Flexible circuit board laser micro-hole processing device

Abstract

This utility model provides a laser micro-hole processing device for flexible circuit boards, comprising: an adjustable base frame; a processing table, the processing table being fixedly connected to the top of the adjustable base frame, an installation frame being installed on the top of the processing table, a docking frame being installed on the top of the installation frame via a connecting frame, a bayonet being provided on the top of the docking frame, a perforated positioning plate being installed on the top of the bayonet, a negative pressure frame being fixedly connected to the bottom of the docking frame, a suction tube being installed on the bottom of the negative pressure frame, and a filter assembly and an exhaust assembly being installed on the top of the adjustable base frame. This utility model significantly improves waste removal efficiency, reduces manual intervention, increases production automation, effectively reduces the probability of hole jamming, improves processing quality, reduces the defect rate, optimizes the processing environment, reduces waste pollution, and ensures stable equipment operation.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a laser micro-hole processing device for flexible circuit boards. Background Technology

[0002] Flexible printed circuit boards (PCBs) are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending properties.

[0003] Laser micro-hole processing for flexible circuit boards utilizes a high-energy-density laser beam focused on the surface of the flexible circuit board. Through photothermal or photochemical effects, the material is vaporized and dissolved in a very short time, forming a micro-aperture. The principle is that after the laser beam is precisely focused by the optical system, the energy is highly concentrated at the processing point, instantly breaking through the material surface and penetrating into the interior. At the same time, in conjunction with a precision motion control system, the positioning and forming of the micro-holes are achieved.

[0004] During the laser micro-hole processing of flexible circuit boards, waste material inside the micro-holes is difficult to remove, which can easily cause blockage and affect processing quality and subsequent processes.

[0005] Therefore, it is necessary to provide a laser micro-hole processing device for flexible circuit boards to solve the above-mentioned technical problems. Utility Model Content

[0006] This invention provides a laser micro-hole processing device for flexible circuit boards, which solves the problem that waste material inside the micro-holes is difficult to remove during the laser micro-hole processing of flexible circuit boards, which can easily cause blockage and affect processing quality and subsequent processes.

[0007] To solve the above-mentioned technical problems, the present invention provides a flexible circuit board laser micro-hole processing device, comprising: an adjustable base frame; A processing table is fixedly connected to the top of an adjustable base frame. An installation frame is installed on the top of the processing table. A docking frame is installed on the top of the installation frame via a connecting frame. A bayonet is provided on the top of the docking frame. A positioning plate with holes is installed on the top of the bayonet. A negative pressure frame is fixedly connected to the bottom of the docking frame. A suction tube is installed on the bottom of the negative pressure frame. A filter assembly and an exhaust assembly are installed on the top of the adjustable base frame. A protective cabinet is installed on the top of the processing table. A cabinet door is rotatably connected to the front of the protective cabinet. A lifting assembly is installed on the top of the protective cabinet. A first adjustment assembly with a drive structure is installed on the telescopic end of the lifting assembly. A second adjustment assembly with a drive structure is installed at the bottom of the first adjustment assembly. The laser micro-hole processing equipment body is installed at the bottom of the second adjustment assembly. The connecting frame is snapped into the interior of the mounting frame to increase connection stability. The connecting frame is installed at the bottom of the docking frame near the outer surface. The distribution of holes on the perforated positioning plate is determined according to the type of flexible circuit board. The inlet of the exhaust assembly is connected to the filter assembly. The first adjustment assembly and the second adjustment assembly work together to drive the laser micro-hole processing equipment body to adjust its position in multiple directions.

[0008] Preferably, a control box is mounted on the top of the adjusting base, and a door is rotatably connected to the front of the control box; The box door is equipped with a lock.

[0009] Preferably, the adjustable base includes a base plate, a mounting structure, and an adjusting structure, wherein the mounting structure is used to install the adjusting structure on the bottom of the base plate; The threaded connection between the adjustment structure and the installation structure can adjust the stability of the base plate.

[0010] Preferably, the first adjusting component includes an adjusting frame, a slide rod, an adjusting screw, and an internal threaded bracket. The adjusting frame is installed on the telescopic end of the lifting component, the adjusting screw and the slide rod are installed inside the adjusting frame, and the internal threaded bracket is installed on the outer surface of the adjusting screw and the slide rod. The slide rod and the internal threaded bracket are slidably connected, the internal threaded bracket and the adjusting screw are threadedly connected, and the adjusting screw is connected to the drive structure.

[0011] Preferably, the exhaust assembly includes a mounting shell, a vacuum generator, an exhaust pipe, and a suction pipe. The mounting shell is used to mount the vacuum generator on the top of the adjustable base, and the exhaust pipe and suction pipe are respectively installed at the inlet and outlet of the vacuum generator. A vacuum generator provides suction.

