Backlight module and display device

Abstract

The embodiment of the application provides a backlight module and a display device, relates to the technical field of display devices, and the backlight module comprises a lamp plate and a diffusion plate. One side of the lamp plate is provided with lamp beads. The diffusion plate is arranged on the side of the lamp plate provided with the lamp beads and is arranged in a spaced mode with the lamp beads. The light entry side of the diffusion plate is provided with a light reflection structure, and the light reflection structure is provided with a light entry hole. In the scheme of the embodiment, after the lamp beads emit light, part of the light can directly enter the light entry hole, and the other part of the light is reflected between the lamp plate and the light reflection structure for multiple times and finally enters the diffusion plate from the light entry hole for diffusion. Since the light entry hole is arranged, on the one hand, the light entry angle of the light entering the diffusion plate can be controlled, and on the other hand, the uniformity of light entry can be improved, so that in the short-OD scene, the optical performance of the backlight module can also be guaranteed, and the overall thickness of the backlight module can be made thinner.

Description

Technical Field

[0001] This application relates to the technical field of display devices, specifically to a backlight module and a display device. Background Technology

[0002] In existing direct-lit backlight module designs, a relatively thick structure is typically required to ensure sufficient optical performance for high-quality display effects. This thickness requirement directly results in a larger overall size for display devices using such backlight modules, posing a significant limitation in modern display product designs that prioritize thinness and aesthetics, and restricting the overall design flexibility of display devices. Utility Model Content

[0003] This application provides a backlight module and a display device, which aims to provide a low-thickness backlight module with good optical performance.

[0004] On one hand, embodiments of this application provide a backlight module, including:

[0005] A lamp panel, wherein lamp beads are provided on one side of the lamp panel;

[0006] A diffuser plate is disposed on the side of the lamp plate where the lamp beads are disposed, and is spaced apart from the lamp beads. The light-incident side of the diffuser plate is provided with a reflective structure, and the reflective structure has a light-incident hole.

[0007] In some embodiments, the reflective structure includes a white ink layer disposed on the light-incident side of the diffuser plate.

[0008] In some embodiments, the thickness of the white ink layer is less than 25. um .

[0009] In some embodiments, the diffusion plate is a glass diffusion plate; and / or,

[0010] The outer surface of the light-emitting side of the diffuser plate is frosted.

[0011] In some embodiments, the light entrance aperture and the LED are arranged in a one-to-one correspondence; and / or,

[0012] The LED chip is a MINI LED chip; and / or,

[0013] The distance between the lamp board and the diffuser plate is D, the diagonal length of the lamp chip is L, and the diameter of the light entrance hole is φ, wherein L+8D≤φ≤L+10D.

[0014] In some embodiments, the light panel includes:

[0015] A substrate having a mounting side, wherein the LED chip is mounted on the mounting side; and...

[0016] A reflector sheet is mounted on the mounting side of the substrate, and a clearance hole is provided corresponding to the lamp bead.

[0017] In some embodiments, the substrate is an aluminum substrate; and / or,

[0018] The thickness of the substrate is less than 0.5 mm.

[0019] In some embodiments, the lamp panel further includes adhesive posts disposed on the reflector at the gaps between the plurality of lamp beads, and the adhesive posts protrude from the top of the lamp beads to space the diffuser plate and the lamp beads when bonded to the diffuser plate.

[0020] In some embodiments, a wiring groove is provided on the mounting side of the substrate, and a copper wire is provided in the wiring groove.

[0021] On the other hand, embodiments of this application provide a display device including any of the backlight modules described above.

[0022] In the scheme of this embodiment, by setting the diffuser plate and the LED beads at intervals, a reflective structure is provided on the light-incident side of the diffuser plate, and the reflective structure has a light-incident hole. So after the LED beads emit light, part of the light can directly enter through the light-incident hole, and the other part of the light is reflected multiple times between the LED plate and the reflective structure, and finally enters the diffuser plate through the light-incident hole for diffusion. Because of the light-incident hole, on the one hand, the incident angle of the light entering the diffuser plate can be controlled, and on the other hand, the uniformity of the incident light at the diffuser plate can be improved. Thus, even in the case of short OD, the good optical performance of the backlight module can be guaranteed, and the overall thickness of the backlight module can be made thinner. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a backlight module provided in some embodiments of this application;

[0025] Figure 2 yes Figure 1 Exploded view of the backlight module in the image;

[0026] Figure 3 yes Figure 2 A schematic diagram of the diffuser plate in the diagram;

[0027] Figure 4 yes Figure 3 A schematic diagram of the light-incident side of the diffuser plate;

[0028] Figure 5 yes Figure 3 A schematic diagram of the light-emitting side of the diffuser plate.

