A solar silicon wafer detection device

Abstract

The utility model discloses a solar energy silicon wafer detection device, including bottom plate, horizontal moving part, longitudinal moving part, silicon wafer assembly board no.

Description

Technical Field

[0001] This utility model relates to the technical field of solar silicon wafer testing equipment, and more specifically to a solar silicon wafer testing device. Background Technology

[0002] With the booming development of the solar energy industry, the quality inspection of solar panels, as a core component, is crucial. Solar silicon wafers are an important material for manufacturing solar panels. Multiple solar silicon wafers are combined together to form a solar panel, and then connected in a certain circuit to form a solar cell module with a specific voltage and power.

[0003] When inspecting the quality of solar silicon wafers, it is necessary to check the surface roughness, warpage, silver grid lines, and morphological features of laser grooving. However, existing solar panel inspection platforms have poor compatibility with solar silicon wafers, and can only inspect the morphological features of the upper and lower surfaces of the solar silicon wafers, failing to inspect multiple end faces, which severely restricts inspection efficiency and the flexibility of enterprise production.

[0004] Therefore, providing a reasonably designed and easy-to-operate device that can detect the upper and lower surfaces and multiple end faces of solar silicon wafers is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a solar silicon wafer inspection device to solve the technical problem that the existing solar panel inspection platform can only inspect the morphological features of the upper and lower surfaces of the solar silicon wafer, but cannot inspect the morphological features of the end face of the solar silicon wafer.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A solar silicon wafer inspection device includes a rectangular base plate, a transverse moving part, a longitudinal moving part, a first silicon wafer assembly plate, and a second silicon wafer assembly plate. A solar silicon wafer inspection mechanism is mounted on one side of the base plate along its length. The transverse moving part is arranged above the base plate and can move along its length. The longitudinal moving part is mounted on the transverse moving part and can move along the width of the base plate. The first silicon wafer assembly plate is arranged parallel to the upper surface of the base plate and mounted at the top of the longitudinal moving part. A solar silicon wafer is detachably mounted on the top of the first silicon wafer assembly plate, allowing the solar silicon wafer inspection mechanism to inspect the morphological features on the upper or lower surface of the solar silicon wafer. The second silicon wafer assembly plate is arranged perpendicular to the upper surface of the base plate and mounted on one side of the longitudinal moving part. A solar silicon wafer is detachably mounted on the outer side of the second silicon wafer assembly plate, allowing the solar silicon wafer inspection mechanism to inspect the morphological features on the end face of the solar silicon wafer.

[0008] Through the above technical solution, this utility model discloses a solar silicon wafer inspection device. A silicon wafer assembly plate one is arranged parallel to the upper surface of the base plate. Solar silicon wafers are assembled on silicon wafer assembly plate one to inspect the morphological features of the upper or lower surface of the solar silicon wafers. A silicon wafer assembly plate two is arranged perpendicular to the upper surface of the base plate. Solar silicon wafers are assembled on silicon wafer assembly plate two to inspect the morphological features of the end face of the solar silicon wafers. Furthermore, moving the lateral or longitudinal moving part can adjust the lateral or longitudinal position of the solar silicon wafers assembled on silicon wafer assembly plates one and two. This utility model's solar silicon wafer inspection device is reasonably designed, easy to operate, and capable of inspecting the morphological features of the upper, lower, and end faces of solar silicon wafers.

[0009] Preferably, a solar silicon wafer inspection device further includes a transverse movement drive unit and a longitudinal movement drive unit. The transverse movement unit is a transverse movement block, which is fixed to the top of the base plate and drives the transverse movement block to move along the length direction of the base plate. The longitudinal movement unit is a longitudinal movement block, which is mounted on the transverse movement block and drives the longitudinal movement block to move along the width direction of the base plate. The silicon wafer assembly plate one and the silicon wafer assembly plate two are respectively mounted on the top end and one side of the longitudinal movement block.

