An upper cover for an IC tray

Abstract

The application relates to the technical field of an upper cover for an IC tray, and an upper cover for an IC tray, which comprises a tray body, an upper cover plate is matched above the tray body, and inserts are fixedly installed at lower ends of the upper cover plate near four corner positions and two middle side positions; a groove is formed in one side of the insert; a surface antistatic coating is coated on the outer surface of the upper cover plate; the antistatic coating covers the outer surface of a base layer; the thickness of the coating is 10-50 mu m; the surface resistivity is less than or equal to 10^6 omega / sq; a composite base layer is arranged in the upper cover plate; the composite base layer is composed of polycarbonate PC and polyethylene terephthalate PET; the PC accounts for 60-80 wt%; the PET accounts for 20-40 wt%; a conductive fiber layer is arranged in the upper cover plate; the conductive fiber layer is embedded in the base layer; the conductive fiber layer contains carbon fibers with a diameter of 5-15 mu m; and the fiber content is 3-8 vol%. Preferably, rectangular grooves are formed at the lower ends of the upper cover plate near the periphery; the upper cover for the IC tray is convenient to use and has good performance.

Description

Technical Field

[0001] This application relates to the technical field of top covers for IC trays, and more particularly to a top cover for an IC tray. Background Technology

[0002] Integrated circuits (ICs) are core components of modern electronic devices, and their protection during production, transportation, and storage is crucial. IC chips are typically stored and transported using dedicated trays to prevent physical damage and electrostatic discharge. However, existing IC tray covers have the following problems in practical applications:

[0003] Insufficient positioning accuracy: Traditional positioning methods for the top cover and tray rely on simple snap-fits or edge alignment, which are prone to displacement due to external impacts or operational errors. This cannot ensure precise alignment of the top cover and tray, potentially exposing or compressing the internal IC chip. Limited sealing performance: Existing sealing designs for the top cover edges mostly use flat contact or simple rubber strips, which are insufficient to effectively prevent dust, moisture, and other contaminants from entering the tray. Especially in high humidity or dusty environments, the IC chip is susceptible to oxidation, short circuits, and other damage.

[0004] Inadequate anti-static measures: Although some top covers are made of anti-static materials, unreasonable structural design, such as uneven material thickness and poor contact with the tray, leads to poor static dissipation paths and still poses a risk of static accumulation causing chip breakdown. Those skilled in the art provide a top cover for IC trays to solve the problems mentioned in the background art. Utility Model Content

[0005] To address the problems mentioned in the background art, this application provides a cover for an IC tray.

[0006] The technical solution provided in this application for a top cover for an IC tray is as follows:

[0007] A cover for an IC tray includes a tray body, a cover plate fitted on top of the tray body, inserts fixedly installed at the lower end of the cover plate near the four corners and the two middle sides, a groove formed on one side of each insert, an antistatic coating on the outer surface of the cover plate covering the outer surface of the substrate layer, the coating thickness being 10-50 μm and the surface resistivity ≤10^6 Ω / sq, a composite substrate layer being disposed inside the cover plate, the composite substrate layer being composed of a blend of polycarbonate (PC) and polyethylene terephthalate (PET), wherein PC accounts for 60-80 wt% and PET accounts for 20-40 wt%, a conductive fiber layer being disposed inside the cover plate, the conductive fiber layer being embedded inside the substrate layer, containing carbon fibers with a diameter of 5-15 μm and a fiber content of 3-8 vol.

[0008] Preferably, a rectangular groove is formed at the lower end of the upper cover plate near the perimeter, and a sponge pad is provided inside the rectangular groove.

[0009] Preferably, a rubber sealing gasket is fixedly installed on the upper end of the tray body near the perimeter, and the rubber sealing gasket is matched with the rectangular groove.

[0010] Preferably, the upper end of the tray body has positioning grooves near the four corners and the two middle sides, and the plug-in is inserted into and matched with the positioning grooves.