[0029] Explanation of key component symbols:

[0030] 100 Backlight module 10 Light panel 11 LED beads 20 Diffuser plate 21 Reflective structure 22 entrance aperture 23 frosted surface 12 substrate 13 reflector 14 glue column 30 Quantum dot film 40 Optical composite film 24 incident light side 25 Light-emitting side Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0034] The use of "applies to" or "configured to" in this application implies open and inclusive language, which does not exclude the applicability to or configuration to devices performing additional tasks or steps. Additionally, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0035] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0036] In existing direct-lit backlight module designs, a relatively thick structure is typically required to ensure sufficient optical performance for high-quality display effects. This thickness requirement directly results in a larger overall size for display devices using such backlight modules, posing a significant limitation in modern display product designs that prioritize thinness and aesthetics, and restricting the overall design flexibility of display devices.

[0037] For this, please refer to Figures 1 to 5 The embodiments of this application provide a backlight module 100, which includes a lamp board 10 and a diffuser plate 20. An LED bead 11 is disposed on one side of the lamp board 10. The diffuser plate 20 is disposed on the side of the lamp board 10 where the LED bead 11 is disposed, and is spaced apart from the LED bead 11. A reflective structure 21 is disposed on the light-incident side 24 of the diffuser plate 20, and the reflective structure 21 has a light-incident hole 22.

[0038] Specifically, the specific implementation of the lamp bead 11 is not limited. It can be an LCD lamp bead, an LED lamp bead, a MINI LED lamp bead, etc., and is not limited here.

[0039] The specific implementation of the reflective structure 21 is not limited. It can be in the form of a white ink layer, or in the form of a reflective sheet, etc. It is not limited here. The reflective structure 21 has light entrance holes 22. The number of light entrance holes 22 is not limited. It can be one or more. It can be the same as the number of LED beads 11 or different, etc. It is not limited here.

[0040] The specific implementation of the diffusion plate 20 is not limited; it can be a prism diffusion plate, a bubble diffusion plate, etc., and is not limited here.

[0041] It should be noted that the diffuser plate 20 and the lamp beads 11 are spaced apart, so that the light emitted by the lamp beads 11 first diffuses in all directions, and then a part of it directly enters the diffuser plate 20 through the light entrance hole 22 for diffusion, while the other part is reflected between the reflective structure 21 and the lamp plate 10, and finally enters the diffuser plate 20 from the light entrance hole 22 for diffusion.

[0042] In the scheme of this embodiment, by setting the diffuser plate 20 and the lamp bead 11 at intervals, the light-incident side 24 of the diffuser plate 20 is provided with a reflective structure 21, and the reflective structure 21 has a light-incident hole 22. So after the lamp bead 11 emits light, part of the light can directly pass through the light-incident hole 22, and the other part of the light is reflected multiple times between the lamp plate 10 and the reflective structure 21, and finally enters the diffuser plate 20 through the light-incident hole 22 for diffusion. Because the light-incident hole 22 is provided, on the one hand, the light-incident angle of the light entering the diffuser plate 20 can be controlled, and on the other hand, the uniformity of the light entering the diffuser plate 20 can be improved. Thus, even in the short OD scenario, the good optical performance of the backlight module 100 can be guaranteed, and the overall thickness of the backlight module 100 can be made thinner.

[0043] It should be emphasized that the backlight module 100 may include multiple lamp boards or only one lamp board, and there is no limitation here. In some embodiments, the backlight module 100 includes only one lamp board. With this setting, a large-size substrate 12 can be used. From the aluminum substrate roll material, to the roll-to-roll aluminum substrate anodizing process, to the roll-to-roll insulating layer coating material coating, to the roll-to-roll structural adhesive coating and curing, and then to the roll-to-roll circuit nano-imprinting copper filling sintering and curing, it is convenient for manufacturing and can make the thickness of the lamp board 10 very thin.