[0012] Preferably, the filtration assembly includes a filter box and an interceptor component, the interceptor component being installed inside the filter box.

[0013] Preferably, a cooling frame is installed on the top of the protective cabinet, and a cooling component is installed on the top of the cooling frame; Air inlets are provided on both sides of the refrigeration frame, and the top of the refrigeration frame is connected to the top of the protective cabinet.

[0014] Preferably, filters are installed on both sides of the refrigeration assembly, and the refrigeration assembly includes a fixed base and a semiconductor refrigeration component. The fixed base is used to install the semiconductor refrigeration component on the top of the refrigeration frame. The cooling surface of the semiconductor cooling component faces the inside of the protective cabinet.

[0015] Compared with related technologies, this utility model has the following beneficial effects: This invention provides a laser micro-hole processing device for flexible circuit boards. To facilitate waste removal during the laser micro-hole processing of flexible circuit boards, a docking frame with a bayonet is installed on the top of the processing table via a mounting frame. Different types of perforated positioning plates are then inserted into the bayonet. The openings on the perforated positioning plates allow waste to be discharged during the laser micro-hole processing of different types of flexible circuit boards. A negative pressure frame is installed at the bottom of the docking frame. The exhaust component provides suction to draw the waste into the filter component for filtration before expelling the air, reducing dust pollution from the waste. This design significantly improves waste removal efficiency, reduces manual intervention, increases production automation, effectively reduces the probability of jamming, improves processing quality, reduces the defect rate, optimizes the processing environment, reduces waste pollution, and ensures stable equipment operation. Attached Figure Description

[0016] Figure 1 A schematic diagram of the first embodiment of the laser micro-hole processing device for flexible circuit boards provided by this utility model; Figure 2 A schematic diagram of the adjustment structure is provided for this utility model; Figure 3 Provided for this utility model Figure 2 An enlarged view of point A shown; Figure 4 A schematic diagram of the exhaust structure is provided for this utility model; Figure 5 A schematic diagram of the second embodiment of the laser micro-hole processing device for flexible circuit boards provided by this utility model; Figure 6 A structural schematic diagram of the refrigeration component is provided for this utility model; Figure 7 Provided for this utility model Figure 6 A magnified view of point B shown.

[0017] The diagram is labeled as follows: 1. Adjustable base frame; 101. Base plate; 102. Mounting structure; 103. Adjustable structure. 2. Control box; 3. Box door; 4. Filter assembly, 401. Filter box, 402. Interception component; 5. Exhaust assembly; 501. Mounting housing; 502. Vacuum generator; 503. Exhaust pipe; 504. Suction pipe II; 6. Processing table; 7. Protective cabinet; 8. Cabinet door; 9. Lifting assembly; 10. Suction tube 1; 11. Docking frame; 12. Connecting frame; 13. Mounting frame; 14. Drive structure. 15. First adjustment component; 151. Adjustment frame; 152. Slide rod; 153. Adjustment screw; 154. Internal threaded bracket; 16. Second adjustment component; 17. Positioning plate with holes; 18. Bayonet; 19. Negative pressure frame; 20. Cooling frame; 21. Refrigeration assembly; 211. Mounting base; 212. Semiconductor refrigeration component; 22. Filter screen; 23. Laser micro-hole processing equipment body. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] First embodiment: Please refer to the following: Figures 1-4 The first embodiment of this invention provides a laser micro-hole processing device for flexible circuit boards, comprising: an adjustable base frame 1; The processing table 6 is fixedly connected to the top of the adjusting base frame 1. The top of the processing table 6 is equipped with an installation frame 13. The top of the installation frame 13 is equipped with a docking frame 11 through a connecting frame 12. The top of the docking frame 11 is provided with a bayonet 18. The top of the bayonet 18 is equipped with a perforated positioning plate 17. The bottom of the docking frame 11 is fixedly connected with a negative pressure frame 19. The bottom of the negative pressure frame 19 is equipped with a suction tube 10. The top of the adjusting base frame 1 is equipped with a filter assembly 4 and an exhaust assembly 5. The protective cabinet 7 is installed on the top of the processing table 6. The front of the protective cabinet 7 is rotatably connected to the cabinet door 8. The top of the protective cabinet 7 is equipped with a lifting component 9. The telescopic end of the lifting component 9 is equipped with a first adjustment component 15 with a drive structure 14. The bottom of the first adjustment component 15 is equipped with a second adjustment component 16 with a drive structure 14. The bottom of the second adjustment component 16 is equipped with the laser micro-hole processing equipment body 23. The connecting frame 12 is inserted into the mounting frame 13 to increase connection stability. The connecting frame 12 is installed at the bottom of the docking frame 11 near the outer surface. The distribution of holes on the perforated positioning plate 17 is determined according to the type of flexible circuit board. The inlet of the exhaust assembly 5 is connected to the filter assembly 4. The first adjustment assembly 15 and the second adjustment assembly 16 cooperate with each other to drive the laser micro-hole processing equipment body 23 to adjust its position in multiple directions. The lifting assembly 9 includes a telescopic rod and a stabilizing rod, which can drive the first adjustment assembly 15 to adjust its position up and down.

