Automatic material screening and pre-dispensing device and material feeding equipment

Abstract

This utility model provides an automatic material screening and pre-discharging device and a material feeding equipment, belonging to the field of mechanical automation technology. The material feeding equipment includes an automatic material screening and pre-discharging device, which includes an inlet, a screening component, a recycling component, a glue discharge component, a material picking position, and a switching unit. The screening component weighs and screens the molding compound and conveys the molding compound that does not meet the requirements to the waste pipe, while the molding compound that meets the requirements is conveyed to the glue discharge component. The glue discharge component can arrange multiple molding compounds into the glue dispensing rack at one time, which speeds up the dispensing rate and greatly improves production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of mechanical automation technology, and in particular relates to an automatic material screening and pre-discharging device and a material feeding device. Background Technology

[0002] In semiconductor packaging, molding dies typically consist of multiple molds of identical size arranged in two rows and columns. Each mold has several recesses for holding cylindrical molding compound. During injection molding, the molding compound is usually placed into a dispensing rack that matches the mold, and then transferred to the recesses of the mold.

[0003] The process of placing molding compound into the dispensing rack is currently partially done manually, while others utilize automated glue feeding devices. Manual operation requires a line operator to manually place each piece of molding compound into the dispensing rack. Automated glue feeding devices typically place the dispensing rack onto an automated glue dispensing machine. This automated machine, following a pre-programmed sequence, uses photoelectric sensors to measure the height of the molding compound to determine if its quality meets requirements. Defective molding compound is rejected, and only qualified pieces are placed into the dispensing rack.

[0004] Manual operation requires operators to handle molding compound by hand. Molding compound has a large amount of dust and a slightly irritating odor. Long-term exposure can affect the operator's health. When manually removing the compound, foreign objects on the operator's hands can easily adhere to the molding compound, affecting the quality of the semiconductor. Operators cannot accurately judge the quality of the molding compound and reject unqualified molding compound. Manual operation cannot guarantee the pass rate of the operator's molding compound removal, resulting in unstable yield and low efficiency.

[0005] Automatic encapsulation feeding devices are typically used in conjunction with semiconductor molding automation systems and molding presses to automate the semiconductor packaging process. However, when there are many molds in a single mold or a large number of molding dies, feeding the encapsulation material one by one into the dispensing rack takes a long time. This prevents the material from being discharged during the molding press's mold closing process, severely impacting the overall production efficiency of the packaging process. Furthermore, when screening encapsulation material, the beam diameter and scattering phenomena of the photoelectric beam sensor introduce significant errors in the measured material's height. This makes it unsuitable for applications with small missing weights and high requirements. Finally, when encapsulation material needs to be replaced, the device cannot automatically remove the encapsulation material already fed into the automated dispensing equipment. Summary of the Invention

[0006] Therefore, in order to overcome the shortcomings of the prior art, the present invention provides a device that can more accurately screen molding compounds and remove molding compounds that do not meet the requirements during operation.

[0007] To achieve the above objectives, this utility model provides an automatic material screening and pre-discharging device, comprising: The feed inlet receives the molding compound; A screening component, located at the feed inlet, has grooves for holding multiple molding compounds, used to weigh and screen the molding compounds on the grooves, and to convey the molding compounds that do not meet the requirements to the waste pipe, and the molding compounds that meet the requirements to the discharge port. A recycling component, located below the waste pipe, is used to recycle the molding compound screened by the screening component; The glue discharge assembly is located below the material discharge port and connected to the material discharge port of the screening assembly. It is used to arrange the molding compound conveyed by the screening assembly. The material receiving position is located at the end of the shaft of the glue dispensing assembly and is used to receive the plastic sealant arranged on the glue dispensing assembly; A switching unit is located below the material taking position. The switching unit is used to lift the molding compound on the glue discharge assembly upward. When the switching unit completes the lifting, the end of the molding compound abuts against the material taking position.

