Temperature control device for a server and server system

Abstract

The application discloses a kind of temperature control device of server, it is related to server technical field, by increasing temperature sensor on hard disk and network card, the temperature of all main heat sources inside server can be monitored by the utility model, provide more comprehensive temperature data, help more accurately assess the overall thermal state of server.Multiple sensor deployment can cross-verify temperature information, even if a sensor fails, the data of other sensors can still be used as a reference, improving the reliability and accuracy of temperature monitoring;The baseboard management controller is electrically connected with all temperature sensors, can obtain data in real time, respond quickly to temperature changes, adjust fan speed or other cooling strategies in time, therefore, it can solve the problem that the temperature monitoring of the server of the existing scheme only sets temperature sensors on the central processing unit and memory, making the temperature monitoring reference reliability of the server of the existing scheme poor, thereby causing the temperature control effect of the server to be poor.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a server temperature control device and server system. Background Technology

[0002] Existing server temperature monitoring solutions only install temperature sensors on the central processing unit (CPU, the core part of a computer system, responsible for executing instructions and processing data) and memory, and use the CPU and memory temperatures as a reference for fan temperature control, thus ignoring the temperatures of the hard drive and network card. As a result, the temperature monitoring results of existing server solutions are difficult to match actual operating conditions, leading to poor reliability of the temperature monitoring reference and thus poor server temperature control performance. Utility Model Content

[0003] This application provides a server temperature control device and server system to at least solve the problem that the temperature monitoring of existing servers only uses temperature sensors on the central processing unit and memory, resulting in poor reliability of the temperature monitoring reference and thus poor temperature control effect.

[0004] This application provides a temperature control device for a server, including: multiple temperature sensors integrated into components of the server, the components including a central processing unit, memory, hard disk and network card; a fan installed inside the server chassis; and a baseboard management controller electrically connected to each temperature sensor and the fan, for receiving temperature data from each temperature sensor and adjusting the fan speed based on the temperature data.

[0005] This application also provides a server system, including: a server and a temperature control device for the server.

[0006] By adding temperature sensors to the hard drive and network card, this invention can monitor the temperature of all major heat sources inside the server, providing more comprehensive temperature data and helping to more accurately assess the overall thermal state of the server. The deployment of multiple sensors allows for cross-validation of temperature information; even if one sensor fails, data from other sensors can still be used as a reference, improving the reliability and accuracy of temperature monitoring. The baseboard management controller is electrically connected to all temperature sensors, enabling real-time data acquisition, rapid response to temperature changes, and timely adjustment of fan speed or other cooling strategies to prevent server overheating. Integrating data from multiple temperature sensors, the baseboard management controller can more intelligently analyze and manage heat dissipation. For example, when multiple components overheat simultaneously, it can comprehensively consider and adjust cooling strategies to avoid overheating. Therefore, it solves the problem that existing server temperature monitoring solutions only use temperature sensors on the central processing unit and memory, resulting in poor reliability of temperature monitoring references and thus poor server temperature control. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 A schematic diagram illustrating the connection between the server's temperature control device and the server, provided in an embodiment of this application.

[0009] Figure 2 This is a schematic diagram of a server system provided in an embodiment of this application.

[0010] The above figures include the following reference numerals:

[0011] 110. Central Processing Unit; 120. Memory; 130. Hard Disk; 140. Network Interface Card; 150. Power Supply; 200. Fan; 300. Baseboard Management Controller; 400. Power Supply Air Deflector; 500. Heatsink. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0013] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0014] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] This application provides a temperature control device for a server, such as... Figure 1 As shown, it includes:

[0016] Multiple temperature sensors are integrated into components of the server, including a central processing unit 110, memory 120, hard disk 130, and network card 140. These components are... Figure 1 The middle section is an integrated structure with a temperature sensor;

[0017] Fan 200, installed inside the server chassis;

[0018] The Baseboard Management Controller 300 (BMC, a dedicated microcontroller located on or near the motherboard, primarily used for hardware monitoring and management of servers) is electrically connected to each temperature sensor and fan, and is used to receive temperature data from each temperature sensor and adjust the fan speed based on the temperature data.

