soldering strength in the subsequent process. Traditionally, two sets of equipment are needed: one for flux spraying and the other for selective soldering. After the product is sprayed with flux by the flux spraying equipment, it is then manually or via a long conveyor belt between the machines to the selective soldering machine for soldering. This makes the overall operation very inefficient. In addition, the two sets of equipment occupy a lot of space and are inconvenient for operators. The operators have to walk back and forth between the two sets of equipment to pick up and put down materials, which is also very physically demanding.

[0006] In response, the inventor of this patent, combining clinical experience, reflecting on problems encountered in clinical work, reviewing a large amount of scientific research data and literature, and conducting a novelty search, gradually conceived and designed this application to solve the relevant technical problems. Utility Model Content

[0007] The present invention aims to at least partially solve one of the technical problems in the related art. Therefore, the purpose of this invention is to provide a dual-station selective soldering machine.

[0008] To achieve one of the above objectives, a dual-station selective soldering machine according to an embodiment of the present invention includes:

[0009] Chassis; a PCB board material feeding device is provided in the middle of the chassis along the front-to-back direction, and an operation port is opened in the front middle of the chassis to expose the front end of the PCB board material feeding device;

[0010] Two-dimensional moving mechanism A and two-dimensional moving mechanism B; the two-dimensional moving mechanism A and two-dimensional moving mechanism B are fixedly installed in the lower part of the chassis from front to back, so as to be located below the PCB board material feeding device;

[0011] Flux sprayer; the flux sprayer is fixed upward to the two-dimensional moving mechanism A, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism A, so as to spray flux onto the preset welding position on the bottom surface of the PCB board material being conveyed backward by the PCB board material feeding device.

[0012] Solder pump; the solder pump is fixed upward to the two-dimensional moving mechanism B, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism B, so as to perform soldering on the preset soldering position where flux is sprayed on the bottom surface of the PCB board material being conveyed backward by the PCB board material feeding device.

[0013] In addition, the dual-station selective soldering machine according to the above embodiments of the present invention may also have the following additional technical features:

[0014] According to one embodiment of the present invention, the two-dimensional moving mechanism A includes a left-right moving component A and a front-back moving component A;

[0015] The left and right moving component A is fixedly installed in the lower front part of the chassis in the left and right direction;

[0016] The forward and backward moving component A is fixed on the left and right moving component A in the forward and backward direction so that it can move left and right under the control of the left and right moving component A;

[0017] The flux injector is fixed on the forward and backward moving member A, so that it can move forward and backward under the control of the forward and backward moving member A.

[0018] According to one embodiment of the present invention, the two-dimensional moving mechanism B includes a left-right moving component B and a front-back moving component B;

[0019] The left and right moving component B is fixedly installed in the lower middle part of the chassis in the left and right direction, and is located behind the left and right moving component A;

[0020] The forward and backward moving component B is fixedly mounted on the left and right moving component B in the forward and backward direction, so that it can move left and right under the control of the left and right moving component B.

[0021] The solder pump is fixed on the forward and backward moving member B, so that it can move forward and backward under the control of the forward and backward moving member B.

[0022] According to one embodiment of the present invention, it further includes a lifting component A for controlling the lifting and lowering of the solder pump;

[0023] The lifting component A is fixed between the bottom of the solder pump and the top of the forward and backward moving component B.

[0024] According to one embodiment of the present utility model, a PCB board feeding lifting device is provided in the middle and rear part of the chassis along the front-to-back direction, and a PCB board feeding export device is provided in the middle and upper part of the chassis along the front-to-back direction, located above the PCB board feeding import device, and the front end of the PCB board feeding export device is exposed in the operation port.

[0025] When the PCB board material lifting device descends to the first position, its front end connects with the rear end of the PCB board material inlet device to receive the PCB board material that has been welded at the preset welding position on the bottom surface and is conveyed backward by the PCB board material inlet device.

[0026] When the PCB board material lifting device rises to the second position, its front end connects with the rear end of the PCB board material discharge device to convey the PCB board material that has been welded at the preset welding position on the bottom surface forward to the PCB board material discharge device, so that it can be discharged from the operation port under the conveying of the PCB board material discharge device.

[0027] According to one embodiment of the present invention, the PCB board material feeding device includes a left clamping conveyor A and a right clamping conveyor A arranged in the front-back direction;

[0028] Under the clamping and conveying of the left clamping conveyor A and the right clamping conveyor A, the PCB board is conveyed from front to back.

[0029] According to one embodiment of the present invention, the PCB board material lifting device includes a left clamping conveyor B, a right clamping conveyor B arranged in the front-back direction, and a lifting member B for controlling the left clamping conveyor B and the right clamping conveyor B to rise and fall synchronously to switch between the first position and the second position.

[0030] When the lifting component B controls the left clamping conveyor B and the right clamping conveyor B to descend to the first position, the left clamping conveyor B and the right clamping conveyor B together receive the PCB board material that has been welded at the preset welding position on the bottom surface, which is conveyed from front to back.

[0031] According to one embodiment of the present invention, the PCB board material delivery device includes a left clamping conveyor C and a right clamping conveyor C arranged in the front-back direction;

[0032] When the lifting component B controls the left clamping conveyor B and the right clamping conveyor B to rise to the second position, the left clamping conveyor B and the right clamping conveyor B clamp the PCB board material that has been welded at the preset welding position on the bottom surface and convey it forward so that it can be received by the left clamping conveyor C and the right clamping conveyor C.