[0008] Preferably, the filtering component includes: The rotating mechanism includes a fixing member and a tray mounted on the fixing member and rotating about its center. The fixing member has a through groove below the tray that connects to a feed inlet and a discharge outlet. The tray has a recess inside that accommodates the molding compound from the feed inlet. A weighing mechanism is disposed below a groove adjacent to the feed inlet, along the rotation direction of the tray, for weighing the molding compound on the groove. The material feeding mechanism is located below the groove adjacent to the weighing mechanism along the rotation direction of the tray, and is used to feed the plastic sealant when the weight does not meet the requirements.

[0009] Preferably, the material feeding mechanism includes a switching plate and a cylinder. The switching plate has a groove above it and is connected to the waste pipe. The switching plate moves horizontally to drop any unsatisfactory molding compound into the waste pipe. The output end of the cylinder is connected to the switching plate, and the cylinder drives the movement of the switching plate.

[0010] Preferably, the rotating mechanism is equipped with a positioner that ensures that the groove and the feed inlet coincide.

[0011] Preferably, the glue removal assembly includes: The glue discharge seat is provided with glue discharge holes along the conveying direction to carry multiple molding compounds. The transmission unit is used to transmit the glue outlet.

[0012] Preferably, the transmission unit includes: Conveyor belt; A clamping member is movably mounted on the conveyor belt, and a glue discharge seat is fixedly mounted on the clamping member; A drive motor is mounted on the conveyor belt, and the drive motor is used to drive the clamp to reciprocate along the conveyor belt.

[0013] Preferably, the switching unit includes a vertical plate cylinder, a push rod base plate is fixed to the top of the vertical plate cylinder, a plurality of push rods are fixed on the push rod base plate, and the ends of the push rods pass through the switching base and the glue discharge assembly and abut against the material picking position.

[0014] Preferably, the upright plate cylinder is fixed on the upright plate, the upright plate is provided with a clearance groove, the cylinder is located below the clearance groove, and the glue discharge assembly is fixedly installed on the top of the upright plate.

[0015] Preferably, the recycling component includes a waste glue funnel, which is located directly below the waste pipe and is connected to an external waste glue recycling device.

[0016] According to another aspect of this application, a material feeding device is provided, including the above-mentioned automatic material screening and pre-discharging device.

[0017] Compared with the prior art, the advantages of this utility model are: 1. This utility model can automatically arrange the molding compound into rows during operation, and can arrange multiple molding compounds into the dispensing rack at one time, thereby speeding up the dispensing rate and greatly improving production efficiency; 2. This utility model can automatically screen molding compound by weight. The quality tolerance of molding compound can be freely set according to process requirements. Molding compound that exceeds the tolerance range is judged as unqualified material and directly rejected, making the screening of molding compound more accurate. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 and 2 This is a three-dimensional structural schematic diagram of the present invention; Figure 3 This is a three-dimensional structural diagram of the back of this utility model; Figure 4 This is a three-dimensional structural diagram of the screening component of this utility model. Figure 5 This is a three-dimensional structural diagram of the bottom of the screening component of this utility model. Detailed Implementation

[0020] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0021] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] It should be noted that the following description covers various aspects of embodiments within the scope of protection of this invention. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using other structures and / or functionalities besides one or more of the aspects set forth herein.

[0023] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0024] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0025] This application provides a material feeding device, including an automatic material screening and pre-discharging device 100, a plastic sealant dispensing device 200 (not shown in the figure), a plastic sealant waste recycling device 300 (not shown in the figure), and a material receiving device 400 (not shown in the figure) connected to the end of the automatic material screening and pre-discharging device 100.

[0026] The automatic material screening and pre-discharging device 100 is connected to the molding compound dispensing device 200 to receive molding compound. The molding compound dispensing device 200 can be an automated device such as a robotic arm for dispensing molding compound. The material handling device 400 can also be an automated device such as a robotic arm for removing qualified molding compound to the next process. The molding compound waste recycling device 300 is used to recycle unqualified molding compound for reprocessing into qualified molding compound.

[0027] Example 1: The automatic material screening and pre-discharging device 100 is located at the end of the plastic sealing material dispensing device 200. In some embodiments, the automatic material screening and pre-discharging device 100 includes a feed inlet 110, a screening component 120, a recycling component 130, a glue discharge component 140, a material picking position 150, and a switching unit 160.