[0019] Based on the fundamental principles of server thermal management—namely, dynamically adjusting fan speeds by monitoring the temperature of critical components to maintain the server's internal temperature within a safe and efficient range—this mechanism has existed in server hardware design for many years, resulting in a mature technology and standardized solutions.

[0020] By adding temperature sensors to the hard drive and network card, this invention can monitor the temperature of all major heat sources inside the server, providing more comprehensive temperature data and helping to more accurately assess the overall thermal state of the server. The deployment of multiple sensors allows for cross-validation of temperature information; even if one sensor fails, data from other sensors can still be used as a reference, improving the reliability and accuracy of temperature monitoring. The baseboard management controller is electrically connected to all temperature sensors, enabling real-time data acquisition, rapid response to temperature changes, and timely adjustment of fan speed or other cooling strategies to prevent server overheating. Integrating data from multiple temperature sensors, the baseboard management controller can more intelligently analyze and manage heat dissipation. For example, when multiple components overheat simultaneously, it can comprehensively consider and adjust cooling strategies to avoid overheating. Therefore, it solves the problem of existing server temperature monitoring solutions that only use temperature sensors on the central processing unit and memory, resulting in poor reliability of temperature monitoring references and thus poor server temperature control.

[0021] The integration of temperature sensors enables comprehensive thermal management: The integrated design of multiple temperature sensors provides real-time temperature data for various critical components within the server, including the CPU, memory, hard drive, and network interface card (NIC). This ensures comprehensive coverage of server heat sources, providing a foundation for precise thermal management strategies. The integrated temperature sensors can instantly detect temperature changes. Once a component's temperature exceeds a preset threshold, it quickly sends an alarm to the Baseboard Management Controller (BMC) and initiates corresponding cooling strategies to prevent system crashes or hardware damage caused by overheating. Because the temperature sensors are directly mounted on each component, heat loss from the heat source to the sensor is reduced, providing more accurate temperature readings. This is crucial for ensuring server stability under high load conditions and extending hardware lifespan. By monitoring the temperature of each component in real time, fan speeds can be dynamically adjusted to avoid excessive fan operation under low heat loads, thereby achieving refined energy management and reducing the server's overall energy consumption. The integrated advantages of the Baseboard Management Controller (BMC): As the "brain" of the server, the BMC receives signals from various temperature sensors and uses complex algorithms (such as PID control algorithms) to determine fan speed adjustments, ensuring the server maintains optimal thermal management under different load and environmental conditions. The Heat Dissipation Controller (BMC) can collect and analyze historical temperature data to identify potential problems in thermal management, such as specific components being prone to overheating under high loads. This allows for adjustments to thermal management strategies, optimization of server cooling design, and improvement of overall system performance. The BMC supports remote monitoring, enabling administrators to view server temperature status and fan operation in real time via the network, and even remotely adjust fan strategies. This is particularly important for managing large-scale server clusters in data centers. The electrical connection between the BMC and temperature sensors and fans simplifies internal server cabling and hardware design, improves system integration, reduces production costs, and facilitates future maintenance and upgrades. The BMC's intelligent control capabilities effectively prevent system instability caused by localized overheating. By dynamically adjusting fan speeds, it achieves rapid heat dissipation, ensuring stable server operation under various working environments.

[0022] The Importance of Fan Design: An efficient fan design provides sufficient airflow to quickly remove heat from the server's interior. This not only helps maintain components within a safe temperature range but also improves server cooling efficiency and extends hardware lifespan. Traditional fans generate significant noise at high speeds, while the efficient fan design of this invention reduces operating noise while ensuring effective cooling, providing a quieter operating environment for the server. This is especially important for servers deployed in noise-sensitive environments such as offices or laboratories. The intelligent fan control mechanism adjusts the fan speed according to actual temperature requirements, avoiding unnecessary power consumption, improving server energy efficiency, and helping to reduce data center operating costs. By effectively controlling internal temperature, damage to hardware caused by overheating is avoided, extending the lifespan of server components, reducing the frequency of hardware replacement and maintenance, and improving server availability and reliability.