[0033] According to one embodiment of the present utility model, the PCB board material feeding and unloading device further includes a left clamping and conveying component D, a right clamping and conveying component D, a front connecting plate, a rear connecting plate, a rear hanging plate, and a supporting cylinder arranged in the front-back direction.

[0034] The rear end of the left clamping conveyor D is rotatably connected to the front end of the left clamping conveyor C; the rear end of the right clamping conveyor D is rotatably connected to the front end of the right clamping conveyor C.

[0035] The left clamping conveyor C and the right clamping conveyor C clamp the incoming PCB board that has been welded at the preset welding position on the bottom surface and convey it forward so that it can be received by the left clamping conveyor D and the right clamping conveyor D together.

[0036] The front connecting plate is connected between the lower front part of the left clamping conveyor D and the lower front part of the right clamping conveyor D; the rear connecting plate is connected between the lower front part of the left clamping conveyor C and the lower front part of the right clamping conveyor C; the upper end of the hanging plate is connected to the lower middle part of the rear connecting plate.

[0037] The supporting cylinder is inclined forward and upward and has a cylinder rod extending forward and upward. The front end of the cylinder rod is rotatably connected to the middle of the front connecting plate; the rear end of the supporting cylinder is rotatably connected to the lower front end of the hanging plate.

[0038] When the front connecting plate is pressed down so that the front ends of the left clamping conveyor D and the right clamping conveyor D swing downwards by a preset stroke, the cylinder rod is naturally compressed.

[0039] When the front connecting plate is pried up so that the front ends of the left clamping conveyor D and the right clamping conveyor D are both reset to their initial state, the cylinder rod naturally extends to support the front connecting plate through the support cylinder.

[0040] The beneficial effects of this utility model are:

[0041] Firstly, the dual-station selective soldering machine provided in this application, in specific implementation, has the functions of spraying flux at the preset soldering position on the bottom surface of the incoming PCB board and soldering. That is, this application integrates the flux spraying process and the soldering process into one device, which eliminates the trouble of separately equipping flux spraying device and soldering machine device. As a result, this application is convenient to use, and the overall structure of this application is necessarily very compact, which can save a lot of structural components, such as the amount of consumable materials used for the machine casing, etc., so that it occupies little space and can be placed in a local area with limited space, thus making it highly adaptable to use.

[0042] Secondly, this application allows for continuous operation. When the flux is exhausted, the PCB board material feeding device can immediately transport the PCB board material backward by a preset stroke. Under the control of the two-dimensional moving mechanism B, the solder pump is driven to move left and right and back and forth to perform welding on the preset welding position on the bottom surface of the PCB board material where the flux has been sprayed. This process is fully automated and highly continuous, resulting in high flux spraying efficiency and high welding efficiency at the preset welding position on the bottom surface of the PCB board material. It also reduces the likelihood of missed spraying, inaccurate spraying position, and inaccurate welding position, making this application highly reliable.

[0043] Thirdly, this application employs a PCB board inlet rotary operation. When the PCB board inlet lifting device descends to the first position, its front end connects with the rear end of the PCB board inlet guide device to receive the PCB board inlet material that has been soldered at the preset soldering position on the bottom surface, which is being conveyed backward by the PCB board inlet guide device. Then, when the PCB board inlet lifting device rises to the second position, its front end connects with the rear end of the PCB board inlet outlet device to convey the PCB board inlet material that has been soldered at the preset soldering position on the bottom surface forward to the PCB board inlet guide device. The device is designed to guide PCBs with pre-designed soldering positions on their lower surfaces through the operating port, conveyed by the PCB board material delivery device. This allows for easy rotation of the PCBs, enabling operators to conveniently place and guide PCBs with pre-designed soldering positions on their lower surfaces that have not been coated with flux or soldered, and to pick up and export PCBs with pre-designed soldering positions on their lower surfaces that have been coated with flux and soldered. This eliminates the need for operators to move around, significantly reducing their physical exertion and making the operation of this application easy and effortless.

[0044] Fourthly, in practical application of this application, the front end of the PCB board feeding device is exposed in the lower part of the operating port, while the front ends of the left clamping conveyor D and the right clamping conveyor D are located in the upper part of the operating port. At this time, due to their slightly higher position, it is inconvenient for the operator to handle the PCB board feeding device that has been pre-welded at the preset welding position on its lower surface. Therefore, this application further includes the front connecting plate, the rear connecting plate, the rear hanging plate, and the supporting cylinder in the PCB board feeding device, so that the front ends of the left clamping conveyor D and the right clamping conveyor D are located in the upper part of the operating port. Both the front ends of the right clamping conveyor D can swing downwards. During implementation, when the PCB board material that has been soldered at the preset soldering position on the bottom surface is conveyed forward and clamped by the left clamping conveyor D and the right clamping conveyor D, the front connecting plate can be pressed down to make the front ends of the left clamping conveyor D and the right clamping conveyor D swing downwards by a preset stroke. At this time, the PCB board material that has been soldered at the preset soldering position on the bottom surface is placed obliquely forward and downward. In this way, the operator can easily pick it up from the operation port, making it simple and effortless to pick up.

[0045] Fifthly, by lifting the front connecting plate upwards to reset the front ends of the left and right clamping conveyors D to their initial states, the supporting cylinder will automatically draw in air, and the cylinder rod will naturally extend to support the front connecting plate. In this way, the PCB board material that has been welded at the next preset welding position on the bottom surface is clamped and conveyed forward, and then received again by the left and right clamping conveyors D. This cycle is repeated, which makes it convenient for this application to perform flux spraying, welding, and rotation operations on multiple PCB board materials that have been welded at multiple preset welding positions on the bottom surface one by one, resulting in high operating efficiency and greatly improved production capacity.