[0028] like Figures 1-4 As shown, the screening component 120 is located at the feed inlet 110 and has a groove 1011 for carrying multiple molding compounds. It is used to weigh and screen the molding compounds on the groove 1011 and convey the molding compounds that do not meet the requirements to the waste pipe 31-15, while conveying the molding compounds that meet the requirements to the discharge port 125.

[0029] In some embodiments, the screening component 120 includes a rotating mechanism 121, a weighing mechanism 122, and a material dropping mechanism 123.

[0030] like Figures 4-5 As shown, the rotating mechanism 121 includes a fixing member 31-1 and a tray 31-2 disposed on the fixing member 31-1 and rotating around its center. The fixing member 31-1 has a through groove 1012 for receiving and dropping molding compound, and the tray 31-2 has a groove 1011 for receiving molding compound from the feed port 11. During operation, each through groove 1012 coincides with the groove 1011 and is located directly below the groove 1011. The rotating mechanism 121 is provided with a positioner 31-10. During operation, the rotator 31-4 and the positioner 31-10 on the rotating mechanism 121 are positioned to ensure that the groove 1011 and the feed port 11 coincide.

[0031] The positioner 31-10 can be a commonly used shaft positioning method such as shoulder and collar positioning or sleeve positioning. After the equipment is powered on, the positioning parts of the positioner 31-10 are first placed into the corresponding slots on the fixing part 31-1 and the tray 31-2. Then, the control system controls the rotation of the rotor 31-4 to clamp the positioner 31-10 onto the shaft end of the rotor 31-4. At this time, the through slot 1012 on the fixing part 31-1 and the groove 1011 on the tray 31-2 coincide. The rotation angle of the rotor 31-4 can be controlled by the control system setting a command to select the rotation angle in advance, or by setting an electronic limiter in the rotor 31-4, and using the sensor or encoder of the electronic limiter to monitor the angle in real time, and stopping the motor within the set range through the control system. No limitation is made here.

[0032] Specifically, at least one weighing mechanism 122 is disposed below the groove 1011 adjacent to the feed inlet 110 along the rotation direction of the tray 31-2, for weighing the molding compound on the groove 1011. At least one weighing sensor 31-3 is disposed below the groove 1011. The weighing mechanism 122 can be set to automatically zero at a certain working node, making the quality of the molding compound more accurate.

[0033] Specifically, at least one material feeding mechanism 123 is positioned below the groove 1011 adjacent to the weighing sensor 31-3 along the rotation direction of the tray 31-2.

[0034] In some embodiments, the material feeding mechanism 123 includes a switching plate 31-6 and a cylinder 31-9. The upper part of the switching plate 31-6 is a groove 1011. The switching plate 31-6 is connected to the waste pipe 31-15. The switching plate 31-6 moves horizontally to drop unsatisfactory molding materials into the waste pipe 31-15. The output end of the cylinder 31-9 is connected to the switching plate 31-6. The cylinder 31-9 drives the movement of the switching plate 31-6. Alternatively, the movement of the switching plate 31-6 can be driven by gears or a motor.

[0035] Specifically, when the molding compound reaches the inlet 110, the sensor near the inlet 110 detects that there is material in the inlet 110, and the rotating mechanism 121 rotates, so the molding compound moves with the tray 31-2 to the weighing position. At this time, the weighing mechanism 122 weighs the molding compound, and the next groove 1011 on the tray 31-2, which is opposite to the direction of rotation, is directly opposite to the inlet 110. Next, the rotating mechanism 121 continues to rotate with the molding compound to above the waste pipe 31-15. According to the measurement result of the molding compound by the weighing mechanism 122, if the weight of the molding compound is within the set qualified range, the cylinder 31-9 does not operate; if the weight of the molding compound is not within the set qualified range, the cylinder 31-9 operates, the switching plate 31-6 moves horizontally, the groove 1011 carrying the molding compound connects with the waste pipe 31-15, and the molding compound is discharged from the waste pipe 31-15. Plastic sealant that does not meet the weight requirements is discharged from waste pipe 31-15 to recycling component 130. Cylinder 31-9 returns to its initial state, switching plate 31-6 moves horizontally, and the groove 1011 that originally carried the plastic sealant is no longer connected to waste pipe 31-15. Rotating mechanism 121 continues to rotate, continuously feeding material into inlet 110. Tray 31-2 rotates carrying plastic sealant, and plastic sealant that meets the requirements is discharged into discharge port 125.

