A digitalized maintenance system heating control circuit
Patent Information
- Application Number
- CN202522066506.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-25
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-25
AI Technical Summary
[0003]本实用新型公开了一种数字化养护系统加热控制电路，解决了加热功能过流、短路时，断路保护响应不及时的问题
[0019] 1. In the heating power acquisition and processing module of this application, an optocoupler is set between the heating power acquisition and detection circuit and the heating power signal processing circuit to resist interference and to prevent high voltage caused by overcurrent from damaging the downstream circuit.
Smart Images
Figure CN224746236U_ABST
Abstract
Description
Technical Field
[0001] This application relates to battery control circuits, and more particularly to a heating control circuit for a digital maintenance system. Background Technology
[0002] The heating control circuit is a crucial component of a digital battery maintenance system, featuring intelligent temperature regulation for simultaneous charging and battery maintenance, thereby extending battery life. Its design principle utilizes automatic heating to ensure the battery is fully charged even in low-temperature environments, reducing range degradation in winter. However, the original circuit design was simple and unable to provide timely and effective protection against faults such as overcurrent or short circuits in the heating function. To address these usage scenarios, a more stable and reliable circuit structure is urgently needed to ensure proper functioning between electrical components. Utility Model Content
[0003] This utility model discloses a heating control circuit for a digital maintenance system, which solves the problem of untimely response of circuit breaker protection when the heating function is overcurrent or short-circuited.
[0004] A heating control circuit for a digital maintenance system, used for circuit breaking protection in case of overcurrent in the heating circuit, includes,
[0005] The MCU module, acting as a controller, receives overcurrent signals and outputs control signals;
[0006] The heating power acquisition and processing module is connected to the heating circuit and is used to sample the current magnitude of the heating current and convert the overcurrent into a stable overcurrent signal as the input of the MCU module.
[0007] The heating control module is connected to the MCU module and controls the current flow in the heating circuit based on the control signals output by the MCU module.
[0008] In this application, a heating power acquisition and processing module is set up to acquire the heating circuit current to form an overcurrent signal, which is used by the MCU module to drive the heating control module to control the current on and off in the heating circuit, thus forming timely circuit breaker protection.
[0009] Several alternative methods are provided below, but they are not intended as additional limitations on the overall solution above. They are merely further additions or optimizations. Provided there are no technical or logical contradictions, each alternative method can be combined individually with respect to the overall solution above, or multiple alternative methods can be combined with each other.
[0010] Optionally, the heating power acquisition and processing module includes,
[0011] A heating power acquisition and detection circuit is connected in the heating circuit to sample the current in the heating circuit and obtain the overcurrent.
[0012] The heating power signal processing circuit is located at the back end of the heating power acquisition and detection circuit. It receives the overcurrent and converts it into a stable overcurrent signal, which is then input to the MCU module.
[0013] Optionally, an optocoupler for anti-interference is provided between the heating power acquisition and detection circuit and the heating power signal processing circuit. The heating power acquisition and detection circuit is connected to the light-emitting diode in the optocoupler, and the heating power signal processing circuit is connected to the phototransistor in the optocoupler.
[0014] Optionally, the heating control module includes a heating switch circuit and a heating switch control circuit. The heating switch circuit uses a MOSFET, and the heating switch control circuit is connected to the gate of the MOSFET and controls the magnitude of the voltage input at the gate. The MOSFET controls the current flow in the heating circuit according to the magnitude of the voltage input at the gate.
[0015] Optionally, the heating switch control circuit is connected to the heating circuit as the input voltage at the gate of the MOS transistor, and a pull-down circuit is provided for pulling down the input voltage.
[0016] A transistor Q2 is installed on the pull-down circuit. The control signal output by the MCU module controls the switching of the transistor Q2, which is used to control the magnitude of the voltage input at the gate of the MOSFET.
[0017] Optionally, the heating control module further includes a heating abnormality lockout control circuit. The heating abnormality lockout control circuit is connected to the heating circuit and the gate of the MOSFET, and a transistor Q3 is placed between the heating circuit and the gate of the MOSFET. The base of the transistor Q3 is connected to the heating power signal processing circuit to obtain an overcurrent signal, which is used to trigger the transistor Q3 to conduct and turn off the MOSFET.
[0018] The beneficial effects of this application are as follows:
[0019] 1. In the heating power acquisition and processing module of this application, an optocoupler is set between the heating power acquisition and detection circuit and the heating power signal processing circuit to resist interference and to prevent high voltage caused by overcurrent from damaging the downstream circuit.
