Shielded electric pump comprising a power electronic control circuit

Abstract

A shielded electric pump with power electronic control circuitry includes a pump cover, pump body, rear housing, end cover, motor assembly, and control board assembly. The pump body has a built-in motor housing cavity, control housing cavity, and flow channel cavity. The control board assembly includes a control board, an insulating protective plate integrally injection molded with a copper busbar, an IGBT module, and a heat dissipation bracket. The copper busbar connects the control board and the IGBT module. The control board, insulating protective plate, and heat dissipation bracket with a heat dissipation and heat conduction surface perpendicular to the pump axis are arranged and fixed in layers along the pump axis from the inner end face of the end cover to the outer end face of the rear housing in the control housing cavity. The insulating protective plate partially separates the control board and the heat dissipation bracket, and another part partially separates the control board and the rear housing. The IGBT module is mounted on the insulating protective plate in the projection of the flow channel cavity along the pump axis, and at least part of the heat dissipation bracket abuts against the IGBT module, the insulating protective plate, the control board, and the rear housing. The heat dissipation bracket abuts against the outer surface of the rear housing in the projection of the flow channel cavity along the pump axis, which can reduce the interference of the IGBT to other circuits while dissipating heat from the IGBT module.

Description

Technical Field

[0001] This utility model relates to a shielded electric pump (commonly known in the industry as an electronic water pump) containing a power electronic control circuit, and its IPC classification may be F04D29 / 58 or F04D29 / 40. Background Technology

[0002] In related technologies, current shielded electric pumps with encapsulated stators and power electronic control circuits have centrifugal pump bodies occupying the central projection area along the pump axis, and flow channels occupying the outer projection area along the pump axis in the control chamber. The power electronic components such as IGBTs in the circuit generate high heat and require cooling through the outer flow channels. This is evident in the applicant's prior application CN214330920U, "An Electronic Water Pump Utilizing Its Own Working Medium for Heat Dissipation." Traditional designs for this type of pump use large IGBT devices and their heat dissipation structures, which can easily interfere with other circuits. Therefore, the industry has been continuously striving to improve electrical insulation and EMC performance while ensuring heat dissipation.

[0003] For general knowledge and terminology, please refer to the 1978-1983 edition or the 1997 2nd edition of "Mechanical Engineering Handbook" and "Electrical Engineering Handbook" published by Machinery Industry Press, the 2014 1st edition of "Pump Theory and Technology" published by Machinery Industry Press, and the national standard GB / T7021 "Centrifugal Pump Terminology". Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a shielded electric pump with power electronic control circuitry, which can enhance electrical insulation and EMC performance while promoting heat dissipation of IGBT modules.

[0005] In a first aspect, this utility model provides a shielded electric pump containing a power electronic control circuit, comprising: a pump cover, a pump body, a rear shell, an end cover, a motor assembly, and a control board assembly; the pump body is provided with a motor receiving cavity for accommodating the motor assembly and a control receiving cavity for accommodating the control board assembly, the motor receiving cavity being surrounded by the pump cover, the inner wall of the pump body, and the rear shell, and the control receiving cavity being surrounded by the rear shell and the end cover, the pump cover, the motor assembly, the inner wall of the pump body, and the rear shell forming a flow channel cavity; characterized in that the control board assembly includes a control board, an insulating protective plate integrally injection molded with a copper busbar, an IGBT module, and a heat dissipation bracket, the copper busbar being used to connect the control board and the IGBT module. The control board, insulating protective plate, and heat dissipation bracket with a heat dissipation and heat conduction surface perpendicular to the pump axis are arranged and fixed in layers along the pump axis from the inner end face of the end cover to the outer end face of the rear shell within the control receiving cavity. A portion of the insulating protective plate partially separates the control board and the heat dissipation bracket, and another portion of the insulating protective plate partially separates the control board and the rear shell. The IGBT module is mounted on the insulating protective plate in the projection of the flow channel cavity along the pump axis, and at least a portion of the heat dissipation bracket abuts against the IGBT module, the insulating protective plate, the control board, and the rear shell. The heat dissipation bracket abuts against the outer surface of the rear shell in the projection of the flow channel cavity along the pump axis.

