Inductor assembled and conducive to drmos cooling

Abstract

The utility model discloses an inductor of assembly and benefit drmos cooling, face the drmos of having connected and set up on the PCB board and match the installation, the pin of this inductor is bent to the bottom distance, and the inductor is welded in the PCB board through the pin and is superposed on the drmos, and the distance between the inductor bottom surface and the PCB board surface is suitable for drmos compatible and is integrally connected by the heat conduction glue. The inductor surface of surface area number times increase helps heat dissipation. The utility model discloses the inductor structure, and the effective temperature control is obtained along with the heat of drmos through the inductor rapid dissipation, thereby more favorably promote the conversion efficiency of DC-DC step-down transformer circuit.

Description

Technical Field

[0001] This utility model relates to an inductor device, and more particularly to a DRMOS device that utilizes the pre-reserved space for the pins of the inductor to be mounted on the PCB board to assist in heat dissipation and cooling, belonging to the field of basic electronic component technology. Background Technology

[0002] Inductors are one of the most commonly used components in electronic devices, widely used in various circuits to perform functions such as filtering, energy storage, matching, and resonance. With the increasing miniaturization and portability of electronic products, and the high-density assembly of components, inductor components have developed rapidly. Furthermore, considering electromagnetic compatibility, the ability of electronic products to resist electromagnetic interference has become a basic design requirement, thus increasing the demand for and application of inductors.

[0003] The area of ​​a 3-in-1 packaged DRMOS is one-quarter that of a discrete MOSFET, and its power density is three times that of a discrete MOSFET, increasing its overvoltage and overclocking potential. Motherboards using DRMOS can feature energy saving, high-efficiency overclocking, and low temperature. It can achieve higher power efficiency for the motherboard under high load, reducing energy waste and thus achieving power saving. In addition, DRMOS generates less heat under high load, with a temperature about half that of MOSFETs in traditional power supply sections. However, the temperature generated by DRMOS under operating conditions still remains above 65°C, which is not conducive to achieving more stable operating efficiency. Compared to DRMOS and other heat-generating components, inductors have a relatively large package surface area, which is more conducive to heat dissipation. Summary of the Invention

[0004] In view of the above-mentioned defects in the existing technology, the purpose of this utility model is to propose an inductor that is assembled and facilitates DRMOS cooling, aiming to improve the conversion efficiency of DC voltage drop circuits.

[0005] The technical solution of this utility model to achieve the above-mentioned objective is: an inductor that is assembled and facilitates the cooling of DRMOS, and is mounted to the DRMOS that has been connected to the PCB board. The inductor's pins are bent at a certain distance to the bottom, and the inductor is soldered to the PCB board through the pins and stacked on the DRMOS. The distance between the bottom surface of the inductor and the surface of the PCB board is suitable for the DRMOS to be compatible with it and is integrally connected by thermally conductive adhesive.

[0006] Furthermore, the inductor is composed of a metal core, a terminal frame, and a magnetic core encapsulation shell. The metal core is a double-layered coil formed by winding copper wire, and the number of turns of the coil is greater than 4. The two free ends of the coil are led out from the bottom in the same direction and connected to the terminal frame. The terminal frame is separated by cutting off the leads when the metal core is formed by the magnetic core encapsulation shell, and the terminal fins are shaped into leads.

[0007] Furthermore, the terminal frame is provided with a first terminal fin, a second terminal fin, and a third terminal fin that are welded to the two free ends and are separate from the metal core. All three terminal fins are integrally encapsulated in the magnetic core package. The pins formed by the first terminal fin and the second terminal fin are welded to the voltage poles on the PCB board, and the pins formed by the third terminal fin are welded to the grounding point on the PCB board.

[0008] Furthermore, the magnetic core packaging shell is a cube formed by molding powder material using a custom mold, and the magnetic core packaging shell completely covers drmos in the projection direction of the PCB board.

[0009] Furthermore, the DRMOS is a plastic-encapsulated chip or core that includes a switching MOSFET and a driver chip.

[0010] Compared with the prior art, the advantages of applying the inductor of this utility model are reflected in the following: by stacking the inductor and the DRMOS on the PCB board one on the other, and connecting the two surfaces into one by thermally conductive adhesive, the heat of the DRMOS can be quickly dissipated through the inductor. This temperature control structure is more conducive to improving the conversion efficiency of DC-DC step-down transformer circuit. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the structural evolution of the inductor of this utility model as it is manufactured.

[0012] Figure 2 This is a schematic diagram of the assembly of the inductor of this utility model with respect to PCB and DRMOS. Detailed Implementation

[0013] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0014] like Figure 1 and Figure 2As shown, this utility model discloses an inductor that facilitates DRMOS cooling. The inductor is an integrated package with a metal core 3, inheriting the functions achieved by various inductors integrated on a PCB board, and simultaneously accommodating DRMOS chips already connected to the PCB board. Since the surface area of ​​the integrated inductor 5 is often much larger than the surface area of ​​the various DRMOS microchips 7 (hereinafter referred to as DRMOS) integrated on the PCB board 6, this application proposes structural improvements to both the internal and external aspects of the inductor for the purpose of protecting these microchips and achieving rapid heat dissipation. In summary: the inductor's leads are bent downwards at a fixed distance, and the distance d between the bottom surface of the inductor and the surface of the PCB board is suitable for DRMOS compatibility. The inductor is soldered to the PCB board via its leads, meaning the entire inductor body is suspended above the PCB board surface. This allows the inductor to be stacked on top of the already assembled DRMOS, and a portion of the outer surfaces of both are connected integrally using thermally conductive adhesive (not shown). The Drmos is a plastic-encapsulated chip or core that includes a switching MOS and a driver chip.