[0046] Sixthly, by setting up a material tray of appropriate size to handle the incoming PCB board, the incoming PCB board can be well protected, and its periphery is not easily worn, thus making the reliability of this application better.

[0047] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the overall structure of the dual-station selective soldering machine of this utility model. Figure 1 ;

[0050] Figure 2 This is a schematic diagram of the overall structure of the dual-station selective soldering machine of this utility model. Figure 2 ;

[0051] Figure 3 This is a schematic diagram of the overall structure of the two-dimensional moving mechanism A, the two-dimensional moving mechanism B, the flux injector, the solder pump, and the lifting component A arranged together in this embodiment of the utility model.

[0052] Figure 4 This is a schematic diagram of the overall structure of the dual-station selective soldering machine of this utility model when the upper part of the chassis is removed;

[0053] Figure 5 This is a schematic diagram of the overall structure of the PCB board feeding device, the PCB board lifting device, the PCB board feeding unloading device, and the material tray arranged together in this embodiment of the utility model. Figure 1 ;

[0054] Figure 6 This is a schematic diagram of the overall structure of the PCB board feeding device, the PCB board lifting device, the PCB board feeding unloading device, and the material tray arranged together in this embodiment of the utility model. Figure 2 ;

[0055] Figure 7 This is a schematic diagram of the overall structure of the PCB board material unloading device in this embodiment of the present invention;

[0056] Figure 8 This is a schematic diagram of the overall structure of the material tray in an embodiment of this utility model;

[0057] Figure label:

[0058] Dual-station soldering machine 1000;

[0059] Chassis 10;

[0060] Operation port 101;

[0061] Adjust the foot pads to 102;

[0062] 103 omnidirectional swivel casters;

[0063] PCB board inlet feeding device 20;

[0064] Left clamping conveyor A201;

[0065] Right clamping conveyor A202;

[0066] Two-dimensional moving mechanism A30;

[0067] Left and right movable component A301;

[0068] Forward and backward moving component A302;

[0069] Two-dimensional moving mechanism B40;

[0070] Left and right movable component B401;

[0071] Forward and backward moving component B402;

[0072] Flux injector 50;

[0073] Solder pump 60;

[0074] Lifting component A70;

[0075] PCB board inlet lifting device 80;

[0076] Left clamping conveyor B801;

[0077] Right clamping conveyor B802;

[0078] Lifting component B803;

[0079] PCB board material delivery device 90;

[0080] Left clamping and conveying component C901;

[0081] Right clamping transfer component C902;

[0082] Left clamping and conveying component D903;

[0083] Right clamping transfer component D904;

[0084] Front connecting plate 905;

[0085] Rear connecting plate 906;

[0086] Rear suspension plate 907;

[0087] Support cylinder 908;

[0088] Cylinder rod 9081;

[0089] 100 trays;

[0090] View window 1001;

[0091] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0092] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0093] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0094] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0095] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0096] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0097] The dual-station selective soldering machine of this utility model is described in detail below with reference to the accompanying drawings.

[0098] Reference Figures 1 to 4 As shown;

[0099] The dual-station selective soldering machine provided according to the embodiments of the present utility model includes a chassis 10, a two-dimensional moving mechanism A30, a two-dimensional moving mechanism B40, a flux injector 50, and a solder pump 60.

[0100] The chassis 10 has a PCB board material inlet guide device 20 located in the middle of the chassis 10 along the front-to-back direction, and the chassis 10 has an operation port 101 in the front middle to expose the front end of the PCB board material inlet guide device 20; the two-dimensional moving mechanism A30 and the two-dimensional moving mechanism B40 are fixedly installed in the lower part of the chassis 10 from front to back, so as to be located below the PCB board material inlet guide device 20.

[0101] Furthermore, the flux injector 50 is fixed upward to the two-dimensional moving mechanism A30, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism A30 to spray flux onto the preset welding position on the bottom surface of the PCB board material being conveyed backward by the PCB board material inlet device 20; the solder pump 60 is fixed upward to the two-dimensional moving mechanism B40, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism B40 to perform welding on the preset welding position on the bottom surface of the PCB board material being conveyed backward by the PCB board material inlet device 20 where flux has been sprayed.

[0102] Based on the above, it is clear that in specific implementation, this application is mainly used as a dual-station selective soldering machine.

[0103] Specifically, when applying this application, the application is assembled according to the structure described above, and the PCB board material that needs to be sprayed with flux and soldered at the preset soldering position on the bottom surface is placed on the PCB board material feeding device 20. The PCB board material feeding device 20 conveys the PCB board material backward by a preset stroke. Under the control of the two-dimensional moving mechanism A30, the flux sprayer 50 is driven to move left and right and back and forth to spray flux at the preset soldering position on the bottom surface of the PCB board material. Then, the PCB board material feeding device 20 conveys the PCB board material backward by a preset stroke. Under the control of the two-dimensional moving mechanism B40, the solder pump 60 is driven to move left and right and back and forth to solder at the preset soldering position on the bottom surface of the PCB board material that has been sprayed with flux. In this way, this application can be used easily.

[0104] Clearly, the application of this application will have the following technical effects:

[0105] On the one hand, this application has the functions of spraying flux at the preset soldering position on the bottom surface of the incoming PCB board and soldering. That is, this application integrates the flux spraying process and the soldering process into one device, which eliminates the trouble of separately equipping flux spraying device and soldering machine device, making this application convenient to use. Moreover, the overall structure of this application will inevitably be very compact, which can save a lot of structural components, such as the amount of consumable materials for the housing, etc., so that it occupies little space and is suitable for use in areas with limited space, thus making it highly adaptable to use.