[0044] In some embodiments, the reflective structure 21 includes a white ink layer disposed on the light-incident side 24 of the diffuser plate 20.

[0045] In the scheme of this embodiment, by setting the reflective structure 21 as white ink, compared with other forms, on the one hand, white ink is low in cost and easy to set. In actual production, it is only necessary to coat the white ink on the light-incident side 24 of the diffuser plate 20. On the other hand, the thickness of the white ink layer can be made very thin, which can be controlled within 25um, thereby making the overall thickness of the backlight module 100 thinner.

[0046] Furthermore, in some embodiments, the thickness of the white ink layer is less than 25 μm, thereby allowing the overall thickness of the backlight module 100 to be thinner.

[0047] Specifically, the thickness of the white ink layer cannot be too thin. If it is too thin, the reflection effect will be poor, and light can directly pass through the white ink layer into the diffuser plate 20. Therefore, in some embodiments, the thickness of the white ink layer is greater than 2 μm.

[0048] The material of the diffuser plate 20 is not limited; it can be made of PS material, glass material, etc., and no limitation is made here.

[0049] It should be noted that the difference between the expansion and contraction of the PS material diffuser plate 20 and the lamp plate 10 is large. When the diffuser plate 20 is directly bonded to the lamp plate 10, the two are prone to separation, resulting in poor long-term stability of the backlight module 100.

[0050] Therefore, in some embodiments, the diffuser plate 20 is a glass diffuser plate 20.

[0051] In this embodiment, by setting the diffuser plate 20 as a glass diffuser plate 20, the glass material's expansion and contraction ensure good long-term stability even when it is very close to the LED beads 11 or directly bonded to the lamp panel 10. Even if the diffuser plate 20 is directly bonded to the lamp panel 10, the backlight module 100 still has good long-term stability.

[0052] Please refer to this carefully. Figure 5 In some embodiments, the outer surface of the light-emitting side 25 of the diffuser plate 20 is a frosted surface 23.

[0053] Specifically, the specific implementation of the frosted surface 23 is not limited. It can be that multiple frosted protrusions are directly provided on the light-emitting side 25 of the diffuser plate 20. When the diffuser plate 20 is a glass diffuser plate 20, it can also be directly set as a frosted glass surface, etc. There are no limitations here.

[0054] In the scheme of this embodiment, by setting the light-emitting side 25 of the diffuser plate 20 as a frosted surface 23, the uniformity of light emission can be improved, and the frosted surface 23 plays the role of light diffusion.

[0055] In some embodiments, the light entrance holes 22 and the lamp beads 11 are arranged in a one-to-one correspondence, that is, the number of light entrance holes 22 is the same as the number of lamp beads 11, so that the light emitted by each lamp bead 11 can enter the diffuser plate 20 through its corresponding light entrance hole 22 when it meets a specific light entrance angle range. Specifically, the one-to-one correspondence between the light entrance holes 22 and the lamp beads 11 can also mean that the positions of the light entrance holes 22 and the lamp beads 11 are one-to-one correspondences.

[0056] In some embodiments, the lamp bead 11 is a MINI LED lamp bead, that is, the backlight module 100 is a MINI LED backlight module 100. Since the lamp bead 11 is set as a MINI LED lamp bead, there are many lamp beads 11. Correspondingly, when applied to the solution of this application, the uniformity of light output can be better. Even if the thickness of the backlight module 100 is made very thin, its optical performance can still be guaranteed.

[0057] The size of the light inlet aperture 22 is not limited and can be any value according to actual needs, and is not limited here.

[0058] Please refer to this carefully. Figures 1 to 3 In some embodiments, the diagonal length of the LED chip 11 is L, the distance between the center points of two adjacent LED chips 11 is P, and the diameter of the light entrance hole 22 is φ, with L≤φ≤P.