[0020] Please refer to Figure 1 A control box 2 is installed on the top of the adjustable base frame 1, and a door 3 is rotatably connected to the front of the control box 2; The door 3 is equipped with a lock, and the control box 2 contains a power switch and a controller for the operation of auxiliary equipment.

[0021] Please refer to Figure 1 and Figure 2The adjustable base frame 1 includes a base plate 101, a mounting structure 102 and an adjusting structure 103. The mounting structure 102 is used to mount the adjusting structure 103 to the bottom of the base plate 101. The threaded connection between the adjustment structure 103 and the mounting structure 102 can adjust the stability of the base plate 101.

[0022] Please refer to Figure 2 and Figure 3 The first adjustment component 15 includes an adjustment frame 151, a slide rod 152, an adjustment screw 153, and an internal threaded bracket 154. The adjustment frame 151 is installed on the telescopic end of the lifting component 9, the adjustment screw 153 and the slide rod 152 are installed inside the adjustment frame 151, and the internal threaded bracket 154 is installed on the outer surface of the adjustment screw 153 and the slide rod 152. The slide rod 152 and the internal threaded bracket 154 are slidably connected, the internal threaded bracket 154 and the adjusting screw 153 are threadedly connected, and the adjusting screw 153 is connected to the drive structure 14.

[0023] Please refer to Figure 1 , Figure 2 and Figure 4 The exhaust assembly 5 includes a mounting housing 501, a vacuum generator 502, an exhaust pipe 503, and a suction pipe 504. The mounting housing 501 is used to mount the vacuum generator 502 on the top of the adjusting base 1. The exhaust pipe 503 and the suction pipe 504 are respectively installed at the inlet and outlet of the vacuum generator 502. Vacuum generator 502 provides suction, and the other end of suction tube 504 is connected to one side of filter assembly 4.

[0024] Please refer to Figure 1 , Figure 2 and Figure 4 The filter assembly 4 includes a filter box 401 and an interception component 402, with the interception component 402 installed inside the filter box 401; The other side of the filter box 401 is connected to the other end of the straw 10.

[0025] The working principle of this first embodiment is as follows: A docking frame 11 with a bayonet 18 is installed on the top of the processing table 6 via the mounting frame 13. Then, different types of perforated positioning plates 17 are inserted into the bayonet 18. Through the openings on the different types of perforated positioning plates 17, waste can be discharged during the laser micro-hole processing of different types of flexible circuit boards. A negative pressure frame 19 is installed at the bottom of the docking frame 11. The exhaust component 5 provides suction to draw the waste into the filter component 4 for filtration and then exhausts the air, reducing dust pollution of the surrounding air. In actual use, the corresponding model of perforated positioning plate 17 is first inserted into the bayonet 18, and then the flexible circuit board is placed on the perforated positioning plate 17. At the same time, the exhaust component 5 provides suction to create a negative pressure between the perforated positioning plate 17 and the flexible circuit board, which firmly adsorbs it. After fixing, the cabinet door 8 can be closed and the laser micro-hole processing equipment body 23 can be used to perform micro-hole processing on the flexible circuit board.

[0026] In this first embodiment, to facilitate waste removal during the laser micro-hole processing of flexible circuit boards, a docking frame 11 with a bayonet 18 is installed on the top of the processing table 6 via a mounting frame 13. Different types of perforated positioning plates 17 are then inserted into the bayonet 18. The openings on the perforated positioning plates 17 allow waste to be removed during the laser micro-hole processing of different types of flexible circuit boards. A negative pressure frame 19 is installed at the bottom of the docking frame 11. The exhaust assembly 5 provides suction to draw the waste into the filter assembly 4 for filtration before expelling the air. This reduces dust pollution in the waste, significantly improving waste removal efficiency, reducing manual intervention, increasing production automation, effectively reducing the probability of jamming, improving processing quality, reducing defect rates, optimizing the processing environment, reducing waste pollution, and ensuring stable equipment operation.

