Wafer cutting apparatus

Abstract

The application discloses a wafer cutting device. The wafer cutting device comprises a grinding mechanism and a vacuum generating assembly. The grinding mechanism comprises a bearing table and a grinding stone, the bearing table is provided with a suction channel, the suction port of the suction channel is located on the upper surface of the bearing table, and the grinding stone is arranged on the upper surface of the bearing table. The vacuum generating assembly comprises a first vacuum generator, a second vacuum generator and a three-way cavity, the three-way cavity comprises a first interface, a second interface and a third interface, the first interface is communicated with the suction channel, the second interface is communicated with the first vacuum generator, the third interface is communicated with the second vacuum generator, and the suction force of the first vacuum generator is greater than that of the second vacuum generator. The wafer cutting device provided by the application can at least solve the problems that the water enters the vacuum pipeline of the grinding mechanism in the wafer cutting device in the prior art, the wafer cutting quality is affected, and the system software alarm is caused.

Description

Technical Field

[0001] This application relates to the field of ultra-precision machining technology, and more specifically, to a wafer dicing apparatus. Background Technology

[0002] The grinding unit in a wafer dicing machine plays a crucial role in maintaining the sharpness of the cutting blade and ensuring cutting quality. In existing technology, grinding units are typically equipped with a vacuum tubing system to hold the grinding stones, and during the cutting process, a large amount of coolant is usually used to reduce cutting temperature, minimize blade wear, and flush away cutting debris. This coolant splashes throughout the working area, easily coming into contact with the vacuum tubing and seeping into its interior.

[0003] When coolant enters the vacuum lines, it reduces the adhesion of the vacuum lines to the sharpening stone, causing the stone to shift or fall off during sharpening, thus affecting the cutting accuracy of the wafer. Furthermore, coolant entering the vacuum lines may trigger the vacuum sensor's protection mechanism due to abnormal pressure, resulting in a software alarm. Utility Model Content

[0004] The main objective of this application is to provide a wafer dicing apparatus to at least solve the problem in the prior art where water ingress into the vacuum tubing of the grinding device in a wafer dicing apparatus affects the wafer dicing quality and triggers system software alarms.

[0005] According to one aspect of this application, a wafer dicing apparatus is provided, comprising:

[0006] A knife sharpening mechanism, comprising a support platform and a sharpening stone, wherein a suction channel is provided on the support platform, the suction port of the suction channel is located on the upper surface of the support platform, and the sharpening stone is disposed on the upper surface of the support platform;

[0007] A vacuum generating assembly includes a first vacuum generator, a second vacuum generator, and a three-way cavity. The three-way cavity includes a first interface, a second interface, and a third interface. The first interface is connected to the suction channel, the second interface is connected to the first vacuum generator, and the third interface is connected to the second vacuum generator. The suction force of the first vacuum generator is greater than that of the second vacuum generator.

[0008] Furthermore, along the height direction of the wafer dicing apparatus, the first interface and the third interface are coaxially arranged and located in a first horizontal plane, while the second interface is located below the first horizontal plane.

[0009] Furthermore, the vacuum generating assembly also includes a Y-type connector and a vacuum sensor. The Y-type connector includes a fourth interface, a fifth interface, and a sixth interface. The fourth interface is connected to the third interface, the fifth interface is connected to the second vacuum generator, and the sixth interface is connected to the vacuum sensor.

[0010] Furthermore, a vacuum filter is provided between the sixth interface and the vacuum sensor.

[0011] Furthermore, the wafer dicing apparatus also includes a vacuum container plate, on which the first vacuum generator and the second vacuum generator are mounted.

[0012] Furthermore, the vacuum container plate is provided with two insertion interfaces, wherein:

[0013] The vacuum generating assembly further includes a first air inlet pipe. The first vacuum generator includes a first air inlet, a first air outlet, and a first connection port. The first air inlet is connected to one end of the first air inlet pipe, and the other end of the first air inlet pipe is connected to an air source. The first air outlet is connected to one of the plug interfaces, and the first connection port is connected to the second interface.

[0014] Furthermore, the vacuum generating assembly also includes a second air inlet pipe. The second vacuum generator includes a second air inlet, a second air outlet, and a second connection port. The second air inlet is connected to one end of the second air inlet pipe, and the other end of the second air inlet pipe is connected to an air source. The second air outlet is connected to another interface on the vacuum container plate, and the second connection port is connected to the fifth interface.