[0006] The stacked structure along the pump axis is very compact and robust, and the conductive distance is greatly shortened. This not only enables the IGBT module to utilize the pump flow channel for heat dissipation more effectively, but also greatly reduces the interference of the IGBT module to other circuits. It is beneficial to enhance electrical insulation and EMC performance, and also reduces the number of parts, simplifies assembly, and improves production efficiency.

[0007] According to some embodiments of this utility model, the insulating protective plate has an opening, and a first copper busbar terminal extends from one end of the copper busbar of the insulating protective plate, while a second copper busbar terminal extends from the other end. The first copper busbar terminal extends horizontally from the opening along the end face of the insulating protective plate, and the second copper busbar terminal extends vertically along the end face of the insulating protective plate. The insulating protective plate includes a first mounting surface, and a first mounting groove for mounting the IGBT module is provided on the first mounting surface. A first through hole is provided in the first mounting groove facing the extension direction of the first copper busbar terminal. The pins of the IGBT module pass through the first through hole and connect to the first copper busbar terminal. The second copper busbar terminal connects to the control board. The connection between the IGBT and the circuit board is achieved through the copper busbar terminal. This compact power electronic circuit connection significantly shortens the conductive distance and has high assembly efficiency.

[0008] According to some embodiments of this utility model, a welding groove is provided on the first copper busbar terminal, and the pins of the IGBT module are welded to the welding groove. This makes it less likely for the solder to flow away during soldering of the IGBT pins, resulting in a more stable soldering.

[0009] According to some embodiments of this utility model, the first mounting surface is further provided with an adhesive groove and an insulating and heat-dissipating tape corresponding to the shape of the adhesive groove. The insulating and heat-dissipating tape is adhered to the adhesive groove to cover the IGBT module, the opening, and the first copper busbar terminal. The insulating and heat-dissipating tape can further insulate the IGBT module.

[0010] According to some embodiments of this utility model, the height of the through-section of the first via is greater than the thickness of the IGBT module. This makes it easier for the pins of the IGBT module to extend from the first mounting slot.

[0011] According to some embodiments of this utility model, the end face of the heat dissipation bracket that abuts against the insulating protective plate is provided with multiple convex surfaces, and the convex surfaces abut against the control plate through thermally conductive putty. The convex surfaces can enhance the heat dissipation efficiency of the heat dissipation bracket.

[0012] According to some embodiments of this utility model, the insulating protective plate includes a second mounting surface, and a plurality of flanges are provided between the second mounting surface and the first mounting groove. A first through hole is provided on the second mounting surface within the flanges. A second through hole corresponding to the first through hole is provided on the heat dissipation bracket. A first screw hole corresponding to the first through hole is provided on the end face of the rear shell facing the flow channel cavity. The insulating protective plate, the IGBT module, and the heat dissipation bracket are fixed to the rear shell by screws sequentially passing through the first through hole, the second through hole, and the first screw hole. This is used to fix the insulating protective plate, the IGBT module, and the heat dissipation bracket into one unit.

[0013] According to some embodiments of the present invention, the rear shell is provided with a positioning flange, and the heat dissipation bracket is provided with a positioning recess corresponding to the positioning flange and a positioning hole for positioning. The positioning flange, positioning recess and positioning hole are used to position the heat dissipation bracket, and the positioning hole is used for fixing the heat dissipation bracket and the rear shell together by screws.

[0014] Used to position the heat sink bracket and prevent mistaken installation.

[0015] According to some embodiments of this utility model, the adhesive groove further includes a process hole, and the adhesive groove on the second mounting surface is coated with insulating adhesive, which at least covers the opening and the process hole. Applying insulating adhesive further insulates the insulating shield and the circuit board.

