A laser soldering apparatus

Abstract

The utility model discloses a laser solder ball welding device for solving the technical problem of lacking the cleaning function of the existing laser solder ball welding device. The laser solder ball welding device of the utility model is provided with a rotary driving part connected with a distributing disc on the upper fixing seat, the distributing disc is provided with a plurality of tin ball holes arranged at intervals in the circumferential direction, the upper fixing seat is provided with a feeding hole at the position corresponding to one of the tin ball holes; the upper fixing seat is provided with a blowing assembly, the nozzle is arranged on the lower fixing seat, the blowing assembly is used for blowing the tin ball in the tin ball hole into the nozzle, the upper fixing seat is provided with a laser port at the position corresponding to the nozzle, and the laser head is located above the laser port; the cleaning assembly comprises a cleaning laser and a negative pressure air duct, the first end of the negative pressure air duct is connected with a negative pressure connector, the second end of the negative pressure air duct can be communicated with the tin ball hole at the aligned position, the upper fixing seat is provided with a laser hole at the position corresponding to the second end of the negative pressure air duct, and the cleaning laser is arranged above the laser hole.

Description

Technical Field

[0001] This utility model relates to the field of solder ball welding technology, and in particular to a laser solder ball welding device. Background Technology

[0002] Solder ball laser welding systems are mainly used in the 3C electronics industry, such as welding precision micro-components like camera modules, VCM modules, contact brackets, and magnetic heads. In existing solder ball welding devices, solder balls enter the solder ball holes of the distribution tray through the loading hole of the upper fixed seat. Then, the distribution tray is driven to rotate, aligning the solder ball holes with the air blowing component. Subsequently, the air blowing component blows the solder balls from the solder ball holes into the nozzle. Finally, the laser component heats and melts the solder balls, and the molten solder is sprayed through the nozzle to the designated location to complete the subsequent welding process.

[0003] Since existing material sorting trays generally have multiple solder ball holes, after the soldering work is completed, a certain number of solder balls remain on the material sorting tray that have not been conveyed to the nozzle. In order to prevent these solder balls from affecting the next soldering work, the current practice is to disassemble the material sorting tray for cleaning. However, the disassembly and assembly process is relatively complicated and poses a certain operational difficulty for operators. Furthermore, repeated disassembly and assembly can easily affect the assembly accuracy and is not conducive to the long-term use of the device.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0005] This utility model discloses a laser solder ball welding device to solve the technical problem that existing laser solder ball welding devices lack cleaning functions.

[0006] This utility model provides a laser solder ball welding device, including an upper fixed base, a lower fixed base, an air blowing component, a cleaning component, a laser head, a nozzle, and a material distribution plate rotatably disposed between the upper fixed base and the lower fixed base;

[0007] The upper fixed base is equipped with a rotary drive component connected to the distributing plate. The distributing plate is provided with a plurality of spaced solder ball holes along the circumferential direction. The upper fixed base is provided with a feeding hole at a position corresponding to one of the solder ball holes.

[0008] The upper fixed base is provided with an air blowing assembly, and the nozzle is provided on the lower fixed base. The air blowing assembly is used to blow the solder ball in the solder ball hole into the nozzle. The upper fixed base has a laser port at a position corresponding to the nozzle, and the laser head is located above the laser port.

[0009] The cleaning assembly includes a cleaning laser and a negative pressure airway. The first end of the negative pressure airway is connected to a negative pressure connector, and the second end of the negative pressure airway can communicate with a solder ball hole at an aligned position. The upper fixing base has a laser hole at a position corresponding to the second end of the negative pressure airway, and the cleaning laser is disposed above the laser hole.

[0010] Optionally, the air blowing assembly includes an air blowing connector and an air inlet;

[0011] The air intake is disposed on the upper fixed base, the first end of the air intake is connected to the air blowing connector, and the second end of the air intake can communicate with a single solder ball hole at the aligned position.

[0012] Optionally, the lower fixed base is further provided with a feeding channel, the first end of the feeding channel being correspondingly provided with the second end of the air inlet channel, and the second end of the feeding channel being connected to the nozzle.

[0013] Optionally, an optical lens is provided inside the laser port.

[0014] Optionally, a sealing ring is provided between the optical lens and the laser port.

[0015] Optionally, the material distribution tray is further provided with a plurality of spaced light-transmitting holes along the circumferential direction. The light-transmitting holes are located inside or outside the solder ball holes. The upper fixing seat is provided with a first through hole, and the lower fixing seat is provided with a second through hole at a position corresponding to the first through hole. Both the first through hole and the second through hole can communicate with a single light-transmitting hole at the aligned position. A position sensor is provided above the first through hole or below the second through hole.