[0015] Furthermore, the wafer dicing apparatus also includes a guide rail component, a processing table, and a dicing tool. The guide rail component extends along a first direction, and the grinding mechanism is fixedly connected to the processing table. The processing table is disposed on the guide rail component and can move along the first direction, thereby driving the grinding mechanism to move to the dicing tool.

[0016] Furthermore, the support platform includes a whetstone suction cup, which is located on the upper surface of the support platform. The upper surface of the whetstone suction cup is provided with vacuum grooves, which are arranged in a grid pattern and are at a predetermined distance from the outer edge of the whetstone suction cup.

[0017] Furthermore, the whetstone suction cup is provided with at least two limiting parts, each of the at least two limiting parts protruding from the upper surface of the whetstone suction cup, and each of the limiting parts has a limiting surface perpendicular to the upper surface of the whetstone suction cup, and the limiting surfaces on at least two of the limiting parts intersect.

[0018] In this invention, by setting a first vacuum generator, a second vacuum generator, and a three-way cavity, and by ensuring that the suction force of the first vacuum generator is greater than that of the second vacuum generator, the stability of the vacuum pressure of the grinding stone and the stability of the readings of the vacuum sensor can be improved during the grinding process. This can solve the problem in the prior art where water enters the vacuum pipeline of the grinding device in the wafer dicing apparatus, affecting the wafer dicing quality and triggering system software alarms. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0020] Figure 1 This is a schematic diagram showing the connection between the three-way cavity and the grinding mechanism of the wafer dicing apparatus disclosed in this application;

[0021] Figure 2 This is a schematic diagram showing the positional relationship between the grinding mechanism and the processing table of the wafer dicing apparatus disclosed in this application.

[0022] The above figures include the following reference numerals:

[0023] 61. Support platform; 611. Sharpening stone suction cup; 6111. Limiting part; 612. Vacuum tank; 613. Ceramic layer; 614. Pad layer; 62. Sharpening stone; 63. Suction channel; 64. Vacuum generating assembly; 641. First vacuum generator; 6411. First air inlet; 6412. First air outlet; 6413. First connection port; 642. Second vacuum generator; 6421. Second air inlet; 6422. Second air outlet; 6423. Second... Connection port; 643, T-shaped cavity; 6431, First interface; 6432, Second interface; 6433, Third interface; 644, Y-type connector; 6441, Fourth interface; 6442, Fifth interface; 6443, Sixth interface; 645, Vacuum sensor; 646, Vacuum filter; 647, First air inlet pipe; 648, Second air inlet pipe; 65, Vacuum container plate; 651, Insertion interface; 66, Machining table; 67, Cutting tool; 68, Support frame. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0027] As mentioned in the background section, in existing technologies, coolant can easily enter the vacuum lines, reducing the adhesion of the vacuum lines to the sharpening stone. This can cause the sharpening stone to shift or fall off during the sharpening process, thus affecting the cutting accuracy of the wafer. Therefore, this application provides a wafer dicing apparatus that solves the problem of water ingress into the vacuum lines of the sharpening device in existing wafer dicing apparatuses, which affects the wafer dicing quality. A detailed description will follow with reference to the accompanying drawings.

[0028] See Figures 1 to 2 As shown, according to an embodiment of this application, a wafer dicing apparatus is provided, which includes a grinding mechanism and a vacuum generating assembly 64.

[0029] Specifically, the sharpening mechanism includes a support platform 61 and a sharpening stone 62. The support platform 61 is provided with a suction channel 63, and the suction port of the suction channel 63 is located on the upper surface of the support platform 61. The sharpening stone 62 is located on the upper surface of the support platform 61. The vacuum generating assembly 64 includes a first vacuum generator 641, a second vacuum generator 642, and a three-way cavity 643. The three-way cavity 643 includes a first interface 6431, a second interface 6432, and a third interface 6433. The first interface 6431 is connected to the suction channel 63, the second interface 6432 is connected to the first vacuum generator 641, and the third interface 6433 is connected to the second vacuum generator 642. The suction force of the first vacuum generator 641 is greater than the suction force of the second vacuum generator 642.