[0016] According to some embodiments of this utility model, the insulating protective plate is further provided with mounting holes for pins, components, and screws to pass through. This allows for positioning of the circuit board during installation.

[0017] According to some embodiments of this utility model, the thickness of the IGBT module is 'a', the height of the first mounting groove is 'b', and 'b' ≥ 0.1 mm. Experiments show that this dimensional relationship allows for closer contact between the insulating heat-dissipating tape and the IGBT module, resulting in optimal heat dissipation and good EMC performance.

[0018] According to some embodiments of this utility model, a boss is provided on the first mounting slot, and a first groove corresponding to the boss is provided on the IGBT module. When the IGBT module is installed, the boss is embedded into the first groove to be installed onto the first mounting slot. This prevents the IGBT module from being installed backwards. Attached Figure Description

[0019] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.

[0020] Figure 1 This is an overall schematic diagram of a shielded electric pump provided in one embodiment of the present invention;

[0021] Figure 2 yes Figure 1 The diagram shows the AA cross-section of the shielded electric pump;

[0022] Figure 3 yes Figure 2 A schematic diagram of the overall structure of the insulating protective plate 620 is shown.

[0023] Figure 4 yes Figure 3 A schematic diagram of the second mounting surface 625 of the insulating protective plate 620 is shown;

[0024] Figure 5 yes Figure 4 A top view of the insulating protective plate 620 is shown;

[0025] Figure 6 yes Figure 5 The diagram shows a cross-sectional view of the insulating liner 620 (BB section).

[0026] Figure 7 yes Figure 4 A schematic diagram of the insulating shield 620 without the IGBT module 630 is shown;

[0027] Figure 8 yes Figure 7A partial top perspective view of the insulating liner 620 is shown;

[0028] Figure 9 yes Figure 8 A schematic diagram of an insulating protective plate 620 containing insulating heat-dissipating tape 660 is shown;

[0029] Figure 10 This is a partial schematic diagram of a shielded electric pump provided in one embodiment of the present invention;

[0030] Figure 11 yes Figure 10 The diagram shows the CC cross-section of the shielded electric pump;

[0031] Figure 12 yes Figure 11 A partially enlarged view of the shielded electric pump is shown;

[0032] Figure 13 yes Figure 2 The exploded view of a partially shielded electric pump is shown.

[0033] Figure 14 yes Figure 6 A partial enlarged view B of the insulating protective plate 620 is shown;

[0034] Figure 15 yes Figure 2 A schematic diagram of the first mounting surface 622 of the insulating protective plate 620 is shown.

[0035] Figure 16 yes Figure 3 The diagram shows the overall layout of the IGBT module 630.

[0036] Icon labels:

[0037] Pump cover 100;

[0038] Pump body 200;

[0039] Rear housing 300; Positioning flange 310; First screw hole 320;

[0040] End cap 400;

[0041] Motor assembly 500;

[0042] Control board assembly 600; control board 610; insulating protective plate 620; opening 621; first mounting surface 622; first mounting groove 623; first through hole 624; second mounting surface 625; flange 626; first through hole 627; process hole 628; mounting hole 629; IGBT module 630; first groove 631; copper busbar 640 (terminal assembly for electrically connecting IGBT module 630); first copper busbar terminal 641; second copper busbar terminal 642; welding groove 643; heat dissipation bracket 650; convex surface 651; second through hole 652; positioning recess 653; positioning hole 654; insulating heat dissipation tape 660; adhesive groove 661; boss 670;

[0043] Motor housing cavity 700; flow channel cavity 710;

[0044] Control the cavity 800;

