Die cutting apparatus

Abstract

The utility model discloses a kind of die-cutting devices, die-cutting device includes cutter, conveying mechanism, die-cutting mechanism and top film composite mechanism.Cutter has blade edge extending along first direction;Conveying mechanism is used to convey silk screen material belt to die-cutting station along direction oblique to first direction, silk screen material belt has first fiber group and second fiber group with intersecting extension direction, and the extension direction of first fiber group and second fiber group all intersect with first direction;Die-cutting mechanism is connected with cutter, die-cutting mechanism can drive cutter to move, to make cutter along blade edge and form silk screen structure with silk screen material belt;Top film composite mechanism is used to provide film surface with top film with adhesive area and non-adhesive area, and for top film and silk screen structure composite, to make part of silk screen structure and adhesive area adhere, another part and non-adhesive area adhere, and non-adhesive area extends along first direction.The die-cutting device of the utility model can reduce the risk of silk screen structure occurs silk drawing defect.

Description

Technical Field

[0001] This utility model relates to the field of die-cutting technology, and in particular to a die-cutting device. Background Technology

[0002] In the die-cutting process, it is often necessary to die-cut the wire mesh strip to form a wire mesh structure, and then bond a top film to the wire mesh structure. The top film has adhesive and non-adhesive areas. The wire mesh strip is usually formed by the collaborative weaving of multiple fiber groups, each fiber group having multiple fibers extending in parallel directions. In the existing technology, after the top film is bonded to the wire mesh structure, the fibers in the area where the wire mesh structure is bonded to the non-adhesive area are prone to poor fiber pulling. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a die-cutting device that can reduce the risk of poor wire pulling in wire mesh structures.

[0004] This utility model provides a die-cutting device, which includes a die, a conveying mechanism, a die-cutting mechanism, and a top film composite mechanism. The die has a blade extending along a first direction; the conveying mechanism is used to convey the wire mesh material strip to the die-cutting station along a direction inclined to the first direction. The wire mesh material strip has a first fiber group and a second fiber group whose extending directions intersect each other, and the extending directions of the first fiber group and the second fiber group both intersect the first direction; the die-cutting mechanism is connected to the die and can drive the die to move so that the die cuts the wire mesh material strip located at the die-cutting station along the blade to form a wire mesh structure; the top film composite mechanism is used to provide a top film with adhesive areas and non-adhesive areas formed on the film surface, and is used to composite the top film with the wire mesh structure so that part of the wire mesh structure is attached to the adhesive area and another part is attached to the non-adhesive area, the non-adhesive area extending along the first direction.

[0005] The die-cutting apparatus provided by this utility model has at least the following beneficial effects: The die-cutting die cuts the wire mesh strip along its blade edge. In the wire mesh strip, multiple fibers from the first fiber group intersect with multiple fibers from the second fiber group to form multiple nodes on the wire mesh strip. During die-cutting, the fibers are fixed by nodes arranged on opposite sides of the fiber's radial direction. The die-cutting process cuts the fibers, potentially causing some fibers to have adjacent nodes on one side removed, leading to fiber separation from the wire mesh strip and resulting in wire pulling. The extension directions of the first and second fiber groups are inclined to a first direction, and the blade edge extends along this first direction. This reduces the risk of the die-cutting die removing too many nodes adjacent to the fiber on the same fiber side, thus reducing the risk of poor wire pulling in the wire mesh structure.

[0006] In one embodiment of this implementation, the conveying mechanism includes a first material roller and a first driver. The axis of the first material roller is perpendicular to a second direction, and the second direction is inclined to the first direction. The first material roller is rotatably connected to the die-cutting mold about an axis perpendicular to the second direction. The outer peripheral surface of the first material roller is used to abut against the wire mesh strip. The first driver is connected to the first material roller and can drive the first material roller to rotate so as to convey the wire mesh strip to the die-cutting station.

[0007] In one embodiment of this implementation, the conveying mechanism further includes a second material roller and a second driver. The axis of the second material roller is perpendicular to the first direction. The second material roller is rotatably connected to the die about an axis perpendicular to the first direction. The outer peripheral surface of the second material roller is used to abut against the bottom film strip. The second driver is connected to the second material roller and can drive the second material roller to rotate, so as to convey the bottom film strip to the side of the screen tape located at the die-cutting station away from the die.

