Infrared sensor chip testing device

Abstract

The utility model relates to chip testing technical field especially relates to an infrared sensor chip testing arrangement, including test board, the test board is installed with sealed box, the test board top center is installed with the placing table, is equipped with chip groove on the placing table, the chip groove rear wall is installed with test probe, installs the heat exchange pipe in the placing table, the heat exchange pipe both ends all are installed with the connecting flange, installs a plurality of thermocouple in the chip groove. The utility model discloses through placing the chip in the chip groove, and makes its pin connected with test probe, then adopts infrared light to carry out the illumination test to it, in this process, the cold water or hot water pipe is connected with the connecting flange in proper order, and the cold water or hot water is introduced into the heat exchange pipe, and the temperature of chip groove is monitored in real time through thermocouple, thereby the chip in the chip groove carries out the cold and hot change, and records the chip data change at this time, thereby the reliability of chip actual work under different temperatures, and the relativity of chip performance change and temperature change.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to an infrared sensor chip testing device. Background Technology

[0002] For example, Chinese patent CN220251191U discloses an infrared sensor chip test stand. By cooperating with the second telescopic rod, crossbar and sliding sleeve in the infrared emitting assembly, the horizontal and vertical distance of the light source can be adjusted and controlled. The scale and pointer set on the second telescopic rod can cooperate to achieve accurate control and recording of the vertical distance of the light source. The hinge head in the infrared emitting assembly can be used to adjust the angle of the light source.

[0003] However, the aforementioned test setup only focuses on the optical performance testing of the chip, lacking consideration of temperature factors. In practical applications, changes in ambient temperature affect the performance of infrared sensor chips. The properties of the semiconductor materials within the chip change at different temperatures, thus affecting key indicators such as sensing sensitivity and signal transmission stability. Therefore, relying solely on the optical performance test results at room temperature cannot accurately assess its actual operational reliability or the changes and correlations in chip performance at different temperatures, resulting in one-sided test results and failing to provide a comprehensive and accurate basis for performance evaluation. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides an infrared sensor chip testing device, which solves the technical problems of existing technologies that only focus on the optical performance detection of chips, lack the reliability of their actual operation at different temperatures, and the correlation between chip performance changes and temperature changes.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an infrared sensor chip testing device, including a test platform, a sealed box installed on the test platform, an optical detection mechanism for multi-angle irradiation testing of the chip set on the top of the sealed box, a placement platform installed at the center of the top of the test platform, a chip slot opened on the placement platform, a test probe installed on the rear wall of the chip slot, a heat exchange tube installed inside the placement platform, connecting flanges installed at both ends of the heat exchange tube, multiple thermocouples installed inside the chip slot, and a fixing mechanism for adsorbing and preventing displacement of the chip set on the placement platform.

[0006] A further improvement is that the heat exchange tubes are arranged in a serpentine structure inside the placement platform.

[0007] A further improvement is that the fixing mechanism includes a sealed cavity installed at the bottom of the placement stage, a negative pressure tube installed at the bottom of the sealed cavity, and an adsorption hole extending into the sealed cavity is opened in the chip slot array.

[0008] A further improvement is that the sealing cavity has a conical structure, and the adsorption hole is positioned to avoid the serpentine structure of the heat exchange tube.

[0009] A further improvement is that the optical detection mechanism includes a lead screw rotatably connected to a rotating hole at the top of the sealed box, a threaded slide connected to the lead screw, a drive motor for driving the lead screw to rotate installed on the sealed box, an electric lifting rod installed at the bottom of the threaded slide, an infrared lamp installed at the bottom of the electric lifting rod, and a deflection component for adjusting the illumination angle of the infrared lamp provided between the electric lifting rod and the infrared lamp.

[0010] A further improvement is that the deflection assembly includes a hinged seat installed at the bottom of the electric lifting rod, a deflection table is rotatably connected to the hinged seat via a rotating shaft, the bottom of the deflection table is connected to an infrared lamp, and a micro motor for driving the deflection table to rotate is installed on the hinged seat.

[0011] By employing the above technical solution, this utility model provides an infrared sensor chip testing device, which has at least the following beneficial effects: 1. This utility model places a chip in a chip slot and connects its pins to test probes. Then, it uses infrared light to irradiate the chip for testing. During this process, cold or hot water pipes are connected to the connecting flange in sequence to introduce cold or hot water into the heat exchange tube. The temperature of the chip slot is monitored in real time by thermocouples, thereby subjecting the chip in the chip slot to thermal changes and recording the chip data changes at this time. This allows for the determination of the chip's actual working reliability at different temperatures and the correlation between chip performance changes and temperature changes.