[0010] The beneficial effect of adopting the above technical solution is that the transverse moving block and the longitudinal moving block can be driven to move by the transverse driving unit and the longitudinal moving block respectively, which can save manual labor and make the automation level of the device higher.

[0011] Preferably, the lateral movement drive unit includes a first lead screw mounting base, a first lead screw, and a lateral movement drive motor; the first lead screw mounting base is elongated and fixed to the top of the base plate along the length direction of the base plate; the first lead screw is rotatably mounted in the first lead screw mounting base, and the lateral movement block is threadedly connected to the first lead screw; the lateral movement drive motor is mounted at one end of the first lead screw mounting base, and its output shaft passes through the first lead screw mounting base and is drivenly connected to the first lead screw.

[0012] The beneficial effect of adopting the above technical solution is that when the transverse drive motor is started, its output shaft can drive the first lead screw to rotate, so that the transverse moving block moves along the length direction of the base plate on the first lead screw mounting seat, thereby adjusting the transverse position of silicon wafer assembly plate one and silicon wafer assembly plate two.

[0013] Preferably, the longitudinal drive unit 7 includes a second lead screw mounting base 71, a second lead screw 72, a nut block 73, and a longitudinal drive motor 74; the second lead screw mounting base 71 is elongated and arranged along the width direction of the base plate 1, and its bottom end is mounted on the top of the transverse moving block through a connecting plate; the second lead screw 72 is rotatably mounted in the second lead screw mounting base 71; the nut block 73 is threadedly connected to the second lead screw 72, and the longitudinal moving block is fixed on the top of the nut block 73; the longitudinal drive motor 74 is mounted at one end of the second lead screw mounting base 71, and its output shaft passes through the second lead screw mounting base 71 and is connected to the second lead screw 72 in a transmission connection.

[0014] The beneficial effect of adopting the above technical solution is that when the longitudinal drive motor is started, its output shaft can drive the second lead screw to rotate, so that the longitudinal moving block moves on the second lead screw mounting seat along the width direction of the base plate, thereby adjusting the longitudinal position of silicon wafer assembly plate one and silicon wafer assembly plate two.

[0015] Preferably, a mesh-like air guide groove is formed on the top of the silicon wafer assembly plate one and the outer surface of the silicon wafer assembly plate two, and air holes penetrating the thickness direction are formed on both the silicon wafer assembly plate one and the silicon wafer assembly plate two. One end of the air hole is connected to the air guide groove, and the other end is connected to a negative pressure device through an air pipe to adsorb the solar silicon wafer onto the silicon wafer assembly plate one or the silicon wafer assembly plate two under negative pressure.

[0016] The beneficial effect of adopting the above technical solution is that the air in the air guide groove can be extracted by the negative pressure device, and the resulting air pressure difference presses the solar silicon wafer tightly onto the surface of silicon wafer assembly plate one or silicon wafer assembly plate two.

[0017] Preferably, the lateral moving part is a movable box, and the bottom plate has sliding holes arranged along the length direction. The bottom of the movable box slides and is limited by a sliding member with the sliding holes.

[0018] The beneficial effect of adopting the above technical solution is that the lateral moving part is designed as a moving box, and the lateral position of silicon wafer assembly plate one and silicon wafer assembly plate two can be adjusted by sliding the moving box on the base plate through the sliding parts.

[0019] Preferably, the longitudinal moving part is a sliding plate, which includes a first sliding plate and a second sliding plate. The top and front sides of the moving box are provided with mounting holes arranged along the width direction of the base plate. The first sliding plate is arranged parallel to the upper surface of the base plate and is slidably limited on the mounting hole at the top of the moving box by a sliding member. The second sliding plate is arranged perpendicular to the upper surface of the base plate and is slidably limited on the mounting hole at the front side of the moving box by a sliding member. The silicon wafer mounting plate is detachably mounted on the top of the first sliding plate, and the silicon wafer mounting plate is detachably mounted on the outer side of the second sliding plate.