[0008] In one embodiment of this implementation, the die-cutting mechanism includes a die-cutting driver whose driving direction is perpendicular to the first direction. The die-cutting driver is connected to the die, and the die-cutting driver can drive the die to move along the first direction so that the die pushes the wire mesh strip onto the base film strip and die-cuts the wire mesh strip on the base film strip to form a wire mesh structure.

[0009] In one embodiment of this implementation, the size of the blade in the first direction is 9.65mm-15.12mm.

[0010] In one embodiment of this implementation, the die-cutting device further includes a trimming blade having a trimming edge extending along a first direction. The trimming blade is located on one side of the die along the first direction, and is used to die-cut the wire mesh structure along the trimming edge to change the shape of the wire mesh structure.

[0011] In one embodiment of this implementation, the height of the blade is 0.11mm-0.17mm.

[0012] In one embodiment of this implementation, the die-cutting mechanism includes a support plate, the support plate and the die are movably connected in a direction perpendicular to a first direction, and the die-cutting driver can drive the die to move toward the support plate to push the bottom film strip to abut against the support plate.

[0013] In one embodiment of this implementation, the die-cutting device further includes a top-cutting mechanism for die-cutting a top film to form a covering structure. A portion of the outline of the covering structure is opposite to the portion of the screen structure that is bonded to the non-adhesive area, and another portion of the outline of the covering structure is opposite to the portion of the screen structure that is bonded to the adhesive area.

[0014] In one embodiment of this implementation, the top-cutting mechanism is used to cut through the top film and the mesh structure to form a cover structure, and to make a portion of the outline of the cover structure overlap with the outline of the mesh structure.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a three-dimensional structural schematic diagram of the die-cutting device according to one embodiment of the present invention; Figure 2 yes Figure 1 A top view of the die-cutting device; Figure 3 yes Figure 1 A schematic diagram of the structure of the first and second fiber groups in the wire mesh tape; Figure 4 yes Figure 1 A schematic diagram of the wire mesh tape and the cutting blade; Figure 5 This is a structural diagram of a wire mesh structure, an adhesive structure, a double-sided adhesive, and a covering structure; Figure 6 for Figure 1 A schematic diagram of the top membrane, adhesive membrane, and wire mesh structure; Figure 7 for Figure 6 A schematic diagram of the top film, adhesive film, and screen mesh structure after die-cutting.

[0017] Figure label: Die-cutting device 100; top film 10; adhesive area 11; non-adhesive area 12; screen printing tape 20; first fiber group 21; longitudinal fiber 211; second fiber group 22; transverse fiber 221; braided hole 23; bottom film tape 30; adhesive film 40; closed contour 41; die 50; blade 51; product 60; covering structure 61; adhesive structure 62; screen printing structure 63; double-sided adhesive 64; node 71; preset contour 72; conveying mechanism 80; first material roller 81; second material roller 82; die-cutting mechanism 90; die-cutting driver 91; trimming blade 92; support plate 93. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0022] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0024] Please see Figure 1 , Figures 3 to 4 , Figure 6 , Figure 1 This is a three-dimensional structural schematic diagram of the die-cutting device 100 according to one embodiment of the present utility model; Figure 3 yes Figure 1 A schematic diagram of the structure of the first fiber group 21 and the second fiber group 22 in the wire mesh tape 20; Figure 4 yes Figure 1 A schematic diagram of the wire mesh strip 20 and the blade 51; Figure 6 for Figure 1A schematic diagram of the structure of the top film 10, adhesive film 40, and screen structure 63. This utility model embodiment provides a die-cutting device 100, which includes a die 50, a conveying mechanism 80, a die-cutting mechanism 90, and a top film composite mechanism. The die 50 has a blade 51 extending along a first direction; the conveying mechanism 80 is used to convey the wire mesh strip 20 to the die-cutting station along a direction inclined to the first direction. The wire mesh strip 20 has a first fiber group 21 and a second fiber group 22 with intersecting extension directions. The extension directions of the first fiber group 21 and the second fiber group 22 both intersect the first direction; the die-cutting mechanism 90 is connected to the die 50 and can drive the die 50 to move so that the die 50 cuts the wire mesh strip 20 located at the die-cutting station along the blade 51 to form a wire mesh structure 63; the top film laminating mechanism is used to provide a top film 10 with an adhesive region 11 and a non-adhesive region 12 formed on the film surface, and is used to laminating the top film 10 with the wire mesh structure 63 so that part of the wire mesh structure 63 is attached to the adhesive region 11 and another part is attached to the non-adhesive region 12, the non-adhesive region 12 extending along the first direction.