[0020] 2. In the heating control module of this application, a heating abnormality lockout control circuit is set up and connected to the heating power signal processing circuit. It can directly obtain the overcurrent signal, control the heating switch circuit to be cut off, save MCU control time, and improve response speed; and continuously disconnect the heating circuit before the overcurrent signal disappears, forming a circuit breaker lockout after overcurrent. Attached Figure Description
[0021] Figure 1 This is a block diagram of an embodiment of this application;
[0022] Figure 2This is a circuit diagram of a heating power acquisition and detection circuit in one embodiment of this application;
[0023] Figure 3 This is a circuit diagram of a heating power signal processing circuit in one embodiment of this application;
[0024] Figure 4 This is a circuit diagram of the heating control module in one embodiment of this application. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0026] It should be noted that when a component is said to be "connected" to another component, it can be directly connected to the other component or it can be connected to a component in between. When a component is said to be "set on" another component, it can be directly set on the other component or it may be set to a component in between.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0028] refer to Figure 1 One embodiment of this application discloses a heating control circuit for a digital maintenance system, which is used to provide circuit breaker protection when the heating circuit is overcurrent. The circuit includes a heating power acquisition and processing module connected to the heating circuit, a heating control module for controlling the on and off of the heating circuit, and an MCU module as a controller.
[0029] The heating power acquisition and processing module is used to acquire the magnitude of the current flowing through the heating circuit, generate an overcurrent signal when there is an overcurrent, and transmit it to the MCU module as input.
[0030] The heating control module is controlled by the MCU module. After the MCU module receives the overcurrent signal, it outputs a control signal to disconnect the heating circuit.
[0031] refer to Figure 2 and Figure 3In some embodiments, the heating power acquisition and processing module includes a heating power acquisition and detection circuit, which includes a resistor R1 connected in series in the heating circuit. By acquiring the voltage across the resistor R1 and transmitting it to the MCU module, the current value on the heating circuit can be calculated.
[0032] The heating power acquisition and processing module also includes a heating power signal processing circuit. This heating power signal processing circuit serves as the back-end circuit of the heating power acquisition and detection circuit. It is equipped with resistors R4 and R5 and capacitor C1 for voltage division and filtering, and transmits the voltage on resistor R1 to the input terminal of the MCU module.
[0033] Furthermore, to prevent excessive current in the heating circuit from damaging the downstream circuitry, in one embodiment, an optocoupler PC1 is provided within the heating power acquisition and processing module. The light-emitting diode of the optocoupler PC1 is connected to the heating power acquisition and detection circuit, and the phototransistor is connected to the heating power signal processing circuit.
[0034] The voltage difference across resistor R1 causes the LED connected in parallel across R1 to light up, which controls the conduction of the phototransistor, thereby isolating the current across the two ends and keeping the overcurrent signal output by the heating power signal processing circuit stable.
[0035] Furthermore, a resistor R2 is connected in series with one end of the aforementioned LED to limit the lower limit of the current for the LED to emit light. When the voltage difference across resistor R1 reaches a certain value, the LED emits light, thus indicating an overcurrent in the heating circuit.
[0036] refer to Figure 4 In one embodiment of this application, the heating control module includes a heating switch control circuit and a heating switch circuit.
[0037] The heating switch circuit uses a MOSFET in the heating circuit. The input to its gate is controlled by the heating switch control circuit, which controls its conduction and cutoff, thereby affecting the on / off state of the heating circuit.
[0038] In one embodiment, the heating switch circuit uses a P-type MOS transistor, which is turned on when its gate is at a low potential and turned off when its gate is at a high potential.
[0039] Furthermore, the aforementioned heating switch control circuit connects the drain and gate of the P-type MOSFET, and a pull-down circuit is connected to the gate to pull down the gate voltage and turn on the P-type MOSFET.
[0040] Furthermore, to control the on / off state of the P-type MOSFET, a transistor Q2 is included in the pull-down circuit. The collector of transistor Q2 is connected to a resistor R12. The base of transistor Q2 is controlled by the MCU module. When the MCU module outputs a high level, it turns on, thereby pulling down the gate voltage of MOSFET M1, and MOSFET M1 turns on. When the output is low, transistor Q2 turns off, the gate of MOSFET M1 is at a high voltage, and MOSFET M1 turns off.