[0106] On the other hand, this application can perform continuous operation. When the flux is exhausted, the PCB board material feeding device 20 can be used to immediately transport the PCB board material backward by a preset stroke. Under the control of the two-dimensional moving mechanism B40, the solder pump 60 is driven to move left and right and back and forth to weld the preset welding position on the bottom surface of the PCB board material where the flux has been sprayed. This process is fully automated and highly continuous, resulting in high flux spraying efficiency and high welding efficiency at the preset welding position on the bottom surface of the PCB board material. It is also less likely to have missed spraying, inaccurate spraying position, or inaccurate welding position, making this application highly reliable.

[0107] Furthermore, through the above-mentioned optimized design, the whole constituted by this application is highly practical and has a good effect in use.

[0108] Furthermore, in specific implementation, in accordance with... Figure 3 As shown, according to one embodiment of the present invention, the two-dimensional moving mechanism A30 includes a left-right moving component A301 and a front-back moving component A302;

[0109] The left-right moving component A301 is fixedly installed in the lower front part of the housing 10 in the left-right direction; the front-back moving component A302 is fixedly installed on the left-right moving component A301 in the front-back direction, so that it can move left and right under the control of the left-right moving component A301; the flux sprayer 50 is fixedly installed on the front-back moving component A302, so that it can move back and forth under the control of the front-back moving component A302.

[0110] Therefore, under the combined action of the left-right moving component A301 and the front-back moving component A302, the flux sprayer 50 can be driven to move left and right and back and forth to spray flux onto the preset soldering position on the bottom surface of the PCB board. In this way, the flux sprayer 50 of this application can be used flexibly, and after its movement trajectory is set in advance by the software program, its spraying position can be made accurate.

[0111] Furthermore, in the specific implementation, we will continue to refer to... Figure 3 As shown, according to one embodiment of the present invention, the two-dimensional moving mechanism B40 includes a left-right moving component B401 and a front-back moving component B402;

[0112] The left-right moving component B401 is fixedly disposed in the lower middle part of the chassis 10 along the left-right direction and is located at the rear of the left-right moving component A301; the front-back moving component B402 is fixedly disposed on the left-right moving component B401 along the front-back direction, so that it can move left and right under the control of the left-right moving component B401; the solder pump 60 is fixedly disposed on the front-back moving component B402, so that it can move back and forth under the control of the front-back moving component B402.

[0113] Therefore, under the combined action of the left-right moving component B401 and the front-back moving component B402, the solder pump 60 can be driven to move left and right and back and forth to perform soldering on the preset soldering position on the bottom surface of the incoming PCB board. In this way, the solder pump 60 of this application can be used flexibly, and after its movement trajectory is set in advance by the software program, its soldering position can be made accurate.

[0114] Preferably, in this technical solution, it is still compared with Figure 3 As shown, according to one embodiment of the present invention, this application also includes a lifting component A70 for controlling the lifting and lowering of the solder pump 60;

[0115] The lifting component A70 is fixed between the bottom of the solder pump 60 and the top of the forward and backward moving component B402.

[0116] In this regard, it should be clarified that in actual use of this application, the soldering process generally requires the soldering head of the solder pump 60 to be in close contact with the preset soldering position on the bottom surface of the PCB board. To address this, this application provides the lifting component A70 to control the solder pump 60 to automatically rise and fall. When it is needed, its upward preset stroke is controlled so that its soldering head can be in close contact with the preset soldering position on the bottom surface of the PCB board for soldering. After soldering is completed, the solder pump 60 can be lowered by the lifting component A70 to make its soldering head move away from the preset soldering position on the bottom surface of the PCB board, so as to avoid them being too close to each other and touching each other as much as possible.

[0117] Furthermore, in specific implementation, in accordance with Figure 4 , Figure 5 and Figure 6 As shown, according to an embodiment of the present utility model, a PCB board feeding lifting device 80 is provided in the rear part of the chassis 10 along the front-back direction, and a PCB board feeding export device 90 is provided in the upper part of the chassis 10 along the front-back direction, located above the PCB board feeding inlet device 20, with the front end of the PCB board feeding export device 90 exposed in the operation port 101.

[0118] When the PCB board material lifting device 80 descends to the first position, its front end connects with the rear end of the PCB board material guiding device 20 to receive the PCB board material that has been welded at the preset welding position on the bottom surface and is conveyed backward by the PCB board material guiding device 20.

[0119] When the PCB board material lifting device 80 rises to the second position, its front end connects with the rear end of the PCB board material discharge device 90, so as to convey the PCB board material that has been welded at the preset welding position on the bottom surface forward to the PCB board material discharge device 90, so as to be discharged from the operation port 101 under the conveying of the PCB board material discharge device 90.

[0120] In this regard, it is clear that this application adopts a PCB board incoming material rotation operation. When the PCB board incoming material lifting device 80 descends to the first position, its front end will connect with the rear end of the PCB board incoming material guiding device 20 to receive the PCB board material with the preset welding position on the bottom surface completed, which is conveyed backward by the PCB board incoming material guiding device 20. Then, when the PCB board incoming material lifting device 80 rises to the second position, its front end will connect with the rear end of the PCB board incoming material discharging device 90 to convey the PCB board material with the preset welding position on the bottom surface forward to the PCB board incoming material discharging device 90, so that the PCB board material with the preset welding position on the bottom surface completed is discharged from the operation port 101 under the conveying of the PCB board incoming material discharging device 90.