[0025] Specifically, the first direction is parallel to the X direction, the blade 51 extends along the X direction, the die 50 is a flat die, the blade 51 is set on the template of the flat die, and the die 50 is opposite to the die-cutting station. The conveying mechanism 80 includes a roller rotatably connected to the die 50, the outer circumferential surface of the roller is used to abut against the wire mesh strip 20, and when the roller rotates, it can convey the wire mesh strip 20 to the die-cutting station in a direction inclined to the X direction. The first fiber group 21 includes multiple longitudinal fibers 211 with parallel extension directions, and the multiple longitudinal fibers 211 are arranged radially spaced along the longitudinal fibers 211. The second fiber group 22 includes multiple transverse fibers 221 with parallel extension directions, and the multiple transverse fibers 221 are arranged radially spaced along the transverse fibers 221. In the wire mesh strip 20, the longitudinal fibers 211 intersect with the multiple transverse fibers 221 in sequence along their extension direction, and alternately pass through the bottom and top sides of the multiple transverse fibers 221 through the interval between adjacent two transverse fibers 221. The rollers in the conveying mechanism 80 convey the wire mesh strip 20 in a direction intersecting both the X and Y directions, so that the extension directions of the longitudinal fibers 211 and the transverse fibers 221 on the wire mesh strip 20 both intersect the X direction. The die-cutting mechanism 90 includes a cylinder whose driving direction is parallel to the Z direction. The piston of the cylinder is connected to the die 50, and the cylinder can drive the die 50 to move in the Z direction, so that the die 50 completes the die-cutting of the wire mesh strip 20. The adhesive area 11 and the non-adhesive area 12 are formed on the same film surface of the top film 10. The top film laminating mechanism includes a laminating roller, the outer peripheral surface of which is used to abut against the top film 10, so that the film surface of the top film 10 with the adhesive area 11 and the non-adhesive area 12 is exposed on the side of the top film 10 away from the laminating roller. The laminating roller can push the top film 10 radially toward the wire mesh structure 63, so that the top film 10 is laminated with the wire mesh strip 20.

[0026] It should be understood that the fibers on the portion of the wire mesh structure 63 that is attached to the adhesive area 11 can be bonded and fixed. The portion of the wire mesh structure 63 exposed to the non-adhesive area 12 is prone to fraying. The non-adhesive area 12 extends along the X direction, so that the extension directions of the longitudinal fibers 211 and the transverse fibers 221 on the wire mesh tape 20 intersect with the X direction. This can reduce the length of a single longitudinal fiber 211 and a single transverse fiber 221 exposed in the non-adhesive area 12, which helps to reduce the risk of fraying.

[0027] Understandably, please refer to Figure 3 When the longitudinal fiber 211 passes over the top or bottom side of the transverse fiber 221, the intersecting portions of the longitudinal fiber 211 and the transverse fiber 221 abut against each other to form a node 71. Multiple longitudinal fibers 211 and multiple transverse fibers 221 on the wire mesh tape 20 intersect to form a matrix of nodes 71, and are woven to form a braided hole 23. The longitudinal fiber 211 is located between two rows of nodes 71, and multiple transverse fibers 221 connect multiple nodes 71 in the two rows of nodes 71 one by one, so that the two rows of nodes 71 can work together with the transverse fibers 221 to fix the longitudinal fiber 211, so that the longitudinal fiber 211 can only slide along the fiber segment of the transverse fiber 221 located between the two rows of nodes 71. When the blade 51 parallel to the extension direction of the longitudinal fiber 211 is used to die-cut the wire mesh tape 20, the fiber segment of the transverse fiber 221 located between the two rows of nodes 71 will be cut off, and the longitudinal fiber 211 can slide out from the cut end of the fiber segment. Between two rows of nodes 71, there are multiple fiber segments. The more fiber segments between the same group of two rows of nodes 71 are cut, the more the longitudinal fibers 211 located between the two rows of nodes 71 can slide out from the break point of the fiber segment, and the easier it is to cause fraying. Die-cutting the wire mesh strip 20 along a direction inclined to the extension direction of the longitudinal fibers 211 can distribute the cut fiber segments among multiple groups of two rows of fiber segments in the node 71 matrix, thereby reducing the number of fiber segments between the same group of two rows of nodes 71 that are cut.