[0059] It can be understood that when the diameter of the light entrance hole 22 is smaller than the diagonal length of the chip of the lamp bead 11, that is, part of the chip of the lamp bead 11 is located outside the projection of the light entrance hole 22 on the lamp board 10. Therefore, a large part of the light cannot directly enter the light entrance hole 22. By setting the diameter of the light entrance hole 22 to be greater than or equal to L, a large part of the light emitted by the lamp bead 11 can directly enter the light entrance hole 22.

[0060] The diameter of the light entrance aperture 22 cannot be too large. If it is too large, it will affect the arrangement space of other light entrance apertures 22, and the reflective structure 21 will occupy a small area, which will not be very effective in adjusting the angle of light incident on the diffuser plate 20. Therefore, by setting the diameter of the light entrance aperture 22 to be less than or equal to P, the problem of the reflective structure 21 having too small an area can be avoided.

[0061] Please refer to this carefully. Figures 1 to 3 Furthermore, in some embodiments, the distance between the lamp plate 10 and the diffuser plate 20 is D, where L+8D≤φ≤L+10D.

[0062] Specifically, assuming the effective light emission angle of the chip is θ, the one-sided variable is M = D * tan(θ / 2), and the window diameter can be expressed as: φ = L + 2M = L + 2 * D * tan(θ / 2).

[0063] Generally, the effective emission angle can be considered to be between 70° and 80° (mostly between 77° and 78°), corresponding to L+8D≤φ≤L+10D, so that light with an emission angle of 70° to 80° can directly enter the light inlet aperture 22.

[0064] In a further embodiment, φ = L + 9D, which means that light rays of 77° to 78° can directly enter the light entrance aperture 22.

[0065] In some embodiments, the lamp panel 10 includes a substrate 12 and a reflector 13. The substrate 12 has a mounting side, and the lamp beads 11 are mounted on the mounting side. The reflector 13 is mounted on the mounting side of the substrate 12 and has clearance holes corresponding to the lamp beads 11.

[0066] In the scheme of this embodiment, by setting the reflector 13, the light emitted by the lamp bead 11 can be reflected again by the reflector 13 after being reflected by the reflective structure 21. After being reflected multiple times by the reflector 13 and the reflective structure 21, it can enter the light entrance hole 22, which can effectively improve the light efficiency.

[0067] Specifically, in some embodiments, the mounting side of the substrate 12 may also be coated with a white ink solder resist layer, thereby achieving insulation and solder resist while improving the light reflection effect of the lamp board 10.

[0068] More specifically, the mounting method of the reflective sheet 13 is not limited. In some embodiments, the reflective sheet 13 is provided with an adhesive backing, thereby achieving bonding between the reflective sheet 13 and the white ink solder resist layer of the substrate 12 through the adhesive backing.

[0069] The thickness of the reflective sheet 13 is not limited and can be any value according to actual needs. In some embodiments, the reflective sheet 13 is a 75um thick planar reflective sheet. This setting can reduce the overall thickness of the backlight module 100 while taking into account the optical effect of reflection.

[0070] In some embodiments, the substrate 12 is an aluminum substrate, which can effectively reduce costs.

[0071] Furthermore, in some embodiments, the substrate 12 is a single-layer board. By setting the substrate 12 as a single-layer board, the amount of copper used can be effectively reduced, thereby reducing costs.

[0072] Furthermore, the thickness of the substrate 12 is not limited and can be any thickness according to actual needs. In some embodiments, the thickness of the substrate 12 is less than 0.5 mm, thereby reducing the overall thickness of the backlight module 100.

[0073] Furthermore, in some embodiments, a wiring groove is provided on the mounting side of the substrate 12, and copper wires are disposed in the wiring groove.

[0074] Specifically, the copper wire can be a regular copper wire or it can be sintered from nano-copper paste. In a further embodiment, the copper wire is sintered from nano-copper paste, so the depth of the circuit groove can be made relatively shallow, thus the substrate 12 does not need to be made very thick.

[0075] In the scheme of this embodiment, since the mounting side of the substrate 12 is provided with a circuit groove and the circuit groove is provided with copper wires, the copper wires can be formed by imprinting. Compared with the traditional etching scheme, it is not necessary to limit the thickness of the substrate 12, and the thickness of the substrate 12 can be made thinner, thereby reducing the overall thickness of the backlight module 100.