[0045] Insulating adhesive 900. Detailed Implementation

[0046] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0047] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0048] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0049] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0050] Reference Figure 1 , Figure 2 and Figure 13The shielded electric pump includes a pump cover 100, a pump body 200, a rear shell 300, an end cover 400, a motor assembly 500, and a control board assembly 600. The pump body 200 has a motor housing cavity 700 for accommodating the motor assembly 500 and a control housing cavity 800 for accommodating the control board assembly 600. The motor housing cavity 700 is surrounded by the pump cover 100, the inner wall of the pump body 200, and the rear shell 300. The control housing cavity 800 is surrounded by the rear shell 300 and the end cover 400. The pump cover 100, the motor assembly 500, the inner wall of the pump body 200, and the rear shell 300 together form a flow channel cavity 710. The motor assembly 500 includes a heating element. The control board assembly 600 comprises a module, stator, and rotor. It includes a control board 610, an insulating protective plate 620 integrally molded with a copper busbar 640, an IGBT module 630, and a heat sink bracket 650. The copper busbar 640 is a flat, elongated terminal used to connect the control board 610 and the IGBT module 630. The control board 610, the insulating protective plate 620, and the heat sink bracket 650, whose heat dissipation and heat conduction surface is perpendicular to the pump axis, are arranged in layers along the pump axis from the inner end face of the end cover 400 to the outer end face of the rear housing 300 within the control housing cavity 800, and are sequentially connected and fixed from bottom to top by screws (or rivets and snap-fits). To make the structure of the control housing cavity 800 more compact, a portion of the insulating protective plate 620 partially separates the control board 610 from the heat sink bracket 650, while another portion of the insulating protective plate 620 partially separates the control board 610 from the rear housing 300. The IGBT module 630 is mounted on the insulating plate 620 within the projection area of ​​the flow channel cavity 710 along the pump axis, and the pins of the IGBT module are connected to the copper busbar 640. At least part of the heat sink 650 directly abuts against the insulating plate 620, the control board 610, and the rear housing 300, and indirectly abuts against the IGBT module. The heat sink 650 abuts against the outer surface of the rear housing 300 within the projection area of ​​the flow channel cavity 710 along the pump axis. By setting the insulating plate 620 in the control housing cavity 800 of the shielded electric pump, the insulating plate 620 is injection molded integrally with the copper busbar 640. The IGBT module 630 is mounted on the insulating plate 620 and connected to the copper busbar 640. The projection position of the flow channel cavity 710 is exactly aligned with the mounting position of the IGBT module 630. The IGBT module 630 conducts heat to the flow channel cavity 710 through the heat sink 650 that abuts against it. In addition, the stacked structure along the pump axis is very compact and robust, and the conductive distance is greatly shortened, which can greatly reduce the interference of the IGBT module 630 to other electronic components, thus playing the role of heat dissipation and interference elimination at the same time.

[0051] It is understandable that the projection of the IGBT module 630 onto the flow channel cavity 710 along the pump axis can be the entire projection range along the pump axis or a partial projection range, which can be changed according to structural requirements and is not specifically limited here.

[0052] Reference Figures 3 to 5, Figures 7 to 8 and Figure 10 An opening 621 is provided on the insulating protective plate 620. A first copper busbar terminal 641 extends from one end of the copper busbar 640, and a second copper busbar terminal 642 extends from the other end. The first copper busbar terminal 641 extends horizontally from the opening 621 along the end face of the insulating protective plate 620, and the second copper busbar terminal 642 extends vertically along the end face of the insulating protective plate 620. The insulating protective plate 620 includes a first mounting surface 622, on which a first mounting groove 623 for mounting the IGBT module 630 is provided. A first through hole 624 is provided in the first mounting groove 623 facing the extension direction of the first copper busbar terminal 641. The pins of the IGBT module 630 pass through the first through hole 624 and connect to the first copper busbar terminal 641, while the second copper busbar terminal 642 connects to the control board 610, thereby realizing the connection between the IGBT module 630 and the control board 610. Specifically, the height of the through-section of the first via 624 is greater than the thickness of the IGBT module 630. When the IGBT module 630 is mounted on the first mounting slot 623, the pins of the IGBT module 630 can pass through the first via 624 and connect to the first copper busbar terminal 641. This compact power electronic circuit connection can significantly shorten the conductive distance and improve assembly efficiency.