[0028] The die-cutting device 100 of this invention has a die 50 that can die-cut the wire mesh strip 20 along the blade edge 51. In the wire mesh strip 20, multiple fibers in the first fiber group 21 intersect with multiple fibers in the second fiber group 22 to form multiple nodes 71 on the wire mesh strip 20. During the die-cutting process, the fibers are fixed by the nodes 71 arranged on opposite sides of the fiber radially. During the die-cutting process of the wire mesh strip 20, the fibers will be cut off, which may cause some nodes 71 adjacent to the fibers on one side to be cut off, thereby causing the fibers to separate from the wire mesh strip 20, resulting in wire pulling. The extension direction of the first fiber group 21 and the second fiber group 22 is inclined to a first direction. The blade edge 51 extends along the first direction, which can reduce the risk of the die 50 cutting off too many nodes 71 adjacent to the fibers on the same fiber side, thereby reducing the risk of poor wire pulling in the wire mesh structure 63.

[0029] Please see Figures 1 to 2 , Figure 2 yes Figure 1 A top view of the die-cutting apparatus 100. In one embodiment of this implementation, the conveying mechanism 80 includes a first material roller 81 and a first driver. The axis of the first material roller 81 is perpendicular to a second direction, and the second direction is inclined to the first direction. The first material roller 81 is rotatably connected to the die 50 about an axis perpendicular to the second direction. The outer peripheral surface of the first material roller 81 is used to abut against the wire mesh strip 20. The first driver is connected to the first material roller 81 and can drive the first material roller 81 to rotate, so as to convey the wire mesh strip 20 to the die-cutting station.

[0030] Specifically, two first material rollers 81 are provided, respectively located on opposite sides of the die 50 along a second direction. The second direction is inclined to the X and Y directions, and the axis of the first material roller 81 is perpendicular to the second direction. The first driver can be a motor. It can be understood that since the axis of the first material roller 81 is perpendicular to the second direction, the first material roller 81 can rotate around this axis. When the first driver drives the first material roller 81 to rotate, the first material roller 81 can convey the wire mesh strip 20 to the die 50 along the second direction, so that the wire mesh strip 20 moves to the die-cutting station.

[0031] Please see Figures 1 to 2 In one embodiment of this implementation, the conveying mechanism 80 further includes a second material roller 82 and a second driver. The axis of the second material roller 82 is perpendicular to the first direction. The second material roller 82 is rotatably connected to the die 50 about an axis perpendicular to the first direction. The outer peripheral surface of the second material roller 82 is used to abut against the bottom film strip 30. The second driver is connected to the second material roller 82 and can drive the second material roller 82 to rotate, so as to convey the bottom film strip 30 to the side of the screen tape 20 located at the die-cutting station away from the die 50.

[0032] Specifically, the axis of the second material roller 82 is perpendicular to the X direction, the second driver can be a motor, and the second material belt can transport the bottom film material belt 30 to the side of the screen material belt 20 located at the die-cutting station away from the die 50, so that the bottom film material belt 30 and the screen material belt 20 are arranged alternately, and the bottom film material belt 30, the screen material belt 20 and the die 50 are arranged sequentially along the Z direction.

[0033] Understandably, during the production process, the wire mesh structure 63 needs to be conveyed along the X direction to the next station for further processing. The second roller 82 and the second driver are used to convey the base film strip 30, which facilitates the conveying of the wire mesh structure 63. The base film strip 30 needs to be conveyed along the X direction, while the wire mesh strip 20 needs to be conveyed along a direction intersecting the X direction. Since the conveying directions of the wire mesh strip 20 and the base film strip 30 are inconsistent, contact during conveying could lead to interference between them. Alternating the wire mesh strip 20 and the base film strip 30 along the Z direction reduces the risk of interference. Furthermore, the alternating arrangement of the wire mesh strip 20 and the base film strip 30 prevents friction between the base film strip 30 and the longitudinal fibers 211 and transverse fibers 221 on the wire mesh strip 20 during conveying, thus reducing the risk of wire breakage.