[0030] like Figure 1 As shown, the sharpening mechanism includes a support platform 61 and a sharpening stone 62. The sharpening stone 62 is disposed on the upper surface of the support platform 61. A suction channel 63 is provided on the support platform 61, with the suction port of the suction channel 63 located on the upper surface of the support platform 61 and below the sharpening stone 62. The suction effect of the suction channel 63 can effectively fix the sharpening stone 62 and keep it stable during the grinding process, thereby improving the efficiency and accuracy of sharpening. The vacuum generating assembly 64 includes a first vacuum generator 641, a second vacuum generator 642, and a three-way cavity 643.

[0031] In actual operation, the first vacuum generator 641 and the second vacuum generator 642 provide a vacuum to adsorb the sharpening stone 62 on the support platform 61, preventing the sharpening stone 62 from falling and affecting the sharpening process. Specifically, the three-way cavity 643 includes a first interface 6431, a second interface 6432, and a third interface 6433. The first interface 6431 is connected to the suction channel 63, the second interface 6432 is connected to the first vacuum generator 641, and the third interface 6433 is connected to the second vacuum generator 642. The suction force of the first vacuum generator 641 is greater than that of the second vacuum generator 642. With this configuration, a large amount of coolant needs to be sprayed during the sharpening process. When the coolant enters the vacuum pipeline through the gap between the sharpening stone 62 and the support platform 61, it connects the first vacuum generator 641 and the second interface 6432. The first vacuum generator 641 uses its greater suction force to draw in the coolant and gas and discharge them into the drainage device. The suction force of the first vacuum generator 641 is greater than that of the second vacuum generator 642, which prevents coolant from accumulating in the vacuum pipeline and disrupting the vacuum, ensuring the stability of the vacuum pressure of the sharpening stone 62. This also prevents the sharpening stone 62 from falling off the support platform 61 and affecting the sharpening process, improving the sharpening accuracy and thus improving the dicing quality of the wafer (not shown in the figure). In addition, the gas entering the third interface 6433 contains almost no moisture, which improves the stability of the reading of the vacuum sensor 645 during the sharpening process due to moisture, reducing the occurrence of software alarms.

[0032] In other words, by setting up a first vacuum generator 641, a second vacuum generator 642, and a three-way cavity 643, and by setting the suction force of the first vacuum generator 641 to be greater than that of the second vacuum generator 642, this application can improve the stability of the vacuum pressure of the whetstone 62 and the stability of the reading of the vacuum sensor 645 during the sharpening process.

[0033] like Figure 1 As shown, along the height direction of the wafer dicing apparatus, the first interface 6431 and the third interface 6433 are coaxially arranged and located within the first horizontal plane, while the second interface 6432 is located below the first horizontal plane. The coaxial arrangement of the first interface 6431 and the third interface 6433 within the same horizontal plane facilitates the connection between the suction channel 63 and the first vacuum generator 641 and the second vacuum generator 642. During installation, the coaxial arrangement of the first interface 6431 and the third interface 6433 within the same horizontal plane allows for smoother pipe connection to the corresponding interfaces, reducing pipe bends and twists, lowering the difficulty of pipe installation, and also making the overall pipe layout of the apparatus neater, more aesthetically pleasing, and easier to maintain and manage. Furthermore, the coaxial arrangement also facilitates smoother airflow transmission within the three-way cavity 643. The second interface 6432 being located below the first horizontal plane facilitates the discharge of coolant from the second interface 6432 during the grinding process. Specifically, the second interface 6432 is connected to the first vacuum generator 641 with a large suction force. The coolant entering the vacuum pipeline first flows out from the second interface 6432 under the action of gravity and suction force, reducing the impact of water accumulation in the vacuum pipeline on the vacuum pressure stability of the whetstone 62.

[0034] like Figure 1As shown, the vacuum generating assembly 64 also includes a Y-type connector 644 and a vacuum sensor 645. The Y-type connector 644 includes a fourth interface 6441, a fifth interface 6442, and a sixth interface 6443. The fourth interface 6441 is connected to the third interface 6433, the fifth interface 6442 is connected to the second vacuum generator 642, and the sixth interface 6443 is connected to the vacuum sensor 645. In this embodiment, by setting the Y-type connector 644, the second vacuum generator 642 and the vacuum sensor 645 work independently yet collaboratively. Specifically, the fourth interface 6441 is connected to the third interface 6433, and the fifth interface 6442 is connected to the second vacuum generator 642, ensuring that the second vacuum generator 642 can participate normally in the entire suction process, guaranteeing the adsorption effect on the whetstone 62 and improving the stability of the whetstone 62. The sixth interface 6443 is connected to the vacuum sensor 645, which monitors the vacuum level in the suction channel 63 in real time to ensure it is within the optimal operating range. This helps maintain the stability and consistency of the tool during the grinding process, improving the quality and efficiency of grinding. Furthermore, the Y-connector 644, as an independent component, is easy to disassemble, clean, or replace, preventing dust accumulation in the vacuum lines from affecting performance.