[0023] Overall Advantages and Application Prospects: The intelligent BMC and high-efficiency fan design together constitute an advanced and comprehensive temperature control system. This not only improves the server's thermal management efficiency but also enables precise energy consumption control, ensuring stable, efficient, and low-noise server operation. This design is suitable not only for high-performance servers in data centers but also for emerging fields such as edge computing and cloud computing. It is of significant value for optimizing server performance and ensuring stability under complex environments and high loads, and is expected to become a standard configuration for future server thermal management systems.

[0024] This invention enables data center operators to build more efficient, environmentally friendly, and reliable computing infrastructure to meet the ever-increasing demands for data processing and storage. The server temperature control device provided by this invention, through an innovative combination of an integrated temperature sensor, intelligent BMC, and high-efficiency fan, achieves comprehensive optimization of server thermal management, improving server performance and stability.

[0025] In one embodiment of this application, such as Figure 2 As shown, the server's temperature control device also includes a heat sink 500, which is installed on the outside of the central processing unit.

[0026] Specifically, the CPU is one of the hottest components in a server. Installing a heatsink directly on its exterior ensures that heat is quickly conducted from the CPU surface to the heatsink, and then dissipated into the air through heat exchange, effectively reducing the CPU temperature and ensuring stable server operation under high load. The heatsink's direct contact with the CPU reduces intermediate heat conduction steps and lowers thermal resistance, meaning a shorter heat transfer path from the CPU to the air and better heat dissipation. Lowering thermal resistance is a key factor in improving the overall heat dissipation performance of a server. Airflow design within the server is crucial for heat dissipation. Heatsinks typically feature fins or heat pipes to guide airflow more effectively across the CPU surface, accelerating heat dissipation. A well-designed airflow system combined with a heatsink can achieve a balanced heat distribution within the server, preventing localized overheating. In server temperature control, the use of heatsinks provides an additional means of thermal management. When CPU heat increases, it can be addressed by optimizing the heatsink layout or improving its efficiency, rather than solely relying on increasing fan size or speed. This reduces energy consumption and noise to some extent. By effectively controlling CPU temperature, the heatsink can prevent CPU damage from overheating, thus extending the server's lifespan. CPU overheating can lead to performance degradation, hardware failure, or data loss; a heatsink can mitigate these risks. Temperature control is a critical factor affecting server performance. Good heat dissipation ensures that the CPU and other critical components operate within their optimal temperature range, preventing automatic throttling or shutdown due to overheating, thereby improving server operating efficiency and processing power.

[0027] In one embodiment of this application, the temperature control device for the server further includes a visualization component, which is electrically connected to the baseboard management controller.

[0028] The visualization component, through its electrical connection to the BMC (Body Control Center), can acquire real-time temperature data and other relevant metrics for key components within the server, such as fan speed and PWM values. This real-time data stream allows test engineers or maintenance personnel to instantly observe the server's thermal management status, promptly identify and resolve potential temperature control issues. When abnormal temperatures or fan control problems occur, the visualization component can quickly generate intuitive charts or reports based on the data provided by the BMC, helping engineers quickly pinpoint the fault. Compared to traditional log file analysis, this real-time visualization method significantly improves the efficiency and accuracy of fault diagnosis. Through its electrical connection to the BMC, the visualization component can dynamically display the server's configuration status and operating parameters, including fan control algorithm settings and temperature threshold adjustments. This provides system administrators with a user-friendly interface, simplifying server configuration and maintenance processes and reducing the possibility of human error. The visualization component typically provides a graphical interface that can display complex data in the form of charts, trend lines, or heatmaps, making it easy for non-technical personnel to understand the server's thermal management status. This not only enhances the system's user-friendliness but also facilitates cross-departmental communication, making technical support and decision-making processes more transparent and efficient. The visualization component, electrically connected to the BMC, can integrate early warning functionality. When the monitored temperature reaches or exceeds a preset warning value, the system can immediately issue an alert via the user interface or other means (such as email or SMS). This enables the operations and maintenance team to respond promptly, preventing hardware damage or performance degradation due to overheating. Electrical connectivity means the visualization component can remotely access BMC data over the network, enabling remote monitoring and management. Especially in distributed server systems or data center environments, remote visualization tools can help the central control room monitor the temperature status of all servers in real time, centrally schedule maintenance resources, and improve the overall operational efficiency of the data center.