[0076] In some embodiments, the lamp panel 10 further includes adhesive posts 14 disposed on the reflector 13 at the gaps between the plurality of lamp beads 11, and the adhesive posts 14 protrude from the top of the lamp beads 11 to space the diffuser plate 20 and the lamp beads 11 when bonded to the diffuser plate 20.

[0077] In this embodiment, by setting the adhesive column 14, there is no need to set an additional lamp support structure, and the OD distance can be made smaller, so that the overall thickness of the backlight module 100 is small.

[0078] Specifically, in the actual production process, adhesive higher than the height of the LED beads 11 can be applied to the center point of each rectangular block composed of four LED beads 11, and then the substrate 12 and the diffuser plate 20 can be bonded together by frame bonding to form the adhesive column 14.

[0079] In addition, in some embodiments, a quantum dot film 30 and / or an optical composite film 40, such as a DOPP film or a COPP film, may be provided on the light-emitting side 25 of the diffuser plate 20.

[0080] In the solution of this application, by using a nano-copper imprinting process, the wiring groove is set on the substrate 12 of the lamp board 10, so that the thickness of the substrate 12 can be less than 0.5mm, or even a 0.2mm aluminum substrate 12 can be used directly, thereby reducing the thickness of the lamp board 10. The diffuser plate 20 and the lamp board 10 are connected by adhesive pillars 14, which effectively reduces the OD distance, thereby significantly reducing the overall thickness of the backlight module 100. By setting the reflective structure 21 on the light-incident side 24 of the diffuser plate 20 and the frosted surface 23 on the light-emitting side 25, and setting the reflective sheet 13 on the lamp board 10, the light efficiency is effectively improved. While reducing the thickness of the backlight module 100, the light efficiency is guaranteed.

[0081] This utility model also provides a display device, which includes the backlight module 100 of the above embodiments. The specific structure of the backlight module 100 is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0082] The display device can be a computer monitor, a television, etc., and is not limited thereto. In some embodiments, the display device is a television.

[0083] The backlight module and display device provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A backlight module, characterized in that, include: A lamp panel, wherein lamp beads are provided on one side of the lamp panel; A diffuser plate is disposed on the side of the lamp plate where the lamp beads are disposed, and is spaced apart from the lamp beads. The light-incident side of the diffuser plate is provided with a reflective structure, and the reflective structure has a light-incident hole.

2. The backlight module of claim 1, wherein, The reflective structure includes a white ink layer disposed on the light-incident side of the diffuser plate.

3. The backlight module of claim 2, wherein, The thickness of the white ink layer is less than 25 μm.

4. The backlight module of claim 1, wherein, The diffusion plate is a glass diffusion plate; and / or, The outer surface of the light-emitting side of the diffuser plate is frosted.

5. The backlight module of claim 1 or 2, wherein, The light entrance aperture and the LED bead are configured in a one-to-one correspondence; and / or, The LED chip is a MINI LED chip; and / or, The distance between the lamp board and the diffuser plate is D, the diagonal length of the lamp chip is L, and the diameter of the light entrance hole is φ, wherein L+8D≤φ≤L+10D.

6. The backlight module according to claim 1, characterized in that, The light panel includes: A substrate having a mounting side, wherein the LED chip is mounted on the mounting side; and... A reflector sheet is mounted on the mounting side of the substrate, and a clearance hole is provided corresponding to the lamp bead.

7. The backlight module according to claim 6, characterized in that, The substrate is an aluminum substrate; and / or The thickness of the substrate is less than 0.5 mm.

8. The backlight module of claim 6, wherein, The lamp panel also includes adhesive posts disposed on the reflector sheet at the gaps between the plurality of lamp beads, and the adhesive posts protrude from the top of the lamp beads to space the diffuser plate and the lamp beads when bonded to the diffuser plate.

9. The backlight module according to claim 6, characterized in that, The mounting side of the substrate is provided with a wiring groove, and copper wires are provided in the wiring groove.

10. A display device, characterized in that, Includes the backlight module as described in any one of claims 1 to 9.

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