[0020] The beneficial effect of adopting the above technical solution is that the longitudinal moving part is designed as a sliding plate component consisting of sliding plate one and sliding plate two. Sliding plate one and sliding plate two on the moving box can adjust the longitudinal position of silicon wafer assembly plate one and silicon wafer assembly plate two respectively.

[0021] Preferably, both the silicon wafer assembly plate one and the silicon wafer assembly plate two include a plate body, a positioning seat, and strip-shaped locking blocks; there are multiple positioning seats, which are respectively installed at the corners of the plate body; there are multiple locking blocks, and the connecting ends of the multiple locking blocks are respectively rotatably connected to the corresponding positioning seats, and the locking ends can rotate freely to limit and press the solar silicon wafers onto the plate body.

[0022] The beneficial effect of adopting the above technical solution is that when the free end of the card block rotates, it can limit and press the solar silicon wafer onto the plate, restricting the movement of the solar silicon wafer during detection.

[0023] Preferably, both the movable box and the second sliding plate are equipped with movable handles.

[0024] Preferably, the solar silicon wafer inspection mechanism includes an inspection instrument bracket and a solar silicon wafer inspection instrument; the inspection instrument bracket is vertically fixed to one side of the base plate along its length; the solar silicon wafer inspection instrument is mounted on the inspection instrument bracket with the inspection end facing downwards, and the solar silicon wafer inspection instrument has multiple inspection probes to detect different morphological features on the surface of the solar silicon wafer.

[0025] The beneficial effect of adopting the above technical solution is that the solar silicon wafer inspection instrument with multiple detection probes can detect multiple morphological features such as roughness, warpage, silver grid lines and laser grooving on the upper surface, lower surface and end face of the solar silicon wafer. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of a solar silicon wafer testing device according to Embodiment 1 of this utility model;

[0028] Figure 2 This is a schematic diagram of the overall structure of a solar silicon wafer testing device according to Embodiment 1 of this utility model from another angle;

[0029] Figure 3 This is a schematic diagram of the transverse drive unit in Embodiment 1 of this utility model;

[0030] Figure 4 This is a schematic diagram of the longitudinal movement drive unit in Embodiment 1 of this utility model;

[0031] Figure 5 This is a top view of the silicon wafer assembly board in Embodiment 1 of this utility model;

[0032] Figure 6 This is a front view of the silicon wafer assembly board 2 in Embodiment 1 of this utility model;

[0033] Figure 7 This is a front view of the connection between the shock-absorbing and leveling component and the silicon wafer assembly plate in Embodiment 1 of this utility model;

[0034] Figure 8 This is a schematic diagram of another angle showing the connection between the shock-absorbing and leveling component and the silicon wafer assembly plate in Embodiment 1 of this utility model;

[0035] Figure 9 This is a schematic diagram showing the connection between the lateral moving part, the longitudinal moving part, and the base plate in Embodiment 2 of the solar silicon wafer testing device of this utility model;

[0036] Figure 10 This utility model Figure 9 Cross-sectional view of the middle structure;

[0037] Figure 11 This is a schematic diagram of the structure of silicon wafer assembly board one and silicon wafer assembly board two in Embodiment 2 of this utility model;

[0038] Figure 12 This is a schematic diagram of the silicon wafer assembly plate 2 being assembled on the longitudinally moving part in Embodiment 2 of this utility model;

[0039] Figure 13 This is a schematic diagram of a silicon wafer assembly plate being assembled on a longitudinally moving part in Embodiment 2 of this utility model.