[0029] In one embodiment of this application, the temperature sensor is one of the following: a thermistor temperature sensor, a thermocouple temperature sensor, an infrared temperature sensor, and a semiconductor temperature sensor.

[0030] Thermistor temperature sensors: Thermistors are highly sensitive to temperature changes, responding quickly to variations and providing accurate temperature measurements. Compared to other types of temperature sensors, thermistors are less expensive and easier to deploy on a large scale. Thermistors can measure over a wide temperature range, making them suitable for temperature monitoring of most internal server components.

[0031] Thermocouple temperature sensors: Thermocouples can measure a very wide temperature range, providing reliable temperature data from low to high temperatures. Some thermocouple materials can operate in extremely high-temperature environments, making them ideal for monitoring the temperature of high-heat areas in servers, such as near the CPU. Thermocouple signals can be transmitted over long distances via cables, suitable for complex server internal layouts without concerns about signal attenuation.

[0032] Infrared temperature sensors: Infrared sensors measure the surface temperature of objects without physical contact, avoiding interference or damage caused by contact. They can capture temperature changes in real time, making them particularly suitable for monitoring rapidly changing heat sources, such as a running CPU. They can monitor the temperature of multiple points simultaneously, providing a global temperature distribution map by scanning internal server components, which is beneficial for optimizing overall thermal management strategies.

[0033] Semiconductor temperature sensors: Semiconductor temperature sensors typically offer high measurement accuracy, providing more precise temperature readings. Their small size allows for easy integration into the compact space of a server, minimizing installation space requirements. Compared to other types of sensors, semiconductor temperature sensors consume less power, contributing to lower overall server energy consumption.

[0034] The advantage of choosing different types of temperature sensors is that they can provide the most suitable temperature monitoring solution according to the specific operating conditions and needs of the server. Whether high accuracy, wide temperature range, non-contact measurement, or cost-effectiveness are required, the most suitable solution can be found, thereby ensuring that the server can maintain an ideal temperature level under various load conditions, and maintain the stability and efficient operation of the system.

[0035] In one embodiment of this application, such as Figure 1 and Figure 2 As shown, the server's temperature control device also includes a power supply temperature sensor, integrated into the server's power supply unit 150 (PSU, Power Supply Unit, used to convert AC power into DC power for internal use in a computer).

[0036] As the core of energy conversion in a server, the power supply unit (PSU) generates a relatively large amount of heat. Integrating a temperature sensor within the PSU allows for direct monitoring of its operating temperature, ensuring precise control of this critical heat source and preventing performance degradation or malfunction due to overheating. The integrated PSU temperature sensor provides real-time feedback, enabling the server's thermal management system to respond instantly to temperature changes and adjust cooling strategies accordingly, such as increasing fan speed for rapid heat dissipation and system stability. The sensor can be configured with temperature thresholds; if the PSU temperature exceeds a preset warning value, an alert mechanism is triggered, notifying the system administrator to take necessary cooling measures or automatically activating overheat protection, such as reducing power output to prevent damage from overheating and extend the PSU's lifespan. Monitoring PSU temperature helps optimize its operation, preventing unnecessary overheating, reducing energy loss, and improving overall server energy efficiency. This is particularly important in large-scale data center applications, as reduced energy consumption translates to lower operating costs and a lesser environmental impact. PSU overheating can lead to power instability or even sudden power outages, threatening stored server data. By continuously monitoring and controlling the PSU temperature, the risk of sudden power outages can be reduced, ensuring data security and system continuity. Integrating the power supply temperature sensor into the PSU eliminates the need for additional external sensor wiring and installation, simplifying the server's internal layout and reducing the complexity of maintenance and troubleshooting, thus ensuring the reliability and ease of use of the thermal management system.