[0121] In this way, even with the rotation of incoming PCBs, operators can easily stand or sit at the operating port 101 to place and guide PCBs with no flux sprayed and no soldering at the preset soldering positions on the bottom surface, and to pick up and export PCBs with flux sprayed and soldering completed at the preset soldering positions on the bottom surface. This eliminates the hassle of operators having to walk back and forth, greatly saving their physical strength and making the operation of this application easy and effortless.

[0122] Furthermore, in specific implementation, we will continue to refer to... Figure 4 , Figure 5 and Figure 6 As shown, according to one embodiment of the present invention, the PCB board material feeding device 20 includes a left clamping conveyor A201 and a right clamping conveyor A202 arranged in the front-back direction;

[0123] Under the clamping and conveying of the left clamping conveyor A201 and the right clamping conveyor A202, the PCB board is conveyed from front to back.

[0124] It should be noted that the left clamping conveyor A201 and the right clamping conveyor A202 can jointly clamp the incoming PCB board and drive it to be transported from front to back.

[0125] In this application, the left clamping conveyor A201 is preferably a left conveyor belt A with a left guard A on the upper left, and the right clamping conveyor A202 is preferably a right conveyor belt A with a right guard A on the upper right. In this way, the left and right sides of the incoming PCB board can be lifted by the left and right conveyor belts A, and when they rotate, they can drive the lifted PCB board to be conveyed backward. Furthermore, the left and right guards A can limit the PCB board to the left and right, so that it is not easy to slip and fall.

[0126] Furthermore, in specific implementation, it is still necessary to refer to... Figure 4 , Figure 5 and Figure 6 As shown, according to an embodiment of the present invention, the PCB board material lifting device 80 includes a left clamping conveyor B801 and a right clamping conveyor B802 arranged in the front-back direction, and a lifting member B803 for controlling the left clamping conveyor B801 and the right clamping conveyor B802 to rise and fall synchronously to switch between the first position and the second position.

[0127] When the lifting component B803 controls the left clamping conveyor B801 and the right clamping conveyor B802 to descend to the first position, the left clamping conveyor B801 and the right clamping conveyor B802 jointly receive the PCB board material that has been welded at the preset welding position on the bottom surface, which is conveyed from front to back.

[0128] Therefore, the PCB board material that has been soldered at the preset soldering position on the bottom surface can be clamped and conveyed by the left clamping conveyor A201 and the right clamping conveyor A202 to the left clamping conveyor B801 and the right clamping conveyor B802.

[0129] Therefore, in this application, the reference is still made. Figure 4 , Figure 5 and Figure 6 As shown, according to one embodiment of the present invention, the PCB board material delivery device 90 includes a left clamping conveyor C901 and a right clamping conveyor C902 arranged in the front-back direction;

[0130] When the lifting component B803 controls the left clamping conveyor B801 and the right clamping conveyor B802 to rise to the second position, the left clamping conveyor B801 and the right clamping conveyor B802 clamp the PCB board material that has been welded at the preset welding position on the bottom surface and convey it forward, so that it can be received by the left clamping conveyor C901 and the right clamping conveyor C902.

[0131] It should be noted that the left clamping conveyor B801 and the right clamping conveyor B802 can jointly clamp the incoming PCB board and drive it to be conveyed from back to front; the left clamping conveyor C901 and the right clamping conveyor C902 can also jointly clamp the incoming PCB board and drive it to be conveyed from back to front.

[0132] In this application, the left clamping conveyor B801 is preferably a left conveyor belt B with a left guard B on the upper left, and the right clamping conveyor B802 is preferably a right conveyor belt B with a right guard B on the upper right. In this way, the left and right sides of the incoming PCB board can be lifted by the left and right conveyor belts B respectively, and when they rotate, they can drive the lifted PCB board to be conveyed forward. Furthermore, the left and right guards B can limit the PCB board to the left and right, so that it is not easy to slip and fall.

[0133] Similarly, in this application, the left clamping conveyor C901 is preferably a left conveyor belt C with a left guard C on the upper left, and the right clamping conveyor C902 is preferably a right conveyor belt C with a right guard C on the upper right. In this way, the left and right sides of the incoming PCB board can be lifted by the left and right conveyor belts C, and when they rotate, they can drive the lifted PCB board to be conveyed forward. Furthermore, the left and right guards C can limit the PCB board to the left and right, making it less likely to slip and fall.

[0134] Furthermore, in this technical solution, compared with... Figure 5 , Figure 6 and Figure 7 As shown, according to one embodiment of the present invention, the PCB board material delivery device 90 further includes a left clamping and conveying member D903, a right clamping and conveying member D904, a front connecting plate 905, a rear connecting plate 906, a rear hanging plate 907, and a support cylinder 908 arranged in the front-back direction.

[0135] Wherein, the rear end of the left clamping and conveying component D903 is rotatably connected to the front end of the left clamping and conveying component C901; the rear end of the right clamping and conveying component D904 is rotatably connected to the front end of the right clamping and conveying component C902.

[0136] The left clamping conveyor C901 and the right clamping conveyor C902 clamp and convey the incoming PCB board that has been welded at the preset welding position on the bottom surface, so as to be received by the left clamping conveyor D903 and the right clamping conveyor D904.