[0040] The components are: 1-base plate, 2-solar silicon wafer inspection mechanism, 3-lateral moving part, 4-longitudinal moving part, 5A-silicon wafer assembly plate one, 5B-silicon wafer assembly plate two, 6-lateral moving drive part, 7-longitudinal moving drive part, 8-sliding part, 9-vibration damping and leveling component, 10-support bar, 11-sliding hole, 21-inspector bracket, 22-solar silicon wafer inspector, 31-assembly hole, 41-sliding plate one, 42-sliding plate two, 51-air guide groove, 52-air hole, 53-plate body, 54-positioning seat, 55-clamping block, 61-first lead screw mounting seat, 62-first lead screw, 63-lateral moving drive motor, 71-second lead screw mounting seat, 72-second lead screw, 73-nut block, 74-longitudinal moving drive motor, 91-triangle plate, 92-support column, 93-buffer spring, 94-height adjustment bolt. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0042] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0043] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] Example 1:

[0045] See appendix Figure 1 To be continued Figure 4 According to the present invention, a solar silicon wafer testing device includes a rectangular base plate 1, a transverse moving part 3, a longitudinal moving part 4, a silicon wafer assembly plate 5A, and a silicon wafer assembly plate 5B. A solar silicon wafer testing mechanism 2 is installed on one side of the base plate 1 along its length. The transverse moving part 3 is arranged above the base plate 1 and can move along its length. The longitudinal moving part 4 is mounted on the transverse moving part 3 and can move along the width of the base plate 1. The silicon wafer assembly plate 5A is arranged parallel to the upper surface of the base plate 1 and installed at the top of the longitudinal moving part 4. A solar silicon wafer can be detachably installed on the top of the silicon wafer assembly plate 5A, so that the solar silicon wafer testing mechanism 2 can test the morphological features on the upper or lower surface of the solar silicon wafer. The silicon wafer assembly plate 5B is arranged perpendicular to the upper surface of the base plate 1 and installed on one side of the longitudinal moving part 4. A solar silicon wafer can be detachably installed on the outer side of the silicon wafer assembly plate 5B, so that the solar silicon wafer testing mechanism 2 can test the morphological features on the end face of the solar silicon wafer.

[0046] This utility model discloses a solar silicon wafer inspection device. The lateral moving part 3 can move to adjust the lateral position of the silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B. The longitudinal moving part 4 can move to adjust the longitudinal position of the silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B. When the solar silicon wafer is installed on the silicon wafer assembly plate 5A, the solar silicon wafer inspection mechanism 2 can inspect the morphological features on the upper or lower surface of the solar silicon wafer. When the solar silicon wafer is installed on the silicon wafer assembly plate 5B, the solar silicon wafer inspection mechanism 2 can inspect the morphological features on the end face of the solar silicon wafer.

[0047] A solar silicon wafer inspection device further includes a transverse movement drive unit 6 and a longitudinal movement drive unit 7. The transverse movement unit 3 is a transverse movement block. The transverse movement drive unit 6 is fixed to the top of the base plate 1 and drives the transverse movement block to move along the length direction of the base plate 1. The longitudinal movement unit 4 is a longitudinal movement block. The longitudinal movement drive unit 7 is installed on the transverse movement block and drives the longitudinal movement block to move along the width direction of the base plate 1. A silicon wafer assembly plate 5A and a silicon wafer assembly plate 5B are respectively installed on the top of the longitudinal movement block and one side thereof.

[0048] The transverse drive unit 6 includes a first lead screw mounting base 61, a first lead screw 62, and a transverse drive motor 63. The first lead screw mounting base 61 is elongated and fixed to the top of the base plate 1 along the length of the base plate 1. The first lead screw 62 is rotatably mounted in the first lead screw mounting base 61, and the transverse moving block is threadedly connected to the first lead screw 62. The transverse drive motor 63 is mounted at one end of the first lead screw mounting base 61, and its output shaft passes through the first lead screw mounting base 61 and is connected to the first lead screw 62.

[0049] When the transverse drive motor 63 is started, it can drive the first lead screw 62 to rotate, causing the transverse moving block to move on the first lead screw mounting seat 61, thereby adjusting the transverse position of silicon wafer assembly plate 1 5A and silicon wafer assembly plate 2 5B on the base plate 1.