[0037] In one embodiment of this application, such as Figure 2 As shown, the server's temperature control device also includes a power supply vent 400, which is installed between the memory and the power supply unit.

[0038] As a core component of server energy conversion, the operating temperature of the power supply unit (PSU) directly affects the overall performance and long-term reliability of the system. In high-performance server scenarios, the concentrated heat flow generated by high-power components such as CPU, GPU, and memory often leads to an uneven temperature field inside the chassis. The PSU, located in the back-end area, is exposed to the preheated airflow of the upstream heat source for a long time, resulting in a particularly harsh working environment. Without a duct, the PSU will be directly affected by the heat radiation and preheated air from the high-temperature components such as the CPU in front, causing its operating temperature to rise significantly. This phenomenon will not only reduce the conversion efficiency of the PSU (typically manifested as increased energy loss), but may also trigger the overheat protection mechanism, leading to reduced server performance or unexpected downtime, posing a serious threat to business continuity. The power supply duct scheme proposed in this patent achieves the following key improvements by reconstructing the internal airflow topology of the server: (1) Directional airflow isolation: physically isolating the high preheated airflow of the upstream heat source of the PSU; (2) Low-temperature airflow guidance: prioritizing the distribution of cold airflow in the system through the PSU heat dissipation area; (3) Air pressure optimization: balancing the air resistance distribution within the system and avoiding heat dissipation blind spots caused by local turbulence. Actual test data shows that this design can reduce the operating temperature of the PSU, while improving the overall energy efficiency ratio and significantly extending the service life of key components.

[0039] In one embodiment of this application, the cross-section of the power supply air guide shroud is trapezoidal, and the inclination angle of the guide plate of the power supply air guide shroud is in the range of 35° to 55°.

[0040] The air guide shroud adopts a trapezoidal main structure and is equipped with guide ramps with an inclination range of 35° to 55°. This design achieves dual advantages through fluid dynamics optimization: (1) wind resistance suppression: the inclination angle of the ramps precisely controls the separation of the airflow boundary layer, significantly reducing turbulent resistance during airflow; (2) flow channel optimization: a gradually expanding flow channel is formed, allowing cold air to smoothly turn, avoiding local high-pressure swirling, achieving efficient delivery to the PSU area, and uniformly covering the PSU heat dissipation area. At the same time, the geometric configuration and spatial positioning of the guide ramps with specific inclination angles have been verified by CFD simulation, which can actively destroy the conditions for vortex generation, eliminate energy loss, improve heat dissipation stability, and ensure operational safety. This structure ultimately achieves laminar flow directional airflow, ensuring efficient airflow through the PSU heat dissipation module.

[0041] In one embodiment of this application, such as Figure 1 and Figure 2 As shown, the fan is installed between the hard drive and the central processing unit.