[0036] The material feeding mechanism 123 and the recycling component 130 may not be installed in this equipment. According to the measurement results of the molding compound by the weighing mechanism 122, if the weight of the molding compound is not within the set qualified range, the externally installed mechanical part will pick up the non-compliant molding compound and recycle it into the molding compound recycling equipment that is not installed in this equipment.

[0037] When different types of molding compound need to be changed according to production requirements, all molding compound in the molding compound dispensing device 200 needs to be removed. At this time, the cylinder 31-9 drives the switching plate 31-6 to move, keeping the groove 1011 carrying the molding compound and the waste pipe 31-15 connected. An external support tray is added below the discharge port 125, and the rotating mechanism 121 rotates to discharge all the molding compound on the groove 1011 from the waste pipe 31-15. Alternatively, a set of discharge mechanisms 123 can be set on the opposite side of the waste pipe 31-15. The discharge mechanism 123 on this side is the cleaning position. When the molding compound reaches the feed port 110, the sensor near the feed port 110 detects that there is material in the feed port 110, and the rotating mechanism 121 rotates in the reverse direction. When the feed port 110 detects that there is material again, the rotating mechanism 121 rotates in the reverse direction, and the molding compound enters the waste pipe 31-15 and is discharged through the cleaning position on the tray 31-2.

[0038] like Figures 1-2As shown, the recycling component 130 is located below the waste pipes 31-15 and is used to recycle the non-compliant molding compound screened by the screening component 120. The recycling component 130 recycles the non-compliant molding compound for reprocessing into compliant molding compound. Preferably, the recycling component 130 includes a waste glue funnel 131, which is located directly below the waste pipes 31-15. The waste glue funnel is connected to an external molding compound waste recycling device 300, which is preferably a recycling bin. When it is necessary to change to a different type of molding compound according to production needs, an empty molding compound waste recycling device 300 needs to be replaced. The molding compound recycled in this instance does not need to be recycled and reprocessed.

[0039] In some embodiments, after qualified molding compound arrives at the discharge port 125, the dispensing assembly 140 located below the discharge port 125 receives the molding compound. The molding compound can fall into the dispensing hole 1401 of the dispensing assembly 140 by gravity, or a clamping mechanism can be provided to place the qualified molding compound into the dispensing hole 1401 of the dispensing assembly 140.

[0040] In one optional embodiment, the glue discharge assembly 140 includes a glue discharge seat 14 and a transmission unit 142. The glue discharge seat 14 is provided with glue discharge holes 1401 along the transmission direction for carrying multiple molding compounds. The transmission unit 142 drives the glue discharge seat 14 to perform transmission. The spacing of the glue discharge holes 1401 is consistent with the size of the mold cavity on the mold box of the molding die where the molding compound is placed.

[0041] Specifically, the transmission unit 142 includes a transmission belt 1, a clamping member 3, and a drive motor 8. The clamping member 3 can reciprocate with the transmission belt 1 to move back and forth between the two ends of the transmission unit 142. The drive motor 8 is mounted on the transmission belt 1 and is used for the reciprocating movement of the transmission belt 1. The drive motor 8 can be any type of drive device, such as a servo motor, a cylinder, or a hydraulic cylinder, and is not limited here. A glue discharge base 20 is provided below the glue discharge seat 14. The clamping member 3 is used to fix the transmission belt 1 and the glue discharge base 20 together. The glue discharge base 20 has a clamping gap for clamping the glue discharge seat 14. A dustproof baffle 34 is provided on the side of the glue discharge base 20 near the screening component 120. The dustproof baffle 34 can effectively reduce dust entering the glue discharge base 20 and increase the moving resistance of the glue discharge base 20.