[0050] The longitudinal drive unit 7 includes a second lead screw mounting base 71, a second lead screw 72, a nut block 73, and a longitudinal drive motor 74. The second lead screw mounting base 71 is elongated and arranged along the width direction of the base plate 1, and its bottom end is mounted on the top of the transverse moving block through a connecting plate. The second lead screw 72 is rotatably mounted inside the second lead screw mounting base 71. The nut block 73 is threadedly connected to the second lead screw 72, and the longitudinal moving block is fixed on the top of the nut block 73. The longitudinal drive motor 74 is mounted at one end of the second lead screw mounting base 71, and its output shaft passes through the second lead screw mounting base 71 and is connected to the second lead screw 72.

[0051] When the longitudinal drive motor 74 is started, it can drive the second lead screw 72 to rotate, causing the longitudinal moving block connected to the nut block 73 to move on the second lead screw mounting seat 71, thereby adjusting the longitudinal position of silicon wafer assembly plate 1 5A and silicon wafer assembly plate 2 5B on the base plate 1.

[0052] See appendix Figure 5 and attached Figure 6 Both the top of silicon wafer assembly plate 5A and the outer surface of silicon wafer assembly plate 5B are provided with mesh-like air guide grooves 51, and both silicon wafer assembly plate 5A and silicon wafer assembly plate 5B are provided with air holes 52 that penetrate their thickness direction. One end of the air hole 52 is connected to the air guide groove 51, and the other end is connected to a negative pressure device through an air pipe to adsorb the solar silicon wafer onto silicon wafer assembly plate 5A or silicon wafer assembly plate 5B under negative pressure.

[0053] The solar silicon wafer is attached to the top surface of silicon wafer assembly plate 5A or the outer surface of silicon wafer assembly plate 5B. The negative pressure device is activated, and the negative pressure device can extract the air in the air guide groove 51 through the air hole 52, so that the air pressure in the air guide groove 51 is lower than the external ambient air pressure. The resulting air pressure difference can press the solar silicon wafer tightly onto the top surface of silicon wafer assembly plate 5A or the outer surface of silicon wafer assembly plate 5B.

[0054] The bottom of the silicon wafer assembly plate 2 5B is also fixed with a support strip 10 arranged parallel to the upper surface of the base plate 1, which is used to support the bottom end of the solar silicon wafer attached to the outer surface of the silicon wafer assembly plate 2 5B.

[0055] See appendix Figure 7 and attached Figure 8 A solar silicon wafer testing device further includes a vibration damping and leveling assembly 9 for leveling a silicon wafer assembly plate 5A. The vibration damping and leveling assembly 9 includes a triangular plate 91, a support column 92, a buffer spring 93, and two height adjustment bolts 94. The triangular plate 91 is a right-angle plate, with its lower plate surface detachably connected to the top of the longitudinal moving block, and its upper plate surface corresponding to the lower plate surface of the silicon wafer assembly plate 5A. A through hole is provided at the right-angle end of the triangular plate 91, and the top end of the support column 92 slides through the through hole and abuts against the lower plate surface of the silicon wafer assembly plate 5A. A stop block is fixed at the bottom end of the support column 92. The buffer spring 93 is sleeved on the support column 92, and its two ends are respectively connected to the stop block and the lower plate surface of the triangular plate 91. Threaded holes are provided at both acute-angle ends of the triangular plate 91, and each height adjustment bolt 94 is threaded from bottom to top into the corresponding threaded hole and bolted to the silicon wafer assembly plate 5A.

[0056] Specifically, the vibration damping and leveling assembly 9 also includes a rotating ball bearing. The top of the support column 92 has a groove, and the rotating ball bearing is rotatably installed in the groove and its top end abuts against the lower surface of the silicon wafer assembly plate 5A.