[0027] Second embodiment: Please refer to the following: Figures 5-7 The second embodiment of this application proposes another laser micro-hole processing apparatus for flexible printed circuit boards. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0028] Specifically, the difference between the flexible circuit board laser micro-hole processing apparatus provided in the second embodiment of this application and the following is noted: Figure 5 The top of the protective cabinet 7 is equipped with a cooling frame 20, and the top of the cooling frame 20 is equipped with a cooling component 21. Air inlets are provided on both sides of the refrigeration frame 20, and the top of the refrigeration frame 20 is connected to the top of the protective cabinet 7.

[0029] Please refer to Figures 5-7The cooling assembly 21 has filters 22 installed on both sides. The cooling assembly 21 includes a fixed base 211 and a semiconductor cooling component 212. The fixed base 211 is used to install the semiconductor cooling component 212 on the top of the cooling frame 20. The cooling surface of the semiconductor cooling component 212 faces the inside of the protective cabinet 7, and the heating surface of the semiconductor cooling component 212 faces the top of the cooling frame 20.

[0030] In this second embodiment, to assist in cooling the interior of the protective cabinet 7, a cooling frame 20 with a cooling component 21 is installed on the top of the protective cabinet 7. Holes are provided on both sides of the cooling frame 20 and blocked by filters 22 to prevent dust from entering the interior of the protective cabinet 7. During actual use, the exhaust component 5 provides suction to expel air from inside the protective cabinet 7, while external air enters the interior of the protective cabinet 7 through the filters 22. During this process, the cooling surface of the semiconductor cooling component 212 in the cooling component 21 cools the incoming air, assisting in cooling the protective cabinet 7. Meanwhile, the heating surface of the cooling component 21, located at the top of the cooling frame 20, dissipates heat into the air. This design effectively assists in cooling the interior of the protective cabinet 7, preventing high temperatures from affecting the processing quality during the flexible circuit board laser micro-hole processing device.

[0031] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A laser micro-hole processing device for flexible circuit boards, characterized in that, include: Adjust the base frame (1); A processing table (6) is fixedly connected to the top of an adjustable base frame (1). An installation frame (13) is installed on the top of the processing table (6). A docking frame (11) is installed on the top of the installation frame (13) via a connecting frame (12). A bayonet (18) is opened on the top of the docking frame (11). A perforated positioning plate (17) is installed on the top of the bayonet (18). A negative pressure frame (19) is fixedly connected to the bottom of the docking frame (11). A suction tube (10) is installed on the bottom of the negative pressure frame (19). A filter assembly (4) and an exhaust assembly (5) are installed on the top of the adjustable base frame (1). A protective cabinet (7) is installed on the top of the processing table (6). The front of the protective cabinet (7) is rotatably connected to a cabinet door (8). A lifting assembly (9) is installed on the top of the protective cabinet (7). A first adjustment assembly (15) with a drive structure (14) is installed on the telescopic end of the lifting assembly (9). A second adjustment assembly (16) with a drive structure (14) is installed at the bottom of the first adjustment assembly (15). The laser micro-hole processing equipment body (23) is installed at the bottom of the second adjustment assembly (16).

2. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The top of the adjustable base frame (1) is equipped with a control box (2), and the front of the control box (2) is rotatably connected with a door (3).

3. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The adjustable base frame (1) includes a base plate (101), a mounting structure (102) and an adjusting structure (103). The mounting structure (102) is used to install the adjusting structure (103) on the bottom of the base plate (101).

4. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The first adjustment component (15) includes an adjustment frame (151), a slide rod (152), an adjustment screw (153), and an internal thread frame (154). The adjustment frame (151) is installed on the telescopic end of the lifting component (9). The adjustment screw (153) and the slide rod (152) are installed inside the adjustment frame (151). The internal thread frame (154) is installed on the outer surface of the adjustment screw (153) and the slide rod (152).

5. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The exhaust assembly (5) includes a mounting shell (501), a vacuum generator (502), an exhaust pipe (503), and a second suction pipe (504). The mounting shell (501) is used to mount the vacuum generator (502) on the top of the adjustable base (1). The exhaust pipe (503) and the second suction pipe (504) are respectively installed at the inlet and outlet of the vacuum generator (502).

6. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The filter assembly (4) includes a filter box (401) and an interceptor (402), the interceptor (402) being installed inside the filter box (401).

7. The flexible circuit board laser micro-hole processing device according to claim 1, characterized in that, The top of the protective cabinet (7) is equipped with a cooling frame (20), and the top of the cooling frame (20) is equipped with a cooling component (21).

8. The flexible circuit board laser micro-hole processing device according to claim 7, characterized in that, The cooling assembly (21) has filters (22) installed on both sides. The cooling assembly (21) includes a fixed base (211) and a semiconductor cooling component (212). The fixed base (211) is used to install the semiconductor cooling component (212) on the top of the cooling frame (20).

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