[0016] Optionally, the lower fixed base is further provided with a pressure detection channel, the first end of which is connected to the nozzle, and the second end of which is connected to a pressure sensor.

[0017] Optionally, the rotary drive includes a stepper motor and an output shaft;

[0018] The output end of the stepper motor is connected to the output shaft, and the output shaft is connected to the material distribution plate.

[0019] Optionally, the feeding hole is provided with a feeding pipe.

[0020] Optionally, the nozzle has an injection port whose diameter gradually decreases from the inside to the outside.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] In this laser solder ball welding device, solder balls enter the solder ball hole of the powder tray through the feeding hole. Driven by a rotary drive, the distribution tray rotates. When the solder ball hole aligns with the air blowing assembly, the air blowing assembly blows the solder ball into the nozzle. Subsequently, the laser head emits a laser beam onto the solder ball, heating and melting it. Finally, the air blowing assembly blows the molten solder out of the nozzle, allowing it to fall into a designated location. After the welding process is completed, the distribution tray continues to rotate. When the negative pressure air channel aligns with the solder ball hole, the cleaning laser emits a laser beam onto the solder ball in the hole, melting it. The melted molten solder is then extracted from the laser solder ball welding device through the negative pressure air channel. This design effectively removes residual solder balls from the distribution tray, significantly improving the cleaning efficiency of the laser solder ball welding device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a laser solder ball welding device provided by this utility model;

[0025] Figure 2 Another structural schematic diagram of a laser solder ball welding device provided by this utility model;

[0026] Figure 3 An exploded view of the structure of a laser solder ball welding device provided by this utility model;

[0027] Figure 4 A schematic diagram of the material distribution tray of a laser solder ball welding device provided by this utility model;

[0028] Figure 5 A schematic diagram of the air inlet in a laser solder ball welding device provided by this utility model;

[0029] Figure 6 A schematic diagram of the feeding channel in a laser solder ball welding device provided by this utility model;

[0030] Figure 7 A schematic diagram of the gas pressure detection channel in a laser solder ball welding device provided by this utility model;

[0031] Figure 8 A schematic diagram of the negative pressure air passage in a laser solder ball welding device provided by this utility model.

[0032] Illustration: Upper fixed base 1; Lower fixed base 2; Rotary drive component 3; Feeding pipe 4; Air blowing connector 5; Nozzle 6; Air pressure sensor 7; Negative pressure connector 8; Laser hole 9; Laser port 10; First through hole 11; Distributor plate 12; Solder ball hole 13; Light transmission hole 14; Air inlet 15; Feeding channel 16; Air pressure detection channel 17; Negative pressure air channel 18; Second through hole 19. Detailed Implementation

[0033] This utility model discloses a laser solder ball welding device to solve the technical problem that existing laser solder ball welding devices lack cleaning functions.

[0034] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see Figures 1 to 8 The present invention provides a laser solder ball welding device, which includes an upper fixed seat 1, a lower fixed seat 2, an air blowing component, a cleaning component, a laser head, a nozzle 6, and a material distribution plate 12 rotatably disposed between the upper fixed seat 1 and the lower fixed seat 2.

[0036] The upper fixed base 1 is equipped with a rotary drive 3 connected to the material distribution plate 12. The material distribution plate 12 is provided with a plurality of spaced solder ball holes 13 along the circumferential direction. The upper fixed base 1 is provided with a feeding hole at a position corresponding to one of the solder ball holes 13.

[0037] The upper fixed base 1 is provided with an air blowing assembly, and the nozzle 6 is provided on the lower fixed base 2. The air blowing assembly is used to blow the solder ball in the solder ball hole 13 into the nozzle 6. The upper fixed base 1 is provided with a laser port 10 at a position corresponding to the nozzle 6, and the laser head is located above the laser port 10.

[0038] The cleaning assembly includes a cleaning laser and a negative pressure airway 18. The first end of the negative pressure airway 18 is connected to a negative pressure connector 8, and the second end of the negative pressure airway 18 can communicate with the solder ball hole 13 at the aligned position. The upper fixing seat 1 has a laser hole 9 at the position corresponding to the second end of the negative pressure airway 18, and the cleaning laser is arranged above the laser hole 9.