[0012] 2. This utility model drives the lead screw to rotate by starting the drive motor, which in turn drives the threaded slide on the lead screw to move against the top wall of the sealed box, thereby driving the electric lifting rod and the infrared lamp at its bottom to move left and right. The electric lifting rod is used to adjust the illumination height of the infrared lamp, so as to irradiate the infrared sensor chip from different positions and heights and test the optical performance of the chip under different conditions.

[0013] 3. This utility model uses a drive motor to rotate a lead screw, which in turn causes the threaded slide on the lead screw to move against the top wall of the sealed box. This, in turn, causes the electric lifting rod and the infrared lamp at its bottom to move laterally left and right. The electric lifting rod is used to adjust the illumination height of the infrared lamp, thereby enabling the infrared sensor chip to be illuminated from different positions and heights, and testing the optical performance of the chip under different conditions. Attached Figure Description

[0014] The accompanying drawings, which are provided to further illustrate this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application.

[0015] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional view of the internal structure of the sealing box of this utility model; Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle; Figure 4 This is a schematic diagram of the placement platform and its structure according to the present invention; Figure 5 This is a cross-sectional view of the disassembled structure of the placement platform of this utility model.

[0016] In the diagram: 1. Test bench; 2. Sealed box; 3. Optical inspection mechanism; 31. Lead screw; 32. Threaded slide; 33. Drive motor; 34. Electric lifting rod; 35. Infrared lamp; 36. Deflection assembly; 361. Hinge mount; 362. Deflection stage; 363. Micro motor; 4. Placement stage; 5. Chip slot; 6. Test probe; 7. Heat exchange tube; 8. Connecting flange; 9. Thermocouple; 10. Fixing mechanism; 101. Sealing cavity; 102. Negative pressure pipe; 103. Adsorption hole. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Given that current technologies focus solely on the optical performance testing of chips, lacking information on their actual operational reliability at different temperatures and the correlation between chip performance changes and temperature variations, this embodiment provides an infrared sensor chip testing device. While irradiating the chip at different angles to test its optical performance, the device subjectes the chip to high and low temperature variations, thereby measuring the chip's actual operational reliability at different temperatures and the correlation between chip performance changes and temperature variations. Please refer to... Figures 1-5The infrared sensor chip testing device includes a test platform 1, a sealed box 2 mounted on the test platform 1, an optical detection mechanism 3 for multi-angle chip irradiation testing on the top of the sealed box 2, a placement platform 4 mounted at the top center of the test platform 1, a chip slot 5 formed on the placement platform 4, a test probe 6 mounted on the rear wall of the chip slot 5, a heat exchange tube 7 installed inside the placement platform 4, and connecting flanges 8 mounted at both ends of the heat exchange tube 7, multiple thermocouples 9 installed inside the chip slot 5, and a fixing mechanism 10 for chip adsorption and anti-displacement on the placement platform 4; the chip is placed in the chip slot 5 and... The pins are connected to the test probes 6, which facilitates the real-time recording of chip test data through the central control system. Subsequently, the optical performance of the chip is measured by irradiation from different angles and heights through the optical detection mechanism 3. During this process, cold or hot water pipes are connected to the connecting flange 8 in sequence, and cold or hot water is introduced into the heat exchange tube 7. The temperature of the chip slot 5 is monitored in real time through the thermocouple 9, thereby subjecting the chip in the chip slot 5 to thermal changes and recording the changes in chip data at this time. This allows for the determination of the chip's actual working reliability at different temperatures, as well as the correlation between chip performance changes and temperature changes.

[0019] Specifically, the heat exchange tube 7 is arranged in a serpentine structure inside the placement platform 4; the serpentine structure of the heat exchange tube 7 increases the contact area with the chip slot 5, thereby better heating or cooling the chips in the chip slot 5 as a whole.

[0020] To prevent the chip from moving within the chip slot 5 during testing, which could cause the chip pins to detach from the test probe 6 and result in data loss, the device is also equipped with a fixing mechanism 10. The fixing mechanism 10 includes a sealed cavity 101 installed at the bottom of the placement stage 4, a negative pressure tube 102 installed at the bottom of the sealed cavity 101, and an array of adsorption holes 103 extending into the sealed cavity 101 are formed in the chip slot 5.