[0137] The front connecting plate 905 is connected between the lower front part of the left clamping conveyor D903 and the lower front part of the right clamping conveyor D904; the rear connecting plate 906 is connected between the lower front part of the left clamping conveyor C901 and the lower front part of the right clamping conveyor C902; the upper end of the hanging plate is connected to the lower middle part of the rear connecting plate 906.

[0138] The supporting cylinder 908 is inclined forward and upward and has a cylinder rod 9081 extending forward and upward. The front end of the cylinder rod 9081 is rotatably connected to the middle of the front connecting plate 905; the rear end of the supporting cylinder 908 is rotatably connected to the lower front end of the hanging plate.

[0139] When the front connecting plate 905 is pressed down so that the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 swing down a preset stroke, the support cylinder 908 exhausts air and the cylinder rod 9081 is naturally compressed.

[0140] When the front connecting plate 905 is pried up so that the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 are both reset to their initial state, the support cylinder 908 draws in air, and the cylinder rod 9081 naturally extends to support the front connecting plate 905 through the support cylinder 908.

[0141] In this regard, it is clear that in the actual application of this application, the front end of the PCB board material feeding device 20 is exposed in the lower part of the operation port 101, and the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 are located in the upper part of the operation port 101. At this time, because their positions are slightly higher, it is inconvenient for the operator to clamp and convey the PCB board material that has been welded at the preset welding position on the bottom surface.

[0142] Therefore, this application makes the PCB board material delivery device 90 further include the front connecting plate 905, the rear connecting plate 906, the rear hanging plate 907 and the support cylinder 908, so that the front end of the left clamping conveyor D903 and the front end of the right clamping conveyor D904 can swing downward.

[0143] During implementation, when the PCB board material that has been soldered at the preset soldering position on the bottom surface is conveyed forward and clamped by the left clamping conveyor D903 and the right clamping conveyor D904, the front connecting plate 905 can be pressed down to make the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 swing downward by a preset stroke. At this time, the PCB board material that has been soldered at the preset soldering position on the bottom surface is placed obliquely forward and downward, so that the operator can easily pick it up from the operation port 101, making picking up simple and effortless.

[0144] Then, the front connecting plate 905 can be lifted upwards to reset the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 to their initial states. At this time, the support cylinder 908 will automatically draw in air, and the cylinder rod 9081 will naturally extend to support the front connecting plate 905 through the support cylinder 908. In this way, even if the PCB board material that has been soldered at the next preset soldering position on the bottom surface is clamped and conveyed forward, it can be received again by the left clamping conveyor D903 and the right clamping conveyor D904.

[0145] This cyclical operation allows the present application to perform flux spraying, soldering, and rotation operations on PCBs that have been soldered at multiple preset soldering positions on the bottom surface one by one, resulting in high operational efficiency and significantly improved production capacity.

[0146] It should be added that, in specific implementation, comparison should be made with... Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, according to one embodiment of the present invention, this application also includes a material tray 100 for loading PCB board materials;

[0147] The bottom surface of the tray 100 has a viewing window 1001 to expose the preset soldering position on the bottom surface of the incoming PCB board.

[0148] Furthermore, the gap between the left clamping conveyor A201 and the right clamping conveyor A202 is equal to the gap between the left clamping conveyor B801 and the right clamping conveyor B802, and equal to the gap between the left clamping conveyor C901 and the right clamping conveyor C902, and equal to the gap between the left clamping conveyor D903 and the right clamping conveyor D904, so that the tray 100 is adapted to be clamped and conveyed backward by the left clamping conveyor A201 and the right clamping conveyor A202, adapted to be clamped and conveyed forward by the left clamping conveyor B801 and the right clamping conveyor B802, adapted to be clamped and conveyed forward by the left clamping conveyor C901 and the right clamping conveyor C902, and adapted to be clamped and conveyed forward by the left clamping conveyor D903 and the right clamping conveyor D904.

[0149] Therefore, it is clear that in the actual application of this application, the material tray 100 is used to place the PCB board material that needs to be sprayed with flux and welded at the preset welding position on the bottom surface. In actual operation, multiple material trays 100 are set up. This makes it convenient to rotate and transfer multiple PCB board materials that need to be sprayed with flux and welded at the preset welding position on the bottom surface, so that the preset welding position on the bottom surface can be sprayed with flux and welded one by one.

[0150] For the above-mentioned operations, by setting a material tray 100 of appropriate size to handle the incoming PCB board, the incoming PCB board can be well protected and its periphery is not easily worn, thus making the reliability of this application better.

[0151] Furthermore, in specific implementation, according to the dual-station selective soldering machine provided in this utility model embodiment, the left-right moving component A301, the front-back moving component A302, the left-right moving component B401, the front-back moving component B402, the lifting component A70, and the lifting component B803 are all preferably screw-driven linear modules, chain-driven linear modules, belt-driven linear modules, or cylinder-driven linear modules, etc., which are common in the prior art, so their details are not described here.

[0152] Furthermore, in specific implementation, according to the dual-station soldering machine provided in this utility model embodiment, this application adopts a left and right dual-station configuration, sharing an operating port 101 opened from left to right. That is, the PCB board material feeding device 20, two-dimensional moving mechanism A30, two-dimensional moving mechanism B40, flux sprayer 50, solder pump 60, lifting component A70, PCB board material lifting device 80, PCB board material unloading device 90, and material tray 100 are all provided in two sets, so that this application can simultaneously or without distinction between front and back to rotary convey the PCB board materials that need to be sprayed with flux and soldered at the two preset soldering positions on the bottom surface, so that the preset soldering positions on the bottom surface can be sprayed with flux and soldered one by one.