[0011] Preferably, a rotating column is provided on the outer side of the tray body, and a screw is connected to one end of the rotating column. The screw penetrates the interior of the tray body and is threadedly connected to the tray body.

[0012] Preferably, the screw passes through the interior of the positioning groove, and a fixing ring is fixedly installed on the outside of the screw inside the positioning groove, and a retaining ring is fixedly installed on the outside of the fixing ring.

[0013] Preferably, the retaining ring engages and matches the groove.

[0014] In summary, this application includes the following beneficial technical effects: After the plug-in and positioning groove are matched, the upper cover plate is locked above the tray body, and the rubber sealing gasket is locked inside the rectangular groove. The rubber sealing gasket and the sponge pad inside the rectangular groove squeeze each other to complete the sealing of the tray body, effectively preventing dust, moisture and other contaminants from entering the tray body, preventing IC chip oxidation and improving the service life of IC chips.

[0015] The foam pads provide excellent cushioning, preventing excessive stress when the top cover is snapped onto the tray, which could damage the IC chips. They also overlap and adhere to the rubber sealing pads to prevent dust from entering the interior of the tray.

[0016] With the rotating column, when the plug is inserted into the positioning groove, rotating the rotating column will cause the fixing ring to rotate due to the threaded connection between the screw and the tray body. The fixing ring is located inside the positioning groove. As the fixing ring rotates, the retaining ring rotates, thereby engaging with the groove to prevent the top cover from loosening. It is also more convenient to remove the top cover to repair the IC chip on the tray body.

[0017] By employing a surface antistatic coating, a conductive fiber layer (using Toray T700SC carbon fiber, 7μm diameter, 5.5% volume content), a continuous conductive path with a mesh density of 25-40 mesh / mm² is formed, achieving a volume resistivity ≤1×10⁻⁶. 4The surface resistivity is ≥18 N / mm², with nano-SiO₂ (0.35 wt%) added to the matrix to improve interfacial bonding strength. Surface charge is dynamically dissipated. The antistatic coating contains PEDOT:PSS (2.2 wt%) and nano-zinc oxide (1.5 wt%), and the surface resistivity is stably controlled at 10 Ω·cm². 6 -10 7 With an Ω / sq range and a decay rate of <15% after 200 rubs, the performance of the top cover plate is greatly improved. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a top cover for an IC tray in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of a plug-in structure for an IC tray cover according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the upper cover structure of an IC tray according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of a screw structure for an IC tray cover according to an embodiment of this application.

[0022] Explanation of reference numerals in the attached drawings: 1. Tray body; 2. Top cover plate; 3. Positioning groove; 4. Rubber sealing gasket; 5. Rotating column; 6. Insert; 8. Groove; 9. Rectangular groove; 21. Surface antistatic coating; 22. Composite substrate layer; 23. Conductive fiber layer; 10. Screw; 11. Retaining ring; 15. Snap ring; 16. Sponge pad. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the present utility model embodiments clearer, the present utility model embodiments will be further described in detail below with reference to the embodiments and accompanying drawings.

[0024] The illustrative embodiments of this utility model and their descriptions are provided herein to explain this utility model, but are not intended to limit this utility model.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] It should be understood that the terms "comprising / including," "consisting of," or any other variations are intended to cover non-exclusive inclusion, such that a product, apparatus, process, or method that comprises a list of elements includes not only those elements but may also include, where necessary, other elements not expressly listed, or elements inherent to such a product, apparatus, process, or method. Without further limitation, an element defined by the phrases "comprising / including," "consisting of," does not exclude the presence of additional identical elements in the product, apparatus, process, or method that includes said element.