[0034] Please see Figures 1 to 2 In one embodiment of this implementation, the die-cutting mechanism 90 includes a die-cutting driver 91 whose driving direction is perpendicular to the first direction. The die-cutting driver 91 is connected to the die 50. The die-cutting driver 91 can drive the die 50 to move along the first direction so that the die 50 pushes the screen tape 20 toward the base film tape 30 and die-cuts the screen tape 20 on the base film tape 30 to form a screen structure 63.

[0035] Specifically, the die-cutting driver 91 is a cylinder with a driving direction parallel to the Z direction. The die-cutting driver 91 can drive the die 50 to push the wire mesh strip 20 along the Z direction to the base film strip 30, and cause the die 50 to die-cut the wire mesh strip 20 to form the wire mesh structure 63 on the base film strip 30.

[0036] Understandably, the feed cycle and die-cutting cycle are defined. In the feed cycle, the second material roller 82 rotates and drives the bottom film strip 30 to move towards the die-cutting position, and the first material roller 81 rotates and drives the screen tape 20 to move towards the die-cutting position. In the die-cutting cycle, the first material roller 81 and the second material roller 82 stop rotating so that the screen tape 20 and the bottom film strip 30 are stationary relative to the die 50. The die-cutting driver 91 drives the die 50 to push the screen tape 20 towards the bottom film strip 30 in the Z direction so as to die-cut the screen tape 20 to form the screen structure 63 on the bottom film strip 30. After the die 50 has finished die-cutting the screen tape 20, the die-cutting driver 91 drives the die 50 to move away from the screen tape 20 and separate the screen tape 20 and the bottom film strip 30 so as to switch from the die-cutting cycle to the feed cycle. The die-cutting driver 91 reciprocates during alternating feed and die-cutting cycles, enabling it to die-cut multiple positions on the wire mesh belt 20 to form multiple spaced wire mesh structures 63 on the base film belt 30. This improves efficiency and prevents the base film belt 30 from rubbing against the longitudinal fibers 211 and transverse fibers 221 on the wire mesh belt 20 during transport, thus reducing the risk of wire mesh belt 20 pulling out.

[0037] Please see Figure 4 In one embodiment of this implementation, the blade 51 has a dimension of 9.65mm-15.12mm in the first direction.

[0038] Specifically, the dimensions of the blade 51 in the X direction can be 9.650mm, 12.170mm, 12.385mm, 12.600mm, and 15.120mm. Understandably, when the dimension of the blade 51 in the X direction is less than 9.650mm, the size of the die-cut mesh structure 63 will be too small, resulting in fewer longitudinal fibers 211 and shorter transverse fibers 221 on the mesh structure 63. This will lead to unstable weaving connections between the first fiber group 21 and the second fiber group 22 in the mesh structure 63, making it easy for the longitudinal fibers 211 and transverse fibers 221 to separate, causing fraying. When the dimension of the blade 51 in the X direction is greater than 15.120mm, more fibers will be cut on the mesh strip 20 during the die-cutting process, also causing fraying. The dimensions of the Blade 51 in the X direction are 9.650mm, 12.170mm, 12.385mm, 12.600mm and 15.120mm, which helps to reduce the risk of wire breakage.

[0039] Please see Figure 2 , Figures 6 to 7 , Figure 7 for Figure 6A schematic diagram of the top film 10, adhesive film 40, and screen mesh structure 63 after die-cutting. In one embodiment of this invention, the die-cutting device 100 further includes a trimming blade 92, which has a trimming edge extending along a first direction. The trimming blade 92 is located on one side of the die 50 along the first direction. The trimming blade 92 is used to die-cut the screen mesh structure 63 along the trimming edge to change the shape of the screen mesh structure 63.