[0057] When using the shock-absorbing and leveling component 9, the height of the silicon wafer assembly plate 5A can be adjusted using the two height adjusting bolts 94. When the silicon wafer assembly plate 5A vibrates and produces vertical displacement, the buffer spring 93 can buffer and dampen the triangular plate 91 that is bolted to the silicon wafer assembly plate 5A, and achieve automatic reset of the silicon wafer assembly plate 5A through the elastic force.

[0058] See appendix Figure 1 The solar silicon wafer inspection mechanism 2 includes an inspection instrument bracket 21 and a solar silicon wafer inspection instrument 22. The inspection instrument bracket 21 is vertically fixed on one side of the base plate 1 along the length direction. The solar silicon wafer inspection instrument 22 is mounted on the inspection instrument bracket 21 with the inspection end facing downward. The solar silicon wafer inspection instrument 22 has multiple inspection probes to detect different morphological features on the surface of the solar silicon wafer.

[0059] Example 2:

[0060] See appendix Figure 9 To be continued Figure 13 According to the present invention, a solar silicon wafer testing device includes a rectangular base plate 1, a transverse moving part 3, a longitudinal moving part 4, a silicon wafer assembly plate 5A, and a silicon wafer assembly plate 5B. A solar silicon wafer testing mechanism 2 is installed on one side of the base plate 1 along its length. The transverse moving part 3 is arranged above the base plate 1 and can move along its length. The longitudinal moving part 4 is mounted on the transverse moving part 3 and can move along the width of the base plate 1. The silicon wafer assembly plate 5A is arranged parallel to the upper surface of the base plate 1 and installed at the top of the longitudinal moving part 4. A solar silicon wafer can be detachably installed on the top of the silicon wafer assembly plate 5A, so that the solar silicon wafer testing mechanism 2 can test the morphological features on the upper or lower surface of the solar silicon wafer. The silicon wafer assembly plate 5B is arranged perpendicular to the upper surface of the base plate 1 and installed on one side of the longitudinal moving part 4. A solar silicon wafer can be detachably installed on the outer side of the silicon wafer assembly plate 5B, so that the solar silicon wafer testing mechanism 2 can test the morphological features on the end face of the solar silicon wafer.

[0061] This utility model discloses a solar silicon wafer inspection device. The lateral moving part 3 can move to adjust the lateral position of the silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B. The longitudinal moving part 4 can move to adjust the longitudinal position of the silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B. When the solar silicon wafer is installed on the silicon wafer assembly plate 5A, the solar silicon wafer inspection mechanism 2 can inspect the morphological features on the upper or lower surface of the solar silicon wafer. When the solar silicon wafer is installed on the silicon wafer assembly plate 5B, the solar silicon wafer inspection mechanism 2 can inspect the morphological features on the end face of the solar silicon wafer.

[0062] The lateral moving part 3 is a movable box. The bottom plate 1 has sliding holes 11 arranged along the length direction. The bottom of the movable box slides and is limited by the sliding part 8.

[0063] The longitudinal moving part 4 is a sliding plate, which includes a sliding plate 41 and a sliding plate 42. The top and front sides of the moving box are provided with mounting holes 31 arranged along the width direction of the base plate 1. The sliding plate 41 is arranged parallel to the upper plate surface of the base plate 1 and is slidably limited on the mounting hole 31 on the top of the moving box by the sliding member 8. The sliding plate 42 is arranged perpendicular to the upper plate surface of the base plate 1 and is slidably limited on the mounting hole 31 on the front side of the moving box by the sliding member 8. The top of the sliding plate 41 can be detachably installed with a silicon wafer mounting plate 5A, and the outer side of the sliding plate 42 can be detachably installed with a silicon wafer mounting plate 5B.

[0064] By using the slider 8, while enabling the sliding plate 41 and the sliding plate 42 to slide into the mounting hole 31 on the movable box, it can prevent the sliding plate 41 and the sliding plate 42 from disengaging from the corresponding mounting hole 31.