[0153] This allows the application to adopt a dual-station design, thereby optimizing the overall work efficiency.

[0154] Furthermore, it should be added that, in specific implementation, the bottom four corners of the chassis 10 are respectively provided with height adjustment pads 102 and casters 103. By manipulating the height adjustment pads 102, the stability of this application when placed on the ground or other platforms can be improved. By setting the casters 103, when they are unlocked or when the height adjustment pads 102 are raised, the application can be easily transported and moved.

[0155] Other embodiments, etc., will not be described here.

[0156] In summary, the dual-station selective soldering machine provided in this application, in specific implementation, has the functions of spraying flux at the preset soldering position on the bottom surface of the incoming PCB board and soldering. That is, this application integrates the flux spraying process and the soldering process into one device, which eliminates the trouble of separately equipping flux spraying device and soldering machine device. As a result, this application is convenient to use, and the overall structure of this application is necessarily very compact, which can save a lot of structural components, such as the amount of consumable materials for the machine casing, etc., so that it occupies little space and can be placed in a localized area with limited space, thus making it highly adaptable to use.

[0157] Furthermore, this application allows for continuous operation. When the flux is exhausted, the PCB board material feeding device 20 can immediately transport the PCB board material backward by a preset stroke. Under the control of the two-dimensional moving mechanism B40, the solder pump 60 is driven to move left and right and back and forth to perform welding on the preset welding position on the bottom surface of the PCB board material where flux has been sprayed. This process is fully automated and highly continuous, resulting in high flux spraying efficiency and high welding efficiency at the preset welding position on the bottom surface of the PCB board material. It also reduces the likelihood of missed spraying, inaccurate spraying position, and inaccurate welding position, making this application highly reliable.

[0158] Furthermore, this application employs a PCB board inbound rotary operation. When the PCB board inbound lifting device 80 descends to the first position, its front end connects with the rear end of the PCB board inbound guiding device 20 to receive the PCB board inbound material that has been soldered at the preset soldering position on the bottom surface, which is being conveyed backward by the PCB board inbound guiding device 20. Then, when the PCB board inbound lifting device 80 rises to the second position, its front end connects with the rear end of the PCB board inbound exit device 90 to convey the PCB board inbound material that has been soldered at the preset soldering position on the bottom surface forward to the PCB board inbound exit device 90. The device 90, under the conveying of the PCB board material delivery device 90, exports PCB board materials with pre-set soldering positions on the bottom surface completed from the operation port 101. In this way, even the rotation of the PCB board material allows the operator to stand or sit at the operation port 101 to place and import PCB board materials with pre-set soldering positions on the bottom surface that have not been sprayed with flux and have not been soldered, and to pick up and export PCB board materials with pre-set soldering positions on the bottom surface that have been sprayed with flux and have been soldered. This eliminates the trouble of the operator walking back and forth, greatly saves the operator's physical strength, and makes the operation of this application easy and effortless.

[0159] Furthermore, in practical application of this application, the front end of the PCB board feeding device 20 is exposed in the lower part of the operation port 101, while the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 are located in the upper part of the operation port 101. At this time, due to their slightly higher position, it is inconvenient for the operator to handle the PCB board feeding device 90 after it has been welded to the preset welding position on the lower surface. Therefore, this application further includes the front connecting plate 905, the rear connecting plate 906, the rear hanging plate 907, and the supporting cylinder 908, so that the left clamping conveyor D903... Both the front end and the front end of the right clamping conveyor D904 can swing downwards. During implementation, when the PCB board material that has been soldered at the preset soldering position on the bottom surface is conveyed forward and clamped by the left clamping conveyor D903 and the right clamping conveyor D904, the front connecting plate 905 can be pressed down to make the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 swing downwards by a preset stroke. At this time, the PCB board material that has been soldered at the preset soldering position on the bottom surface is placed obliquely forward and downward, so that the operator can easily pick it up from the operation port 101, making picking up simple and effortless.

[0160] Next, the front connecting plate 905 is lifted upwards to reset the front ends of the left clamping conveyor D903 and the right clamping conveyor D904 to their initial states. At this time, the support cylinder 908 will automatically draw in air, and the cylinder rod 9081 will naturally extend to support the front connecting plate 905. In this way, the PCB board material that has been welded at the next preset welding position on the bottom surface is clamped and conveyed forward, so that it can be received again by the left clamping conveyor D903 and the right clamping conveyor D904. This cycle is repeated, which makes it convenient for this application to perform flux spraying, welding and rotation operations on multiple PCB board materials that have been welded at multiple preset welding positions on the bottom surface one by one, so that the operation efficiency of this application is high and the production capacity can be greatly improved.

[0161] Furthermore, by setting up a material tray 100 of appropriate size to handle the incoming PCB board, the incoming PCB board can be well protected, and its periphery is not easily worn, making the reliability of this application better.

[0162] Furthermore, the dual-station selective soldering machine provided in this application is indeed highly practical and has excellent performance, which makes this application inherently valuable for market promotion and will certainly be very popular and widely adopted.