[0040] Specifically, the trimming blade 92 is located on one side of the die 50 along the X direction. The trimming blade 92 is a flat die that can move along the Z direction. When the trimming blade 92 moves along the Z direction, it can die-cut the screen mesh structure 63. The trimming blade 92 can cut through the top film 10 and the screen mesh structure 63 along the preset contour 72 to remove the part of the screen mesh structure 63 that is attached to the non-adhesive area 12. The trimming tip is used to die-cut the part of the contour extending along the X direction in the preset contour 72. It can be understood that after the top film 10 is attached to the screen mesh structure 63, further processing of the shape of the screen mesh structure 63 can be achieved. The adhesive area 11 can provide fixation for the first fiber group 21 and the second fiber group 22 on the screen mesh structure 63. The trimming blade 92 performs die-cutting on the screen mesh structure 63 after the top film 10 is attached to the screen mesh structure 63, which helps to further reduce the risk of the screen mesh structure 63 pulling out.

[0041] Please see Figures 1 to 4 In one embodiment of this implementation, the height of the blade 51 is 0.11mm-0.17mm.

[0042] Specifically, the height of the blade 51 can be 0.11mm, 0.12mm, 0.14mm, 0.16mm, and 0.17mm. Understandably, if the height of the blade 51 is less than 0.11mm, it will be difficult for the blade 51 to cut through the wire mesh strip 20, resulting in poor quality of the die-cut wire mesh structure 63. During the cutting process of the blade 51 into the wire mesh strip 20, the blade 51 will abut against the cross-section of the fiber and slide relative to the fiber to generate friction through the cross-section of the fiber. If the height of the blade 51 is greater than 0.17mm, the sliding distance of the blade 51 relative to the fiber during the die-cutting process of the wire mesh strip 20 will be longer, which may cause the fiber to slip unexpectedly, leading to fraying. Using blade height values ​​of 0.11mm, 0.12mm, 0.14mm, 0.16mm, and 0.17mm can reduce the risk of fraying while ensuring the quality of the die-cut wire mesh structure 63.

[0043] Please see Figures 1 to 2 In one embodiment of this implementation, the die-cutting mechanism 90 includes a support plate 93, which is movably connected to the die 50 in a direction perpendicular to the first direction. The die-cutting driver 91 can drive the die 50 to move toward the support plate 93 to push the bottom film strip 30 to abut against the support plate 93.

[0044] Specifically, the support plate 93 and the die 50 are arranged along the Z-direction. It is understood that during the die-cutting process, the support plate 93 provides support force towards the die 50 for the bottom film strip 30 and the wire mesh structure 63, facilitating the die 50's cutting through the wire mesh structure 63 and improving the edge uniformity of the die-cut wire mesh structure 63. It should be understood that if the support force on the wire mesh strip 20 is insufficient, the portion of the wire mesh strip 20 opposite to the blade 51 will be concave and wrinkled during the die-cutting process. This will cause the die 50 to cut the wire mesh strip 20 along an unexpected path, easily leading to wire pulling.

[0045] Please see Figures 1 to 2 , Figures 5 to 7 , Figure 5 This is a schematic diagram of the structure of the screen mesh structure 63, the adhesive structure 62, the double-sided adhesive 64, and the covering structure 61. In one embodiment of this implementation, the die-cutting device 100 further includes a top-cutting mechanism for die-cutting the top film 10 so that the top film 10 forms the covering structure 61. A portion of the outline of the covering structure 61 is opposite to the portion of the screen mesh structure 63 that is attached to the non-adhesive area 12, and another portion of the outline of the covering structure 61 is opposite to the portion of the screen mesh structure 63 that is attached to the adhesive area 11.

[0046] Specifically, in some embodiments, a top film laminating mechanism is used to laminate an adhesive film 40 and a top film 10. The adhesive film 40 has two opposing adhesive film surfaces. After the adhesive film 40 is laminated with the top film 10, the adhesive film 40 covers the film surface of the top film 10. The top-cutting mechanism includes a top-cutting cylinder and a top-cutting platen mold. The top-cutting cylinder is connected to the top-cutting platen mold. The top-cutting platen mold has a cutting line corresponding to the closed contour 41. When the top-cutting cylinder drives the top-cutting platen mold to move, it can cut the adhesive film 40 on the top film 10 along the closed contour 41, so that two independent films are formed on the adhesive film 40. The top-cutting cylinder can drive the top-cutting platen mold to move away from the adhesive film 40, so that the top-cutting platen mold can drive one of its independent films to leave the top film 10. The film surface of the top film 10 opposite to the discharged independent film is exposed. The film surface of the top film 10 is not sticky, thus forming a non-adhesive area 12. The part of the independent film that is not discharged is an adhesive structure 62 with adhesive. The surface of the adhesive structure 62 forms an adhesive area 11. The top-cutting flat film is also provided with cutting lines corresponding to the preset contour 72. After the screen mesh structure 63 is attached to the top film 10, the top-cutting cylinder can drive the top-cutting flat die to cut from the side of the top die away from the screen mesh structure 63, and cut through the top film 10, adhesive film 40 and screen mesh structure 63 in sequence along the preset contour 72 to form a covering structure 61 on the top film 10, while changing the shape of the adhesive structure 62 and the screen mesh structure 63.