[0027] It should also be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device, component or structure referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation on this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] like Figures 1-4 As shown, a cover for an IC tray includes a tray body 1, a cover plate 2 fitted on the top of the tray body 1, and inserts 6 fixedly installed at the lower end of the cover plate 2 near the four corners and the middle two sides. A groove 8 is provided on one side of the insert 6. The outer surface of the cover plate 2 is coated with an antistatic coating 21, which covers the outer surface of the substrate layer. The coating thickness is 10-50μm and the surface resistivity is ≤10^6Ω / sq. The interior of the cover plate 2 is provided with a composite substrate layer 22, which is composed of a blend of polycarbonate (PC) and polyethylene terephthalate (PET), wherein PC accounts for 60-80wt% and PET accounts for 20-40wt%. The interior of the cover plate 2 is provided with a conductive fiber layer 23, which is embedded in the substrate layer and contains carbon fibers with a diameter of 5-15μm and a fiber content of 3-8vol.

[0030] During use, after the plug-in 6 and the positioning slot 3 are inserted and matched, the upper cover 2 is locked on the top of the tray body 1. At this time, the rubber sealing gasket 4 is locked inside the rectangular slot 9. The rubber sealing gasket 4 and the sponge gasket 16 inside the rectangular slot 9 squeeze each other to complete the sealing of the tray body 1, effectively preventing dust, moisture and other contaminants from entering the tray body 1, preventing IC chip oxidation and improving the service life of IC chip.

[0031] The conductive fiber layer 23 uses Toray T700SC carbon fiber (7μm in diameter, 5.5% by volume) to form a continuous conductive path with a mesh density of 25-40 mesh / mm² and a volume resistivity ≤1×10⁻⁶. 4 Ω·cm2.

[0032] Nano-SiO2 (0.35wt%) is added to the composite matrix layer 22 to improve the interfacial bonding strength, with a fiber-matrix peel force ≥18N / mm1. The surface antistatic coating dynamically dissipates; the antistatic coating contains PEDOT:PSS (2.2wt%) and nano-zinc oxide (1.5wt%), and the surface resistivity is stably controlled at 10 Ω·cm through an ion-electron dual-conduction mechanism. 6 -10 7 The resistance is within the range of Ω / sq, and the attenuation rate after 200 friction cycles is <15%; the following data were obtained based on the experiment;

[0033] Performance indicators Test conditions Measured value Improvement compared to traditional solutions Surface potential decay rate ESDS4.1-2016, 25℃ / 50%RH The time taken to change from 500V to 100V is less than 0.5s. 300% accelerated dissipation electrostatic shielding effectiveness IEC61340-5-1, 1kHz-1MHz ≥35dB Increased by 2.8 times Environmental stability Cycle 100 times between -40℃ and 85℃. Resistivity fluctuation < ±0.5log Temperature resistance improved by 40%

[0034] In this embodiment, a rectangular groove 9 is provided at the lower end of the upper cover plate 2 near the periphery, and a sponge pad 16 is provided inside the rectangular groove 9.

[0035] The sponge pad 16 provides excellent cushioning, preventing excessive stress when the top cover 2 is snapped onto the tray body 1, which could cause damage to the IC chip. It can also overlap and adhere to the rubber sealing pad 4 to prevent dust from entering the interior of the tray body 1.

[0036] In this embodiment, a rubber sealing gasket 4 is fixedly installed on the upper end of the tray body 1 near the periphery, and the rubber sealing gasket 4 engages and matches with the rectangular groove 9.

[0037] In this embodiment, the upper end of the tray body 1 is provided with positioning grooves 3 near the four corners and the two middle sides, and the plug-in 6 is inserted and matched with the positioning grooves 3.

[0038] In this embodiment, a rotating column 5 is provided on the outer side of the tray body 1, and a screw 10 is connected to one end of the rotating column 5. The screw 10 penetrates the interior of the tray body 1 and is threadedly connected to the tray body 1.

[0039] In this embodiment, the screw 10 passes through the interior of the positioning groove 3, and a fixing ring 11 is fixedly installed on the outside of the screw 10 inside the positioning groove 3, and a retaining ring 15 is fixedly installed on the outside of the fixing ring 11.

