An ultra-thin side-blown open cooling radiator structure

Abstract

This utility model relates to the field of heat sink technology, and in particular to an ultra-thin side-blowing graphics card heat sink structure, including a shell, a heat-conducting component, a heat dissipation fin assembly, and a cooling fan. The cooling fan is located at one end of the shell, the heat dissipation fin assembly is located on top of the heat-conducting component, and the heat dissipation fin assembly is located at the other end of the shell. A clearance gap is provided between the inner wall of the shell and the cooling fan. A connector is provided at the end of the shell near the cooling fan, located at one end of the clearance gap, and the other end of the clearance gap is connected to the top of the heat-conducting component. This utility model allows for direct and unobstructed plugging and unplugging of power cables or signal cables from the end of the graphics card without disassembling adjacent graphics cards, simplifying the installation, maintenance, and upgrade process. It effectively reduces the overall height of the heat sink in the direction perpendicular to the PCB board, and the clearance gap between the inner wall of the shell and the cooling fan provides space for the wiring arrangement of the connector and the graphics card PCB.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to an ultra-thin side-blowing graphics card heat sink structure. Background Technology

[0002] With the rapid development of computer hardware technology, the performance of graphics processing units (GPUs) has continued to improve, but their power consumption and heat generation have also increased dramatically. As a core component of a computer system, the heat dissipation efficiency of the graphics card directly affects the stability, performance, and lifespan of the device. Traditional side-blowing heatsink structures have significant limitations in applications such as servers or workstations that require multiple graphics cards.

[0003] Server graphics cards are typically installed in a dense arrangement. In current technology, the external power supply interfaces or signal connectors of graphics cards are mostly located on the outer middle section of the heatsink. When multiple graphics cards are installed side-by-side, the side connectors located on the outer middle section of the graphics cards are severely obstructed by adjacent graphics cards or the chassis structure, making it extremely difficult to plug and unplug power or signal cables. This often necessitates disassembling adjacent graphics cards before wiring or maintenance can be completed, significantly increasing the complexity and time cost of installation and maintenance, and hindering rapid deployment and maintenance of the equipment. Utility Model Content

[0004] This invention aims to at least solve the technical problems existing in the prior art. To this end, this invention proposes an ultra-thin side-blowing graphics card heatsink structure, which has high heat dissipation efficiency, high space utilization, and optimized connector layout, facilitating wiring and maintenance in multi-card environments.

[0005] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure includes a housing, a heat-conducting component, a heat dissipation fin assembly, and a cooling fan. The cooling fan is located at one end of the housing, the heat dissipation fin assembly is disposed on top of the heat-conducting component, and the heat dissipation fin assembly is located at the other end of the housing. A clearance gap is provided between the inner wall of the housing and the cooling fan. A connector is provided at the end of the housing near the cooling fan, the connector is located at one end of the clearance gap, and the other end of the clearance gap communicates with the top of the heat-conducting component.

[0006] An ultra-thin side-blowing graphics card heatsink structure according to some embodiments of the present invention has at least the following beneficial effects:

[0007] This invention cleverly avoids the area on the outer side of the graphics card that is easily blocked by adjacent graphics cards by placing the connector at the end of the housing near the cooling fan. In scenarios where multiple graphics cards are densely arranged, such as servers or workstations, users can directly and unblock power cables or signal cables from the end of the graphics card without removing adjacent graphics cards, simplifying the installation, maintenance, and upgrade process. By placing the cooling fan at one end of the housing and the heat dissipation fin assembly at the other end, and utilizing the clearance between the inner wall of the housing and the fan for structural layout, the overall structure is compact. This side-blowing layout effectively reduces the overall height of the heatsink in the direction perpendicular to the PCB board, achieving ultra-thin design. The clearance between the inner wall of the housing and the cooling fan provides space for the wiring arrangement of the connector and the graphics card PCB.

[0008] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure is provided, wherein the heat-conducting component includes a heat-conducting plate, multiple heat-conducting pipes, and a boss. The heat-conducting plate has a clearance hole in the middle and multiple positioning grooves on the top of the heat-conducting plate. The heat-conducting pipes are arranged one by one on the positioning grooves. The boss is located at the bottom of the clearance hole. One end of each heat-conducting pipe is connected to the top of the boss. The heat-conducting plate is connected to the bottom of the heat dissipation fin assembly.

[0009] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure is provided with a connecting piece at the bottom of the cooling fan, and the edge of the connecting piece is connected to the edge of the housing.