[0047] Understandably, the screen mesh structure 63 needs to be bonded to the cover structure 61 to form the product 60. After the cover structure 61 is formed by die-cutting on the top film 10 by the top-cutting mechanism, a product 60 with the screen mesh structure 63 and the cover structure 61 bonded together can be formed, which facilitates the use of the die-cutting device 100 for the production of the product 60. The adhesive film 40 is used to bond the cover structure 61 to the screen mesh structure 63. Under certain production requirements, it is necessary to make the bond between the screen mesh structure 63 and the top film 10 easy to detach, so that the user can easily peel the top film 10 off the screen mesh structure 63. The larger the area of ​​the non-adhesive area 12, the easier it is for the top film 10 to separate from the screen mesh structure 63. The larger the size of the adhesive structure 62, the stronger the bond between the top film 10 and the screen mesh structure 63. Two independent films are formed by die-cutting the adhesive film 40 by the top cutting mechanism, and one of the independent films is removed. By adjusting the size of the two independent films, the area of ​​the formed adhesive-free region 12 and the size of the adhesive structure 62 can be controlled, which is beneficial to controlling the firmness of the adhesion between the screen structure 63 and the top film 10.

[0048] It should be noted that in the workflow of the top-cutting mechanism, the top-cutting flat die first cuts the adhesive mold to form a non-adhesive area 12 and an adhesive structure 62 on the top film 10. Subsequently, the top film laminating mechanism attaches the top film 10 to the screen mesh structure 63 on the bottom film strip 30, so that the adhesive structure 62 is located between the screen mesh structure 63 and the top film 10. Next, the top-cutting flat film cuts the top die from the side of the top die away from the screen mesh structure 63, and sequentially cuts through the top film 10, the adhesive film 40, and the screen mesh structure 63 along the preset contour 72.

[0049] Please see Figures 5 to 7 In one embodiment of this implementation, the top-cutting mechanism is used to cut through the top film 10 and the mesh structure 63 to form a cover structure 61, and to make a portion of the outline of the cover structure 61 overlap with the outline of the mesh structure 63.

[0050] Specifically, the top-cutting plate mold has a cutter. The height of the cutter is greater than the sum of the thickness of the top film 10 and the thickness of the wire mesh structure 63, so that the top-cutting plate mold can cut through the top film and the wire mesh structure 63. The top-cutting plate mold cuts through the top film 10 and the wire mesh structure 63 along the preset contour 72 with the cutter to form a covering structure 61 on the top film 10, and cuts the part of the wire mesh structure 63 that is opposite to the preset contour 72, so that the covering structure 61 and the wire mesh structure 63 have partially overlapping contours.

[0051] Under certain conditions, the edges of the cover structure 61 and the screen mesh structure 63 in product 60 need to be flush. By die-cutting the top film 10 and the screen mesh structure 63 by the top cutting mechanism, product 60 consisting of a cover structure 61 and a screen mesh structure 63 with partially overlapping contours can be formed, thereby improving the applicability of the die-cutting device 100.

