A TMAP sensor

Abstract

The present disclosure provides a TMAP sensor, which comprises a shell, a PCBA board, a pressure integrated chip, an NTC resistor, a sealing ring and an upper cover; the shell comprises an upper open end and a lower open end; the NTC resistor is arranged in the shell through the lower open end and the lower open end is sealed by the sealing ring; the pressure integrated chip and the PCBA board are arranged in the shell and arranged above the NTC resistor in sequence; and the upper cover seals the upper open end. The TMAP sensor of the present disclosure can effectively avoid line corrosion and meet the needs of EGR application.

Description

Technical Field

[0001] This disclosure relates to the technical field of automobiles, and more particularly to a TMAP sensor. Background Technology

[0002] The Throttle Manifold Absolute Pressure (TMAP) sensor is a sensor that detects the absolute pressure in the intake manifold behind the throttle valve. It can detect changes in the absolute pressure in the manifold based on engine speed and load, and convert this information into a voltage signal, which is sent to the Engine Control Unit (ECU). The ECU uses the magnitude of this voltage signal to control the basic fuel injection quantity.

[0003] The TAMP sensor plays a crucial role, helping the ECU to more precisely control fuel injection quantity and ignition timing, thereby improving engine performance and efficiency. By measuring air density, the TAMP sensor provides more accurate data, ensuring the engine operates normally under various conditions.

[0004] Exhaust Gas Recirculation (EGR) technology involves connecting an exhaust gas recirculation line to the exhaust system, drawing exhaust gases out and reintroducing them into the intake system. This allows the exhaust gases to mix thoroughly with fresh air before entering the cylinders. Since the exhaust gases contain a large amount of polyatomic gases such as CO2, which are non-combustible but absorb a significant amount of heat due to their high specific heat capacity, the maximum combustion temperature of the air-fuel mixture in the cylinder is lowered, thereby reducing NOx formation.

[0005] In existing TMAP sensors, the exhaust gas contains corrosive gases and comes into direct contact with the pressure chip pads and negative temperature coefficient (NTC) pads on the printed circuit board (PCB). Over time, the pressure chip pads and NTC pads will be slowly corroded, leading to circuit corrosion interruption and product failure. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this disclosure is to provide a TMAP sensor that can effectively avoid circuit corrosion and meet the requirements of EGR applications.

[0007] This disclosure provides a TMAP sensor, which includes a housing, a PCBA board, a pressure integrated chip, an NTC resistor, a sealing ring, and a top cover. The housing includes an upper opening and a lower opening. The NTC resistor is disposed inside the housing through the lower opening and is sealed by the sealing ring. The pressure integrated chip and the PCBA board are disposed inside the housing and are sequentially disposed above the NTC resistor. The top cover seals the upper opening.

[0008] In one embodiment of this disclosure, the NTC resistor includes two leads and a resistor body; the housing is provided with NTC lead limiting slots and NTC pins corresponding one-to-one with the leads;

[0009] The pin is fixed in the corresponding NTC pin limiting slot and connected to the corresponding NTC pin.

[0010] In one embodiment of this disclosure, the NTC resistor and the pressure integrated chip are isolated by a sealant.

[0011] In one embodiment of this disclosure, a horizontally arranged sealing groove is provided inside the housing, the bottom of the sealing groove is connected to the lower opening, one end of the pin passes through the bottom of the sealing groove and passes horizontally through the sealing groove after being bent, and the sealant is filled in the sealing groove.

[0012] In one embodiment of this disclosure, the pressure integrated chip is connected to the PCBA board.

[0013] In one embodiment of this disclosure, the NTC resistor is connected to the PCBA board.

[0014] In one embodiment of this disclosure, the sealing ring is made of rubber.

[0015] As described above, the TMAP sensor of this disclosure has the following beneficial effects:

[0016] (1) The chip pins and PCBA pads are not in contact with the external medium, and can be used for a long time in harsh environments to ensure that they are not corroded or oxidized, thus meeting the requirements of EGR applications.

[0017] (2) The reduction in BOM materials effectively lowered costs;

[0018] (3) The production process is simple and highly practical. Attached Figure Description

[0019] Figure 1 Shown as an exploded structural diagram of the TMAP sensor of this disclosure in one embodiment;

[0020] Figure 2The diagram shown is a cross-sectional view of the TMAP sensor of this disclosure in one embodiment.

[0021] Figure 3 The diagram shown is an internal structure diagram of the TMAP sensor of this disclosure in one embodiment;

[0022] Figure 4 This is shown as an internal schematic diagram of the TMAP sensor of this disclosure in another embodiment. Detailed Implementation

[0023] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the information disclosed herein. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this disclosure can be modified or changed according to different viewpoints and application modules without departing from the spirit of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be combined with each other.