[0035] Furthermore, a vacuum filter 646 is provided between the sixth interface 6443 and the vacuum sensor 645. The vacuum filter 646 between the sixth interface 6443 and the vacuum sensor 645 protects the vacuum sensor 645, preventing fine metal shavings, dust, or other impurities that may be generated during the grinding process from affecting the detection accuracy and lifespan of the vacuum sensor 645. The vacuum filter 646 also improves the measurement accuracy of the vacuum sensor 645 and maintains the stability of the entire vacuum system.

[0036] like Figure 1 As shown, the wafer dicing apparatus also includes a vacuum mounting plate 65, on which a first vacuum generator 641 and a second vacuum generator 642 are mounted. Integrating the first vacuum generator 641 and the second vacuum generator 642 onto the vacuum mounting plate 65 improves system performance, stability, and operational flexibility, while also facilitating equipment management and maintenance.

[0037] Furthermore, the vacuum container plate 65 is provided with two plug-in interfaces 651, which can realize quick plugging and unplugging of the air circuit, simplify the on-site installation process, and improve the maintainability and interchangeability of the system.

[0038] The vacuum generating assembly 64 further includes a first air inlet pipe 647, and a first vacuum generator 641 including a first air inlet 6411, a first air outlet 6412, and a first connection port 6413. The first air inlet 6411 is connected to one end of the first air inlet pipe 647, and the other end of the first air inlet pipe 647 is connected to a gas source. The first air outlet 6412 is connected to a plug-in interface 651, and the first connection port 6413 is connected to a second interface 6432. In this embodiment, the vacuum generating assembly 64 further includes a second air inlet pipe 648, and a second vacuum generator 642 including a second air inlet 6421, a second air outlet 6422, and a second connection port 6423. The second air inlet 6421 is connected to one end of the second air inlet pipe 648, and the other end of the second air inlet pipe 648 is connected to a gas source. The second air outlet 6422 is connected to another plug-in interface 651 on the vacuum container plate 65, and the second connection port 6423 is connected to a fifth interface 6442.

[0039] In actual operation, the first vacuum generator 641 and the second vacuum generator 642 obtain compressed air from an external air source (not shown in the figure) through their respective independent first air inlet pipes 647 and second air inlet pipes 648, avoiding mutual interference and ensuring the stability of their respective performance. The first air outlet 6412 and the second air outlet 6422 are respectively connected to the plug interface 651 on the vacuum housing plate 65 for unified exhaust and drainage. During actual operation, a drainage device (not shown in the figure) is provided at the bottom of the plug interface 651. The coolant entering the vacuum circuit is discharged into the drainage device through the first air outlet 6412 and the second air outlet 6422 and then discharged externally, which helps to improve the environmental quality of the workshop. The first connection port 6413 is connected to the second interface 6432. The coolant is discharged externally under the action of gravity and a large suction force, and basically does not enter the third interface 6433, so as not to affect the normal operation of the subsequent vacuum sensor 645. The second connection port 6423 is connected to the fifth interface 6442, so that the output of the second vacuum generator 642 is connected to one end of the Y-type connector 644, and thus participates in the auxiliary suction of the suction channel 63.

[0040] like Figure 2 As shown, the wafer dicing apparatus also includes a guide rail component (not shown), a processing table 66, and a dicing tool 67. The guide rail component extends along a first direction (i.e., the direction from which the processing table 66 faces the dicing tool 67). A grinding mechanism is fixedly connected to the processing table 66. The processing table 66 is mounted on the guide rail component and can move along the first direction, driving the grinding mechanism to move to the dicing tool 67. By combining the grinding mechanism with the processing table 66 and utilizing the guide rail component to achieve precise movement, the functionality and practicality of the wafer dicing apparatus are greatly enhanced. This design not only improves processing accuracy and efficiency but also simplifies the maintenance process.