[0040] In this embodiment, the retaining ring 15 engages and matches with the groove 8.

[0041] When the plug 6 is inserted into the positioning groove 3, the rotating column 5 is rotated. Since the screw 10 is threadedly connected to the tray body 1, the fixing ring 11 is rotated. The fixing ring 11 is located inside the positioning groove 3. As the fixing ring 11 rotates, the retaining ring 15 rotates, thereby engaging the retaining ring 15 with the groove 8 to prevent the upper cover plate 2 from loosening. This also makes it more convenient to remove the upper cover plate 2 to repair the IC chip on the tray body 1.

[0042] The implementation principle of the top cover for an IC tray in this embodiment is as follows: During use, after the plug-in 6 and the positioning groove 3 are inserted and matched, the top cover 2 is engaged above the tray body 1. At this time, the rubber sealing gasket 4 is engaged inside the rectangular groove 9. The rubber sealing gasket 4 and the sponge pad 16 inside the rectangular groove 9 squeeze each other to complete the sealing of the tray body 1, effectively preventing dust, moisture and other contaminants from entering the tray body 1, preventing IC chip oxidation, and improving IC performance. The sponge pad 16 provides excellent cushioning to extend the lifespan of the chip, preventing excessive stress when the top cover 2 is engaged with the tray body 1, which could cause damage to the IC chip. It also overlaps and adheres to the rubber sealing gasket 4 to prevent dust from entering the interior of the tray body 1. When the plug 6 is inserted into the positioning groove 3, rotating the rotating column 5 causes the fixing ring 11 to rotate due to the threaded connection between the screw 10 and the tray body 1. The fixing ring 11 is located inside the positioning groove 3, and as the fixing ring 11 rotates, the retaining ring 15 rotates, thereby engaging with the groove 8 to prevent the top cover 2 from loosening. This also makes it more convenient to remove the top cover 2 to repair the IC chip on the tray body 1.

[0043] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0044] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0045] In conclusion, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cover for an IC tray, comprising a tray body (1), wherein a cover plate (2) is fitted on the upper part of the tray body (1), characterized in that: The lower end of the upper cover plate (2) is fixedly installed with plugs (6) near the four corners and the middle two sides. A groove (8) is opened on one side of the plugs (6). The outer surface of the upper cover plate (2) is coated with a surface antistatic coating (21). The antistatic coating (21) covers the outer surface of the substrate layer. A composite substrate layer (22) is provided inside the upper cover plate (2). A conductive fiber layer (23) is provided inside the upper cover plate (2). The conductive fiber layer (23) is embedded inside the substrate layer.

2. A top cover for an IC tray according to claim 1, characterized in that: The lower end of the upper cover plate (2) is provided with a rectangular groove (9) near the periphery, and a sponge pad (16) is provided inside the rectangular groove (9).

3. A top cover for an IC tray according to claim 1, characterized in that: A rubber sealing gasket (4) is fixedly installed on the upper end of the tray body (1) near the periphery, and the rubber sealing gasket (4) engages and matches with the rectangular groove (9).

4. A top cover for an IC tray according to claim 1, characterized in that: The upper end of the tray body (1) is provided with positioning grooves (3) near the four corners and the middle two sides, and the plug (6) is inserted and matched with the positioning grooves (3).

5. A top cover for an IC tray according to claim 4, characterized in that: A rotating column (5) is provided on the outside of the tray body (1). One end of the rotating column (5) is connected to a screw (10). The screw (10) passes through the interior of the tray body (1) and is threadedly connected to the tray body (1).

6. A top cover for an IC tray according to claim 5, characterized in that: The screw (10) passes through the interior of the positioning groove (3), and a fixing ring (11) is fixedly installed on the outside of the screw (10) inside the positioning groove (3), and a retaining ring (15) is fixedly installed on the outside of the fixing ring (11).

7. A top cover for an IC tray according to claim 6, characterized in that: The retaining ring (15) engages and matches with the groove (8).

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