[0065] Both silicon wafer assembly plate 5A and silicon wafer assembly plate 5B include a plate body 53, a positioning seat 54, and a strip-shaped clamping block 55. There are multiple positioning seats 54, which are respectively installed at the corners of the plate body 53. There are multiple clamping blocks 55, and the connecting ends of the multiple clamping blocks 55 are respectively rotatably connected to the corresponding positioning seat 54. The clamping ends can rotate freely to limit and press the solar silicon wafer onto the plate body 53.

[0066] When using silicon wafer assembly plate 5A and silicon wafer assembly plate 5B, multiple clamping blocks 55 are rotated to the inside of the plate body 53 to limit and press the solar silicon wafer onto the plate body 53. After the inspection is completed, the multiple clamping blocks 55 are rotated to the outside of the plate body 53 to remove the solar silicon wafer.

[0067] Specifically, both sliding plate 41 and sliding plate 42 are fixed with magnets and multiple positioning posts. Both silicon wafer assembly plate 5A and silicon wafer assembly plate 5B are metal plates, and both have multiple positioning holes. The depth of the positioning holes is the same as the length of the positioning posts.

[0068] The silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B can be positioned and assembled on the sliding plate 41 and the sliding plate 42 respectively by means of positioning pins and positioning holes. The silicon wafer assembly plate 5A and the silicon wafer assembly plate 5B can be magnetically attracted to the sliding plate 41 and the sliding plate 42 respectively by means of magnets.

[0069] Both the movable box and the sliding plate 42 are equipped with a moving handle, which makes it easier to move the movable box and the sliding plate 42.

[0070] See appendix Figure 1The solar silicon wafer inspection mechanism 2 includes an inspection instrument bracket 21 and a solar silicon wafer inspection instrument 22. The inspection instrument bracket 21 is vertically fixed on one side of the base plate 1 along the length direction. The solar silicon wafer inspection instrument 22 is mounted on the inspection instrument bracket 21 with the inspection end facing downward. The solar silicon wafer inspection instrument 22 has multiple inspection probes to detect different morphological features on the surface of the solar silicon wafer.

[0071] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A solar silicon wafer testing device, characterized in that, include: A rectangular base plate (1) is provided with a solar silicon wafer detection mechanism (2) installed on one side of the base plate (1) along its length. Lateral moving part (3), which is arranged above the base plate (1) and can move along its length; The longitudinal moving part (4) is mounted on the transverse moving part (3) and can move along the width direction of the base plate (1); A silicon wafer assembly plate (5A) is arranged parallel to the upper surface of the base plate (1) and installed at the top of the longitudinal moving part (4). A solar silicon wafer is detachably installed on the top of the silicon wafer assembly plate (5A) so that the solar silicon wafer detection mechanism (2) can detect the morphological features on the upper or lower surface of the solar silicon wafer. A second silicon wafer assembly plate (5B) is arranged perpendicularly to the upper surface of the base plate (1) and installed on one side of the longitudinal moving part (4). A solar silicon wafer can be detachably installed on the outer side of the second silicon wafer assembly plate (5B) so that the solar silicon wafer detection mechanism (2) can detect the morphological features on the end face of the solar silicon wafer.

2. The solar silicon wafer testing device according to claim 1, characterized in that, It also includes a transverse movement drive unit (6) and a longitudinal movement drive unit (7). The transverse movement unit (3) is a transverse movement block. The transverse movement drive unit (6) is fixed to the top of the base plate (1) and drives the transverse movement block to move along the length direction of the base plate (1). The longitudinal movement unit (4) is a longitudinal movement block. The longitudinal movement drive unit (7) is installed on the transverse movement block and drives the longitudinal movement block to move along the width direction of the base plate (1). The silicon wafer assembly plate one (5A) and the silicon wafer assembly plate two (5B) are respectively installed on the top and one side of the longitudinal movement block.