[0052] It should be understood that in some embodiments, the base film strip 30 has double-sided adhesive 64. During the die-cutting process of the screen mesh strip 20, the die 50 pushes the screen mesh strip 20 toward the base film strip 30 so that the double-sided adhesive 64 on the screen mesh strip 20 adheres. Then the die 50 die-cuts the screen mesh strip 20 to form a screen mesh structure 63 that adheres to the double-sided adhesive 64. After the top film laminating mechanism combines the top film 10 with the screen mesh structure 63, the top film 10, adhesive structure 62, screen mesh structure 63 and double-sided adhesive 64 are arranged sequentially along the Z direction. When the top cutting plate performs die cutting on the top film 10, the cutter cuts through the top film 10, adhesive structure 62, screen mesh structure 63 and double-sided adhesive 64 sequentially along the preset contour 72 to form a product 60 in which the top film 10, adhesive structure 62, screen mesh structure 63 and double-sided adhesive 64 are stacked in sequence, and the edges of the top film 10, adhesive structure 62, screen mesh structure 63 and double-sided adhesive 64 are flush. This arrangement helps to reduce the exposed area of ​​the screen mesh structure 63 in the product 60, thereby reducing the risk of fraying.

[0053] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A die-cutting device, characterized in that, include: A die-cutting mold having a cutting edge extending in a first direction; A conveying mechanism is used to convey a wire mesh strip to a die-cutting station along a direction inclined to the first direction. The wire mesh strip has a first fiber group and a second fiber group whose extension directions intersect each other. The extension directions of the first fiber group and the second fiber group both intersect the first direction. A die-cutting mechanism is connected to the die-cutting mold. The die-cutting mechanism can drive the die-cutting mold to move so that the die-cutting mold can cut the wire mesh strip located at the die-cutting station along the blade edge to form a wire mesh structure. A top film composite mechanism is used to provide a top film having an adhesive region and an adhesive-free region formed on its surface, and to composite the top film with the screen structure such that a portion of the screen structure is bonded to the adhesive region and another portion is bonded to the adhesive-free region, the adhesive-free region extending along a first direction.

2. The die-cutting apparatus according to claim 1, characterized in that, The conveying mechanism includes a first material roller and a first driver. The axis of the first material roller is perpendicular to a second direction, and the second direction is inclined to the first direction. The first material roller is rotatably connected to the die-cutting mold about an axis perpendicular to the second direction. The outer peripheral surface of the first material roller is used to abut against the wire mesh material strip. The first driver is connected to the first material roller and can drive the first material roller to rotate so as to convey the wire mesh material strip to the die-cutting station.

3. The die cutting apparatus of claim 1, wherein, The conveying mechanism further includes a second material roller and a second driver. The axis of the second material roller is perpendicular to the first direction. The second material roller is rotatably connected to the die about an axis perpendicular to the first direction. The outer peripheral surface of the second material roller is used to abut against the bottom film strip. The second driver is connected to the second material roller and can drive the second material roller to rotate, so as to convey the bottom film strip to the side of the screen tape located at the die-cutting station away from the die.

4. The die cutting apparatus of claim 3, wherein, The die-cutting mechanism includes a die-cutting driver whose driving direction is perpendicular to the first direction. The die-cutting driver is connected to the die and can drive the die to move along the first direction so that the die pushes the wire mesh strip towards the base film strip and die-cuts the wire mesh strip on the base film strip to form the wire mesh structure.

5. The die cutting apparatus of claim 1, wherein, The blade has a dimension of 9.65mm-15.12mm in the first direction.

6. The die cutting apparatus of claim 1, wherein, The die-cutting device further includes a trimming blade, which has a trimming edge extending along the first direction. The trimming blade is located on one side of the die along the first direction. The trimming blade is used to die-cut the wire mesh structure along the trimming edge to change the shape of the wire mesh structure.

7. The die-cutting apparatus according to claim 1, characterized in that, The height of the blade is 0.11mm-0.17mm.

8. The die cutting apparatus of claim 4, wherein, The die-cutting mechanism includes a support plate, which is movably connected to the die in a direction perpendicular to the first direction. The die-cutting driver can drive the die to move toward the support plate to push the bottom film strip to abut against the support plate.

9. The die cutting apparatus of claim 1, wherein, The die-cutting device further includes a top-cutting mechanism for die-cutting the top film to form a covering structure. A portion of the outline of the covering structure is opposite to the portion of the screen structure that is attached to the adhesive-free area, and another portion of the outline of the covering structure is opposite to the portion of the screen structure that is attached to the adhesive area.

10. The die-cutting apparatus according to claim 9, characterized in that, The top-cutting mechanism is used to cut through the top film and the mesh structure to form the covering structure, and to make a portion of the outline of the covering structure overlap with the outline of the mesh structure.

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