[0021] The sealed cavity 101 has a conical structure, and the adsorption hole 103 is positioned to avoid the serpentine structure of the heat exchange tube 7. The negative pressure tube 102 is connected to an external vacuum machine, and the resulting negative pressure suction force firmly adsorbs the chip into the chip slot 5 through the adsorption hole 103, thereby preventing the chip from moving in the chip slot 5, which would cause the chip pins to detach from the test probe 6 and result in data loss.

[0022] To better test the optical performance of the infrared sensor chip under illumination from different angles and heights, the device also includes an optical detection mechanism 3. The optical detection mechanism 3 includes a lead screw 31 rotatably connected to a rotating hole at the top of the sealed box 2. A threaded slide 32 is threaded onto the lead screw 31. A drive motor 33 is mounted on the sealed box 2 to drive the lead screw 31 to rotate. An electric lifting rod 34 is mounted at the bottom of the threaded slide 32, and an infrared lamp 35 is mounted at the bottom of the electric lifting rod 34. A deflection assembly 36 for adjusting the illumination angle of the infrared lamp 35 is provided between the electric lifting rod 34 and the infrared lamp 35. Activating the drive motor 33 rotates the lead screw 31, which in turn moves the threaded slide 32 against the top wall of the sealed box 2. This causes the electric lifting rod 34 and the infrared lamp 35 at its bottom to move laterally left and right, adjusting the illumination height of the infrared lamp 35 in conjunction with the electric lifting rod 34. This allows the infrared sensor chip to be illuminated from different positions and heights, testing the chip's optical performance under different conditions.

[0023] Furthermore, the deflection assembly 36 includes a hinge base 361 installed at the bottom of the electric lifting rod 34. A deflection stage 362 is rotatably connected to the hinge base 361 via a rotating shaft, and the bottom of the deflection stage 362 is connected to the infrared lamp 35. A micro motor 363 is installed on the hinge base 361 to drive the deflection stage 362 to rotate. When adjusting the irradiation position, the micro motor 363 can also drive the deflection stage 362 to rotate within the hinge base 361, thereby causing the infrared lamp 35 to swing left and right. This allows for testing the optical performance of the infrared lamp 35 when it directly irradiates the chip at different positions and when the chip is backlit, thus improving the comprehensiveness of the test.

[0024] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An infrared sensor chip testing device, comprising a testing platform (1), characterized in that: The test platform (1) is equipped with a sealed box (2). The top of the sealed box (2) is equipped with an optical detection mechanism (3) for irradiating and testing the chip at multiple angles. The test platform (1) is equipped with a placement platform (4) at the top center. The placement platform (4) has a chip slot (5). The back wall of the chip slot (5) is equipped with a test probe (6). The placement platform (4) is equipped with a heat exchange tube (7). Both ends of the heat exchange tube (7) are equipped with connecting flanges (8). The chip slot (5) is equipped with multiple thermocouples (9). The placement platform (4) is equipped with a fixing mechanism (10) for adsorbing and preventing displacement of the chip.

2. The infrared sensor chip testing device according to claim 1, characterized in that: The heat exchange tube (7) is arranged in a serpentine structure inside the placement platform (4).

3. The infrared sensor chip testing device according to claim 1, characterized in that: The fixing mechanism (10) includes a sealing cavity (101) installed at the bottom of the placement platform (4), a negative pressure tube (102) installed at the bottom of the sealing cavity (101), and an array of adsorption holes (103) extending into the sealing cavity (101) are opened in the chip slot (5).

4. The infrared sensor chip testing device according to claim 3, characterized in that: The sealing cavity (101) has a conical structure, and the adsorption hole (103) is positioned to avoid the serpentine structure of the heat exchange tube (7).

5. The infrared sensor chip testing apparatus according to claim 1, wherein: The optical detection mechanism (3) includes a lead screw (31) rotatably connected to the top rotating hole of the sealed box (2), a threaded slide (32) threadedly connected to the lead screw (31), a drive motor (33) for driving the lead screw (31) to rotate is installed on the sealed box (2), an electric lifting rod (34) is installed at the bottom of the threaded slide (32), an infrared lamp (35) is installed at the bottom of the electric lifting rod (34), and a deflection component (36) for adjusting the irradiation angle of the infrared lamp (35) is provided between the electric lifting rod (34) and the infrared lamp (35).

6. The infrared sensor chip testing apparatus according to claim 5, wherein: The deflection assembly (36) includes a hinge seat (361) installed at the bottom of the electric lifting rod (34). A deflection table (362) is rotatably connected inside the hinge seat (361) via a rotating shaft. The bottom of the deflection table (362) is connected to an infrared lamp (35). A micro motor (363) for driving the deflection table (362) to rotate is installed on the hinge seat (361).

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