[0042] The transmission unit 142 is mounted on the switching base plate 18. Push rod motor seats 2 are located at both ends of the switching base plate 18. Synchronous pulleys 9 are installed in both push rod motor seats 2. One synchronous pulley 9 is connected to the shaft of the drive motor 8, and the other synchronous pulley 9 is connected to the shaft 10. Protective covers 13 are fixed to both push rod motor seats 2. A base plate protective cover 35 is also provided on the side of the drive motor 8 at the other end. The protective covers 13 and 35 shield the moving parts to prevent movement of the moving parts when the operator is troubleshooting, thereby preventing injury to personnel during equipment maintenance.

[0043] Specifically, when the molding compound reaches the discharge port 125, it falls into the discharge hole 1401 at the forefront of the conveying direction of the discharge seat 14 below. The sensor will detect that molding compound has fallen into the discharge seat 14, and the drive motor 8 will drive the discharge seat 14 to move forward along the conveying direction, so that the next hole on the discharge seat 14 is directly below the discharge port 125. After waiting for the next qualified molding compound to fall into it, it will move in the conveying direction again until the discharge hole 1401 on the discharge seat 14 is completely filled with molding compound. The drive motor 8 will drive the discharge seat 14 to the material picking position 150 set on the other side. At this time, the discharge seat 14 is located directly below the material picking position 150, and the molding compound in the discharge seat 14 is coaxial with the hole on the material picking position 150.

[0044] In this design, the switching unit 160 includes a vertical plate cylinder 26, with a push rod base plate 16 fixed to the top of the cylinder 26. Several push rods 43 are fixed on the push rod base plate 16, and these push rods 43 can slide through the switching base plate 15 and the dispensing assembly 140 as the vertical plate cylinder 26 slides, abutting against the material receiving position 150. The material receiving position 150 is located at one end of the dispensing assembly 140 and is used to receive the plastic sealant arranged on the dispensing assembly 140. In an optional embodiment, to reduce the eccentric loss caused by the weight of the molding compound on the piston movement of the vertical plate cylinder 26, the switching unit 160 further includes a switching base 15. The switching base 15 is fixed on the switching base plate 18 and located at the bottom of the dispensing assembly 140. The switching base 15 is preferably horizontally H-shaped, and a clearance groove is provided on the switching base 15. The switching base plate 18 and the switching base 15 have the same clearance groove at the same position. The width of the clearance groove on the switching base plate 18 and the switching base 15 is larger than the diameter of the push rod 43 and smaller than the diameter of the molding compound.

[0045] Specifically, the vertical plate cylinder 26 is fixed on the vertical plate 17, and a switching base plate 18 is fixedly installed on the top of the vertical plate 17. The vertical plate 17 is provided with a clearance groove, and the vertical plate cylinder 26 is located below this clearance groove. Dustproof plates are provided on both sides of the clearance groove to prevent dust from the molding compound from falling into the vertical plate cylinder 26 and the space around the device. Preferably, the dustproof plates and a vacuum source connected to the control system are used to suction the dust in real time.

[0046] The automatic material screening and pre-discharging device 100 is equipped with multiple sensors for transmitting signals of feeding, weighing, discharging and rotation. The sensors are electrically connected to the electrical control system, which is also connected to the cylinder 31-9, the rotator 31-4, the vertical plate cylinder 26 and the drive motor 8. The system controls the above equipment according to the signals transmitted by the sensors to complete the work.

[0047] Example 2: The automatic material screening and pre-discharging device 100 is located at the end of the plastic sealing material dispensing device 200. In some embodiments, the automatic material screening and pre-discharging device 100 includes a feed inlet 110, a screening component 120, and a material dispensing position 150.

[0048] In an optional embodiment, a screening component 120 is disposed at the feed inlet 110, and the screening component 120 includes a rotating mechanism 121 and a weighing mechanism 122. The weighing mechanism 122 weighs the molding compound and outputs a signal indicating whether the molding compound meets the set weight. The rotating mechanism 121 conveys the molding compound that meets the requirements to the discharge port 125. The molding compound that does not meet the requirements is removed by other equipment.