[0015] Understandably, by applying the improved inductor structure of this application, in the circuit design of the PCB board, solder joints for the inductor can be left around the soldering location of the DRMOS. After the DRMOS is assembled, a certain thickness of thermally conductive adhesive is applied to its surface, and then the inductor is aligned and soldered onto the PCB board, ensuring full contact between the bottom surface of the inductor and the thermally conductive adhesive in the overlapping area. Therefore, when the entire circuit board and all its integrated electronic components are operating, the heat generated by the DRMOS can be quickly transferred to the outer wall of the inductor, utilizing a larger surface area for heat exchange.

[0016] Depend on Figure 1 As shown, the inductor in the preferred embodiment comprises a metal core 1, a terminal frame 2, and a magnetic core encapsulation shell 4. The metal core 1 is a double-layered, nested coil formed by winding copper wire, with more than four turns. The two free ends of the coil extend from the bottom in the same direction and are connected to the terminal frame 2, forming the encapsulation front body 3. The terminal frame 2 is a die-cast metal sheet with a rectangular outer frame and several distributed, inwardly extending terminal fins. The terminal frame is separated by cutting off the leads when the metal core is encapsulated in the magnetic core encapsulation shell, i.e., removing the outer frame and retaining only the encapsulation body and its connected terminal fins 21. These terminal fins are then shaped to form the leads of the inductor.

[0017] More specifically, the terminal frame 2 is provided with a first terminal fin, a second terminal fin, and a third terminal fin that are welded to the two free ends and are separated from the metal core. All three terminal fins are integrally encapsulated in the magnetic core package. The pins formed by the first terminal fin and the second terminal fin are welded to the voltage poles on the PCB board, and the pins formed by the third terminal fin are welded to the grounding point on the PCB board.

[0018] On the other hand, the inductor has a magnetic core encapsulation shell outside the metal core. From the perspective of optional molding processes, the magnetic core encapsulation shell can be made from one or more mixtures of Fe-based / FeSi / FeSiCr / FeSiAl / FeNi / amorphous / nanocrystalline materials, cold-pressed and baked in a pre-formed mold, or directly hot-pressed into a cube. The molding pressure is between 8-10 T / cm², and it is baked and cured at 160-180℃ for 2-4 hours.

[0019] In summary, the preferred embodiment of the inductor assembled according to this utility model and facilitating DRMOS cooling demonstrates that, compared with the prior art, this solution possesses substantial features and advancements. Its technical effects are manifested in: optimizing the finished structure of the inductor and stacking it vertically with the DRMOS on the PCB board, connecting their surfaces into one unit using thermally conductive adhesive, allowing the heat generated by the DRMOS to dissipate rapidly through the inductor. This temperature control structure is more conducive to improving the conversion efficiency of the DC-DC step-down transformer circuit. Simultaneously, the use of an additional grounding pin ensures that the inductor has a stable zero-potential surface, avoiding any impact on the normal functioning of the DRMOS.

[0020] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. An inductor that assembles and facilitates DRMOS cooling, and is compatible with DRMOS devices already connected to a PCB board, characterized in that: The inductor's pins are bent at a certain distance to the bottom, and the inductor is soldered to the PCB board and stacked on the DRMOS via the pins. The distance between the bottom surface of the inductor and the surface of the PCB board is suitable for the DRMOS to be compatible with it and is integrally connected by thermally conductive adhesive.

2. The inductor assembled and facilitating drmos cooling according to claim 1, wherein: The inductor consists of a metal core, a terminal frame, and a magnetic core encapsulation shell. The metal core is a double-layered coil formed by winding copper wire, with more than 4 turns. The two free ends of the coil are led out from the bottom in the same direction and connected to the terminal frame. The terminal frame is separated from the metal core by cutting off the leads when the metal core is formed by the magnetic core encapsulation shell, and the terminal fins are shaped into leads.

3. The inductor assembled according to claim 2 and facilitating DRMOS cooling, characterized in that: The terminal frame is provided with a first terminal fin, a second terminal fin, and a third terminal fin that are welded to the two free ends and are separate from the metal core. All three terminal fins are integrally enclosed in the magnetic core package. The pins formed by the first terminal fin and the second terminal fin are welded to the voltage poles on the PCB board, and the pins formed by the third terminal fin are welded to the grounding point on the PCB board.

4. The inductor assembled according to claim 2 and facilitating DRMOS cooling, characterized in that: The magnetic core packaging shell is a cube formed by molding powder material using a custom mold, and the magnetic core packaging shell completely covers drmos in the projection direction of the PCB board.

5. The inductor assembled according to claim 1 and facilitating DRMOS cooling, characterized in that: The DRMOS is a plastic-encapsulated chip or core that includes a switching MOSFET and a driver chip.

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