[0041] For details, please refer to Figure 4 When the heating circuit experiences overcurrent, the MCU module outputs a high level, transistor Q1 conducts, and the current flows from diode D2 to ground. Transistor Q2 has no input at its base and is cut off. MOSFET M1's gate is at a high voltage, so MOSFET M1 is cut off, and the heating circuit is disconnected.
[0042] When the heating circuit current is not excessive, the MCU module outputs a low level, transistor Q1 is cut off, and after the voltage is divided by resistors R9 and R10, transistor Q2 is turned on. Resistor R12 pulls down the gate voltage of MOSFET M1, MOSFET M1 is turned on, and the heating circuit is turned on.
[0043] To improve the response speed of the heating circuit disconnection, a heating abnormality lockout control circuit is also set in the heating control module. This heating abnormality lockout control circuit is connected to the heating power signal processing circuit, directly obtains the overcurrent signal, and connects to the gate of MOSFET M1 to control MOSFET M1 to disconnect.
[0044] For details, please refer to Figure 4 The heating abnormality lockout control circuit includes a PNP transistor Q3. The emitter of transistor Q3 is connected to the drain of MOSFET M1, and the collector of transistor Q3 is connected to the gate of MOSFET M1. The base of transistor Q3 is controlled by an overcurrent signal. When an overcurrent signal is present, transistor Q3 conducts, causing the gate of MOSFET M1 to be at a high voltage, and MOSFET M1 to be cut off, thus disconnecting the heating circuit.
[0045] Furthermore, the overcurrent signal is connected to transistor Q1, which controls the current to conduct through resistors R13 and R14. After transistor Q1 is turned on, resistor R14 is at a low potential, and transistor Q3 is turned on, thus continuously disconnecting the heating circuit before the overcurrent signal disappears, forming a circuit breaker lockout after overcurrent.
[0046] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification. When technical features of different embodiments are embodied in the same drawing, it can be regarded as the drawing also disclosing examples of combinations of the various embodiments involved.
[0047] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.
Claims
1. A heating control circuit for a digital maintenance system, used for circuit breaking protection in case of overcurrent in the heating circuit, characterized in that, include, The MCU module, acting as a controller, receives overcurrent signals and outputs control signals; The heating power acquisition and processing module is connected to the heating circuit and is used to sample the current magnitude of the heating current and convert the overcurrent into a stable overcurrent signal as the input of the MCU module. The heating control module is connected to the MCU module and controls the current flow in the heating circuit based on the control signals output by the MCU module.
2. The heating control circuit of the digital maintenance system according to claim 1, characterized in that, The heating power acquisition and processing module includes, A heating power acquisition and detection circuit is connected in the heating circuit to sample the current in the heating circuit and obtain the overcurrent. The heating power signal processing circuit is located at the back end of the heating power acquisition and detection circuit. It receives the overcurrent and converts it into a stable overcurrent signal, which is then input to the MCU module.
3. The heating control circuit of the digital maintenance system according to claim 2, characterized in that, An optocoupler for anti-interference is provided between the heating power acquisition and detection circuit and the heating power signal processing circuit. The heating power acquisition and detection circuit is connected to the light-emitting diode in the optocoupler, and the heating power signal processing circuit is connected to the phototransistor in the optocoupler.
4. The heating control circuit of the digital maintenance system according to claim 3, characterized in that, The heating control module includes a heating switch circuit and a heating switch control circuit. The heating switch circuit uses a MOSFET, and the heating switch control circuit is connected to the gate of the MOSFET and controls the magnitude of the voltage input at the gate. The MOSFET controls the current flow in the heating circuit according to the magnitude of the voltage input at the gate.
5. The heating control circuit of the digital maintenance system according to claim 4, characterized in that, The heating switch control circuit is connected to the heating circuit as the input voltage at the gate of the MOS transistor, and a pull-down circuit is provided for pulling down the input voltage. A transistor Q2 is installed on the pull-down circuit. The control signal output by the MCU module controls the switching of the transistor Q2, which is used to control the magnitude of the voltage input at the gate of the MOSFET.
6. The heating control circuit of the digital maintenance system according to claim 5, characterized in that, The heating control module also includes a heating abnormality lockout control circuit. The heating abnormality lockout control circuit is connected to the heating circuit and the gate of the MOS transistor. A transistor Q3 is placed between the heating circuit and the gate of the MOS transistor. The base of the transistor Q3 is connected to the heating power signal processing circuit to obtain an overcurrent signal, which is used to trigger the transistor Q3 to conduct and turn off the MOS transistor.