[0039] It should be noted that the aforementioned negative pressure connector 8 is specifically connected to a negative pressure generator, thereby generating negative pressure in the negative pressure airway 18.

[0040] In this embodiment of the laser solder ball welding device, solder balls enter the solder ball hole 13 of the powder tray through the loading hole. Then, driven by the rotary drive 3, the distribution tray 12 is driven to rotate. When the solder ball hole 13 rotates to the position corresponding to the air blowing component, the air blowing component blows the solder ball into the nozzle 6. Subsequently, the laser head emits a laser beam at the solder ball to heat and melt it. Finally, the air blowing component blows the molten solder out of the nozzle 6 so that the molten solder falls to the designated position. After the welding process is completed, the distribution tray 12 continues to be driven to rotate. When the negative pressure air channel 18 is aligned with the solder ball hole 13, the cleaning laser emits a laser beam at the solder ball in the solder ball hole 13 to melt it. The melted molten solder is extracted from the laser solder ball welding device through the negative pressure air channel 18. Through the above design, the solder balls remaining on the distribution tray 12 can be effectively removed, greatly improving the cleaning efficiency of the laser solder ball welding device.

[0041] Furthermore, the air blowing assembly in this embodiment includes an air blowing connector 5 and an air inlet 15;

[0042] The air intake duct 15 is disposed on the upper fixed base 1. The first end of the air intake duct 15 is connected to the air blowing connector 5, and the second end of the air intake duct 15 can communicate with a single solder ball hole 13 at the aligned position.

[0043] It should be noted that the air blowing connector 5 mentioned above needs to be connected to an inert gas source. When the material distribution plate 12 is driven to rotate so that the solder ball hole 13 is aligned with the second end of the air inlet, the air blowing connector 5 blows in gas so that the solder ball in the solder ball hole 13 is blown into the nozzle 6.

[0044] Furthermore, in this embodiment, the lower fixed base 2 is also provided with a feeding channel 16, the first end of the feeding channel 16 is correspondingly provided with the second end of the air inlet 15, and the second end of the feeding channel 16 is connected to the nozzle 6.

[0045] It should be noted that, with the above design, when the air blowing joint 5 blows the gas to blow the solder ball away from the solder ball hole 13, the solder ball enters the nozzle 6 through the above-mentioned feeding channel 16.

[0046] Furthermore, in this embodiment, an optical lens is provided inside the laser port 10.

[0047] It should be noted that the design of the optical lens described above facilitates the accurate illumination of the solder ball by the laser head. Furthermore, in this embodiment, the optical lens is preferably a lens with a focusing function.

[0048] In addition, a sealing ring is provided between the optical lens and the laser port 10 to ensure airtightness.

[0049] Furthermore, in this embodiment, the material distribution tray 12 is also provided with a plurality of spaced light-transmitting holes 14 along the circumferential direction. The light-transmitting holes 14 are located inside or outside the solder ball holes 13. The upper fixing seat 1 is provided with a first through hole 11, and the lower fixing seat 2 is provided with a second through hole 19 at a position corresponding to the first through hole 11. Both the first through hole 11 and the second through hole 19 can communicate with a single light-transmitting hole 14 at the aligned position. A position sensor is provided above the first through hole 11 or below the second through hole 19.

[0050] It should be noted that the aforementioned position sensor is specifically a photoelectric sensor. When the dispensing tray 12 is driven to rotate so that the first through hole 11, the light-transmitting hole 14, and the second through hole 19 are aligned in a straight line, the light emitted by the photoelectric sensor can directly penetrate the first through hole 11, the second through hole 19, and the light-transmitting hole 14. This indicates that the dispensing tray 12 is in the correct position after rotation, thus confirming that the solder ball hole 13 corresponds to the air inlet 15 and the material feeding channel 16. When the light cannot be blocked, it indicates that the dispensing tray 12 is in the wrong position after rotation, and the operator needs to adjust the position of the dispensing tray 12 in a timely manner.

[0051] Furthermore, in this embodiment, the lower fixed base 2 is also provided with a pressure detection channel 17, the first end of which is connected to the nozzle 6, and the second end of which is connected to a pressure sensor 7.

[0052] It should be noted that, through the above design, when the air blowing assembly blows the solder ball on the solder ball hole 13 into the nozzle 6, since the solder ball blocks the nozzle 6 to prevent the nozzle 6 from communicating with the outside, at this time, the air pressure sensor 7 detects the change in the internal pressure of the nozzle 6, and can then send feedback to the control system so that the control system can control the laser head to start heating and melting the solder ball in the nozzle 6.