[0041] like Figure 1 and Figure 2 As shown, the support platform 61 includes a whetstone suction cup 611. The whetstone suction cup 611 is located on the upper surface of the support platform 61, and a vacuum groove 612 is provided on the upper surface of the whetstone suction cup 611. The vacuum grooves 612 are arranged in a grid pattern, and are spaced a predetermined distance from the outer edge of the whetstone suction cup 611. By providing the vacuum grooves 612 on the whetstone suction cup 611 and utilizing the negative pressure provided by the vacuum generating component 64, the whetstone 62 can be firmly fixed to the support platform 61. This design greatly improves the stability during the whetstone sharpening process, preventing the whetstone 62 from moving or shifting due to external forces, thereby improving the sharpening accuracy.

[0042] Furthermore, the upper surface of the whetstone suction cup 611 is provided with vacuum grooves 612 arranged in a grid pattern, which helps to evenly distribute the vacuum adsorption force, allowing the whetstone 62 to be more stably fixed on the whetstone suction cup 611, avoiding damage or deformation of the whetstone 62 due to excessive local pressure. In addition, in this embodiment, the vacuum grooves 612 are kept at a certain distance from the outer edge of the whetstone suction cup 611, which helps to prevent vacuum leakage and provides an additional safety margin, ensuring that the whetstone 62 remains stable even under extreme operating conditions. That is to say, the design of the whetstone suction cup 611 with the grid-shaped vacuum grooves 612 not only enhances the stability and reliability of the whetstone 62's fixation, but also improves the accuracy and efficiency of the whetstone sharpening process.

[0043] See you again Figure 1 and Figure 2 As shown, a ceramic layer 613 is provided at the bottom of the whetstone suction cup 611. In this embodiment, before sharpening, the height of the whetstone 62 of the sharpening mechanism is measured. A signal transmitter (not shown in the figure) is provided on the cutting tool 67, and a signal receiver (not shown in the figure) is provided on the whetstone suction cup 611. The height measurement signal between the signal transmitter and the signal receiver is used to detect the height between the cutting tool 67 and the whetstone 62. In the wafer dicing apparatus, the sharpening mechanism is connected to the processing table 66 through a support frame 68, which is usually made of metal. Since the support frame 68 and the whetstone suction cup 611 may be at different potentials, the ceramic layer 613 at the bottom of the whetstone suction cup 611 prevents interference when the electrical signal is conducted through the whetstone suction cup 611 to the support frame 68 or other components of the wafer dicing apparatus, ensuring the accuracy of the height measurement signal and thus guaranteeing the sharpening precision.

[0044] Furthermore, a height 614 is provided between the whetstone suction cup 611 and the ceramic layer 613. In this embodiment, to ensure that the sharpening mechanism is at a suitable height and that its relative position to the cutting tool 67 is accurate for easy sharpening, the height of the whetstone 62 needs to be adjusted. Specifically, the thickness of the ceramic layer 613 can be adjusted, but since the production cost of the ceramic layer 613 is relatively high, a height 614 is provided in this application, which is located between the whetstone suction cup 611 and the ceramic layer 613. Exemplarily, the height 614 can be made of stainless steel or other materials, and this application does not make specific limitations.

[0045] like Figure 1 and Figure 2 As shown, the whetstone suction cup 611 is provided with at least two limiting parts 6111, each protruding from the upper surface of the whetstone suction cup 611. Each limiting part 6111 has a limiting surface perpendicular to the upper surface of the whetstone suction cup 611, and the limiting surfaces on at least two limiting parts 6111 intersect. The limiting surfaces on each limiting part 6111 are perpendicular to each other or intersect at a certain angle, forming an "angle positioning" structure. When the whetstone 62 is placed on the whetstone suction cup 611, its edge can fit tightly against these two limiting surfaces, thereby achieving positional constraint in the X and Y directions and avoiding displacement caused by manual installation errors or vibration.

[0046] Based on the above embodiments, it can be seen that the wafer dicing apparatus of this application has at least the following technical effects:

[0047] (1) This application sets up a three-way cavity, a first vacuum generator and a second vacuum generator, wherein the suction force of the first vacuum generator is greater than that of the second vacuum generator. The first and third interfaces of the three-way cavity are coaxially arranged and located in the first horizontal plane, and the second interface is located below the first horizontal plane. The coolant that enters the vacuum pipeline through the gap between the grinding stone and the support table can be discharged from the second interface under the combined action of gravity and suction. This can improve the stability of the vacuum pressure of the grinding stone and the stability of the reading of the vacuum sensor during the grinding process, improve the grinding accuracy and the cutting quality of the wafer, and reduce the occurrence of system alarms.