[0042] Hard drives and CPUs are among the hottest components in a server. Placing a fan between them optimizes airflow, ensuring that cooling air prioritizes these two heat sources, thus improving heat dissipation efficiency. This design effectively reduces the temperature of both the hard drive and CPU, ensuring they operate within safe limits. Installing a fan between the hard drive and CPU helps create a localized cooling environment, achieving thermal isolation. On one hand, it prevents the CPU's high temperature from directly affecting the hard drive, reducing the failure rate caused by overheating; on the other hand, it ensures balanced heat dissipation for both the hard drive and CPU, preventing overheating in any one area and improving the overall thermal stability of the server. By precisely controlling the fan's position and direction, unnecessary airflow can be reduced, lowering the overall power consumption of the fan. Simultaneously, the optimized airflow design helps reduce airflow turbulence, thereby reducing fan noise, which is especially important for data center or office servers requiring a quiet operating environment. Hard drive reliability and performance are significantly affected by temperature; excessively high temperatures can lead to performance degradation or even damage. CPUs are also extremely sensitive to temperature; overheating can cause automatic frequency reduction or shutdown. Mounting the fan between the hard drive and CPU ensures they operate at optimal temperatures, improving data processing speed and storage reliability, and guaranteeing server performance and data security. This design also simplifies hard drive and CPU maintenance. When replacing or maintaining the hard drive, the fan acts as the first line of defense, preventing dust from entering the CPU area and reducing cleaning work during CPU maintenance. Furthermore, the fan's mounting position allows for easier direct maintenance and replacement without frequent disassembly of other components. Placing the fan between the hard drive and CPU provides greater flexibility in cooling strategies. For example, under high load conditions, intelligent control algorithms can adjust fan speed to prioritize CPU cooling; under low load or storage-intensive applications, the strategy can be adjusted to prioritize hard drive cooling.

[0043] This application also provides a server system, including: a server and a temperature control device for the server.

[0044] By adding temperature sensors to the hard drive and network card, this invention can monitor the temperature of all major heat sources inside the server, providing more comprehensive temperature data and helping to more accurately assess the overall thermal state of the server. The deployment of multiple sensors allows for cross-validation of temperature information; even if one sensor fails, data from other sensors can still be used as a reference, improving the reliability and accuracy of temperature monitoring. The baseboard management controller is electrically connected to all temperature sensors, enabling real-time data acquisition, rapid response to temperature changes, and timely adjustment of fan speed or other cooling strategies to prevent server overheating. Integrating data from multiple temperature sensors, the baseboard management controller can more intelligently analyze and manage heat dissipation. For example, when multiple components overheat simultaneously, it can comprehensively consider and adjust cooling strategies to avoid overheating. Therefore, it solves the problem of existing server temperature monitoring solutions that only use temperature sensors on the central processing unit and memory, resulting in poor reliability of temperature monitoring references and thus poor server temperature control.

[0045] The integration of temperature sensors enables comprehensive thermal management: The integrated design of multiple temperature sensors provides real-time temperature data for various critical components within the server, including the CPU, memory, hard drive, and network interface card (NIC). This ensures comprehensive coverage of server heat sources, providing a foundation for precise thermal management strategies. The integrated temperature sensors can instantly detect temperature changes. Once a component's temperature exceeds a preset threshold, it quickly sends an alarm to the Baseboard Management Controller (BMC) and initiates corresponding cooling strategies to prevent system crashes or hardware damage caused by overheating. Because the temperature sensors are directly mounted on each component, heat loss from the heat source to the sensor is reduced, providing more accurate temperature readings. This is crucial for ensuring server stability under high load conditions and extending hardware lifespan. By monitoring the temperature of each component in real time, fan speeds can be dynamically adjusted to avoid excessive fan operation under low heat loads, thereby achieving refined energy management and reducing the server's overall energy consumption. The integrated advantages of the Baseboard Management Controller (BMC): As the "brain" of the server, the BMC receives signals from various temperature sensors and uses complex algorithms (such as PID control algorithms) to determine fan speed adjustments, ensuring the server maintains optimal thermal management under different load and environmental conditions. The Heat Dissipation Controller (BMC) can collect and analyze historical temperature data to identify potential problems in thermal management, such as specific components being prone to overheating under high loads. This allows for adjustments to thermal management strategies, optimization of server cooling design, and improvement of overall system performance. The BMC supports remote monitoring, enabling administrators to view server temperature status and fan operation in real time via the network, and even remotely adjust fan strategies. This is particularly important for managing large-scale server clusters in data centers. The electrical connection between the BMC and temperature sensors and fans simplifies internal server cabling and hardware design, improves system integration, reduces production costs, and facilitates future maintenance and upgrades. The BMC's intelligent control capabilities effectively prevent system instability caused by localized overheating. By dynamically adjusting fan speeds, it achieves rapid heat dissipation, ensuring stable server operation under various working environments.