[0049] In this embodiment, the molding compound that meets the requirements in the discharge port 125 falls directly into the dispensing seat 14. The dispensing seat 14 includes a transmission unit 142. The molding compound arrives at the discharge port 125 and falls into the dispensing hole 1401 at the very front of the transmission direction of the dispensing seat 14. A sensor detects that molding compound has fallen into the dispensing seat 14, and the transmission device moves the dispensing seat 14 forward along the transmission direction, so that the next dispensing hole 1401 on the dispensing seat 14 is directly below the discharge port 125. After the next qualified molding compound falls into the dispensing hole 1401, it moves forward again in the transmission direction until all the dispensing holes 1401 on the dispensing seat 14 are filled with molding compound. The material handling device 400 removes the molding compound from the dispensing seat 14 and dispenses it into the dispensing rack.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A material automatic screening pre-dispensing device, characterized in that, include: The feed inlet receives the molding compound; A screening component, located at the feed inlet, has grooves for holding multiple molding compounds, used to weigh and screen the molding compounds on the grooves, and to convey the molding compounds that do not meet the requirements to the waste pipe, and the molding compounds that meet the requirements to the discharge port. A recycling component, located below the waste pipe, is used to recycle the molding compound screened by the screening component; The glue discharge assembly is located below the material discharge port and connected to the material discharge port of the screening assembly. It is used to arrange the molding compound conveyed by the screening assembly. The material receiving position is located at the end of the shaft of the glue dispensing assembly and is used to receive the plastic sealant arranged on the glue dispensing assembly; A switching unit is located below the material taking position. The switching unit is used to lift the molding compound on the glue discharge assembly upward. When the switching unit completes the lifting, the end of the molding compound abuts against the material taking position.

2. The automatic material screening and pre-dispensing device according to claim 1, characterized in that, The filtering component includes: The rotating mechanism includes a fixing member and a tray mounted on the fixing member and rotating about its center. The fixing member has a through groove below the tray that connects to a feed inlet and a discharge outlet. The tray has a recess inside that accommodates the molding compound from the feed inlet. A weighing mechanism is disposed below a groove adjacent to the feed inlet, along the rotation direction of the tray, for weighing the molding compound on the groove. The material feeding mechanism is located below the groove adjacent to the weighing mechanism along the rotation direction of the tray, and is used to feed the plastic sealant when the weight does not meet the requirements.

3. The automatic material screening and pre-dispensing device according to claim 2, characterized in that, The material feeding mechanism includes a switching plate and a cylinder. The switching plate has a groove above it and is connected to the waste pipe. The switching plate moves horizontally to drop any unsatisfactory molding compound into the waste pipe. The output end of the cylinder is connected to the switching plate, and the cylinder drives the movement of the switching plate.

4. The automatic material screening and pre-dispensing device according to claim 2, characterized in that, The rotating mechanism is equipped with a positioner, which ensures that the groove and the feed inlet coincide.

5. The automatic material screening and pre-dispensing device according to claim 1, wherein, The adhesive discharge assembly includes: The glue discharge seat is provided with glue discharge holes along the conveying direction to carry multiple molding compounds. The transmission unit is used to transmit the glue outlet.

6. The automatic material screening and pre-dispensing device according to claim 5, characterized in that, The transmission unit includes: Conveyor belt; A clamping component is movably mounted on a conveyor belt, and a glue discharge seat is fixedly mounted on the clamping component; A drive motor is mounted on the conveyor belt, and the drive motor is used to drive the clamp to reciprocate along the conveyor belt.

7. The apparatus according to claim 1, wherein The switching unit includes a vertical plate cylinder, a push rod base plate is fixed to the top of the vertical plate cylinder, and a number of push rods are fixed on the push rod base plate. The ends of the push rods pass through the switching base and the glue discharge assembly and abut against the material picking position.

8. The automatic material screening and pre-dispensing device according to claim 7, characterized in that, The vertical plate cylinder is fixed on the vertical plate, the vertical plate is provided with a clearance groove, the cylinder is located below this clearance groove, and the glue discharge assembly is fixedly installed on the top of the vertical plate.

9. The apparatus according to claim 1, wherein, The recycling component includes a waste glue funnel, which is located directly below the waste pipe and is connected to an external waste glue recycling device.

10. A material loading apparatus, characterized by, Includes the automatic material screening and pre-discharging equipment as described in any one of claims 1-9.

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