[0010] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure is provided, wherein a backplate is detachably provided at the bottom of the housing, and the heat conduction component, the heat dissipation fin assembly and the heat dissipation fan are all disposed between the housing and the backplate.

[0011] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure is provided, wherein the bottom of the connecting piece is connected to the back plate.

[0012] According to some embodiments of the present invention, an ultra-thin side-blowing graphics card heatsink structure is provided, wherein the end of the housing is provided with a mounting groove, the connector is disposed in the mounting groove, a positioning post is provided on the outside of the mounting groove, and a pressure plate is detachably provided on the top of the positioning post, the pressure plate extending to the bottom of the mounting groove.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0016] Figure 2 This is a schematic diagram of the structure of this utility model after the shell is hidden.

[0017] Figure 3 This is a bottom view of an embodiment of the present utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the heat-conducting component according to an embodiment of the present invention. Figure 1 .

[0019] Figure 5 This is a schematic diagram of the structure of the heat-conducting component according to an embodiment of the present invention. Figure 2 .

[0020] Reference numerals: 1. Housing; 2. Heat-conducting component; 3. Heat dissipation fin assembly; 4. Cooling fan; 5. Clearance gap; 6. Connector; 7. Heat-conducting plate; 8. Heat-conducting pipe; 9. Boss; 11. Positioning groove; 12. Connecting piece; 13. Back plate; 14. Mounting groove; 15. Positioning post; 16. Pressure plate. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, left, right, front, and back, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the module or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] like Figures 1-5 As shown in the figure, this utility model embodiment provides an ultra-thin side-blowing graphics card heatsink structure.

[0026] An ultra-thin side-blowing graphics card heatsink structure includes a housing 1, a heat-conducting component 2, a heat dissipation fin assembly 3, and a cooling fan 4. The cooling fan 4 is located at one end of the housing 1, and the heat dissipation fin assembly 3 is disposed on top of the heat-conducting component 2 and located at the other end of the housing 1. A clearance gap 5 is provided between the inner wall of the housing 1 and the cooling fan 4. A connector 6 is provided at the end of the housing 1 near the cooling fan 4. The connector 6 is located at one end of the clearance gap 5, and the other end of the clearance gap 5 is connected to the top of the heat-conducting component 2.

[0027] This invention cleverly avoids the area on the outer side of the graphics card that is easily blocked by adjacent graphics cards by placing the connector 6 at one end of the housing 1 near the cooling fan 4. In scenarios where multiple graphics cards are densely arranged, such as servers or workstations, users can directly and unblock power cables or signal cables from the end of the graphics card without removing adjacent graphics cards, simplifying the installation, maintenance, and upgrade process. By placing the cooling fan 4 at one end of the housing 1 and the heat dissipation fin assembly 3 at the other end, and utilizing the clearance 5 between the inner wall of the housing 1 and the cooling fan 4 for structural layout, the overall structure is compact. This side-blowing layout effectively reduces the overall height of the heatsink in the direction perpendicular to the PCB board, achieving ultra-thin design. The clearance 5 between the inner wall of the housing 1 and the cooling fan 4 provides space for the wiring arrangement of the connector 6 and the graphics card PCB.

[0028] This embodiment describes an ultra-thin side-blowing graphics card cooler structure. The heat-conducting component 2 includes a heat-conducting plate 7, multiple heat-conducting pipes 8, and a boss 9. The heat-conducting plate 7 has a clearance hole in its center and multiple positioning slots 11 on its top. Each heat-conducting pipe 8 is mounted on one of the positioning slots 11. The boss 9 is located at the bottom of the clearance hole, and one end of each heat-conducting pipe 8 is connected to the top of the boss 9. The heat-conducting plate 7 is connected to the bottom of the heatsink assembly 3. Specifically, the heat-conducting component 2 adopts a combination structure of the heat-conducting plate 7, heat-conducting pipes 8, and boss 9. The clearance hole on the heat-conducting plate 7 is used to adapt to the graphics card core position. The boss 9 directly contacts the core to enhance heat conduction. The multiple heat-conducting pipes 8 are fixed to the top of the heat-conducting plate 7 and connected to the boss 9 through the positioning slots 11. This allows for rapid horizontal conduction of core heat to the heatsink assembly 3, resulting in a clear heat conduction path, low thermal resistance, and improved overall heat conduction efficiency and structural stability.