[0046] The Importance of Fan Design: An efficient fan design provides sufficient airflow to quickly remove heat from the server's interior. This not only helps maintain components within a safe temperature range but also improves server cooling efficiency and extends hardware lifespan. Traditional fans generate significant noise at high speeds, while the efficient fan design of this invention reduces operating noise while ensuring effective cooling, providing a quieter operating environment for the server. This is especially important for servers deployed in noise-sensitive environments such as offices or laboratories. The intelligent fan control mechanism adjusts the fan speed according to actual temperature requirements, avoiding unnecessary power consumption, improving server energy efficiency, and helping to reduce data center operating costs. By effectively controlling internal temperature, damage to hardware caused by overheating is avoided, extending the lifespan of server components, reducing the frequency of hardware replacement and maintenance, and improving server availability and reliability.

[0047] Overall Advantages and Application Prospects: The intelligent BMC and high-efficiency fan design together constitute an advanced and comprehensive temperature control system. This not only improves the server's thermal management efficiency but also enables precise energy consumption control, ensuring stable, efficient, and low-noise server operation. This design is suitable not only for high-performance servers in data centers but also for emerging fields such as edge computing and cloud computing. It is of significant value for optimizing server performance and ensuring stability under complex environments and high loads, and is expected to become a standard configuration for future server thermal management systems.

[0048] This invention enables data center operators to build more efficient, environmentally friendly, and reliable computing infrastructure to meet the ever-increasing demands for data processing and storage. The server temperature control device provided by this invention, through an innovative combination of an integrated temperature sensor, intelligent BMC, and high-efficiency fan, achieves comprehensive optimization of server thermal management, improving server performance and stability.

[0049] It should be noted that the above electrical connection can be a direct electrical connection or an indirect electrical connection. A direct electrical connection means that two devices are directly connected, while an indirect electrical connection means that there are other devices such as capacitors and resistors connected between the connected A and B.

[0050] The temperature control device and server system for a server provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A temperature control device for a server, characterized in that, include: Multiple temperature sensors integrated into components of a server, including a central processing unit, memory, hard drive, and network interface card; A fan is installed inside the server chassis; A baseboard management controller is electrically connected to each of the temperature sensors and the fan, respectively, for receiving temperature data from each of the temperature sensors and adjusting the speed of the fan based on the temperature data; The temperature control device for the server further includes a visualization component, which is electrically connected to the baseboard management controller.

2. The server temperature control device according to claim 1, characterized in that, The server's temperature control device also includes: A heat sink is mounted on the outside of the central processing unit.

3. The server temperature control device according to claim 1, characterized in that, The temperature sensor is one of the following: a thermistor temperature sensor, a thermocouple temperature sensor, an infrared temperature sensor, and a semiconductor temperature sensor.

4. The server temperature control device according to claim 1, characterized in that, The server's temperature control device also includes: A power temperature sensor is integrated into the power supply unit of the server.

5. The server temperature control device according to claim 4, characterized in that, The server's temperature control device also includes: The PSU air duct is installed between the memory and the power supply unit.

6. The server temperature control device according to claim 5, characterized in that, The cross-section of the PSU air guide shroud is trapezoidal.

7. The server temperature control device according to claim 5, characterized in that, The tilt angle of the guide plate of the PSU air guide shroud ranges from 35° to 55°.

8. The server temperature control device according to claim 1, characterized in that, The fan is installed between the hard drive and the central processing unit.

9. A server system, characterized in that, include: The server and the temperature control device for the server according to any one of claims 1 to 8.

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