[0053] In addition, in this embodiment, the position sensor, laser head, barometric pressure sensor 7, etc. are all connected to the control system to achieve automation.

[0054] Furthermore, the rotary drive 3 in this embodiment includes a stepper motor and an output shaft;

[0055] The output end of the stepper motor is connected to the output shaft, and the output shaft is connected to the material distribution plate 12.

[0056] Furthermore, in this embodiment, the feeding hole is provided with a feeding pipe 4.

[0057] It should be noted that, through the above design, the feeding pipe 4 can guide the incoming solder balls in batches, thereby ensuring that the solder balls can fall accurately into the solder ball hole 13.

[0058] Furthermore, the nozzle 6 in this embodiment has a spray port, the diameter of which gradually decreases from the inside to the outside.

[0059] It should be noted that the above design can increase the spray pressure when molten tin is ejected.

[0060] The above provides a detailed description of the laser solder ball welding device provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A laser solder ball welding device, characterized in that, It includes an upper fixed seat (1), a lower fixed seat (2), an air blowing assembly, a cleaning assembly, a laser head, a nozzle (6), and a material distribution plate (12) rotatably disposed between the upper fixed seat (1) and the lower fixed seat (2). The upper fixed seat (1) is equipped with a rotary drive (3) connected to the material distribution plate (12). The material distribution plate (12) is provided with a plurality of spaced solder ball holes (13) along the circumferential direction. The upper fixed seat (1) is provided with a feeding hole at a position corresponding to one of the solder ball holes (13). The upper fixed seat (1) is provided with an air blowing assembly, and the nozzle (6) is provided on the lower fixed seat (2). The air blowing assembly is used to blow the solder ball in the solder ball hole (13) into the nozzle (6). The upper fixed seat (1) is provided with a laser port (10) at a position corresponding to the nozzle (6), and the laser head is located above the laser port (10). The cleaning assembly includes a cleaning laser and a negative pressure airway (18). The first end of the negative pressure airway (18) is connected to a negative pressure connector (8). The second end of the negative pressure airway (18) can communicate with the solder ball hole (13) at the alignment position. The upper fixing seat (1) is provided with a laser hole (9) at the position corresponding to the second end of the negative pressure airway (18). The cleaning laser is arranged above the laser hole (9).

2. The laser solder ball welding apparatus according to claim 1, characterized in that, The air blowing assembly includes an air blowing connector (5) and an air inlet (15); The air intake (15) is disposed on the upper fixed seat (1), the first end of the air intake (15) is connected to the air blowing connector (5), and the second end of the air intake (15) can communicate with a single solder ball hole (13) at the aligned position.

3. The laser soldering apparatus of claim 2, wherein The lower fixed base (2) is also provided with a feeding channel (16), the first end of the feeding channel (16) is correspondingly provided with the second end of the air inlet (15), and the second end of the feeding channel (16) is connected to the nozzle (6).

4. The laser soldering apparatus of claim 1, wherein An optical lens is provided inside the laser port (10).

5. The laser soldering apparatus of claim 4, wherein, A sealing ring is provided between the optical lens and the laser port (10).

6. The laser soldering apparatus of claim 1, wherein, The material distribution tray (12) is also provided with a plurality of light-transmitting holes (14) arranged at intervals along the circumferential direction. The light-transmitting holes (14) are located inside or outside the solder ball holes (13). The upper fixing seat (1) is provided with a first through hole (11). The lower fixing seat (2) is provided with a second through hole (19) at a position corresponding to the first through hole (11). The first through hole (11) and the second through hole (19) can both communicate with a single light-transmitting hole (14) at the aligned position. A position sensor is provided above the first through hole (11) or below the second through hole (19).

7. The laser soldering apparatus of claim 1, wherein The lower fixed base (2) is also provided with a pressure detection channel (17), the first end of the pressure detection channel (17) is connected to the nozzle (6), and the second end of the pressure detection channel (17) is connected to a pressure sensor (7).

8. The laser soldering apparatus of claim 1, wherein, The rotary drive (3) includes a stepper motor and an output shaft; The output end of the stepper motor is connected to the output shaft, and the output shaft is connected to the material distribution plate (12).

9. The laser soldering apparatus of claim 1, wherein, The feeding hole is equipped with a feeding pipe (4).

10. The laser solder ball welding apparatus according to claim 1, characterized in that, The nozzle (6) has an injection port, the diameter of which gradually decreases from the inside to the outside.

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