[0024] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this disclosure pertains can readily implement it. This disclosure may be embodied in many different forms and is not limited to the embodiments described herein.

[0025] In this disclosure, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic represented in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in any one or a group of embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples represented in this disclosure, as well as the features of those different embodiments or examples.

[0026] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this disclosure, "a set" means two or more, unless otherwise explicitly specified.

[0027] For the purpose of clarity, devices unrelated to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0028] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0029] While the terms first, second, etc., are used in some examples herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, module, item, kind, and / or group, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, modules, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0030] The technical terms used herein are for reference only to specific embodiments and are not intended to limit the scope of this disclosure. The singular form used herein includes the plural form unless the statement explicitly indicates otherwise. The word "comprising" as used in this specification means to specify a particular characteristic, region, integer, step, operation, element, and / or component, and does not exclude the presence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0031] Although not explicitly defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the message of the present disclosure, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0032] The technical solutions in the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0033] like Figures 1-4As shown, in one embodiment, the TMAP sensor disclosed herein includes a housing 1, a PCBA board 2, a pressure integrated chip 3, an NTC resistor 4, a sealing ring 5, and a top cover 6.

[0034] The outer casing 1 includes an upper opening and a lower opening for placing other components inside the outer casing 1.

[0035] The NTC resistor 4 is disposed inside the housing 1 through the lower opening, and the lower opening is sealed by the sealing ring 5. Wherein, as Figure 3 and Figure 4 As shown, the NTC resistor 4 includes two leads and a resistive element. The housing 1 contains NTC pin limiting slots 11 and NTC pins 12, each corresponding to one of the leads. The resistive element of the NTC resistor 4 is located at the bottom, and the leads extend into the housing 1 from the lower opening, passing through the corresponding NTC pin limiting slots 11 and connecting to the corresponding NTC pins 12. The NTC pins 12 connect to the PCBA board 2, thus realizing the circuit connection between the NTC resistor 4 and the PCBA board 2 for signal transmission. Preferably, the sealing ring 5 is made of rubber.

[0036] The pressure integrated chip 3 and the PCBA board 2 are disposed within the housing 1 and sequentially positioned above the NTC resistor 4. The pressure integrated chip 3 is connected to the PCBA board 2 via circuitry to enable signal transmission. Based on the signals acquired by the pressure integrated chip 3 and the NTC resistor 4, the PCBA board 2 outputs the output signal of the TMAP sensor.

[0037] The upper cover 6 seals the upper opening, thereby making the outer shell 1 a complete closed space, avoiding contact with the external medium, and can be used in different environments for a long time.

[0038] In one embodiment, the NTC resistor 4 and the pressure integrated chip 3 are isolated by sealant 7. A horizontally positioned sealing groove 13 is provided within the housing 1. The bottom of the sealing groove 13 communicates with the lower opening. One lead of the NTC resistor 3 passes through the bottom of the sealing groove 13 and, after bending, horizontally passes through the sealing groove 13 to connect with the corresponding NTC pin 12. The sealant 7 fills the sealing groove 13. The sealant 7 cures after heating, ensuring that both the pressure integrated chip 3 and the PCBA board 2 are located inside the sealant 7, preventing direct contact with external media and ensuring protection against corrosion and oxidation. This also meets pressure measurement requirements and can be applied to various EGR system application scenarios.

[0039] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this disclosure. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this disclosure should still be covered by the claims of this disclosure.

Claims

1. A TMAP sensor characterized in that, The TMAP sensor includes a housing, a PCBA board, a pressure integrated chip, an NTC resistor, a sealing ring, and a top cover; The outer shell includes an upper opening and a lower opening; The NTC resistor is disposed inside the housing through the lower opening, and the lower opening is sealed by the sealing ring. The pressure integrated chip and the PCBA board are disposed inside the housing and are sequentially disposed above the NTC resistor; The top cover seals the upper opening.

2. The TMAP sensor according to claim 1, characterized in that, The NTC resistor includes two leads and a resistor body; the housing is provided with NTC lead limiting slots and NTC pins that correspond one-to-one with the leads. The pin is fixed in the corresponding NTC pin limiting slot and connected to the corresponding NTC pin.

3. The TMAP sensor according to claim 2, characterized in that, The NTC resistor and the pressure integrated chip are isolated by sealant.

4. The TMAP sensor according to claim 3, characterized in that, The housing has a horizontally arranged sealing groove, the bottom of which is connected to the lower opening. One end of the pin passes through the bottom of the sealing groove and then passes horizontally through the sealing groove after being bent. The sealant fills the sealing groove.

5. The TMAP sensor according to claim 1, characterized in that, The pressure integrated chip is connected to the PCBA board.

6. The TMAP sensor according to claim 1, characterized in that, The NTC resistor is connected to the PCBA board.

7. The TMAP sensor of claim 1, wherein, The sealing ring is made of rubber.

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