[0048] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0049] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0050] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer dicing apparatus, characterized in that, include: The sharpening mechanism includes a support platform (61) and a sharpening stone (62). The support platform (61) is provided with a suction channel (63). The suction port of the suction channel (63) is located on the upper surface of the support platform (61). The sharpening stone (62) is located on the upper surface of the support platform (61). A vacuum generating assembly (64) includes a first vacuum generator (641), a second vacuum generator (642), and a three-way cavity (643). The three-way cavity (643) includes a first interface (6431), a second interface (6432), and a third interface (6433). The first interface (6431) is connected to the suction channel (63), the second interface (6432) is connected to the first vacuum generator (641), and the third interface (6433) is connected to the second vacuum generator (642). The suction force of the first vacuum generator (641) is greater than the suction force of the second vacuum generator (642).

2. The wafer cutting apparatus according to claim 1, wherein Along the height direction of the wafer dicing apparatus, the first interface (6431) and the third interface (6433) are coaxially arranged and located in the first horizontal plane, and the second interface (6432) is located below the first horizontal plane.

3. The wafer cutting apparatus according to claim 1, wherein The vacuum generating assembly (64) further includes a Y-type connector (644) and a vacuum sensor (645). The Y-type connector (644) includes a fourth interface (6441), a fifth interface (6442), and a sixth interface (6443). The fourth interface (6441) is connected to the third interface (6433), the fifth interface (6442) is connected to the second vacuum generator (642), and the sixth interface (6443) is connected to the vacuum sensor (645).

4. The wafer cutting apparatus according to claim 3, wherein A vacuum filter (646) is provided between the sixth interface (6443) and the vacuum sensor (645).

5. The wafer cutting apparatus according to claim 3, wherein The wafer dicing apparatus further includes a vacuum container plate (65), on which the first vacuum generator (641) and the second vacuum generator (642) are mounted.

6. The wafer dicing apparatus according to claim 5, characterized in that, The vacuum container plate (65) is provided with two insertion interfaces (651), wherein: The vacuum generating assembly (64) further includes a first air inlet pipe (647). The first vacuum generator (641) includes a first air inlet (6411), a first air outlet (6412), and a first connection port (6413). The first air inlet (6411) is connected to one end of the first air inlet pipe (647), and the other end of the first air inlet pipe (647) is connected to an air source. The first air outlet (6412) is connected to one of the plug interfaces (651), and the first connection port (6413) is connected to the second interface (6432).

7. The wafer cutting apparatus according to claim 6, wherein The vacuum generating assembly (64) further includes a second air inlet pipe (648), the second vacuum generator (642) includes a second air inlet (6421), a second air outlet (6422), and a second connection port (6423). The second air inlet (6421) is connected to one end of the second air inlet pipe (648), the other end of the second air inlet pipe (648) is connected to an air source, the second air outlet (6422) is connected to another plug-in interface (651) on the vacuum container plate (65), and the second connection port (6423) is connected to the fifth interface (6442).

8. The wafer cutting apparatus according to claim 1, wherein The wafer dicing device further includes a guide rail component, a processing table (66), and a dicing tool (67). The guide rail component extends along a first direction. The grinding mechanism is fixedly connected to the processing table (66). The processing table (66) is disposed on the guide rail component and can move along the first direction, thereby driving the grinding mechanism to move to the dicing tool (67).

9. The wafer dicing apparatus according to any one of claims 1 to 7, characterized in that, The support platform (61) includes a whetstone suction cup (611), which is located on the upper surface of the support platform (61). The upper surface of the whetstone suction cup (611) is provided with vacuum grooves (612), which are arranged in a grid pattern and are at a predetermined distance from the outer edge of the whetstone suction cup (611).

10. The wafer dicing apparatus according to claim 9, characterized in that, The whetstone suction cup (611) is provided with at least two limiting parts (6111), and the at least two limiting parts (6111) protrude from the upper surface of the whetstone suction cup (611). Each of the limiting parts (6111) has a limiting surface perpendicular to the upper surface of the whetstone suction cup (611), and the limiting surfaces on at least two of the limiting parts (6111) intersect.

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