[0029] This embodiment describes an ultra-thin side-blowing graphics card cooler structure. The bottom of the cooling fan 4 is provided with a connecting piece 12, the edge of which connects to the edge of the housing 1. Specifically, the connection piece 12 at the bottom of the cooling fan 4 connects to the edge of the housing 1, enhancing the structural connection strength between the cooling fan 4 and the housing 1, improving the stability of the cooling fan 4 during operation, effectively reducing vibration and noise. Simultaneously, this connection method facilitates precise positioning and assembly of the cooling fan 4, improving the overall structural reliability.

[0030] This embodiment describes an ultra-thin side-blowing graphics card cooler structure. The bottom of the housing 1 is detachably equipped with a backplate 13. The heat-conducting component 2, the heat dissipation fin assembly 3, and the cooling fan 4 are all disposed between the housing 1 and the backplate 13. Specifically, the detachable backplate 13 at the bottom of the housing 1 allows the heat-conducting component 2, the heat dissipation fin assembly 3, and the cooling fan 4 to be located between the housing 1 and the backplate 13, forming a closed or semi-closed heat dissipation cavity. This facilitates airflow guidance and structural protection. Simultaneously, the detachable design facilitates the installation, maintenance, and replacement of internal components, improving the maintainability and assembly flexibility of the cooler.

[0031] In this embodiment, an ultra-thin side-blowing graphics card heatsink structure is described, in which the bottom of the connecting piece 12 is connected to the backplate 13. Specifically, the connection between the bottom of the connecting piece 12 and the backplate 13 allows the cooling fan 4 to be doubly fixed to both the housing 1 and the backplate 13 via the connecting piece 12. This greatly enhances the installation stability of the cooling fan 4, effectively suppresses the vibration generated by the cooling fan 4 during high-speed operation from being transmitted to the entire heatsink or graphics card PCB, further reduces noise, and improves operational stability and product durability.

[0032] This embodiment describes an ultra-thin side-blowing graphics card cooler structure. The housing 1 has a mounting groove 14 at its end. The connector 6 is disposed within the mounting groove 14. A positioning post 15 is provided on the outer side of the mounting groove 14. A pressure plate 16 is detachably mounted on the top of the positioning post 15, extending to the bottom of the mounting groove 14. Specifically, the mounting groove 14 at the end of the housing 1 is used to position the connector 6. The positioning post 15 on the outer side of the mounting groove 14, along with the detachable pressure plate 16, allows the connector 6 to be securely pressed and fixed. This structure enables reliable and detachable installation of the connector 6, ensuring the stability of the electrical connection and facilitating the replacement or repair of the connector 6, thus improving the reliability and maintenance convenience of the structure.

[0033] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An ultra-thin side-blown flagship heat spreader structure, characterized in that: The device includes a housing, a heat-conducting component, a heat dissipation fin assembly, and a cooling fan. The cooling fan is located at one end of the housing, the heat dissipation fin assembly is disposed on top of the heat-conducting component, and the heat dissipation fin assembly is located at the other end of the housing. A clearance gap is provided between the inner wall of the housing and the cooling fan. A connector is provided at the end of the housing near the cooling fan, and the connector is located at one end of the clearance gap. The other end of the clearance gap communicates with the top of the heat-conducting component.

2. The ultra-thin side-blown finned heat sink structure of claim 1, wherein: The heat-conducting assembly includes a heat-conducting plate, multiple heat-conducting pipes, and a boss. The heat-conducting plate has a clearance hole in the middle and multiple positioning grooves on the top. The heat-conducting pipes are arranged one by one in the positioning grooves. The boss is located at the bottom of the clearance hole. One end of each heat-conducting pipe is connected to the top of the boss. The heat-conducting plate is connected to the bottom of the heat dissipation fin assembly.

3. The ultra-thin side-blown finned heat sink structure of claim 1, wherein: The bottom of the cooling fan is provided with a connecting piece, and the edge of the connecting piece is connected to the edge of the housing.

4. The ultra-thin side-blown finned heat sink structure of claim 3, wherein: The bottom of the housing is detachably provided with a back plate, and the heat conduction component, heat dissipation fin assembly and the cooling fan are all disposed between the housing and the back plate.

5. The ultra-thin side-blown finned heat sink structure of claim 4, wherein: The bottom of the connecting piece is connected to the back plate.

6. The ultra-thin side-blowing graphics card heatsink structure according to claim 1, characterized in that: The end of the housing is provided with a mounting groove, the connector is disposed in the mounting groove, a positioning post is provided on the outside of the mounting groove, a pressure plate is detachably provided on the top of the positioning post, and the pressure plate extends to the bottom of the mounting groove.

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