[0053] refer to Figure 15 and Figure 16 The first mounting slot 623 is also provided with a boss 670, and the IGBT module 630 is provided with a first groove 631 corresponding to the boss 670. When the IGBT module 630 is installed, the boss 670 and the first groove 631 are used to position the front and back sides to prevent the IGBT module 630 from being installed backwards. The boss 670 is embedded in the first groove 631 to be installed on the first mounting slot 623.

[0054] refer to Figures 3 to 5 and Figures 7 to 8 The first copper busbar terminal 641 is provided with a soldering groove 643, and the pins of the IGBT module 630 are soldered to the soldering groove 643. Specifically, the end of the first copper busbar terminal 641 is provided with an arc-shaped soldering groove 643 corresponding to the pins of the IGBT module 630. When the pins are soldered to the arc-shaped soldering groove 643, the solder can remain in the soldering groove 643 and is not easy to flow away or fall off, making the soldering between the pins and the first copper busbar terminal 641 more stable.

[0055] refer to Figure 7 and Figure 9The first mounting surface 622 is provided with an adhesive groove 661 and an insulating and heat-dissipating tape 660 corresponding to the shape of the adhesive groove 661. The insulating and heat-dissipating tape 660 is adhered to the adhesive groove 661 to cover the IGBT module 630, the opening 621, and the first copper bus terminal 641. Specifically, since the first mounting groove 623 and the opening 621 are also located within the adhesive groove 661, when the insulating and heat-dissipating tape 660 is adhered to the adhesive groove 661, it can cover the IGBT module 630 mounted in the first mounting groove 623 and the first copper bus terminal 641 extending from the opening 621, thereby further insulating and dissipating heat from the IGBT module 630.

[0056] refer to Figure 6 and Figure 14 The thickness of the IGBT module 630 is 'a', and the height of the first mounting slot 623 is 'b', with ab ≥ 0.1 mm. This means that the thickness of the IGBT module 630 is greater than the height of the first mounting slot 623, ensuring that the IGBT module 630 and the insulating heat dissipation tape 660 can make close contact and achieve good heat dissipation.

[0057] Understandably, the number of IGBT modules 630 can be set to multiple as needed, and correspondingly, the number of first mounting slots 623, first vias 624, and first copper bus terminals 641 can also be set to multiple. This application does not specify the number of IGBT modules 630, first mounting slots 623, and first vias 624.

[0058] refer to Figure 10 The heat sink bracket 650 has multiple protruding surfaces 651 on its end face where it abuts against the insulating cover plate 620. These protruding surfaces 651 abut against the control board 610 via thermally conductive putty, thus enabling the heat sink bracket 650 to dissipate heat generated by the control board 610. Since the insulating thermal tape 660 covers the IGBT module 630 during application, the heat generated by the IGBT module 630 is also carried away through the insulating thermal tape 660 and the heat sink bracket 650. Furthermore, the protruding surfaces 651 on the end face of the heat sink bracket 650 increase the heat dissipation area, effectively improving heat dissipation efficiency.

[0059] Understandably, the heat sink bracket 650 can be provided with multiple convex surfaces 651 to enhance heat dissipation efficiency. The more convex surfaces 651 there are, the higher the heat dissipation efficiency. The number of convex surfaces 651 can be set according to the area of ​​the end face of the heat sink bracket 650. This application does not make a specific limitation on the number of convex surfaces 651.

[0060] Specifically, one end of the heat dissipation bracket 650 abuts against the insulating protective plate 620 and the IGBT module 630, and the other end abuts against the control board 610. In this way, part of the heat dissipation bracket 650 dissipates heat from the insulating protective plate 620 and the IGBT module 630, and the other part dissipates heat from the control board 610, thereby further improving the heat dissipation efficiency.