3. The solar silicon wafer testing device according to claim 2, characterized in that, The lateral drive unit (6) includes: The first lead screw mounting base (61) is long and fixed to the top of the base plate (1) along the length direction of the base plate (1); The first lead screw (62) is rotatably mounted in the first lead screw mounting seat (61), and the transverse moving block is threadedly connected to the first lead screw (62). A transverse drive motor (63) is mounted on one end of the first lead screw mounting base (61), and its output shaft passes through the first lead screw mounting base (61) and is connected to the first lead screw (62) for transmission.

4. The solar silicon wafer testing device according to claim 3, characterized in that, The longitudinal movement drive unit (7) includes: The second lead screw mounting base (71) is long and strip-shaped and arranged along the width direction of the base plate (1), and its bottom end is mounted on the top of the transverse moving block through a connecting plate. The second lead screw (72) is rotatably mounted in the second lead screw mounting seat (71); Nut block (73), the nut block (73) is threadedly connected to the second lead screw (72), and the longitudinal moving block is fixed on the top of the nut block (73); A longitudinal drive motor (74) is mounted on one end of the second lead screw mounting base (71), and its output shaft passes through the second lead screw mounting base (71) and is connected to the second lead screw (72) for transmission.

5. The solar silicon wafer testing device according to claim 4, characterized in that, Mesh-shaped air guide grooves (51) are provided on the top of the silicon wafer assembly plate one (5A) and the outer surface of the silicon wafer assembly plate two (5B). Air holes (52) penetrating the thickness direction are provided on both the silicon wafer assembly plate one (5A) and the silicon wafer assembly plate two (5B). One end of the air hole (52) is connected to the air guide groove (51), and the other end is connected to a negative pressure device through an air pipe to negatively adsorb the solar silicon wafer onto the silicon wafer assembly plate one (5A) or the silicon wafer assembly plate two (5B).

6. The solar silicon wafer testing device according to claim 1, characterized in that, The lateral moving part (3) is a movable box. The bottom plate (1) has a sliding hole (11) arranged along the length direction. The bottom of the movable box slides and is limited by the sliding part (8) and the sliding hole (11).

7. A solar silicon wafer testing device according to claim 6, characterized in that, The longitudinal moving part (4) is a sliding plate, which includes a sliding plate one (41) and a sliding plate two (42). The top and front sides of the moving box are provided with assembly holes (31) arranged along the width direction of the bottom plate (1). The sliding plate one (41) is arranged parallel to the upper plate surface of the bottom plate (1) and is slidably limited on the assembly hole (31) at the top of the moving box by a sliding member (8). The sliding plate two (42) is arranged perpendicular to the upper plate surface of the bottom plate (1) and is slidably limited on the assembly hole (31) at the front side of the moving box by a sliding member (8). The silicon wafer assembly plate one (5A) can be detachably installed on the top of the sliding plate one (41), and the silicon wafer assembly plate two (5B) can be detachably installed on the outer side of the sliding plate two (42).

8. A solar silicon wafer testing device according to claim 7, characterized in that, Both the silicon wafer assembly board one (5A) and the silicon wafer assembly board two (5B) include: Plate(53); Positioning seats (54), wherein there are multiple positioning seats (54) and they are respectively installed at the corners of the plate (53); The strip-shaped locking block (55) consists of multiple blocks, and the connecting ends of the multiple blocks (55) are rotatably connected to the corresponding positioning seat (54). The locking ends can rotate freely to limit and press the solar silicon wafer onto the plate (53).

9. A solar silicon wafer testing device according to claim 7, characterized in that, Both the movable box and the sliding plate (42) are equipped with movable handles.

10. A solar silicon wafer testing device according to any one of claims 1-9, characterized in that, The solar silicon wafer testing mechanism (2) includes: The detector bracket (21) is vertically fixed to one side of the base plate (1) along the length direction; A solar silicon wafer inspection instrument (22) is mounted on the inspection instrument bracket (21) with the inspection end facing downward. The solar silicon wafer inspection instrument (22) has multiple inspection probes to detect different morphological features on the surface of the solar silicon wafer.

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