[0163] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0164] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A dual station selective soldering machine characterised in that, include: Chassis; The chassis has a PCB board feeding device located in the middle of the chassis along the front-to-back direction, and an operation port is opened in the front middle of the chassis to expose the front end of the PCB board feeding device. Two-dimensional moving mechanism A and two-dimensional moving mechanism B; Two-dimensional moving mechanism A and two-dimensional moving mechanism B are fixedly installed in the lower part of the chassis from front to back, so as to be located below the PCB board material feeding device; Flux sprayer; The flux sprayer is fixed upward to the two-dimensional moving mechanism A, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism A, so as to spray flux on the preset soldering position on the bottom surface of the PCB board material being conveyed backward by the PCB board material feeding device. Solder pump; The solder pump is fixed upward to the two-dimensional moving mechanism B, so that it can move left and right and back and forth under the control of the two-dimensional moving mechanism B, so as to perform soldering on the preset soldering position where flux is sprayed on the bottom surface of the PCB board material being conveyed backward by the PCB board material feeding device.

2. The dual station selective soldering machine of claim 1, wherein, The two-dimensional moving mechanism A includes a left-right moving component A and a forward-backward moving component A; The left-right moving component A is fixedly installed in the lower front part of the chassis along the left-right direction; The forward and backward moving component A is fixed on the left and right moving component A along the forward and backward direction, so that it can move left and right under the control of the left and right moving component A; The flux injector is fixed on the forward and backward moving component A, so that it can move back and forth under the control of the forward and backward moving component A.

3. The dual station select soldering machine of claim 1, wherein, The two-dimensional moving mechanism B includes a left-right moving component B and a forward-backward moving component B; The left-right moving component B is fixed in the lower middle part of the chassis along the left-right direction and is located behind the left-right moving component A; The forward and backward moving component B is fixed on the left and right moving component B along the forward and backward direction, so that it can move left and right under the control of the left and right moving component B; The solder pump is fixed on the forward and backward moving component B, so that it can move back and forth under the control of the forward and backward moving component B.

4. The dual station selective solder according to claim 3, wherein, It also includes a lifting component A for controlling the raising and lowering of the solder pump; The lifting component A is fixed between the bottom of the solder pump and the top of the forward and backward moving component B.

5. The dual station select soldering machine of claim 1 wherein, The rear part of the chassis is equipped with a PCB board feeding lifting device along the front-to-back direction, and the upper part of the chassis is equipped with a PCB board feeding and discharging device located above the PCB board feeding and discharging device along the front-to-back direction. The front end of the PCB board feeding and discharging device is exposed at the operation port. When the PCB board lifting device descends to the first position, its front end connects with the rear end of the PCB board feeding device to receive the PCB board material that has been welded at the preset welding position on the bottom surface and is conveyed backward by the PCB board feeding device. When the PCB board feeding lifting device rises to the second position, its front end connects with the rear end of the PCB board feeding and discharging device to transport the PCB board feeding material that has been soldered at the preset soldering position on the bottom surface forward to the PCB board feeding and discharging device, so that it can be discharged from the operating port under the transport of the PCB board feeding and discharging device.

6. The dual-station selective soldering machine according to claim 5, characterized in that, The PCB board feeding device includes a left clamping conveyor A and a right clamping conveyor A arranged in the front-back direction; Under the clamping and conveying of the left clamping conveyor A and the right clamping conveyor A, the PCB board is conveyed from front to back.

7. The dual-station selective soldering machine according to claim 6, characterized in that, The PCB board material lifting device includes a left clamping conveyor B and a right clamping conveyor B arranged in the front-back direction, and a lifting component B for controlling the left clamping conveyor B and the right clamping conveyor B to rise and fall synchronously to switch between a first position and a second position. When the lifting component B controls the left clamping conveyor B and the right clamping conveyor B to descend to the first position, the left clamping conveyor B and the right clamping conveyor B together receive the PCB board material that has been welded at the preset welding position on the bottom surface, which is conveyed from front to back.

8. The dual station selective soldering machine of claim 7, wherein, The PCB board feeding and unloading device includes a left clamping conveyor C and a right clamping conveyor C arranged in the front-to-back direction; When the lifting component B controls the left clamping conveyor B and the right clamping conveyor B to rise to the second position, the left clamping conveyor B and the right clamping conveyor B clamp the PCB board that has been welded at the preset welding position on the bottom surface and convey it forward so that it can be received by the left clamping conveyor C and the right clamping conveyor C.

9. The dual station select soldering machine of claim 8, wherein, The PCB board feeding and unloading device also includes a left clamping conveyor D, a right clamping conveyor D, a front connecting plate, a rear connecting plate, a rear hanging plate, and a support cylinder arranged in the front-to-back direction. The rear end of the left clamping conveyor D is rotatably connected to the front end of the left clamping conveyor C; the rear end of the right clamping conveyor D is rotatably connected to the front end of the right clamping conveyor C. The left clamping conveyor C and the right clamping conveyor C clamp the incoming PCB board that has been soldered at the preset soldering position on the bottom surface and convey it forward so that it can be received by the left clamping conveyor D and the right clamping conveyor D together. The front connecting plate is connected between the lower front part of the left clamping conveyor D and the lower front part of the right clamping conveyor D; the rear connecting plate is connected between the lower front part of the left clamping conveyor C and the lower front part of the right clamping conveyor C; the upper part of the hanging plate is connected to the lower middle part of the rear connecting plate. The support cylinder is tilted forward and upward and has a cylinder rod extending forward and upward. The front end of the cylinder rod is rotatably connected to the middle of the front connecting plate; the rear end of the support cylinder is rotatably connected to the lower front end of the hanging plate. When the front connecting plate is pressed down so that the front ends of the left clamping conveyor D and the right clamping conveyor D swing down a preset stroke, the cylinder rod is naturally compressed. When the front connecting plate is pried up so that the front ends of the left and right clamping conveyors D are both reset to their initial state, the cylinder rod naturally extends to support the front connecting plate via the support cylinder.

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