[0061] refer to Figure 4 , Figure 5 , Figure 7 , Figure 8 , Figure 11 , Figure 12 The insulating protective plate 620 includes a second mounting surface 625. A flange 626 is provided between the second mounting surface 625 and the first mounting groove 623. A first through hole 627 is provided on the area of ​​the second mounting surface 625 formed by the flange 626 and the first mounting groove 623. A second through hole 652 corresponding to the first through hole 627 is provided on the heat dissipation bracket 650. The insulating protective plate 620, the IGBT module 630 and the heat dissipation bracket 650 are fixed to the rear shell 300 by screws passing through the first through hole 627, the second through hole 652 and the first screw hole 320 in sequence.

[0062] For example, the first through hole 627, the second through hole 652 and the first screw hole 320 are set as a pair and symmetrically arranged at both ends of the first mounting groove 623. The insulating protective plate 620 and the heat dissipation bracket 650 are locked on the rear shell 300 by screws.

[0063] refer to Figures 11 to 13 The rear shell 300 is provided with a positioning flange 310, and the heat dissipation bracket 650 is provided with a positioning recess 653 corresponding to the positioning flange 310 and a positioning hole 654 for positioning. The positioning flange 310, the positioning recess 653 and the positioning hole 654 are used to position the heat dissipation bracket (650). The positioning hole 654 allows the heat dissipation bracket 650 and the rear shell 300 to be fixedly connected by screws, which restricts the movement of the heat dissipation bracket 650 and plays a positioning role.

[0064] refer to Figures 3 to 8 as well as Figure 10 The adhesive groove 661 also includes a process hole 628. Insulating adhesive 900 is applied to the adhesive groove 661 on the second mounting surface 625, and the insulating adhesive 900 at least covers the opening 621 and the process hole 628. It should be noted that the process hole 628 is created during the injection molding of the insulating protective plate 620. Sealing the opening 621 and the process hole 628 with insulating adhesive 900 further enhances the insulation effect.

[0065] Still for reference Figures 3 to 8 as well as Figure 10The rear housing 300 also has a positioning structure, and the insulating plate 620 has mounting holes 629 for pins, components, screws, and the positioning structure to pass through. Specifically, the positioning structure on the rear housing 300 passes through the mounting holes 629 to position the insulating plate 620, the components on the control board 610 are mounted through the mounting holes 629, the pins pass through the mounting holes 629 to connect with the control board 610, and the screws pass through the mounting holes 629 to lock the insulating plate 620.

[0066] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A shielded electric pump containing power electronic control circuitry, including: The pump body comprises a pump cover (100), a pump body (200), a rear shell (300), an end cover (400), a motor assembly (500), and a control board assembly (600). The pump body (200) contains a motor housing cavity (700) for accommodating the motor assembly (500) and a control housing cavity (800) for accommodating the control board assembly (600). The motor housing cavity (700) is formed by the inner walls of the pump cover (100), the pump body (200), and the rear shell (300). The control housing cavity (800) is formed by… The rear shell (300) and end cap (400) form a flow channel cavity (710), which is formed by the pump cover (100), motor assembly (500), inner wall of pump body (200) and rear shell (300); characterized in that the control board assembly (600) includes a control board (610), an insulating protective plate (620) integrally injection molded with a copper busbar (640), an IGBT module (630) and a heat dissipation bracket (650), wherein the copper busbar (640) is used to connect the control board (610) and the IGBT module. Block (630); the control board (610), the insulating protective plate (620), and the heat dissipation bracket (650) with a heat dissipation and heat conduction surface perpendicular to the pump axis are arranged and fixed in layers along the pump axis from the inner end face of the end cover (400) to the outer end face of the rear shell (300) in the control receiving cavity (800), and a part of the insulating protective plate (620) partially separates the control board (610) and the heat dissipation bracket (650), and another part of the insulating protective plate (620) is between the control board (610) and the heat dissipation bracket (650). The rear housing (300) partially separates the two; the IGBT module (630) is mounted on the insulating plate (620) in the projection of the flow channel cavity (710) along the pump axis, and at least part of the heat dissipation bracket (650) abuts against the IGBT module (630), the insulating plate (620), the control board (610) and the rear housing (300), and the heat dissipation bracket (650) abuts against the outer surface of the rear housing (300) in the projection of the flow channel cavity (710) along the pump axis.

2. The shielded electric pump according to claim 1, characterized in that, The insulating plate (620) has an opening (621). A first copper busbar terminal (641) extends from one end of the copper busbar (640) of the insulating plate (620), and a second copper busbar terminal (642) extends from the other end. The first copper busbar terminal (641) extends horizontally from the opening (621) along the end face of the insulating plate (620), and the second copper busbar terminal (642) extends vertically along the end face of the insulating plate (620). The insulating plate (620) includes... A first mounting surface (622) is provided with a first mounting groove (623) for mounting the IGBT module (630). The first mounting groove (623) is provided with a first through hole (624) in the direction of extending from the first copper busbar terminal (641). The pins of the IGBT module (630) pass through the first through hole (624) and are connected to the first copper busbar terminal (641). The second copper busbar terminal (642) is connected to the control board (610).

3. The shielded electric pump according to claim 2, characterized in that, The first copper busbar terminal (641) is provided with a welding groove (643), and the pins of the IGBT module (630) are welded to the welding groove (643).

4. The shielded electric pump according to claim 2, characterized in that, The first mounting surface (622) is also provided with an adhesive groove (661) and an insulating heat-dissipating tape (660) corresponding to the shape of the adhesive groove (661). The insulating heat-dissipating tape (660) is pasted on the adhesive groove (661) to cover the IGBT module, the opening (621) and the first copper bus terminal (641).

5. The shielded electric pump according to claim 2, characterized in that, The height of the cross-section of the first via (624) is greater than the thickness of the IGBT module (630).

6. The shielded electric pump according to claim 4, characterized in that, The end face of the heat dissipation bracket that abuts against the insulating protective plate (620) is provided with a plurality of convex surfaces (651), and the convex surfaces (651) abut against the control plate (610) through thermal conductive putty.

7. The shielded electric pump according to claim 4, characterized in that, The insulating protective plate (620) includes a second mounting surface (625), a flange (626) is provided between the second mounting surface (625) and the first mounting groove (623), a first through hole (627) is provided on the second mounting surface (625) in the flange (626), a second through hole (652) is provided on the heat dissipation bracket (650) corresponding to the first through hole (627), a first screw hole (320) corresponding to the first through hole (627) is provided on the end face of the rear shell (300) opposite to the flow channel cavity (710), and the insulating protective plate (620), the IGBT module (630) and the heat dissipation bracket (650) are fixed to the rear shell (300) by screws passing through the first through hole (627), the second through hole (652) and the first screw hole (320) in sequence.

8. The shielded electric pump according to claim 1, characterized in that, The rear shell (300) is provided with a positioning flange (310), and the heat dissipation bracket (650) is provided with a positioning recess (653) corresponding to the positioning flange (310) and a positioning hole (654) for positioning. The positioning flange (310), positioning recess (653) and positioning hole (654) are used to position the heat dissipation bracket (650), and the positioning hole (654) allows the heat dissipation bracket (650) and the rear shell (300) to be fixedly connected by screws.

9. The shielded electric pump according to claim 7, characterized in that, The adhesive groove (661) also includes a process hole (628), and the adhesive groove (661) of the second mounting surface (625) is coated with insulating adhesive (900), which at least covers the opening (621) and the process hole (628).

10. The shielded electric pump according to claim 1, characterized in that, The insulating protective plate (620) is also provided with mounting holes (629) for pins, components and screws to pass through.

11. The shielded electric pump according to claim 4, characterized in that, The thickness of the IGBT module (630) is a, the height of the first mounting slot (623) is b, and ab≥0.1mm.

12. The shielded electric pump according to claim 2, characterized in that, The first mounting slot (623) is provided with a boss (670), and the IGBT module (630) is provided with a first groove (631) corresponding to the boss (670). When the IGBT module (630) is installed, the boss (670) is embedded in the first groove (631) to be installed on the first mounting slot (623).

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