An intelligent adapter of adaptive virtual impedance control
Patent Information
- Application Number
- CN202522210137.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-10-20
AI Technical Summary
[0003]但是现有的适配器在长时间使用后,其表面因内部设备长时间运转出现较高温度,如不及时进行对适配器进行散热,温度较高容易影响设备的使用,且长时间散热不及时容易影响设备的使用寿命,从而导致设备出现损坏,因此需要提供一种自适应虚拟阻抗控制的智能适配器来解决上述问题
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Figure CN224746448U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of intelligent adapter technology, and more specifically, to an intelligent adapter with adaptive virtual impedance control. Background Technology
[0002] The adaptive virtual impedance control smart adapter is an intelligent power electronic device that combines virtual impedance technology with adaptive control algorithms. It is mainly used to optimize the dynamic performance, stability and energy management of power systems. By monitoring the system status in real time (such as voltage, current and frequency), the virtual impedance technology can dynamically adjust the equivalent impedance characteristics, suppress resonance, improve power distribution and enhance the stability of the system under load changes or fault conditions.
[0003] However, after prolonged use, the surface of existing adapters develops high temperatures due to the continuous operation of internal devices. If heat dissipation is not provided in time, the high temperature can affect the use of the device, and prolonged lack of timely heat dissipation can shorten the lifespan of the device, leading to damage. Therefore, there is a need to provide an intelligent adapter with adaptive virtual impedance control to solve the above problems. Utility Model Content
[0004] To overcome the aforementioned deficiencies of the prior art, embodiments of this utility model provide an intelligent adapter with adaptive virtual impedance control, which improves the heat dissipation effect of the device through a heat dissipation component.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an intelligent adapter with adaptive virtual impedance control, comprising an adapter body, the adapter body including a housing, a heat dissipation copper fin disposed inside the housing, and a device body disposed in the middle of the heat dissipation copper fin, and a heat dissipation component disposed between the housing and the heat dissipation copper fin; The heat dissipation assembly includes an I-shaped support frame, with a cavity in the middle and a groove at the top, and a dustproof component on the top of the I-shaped support frame. The dustproof component includes a sealing frame, a dustproof net at the bottom of the sealing frame, a positioning frame at the bottom of the dustproof net, a pressing block at the top of the positioning frame, and a connecting ear plate on one side of the positioning frame.
[0006] Furthermore, there are two outer shells, symmetrically distributed outside the heat dissipation copper fin, with the heat dissipation copper fin located in the middle of the two outer shells. The main body of the device is installed in the middle of the heat dissipation copper fin, and the heat dissipation copper fin wraps around the outside of the main body of the device. A certain distance is provided between the heat dissipation copper fin and the inner wall of each of the two outer shells.
[0007] Furthermore, there are two I-shaped support frames, which are symmetrically distributed on the inner walls of opposite sides of the two outer shells. One of the I-shaped support frames has a groove on the top of the side closest to the outer shell, and a cavity is formed in the middle of the I-shaped support frame, which penetrates the I-shaped support frame.
[0008] Furthermore, a heat dissipation groove is provided on the side of the outer shell near the groove, and the heat dissipation groove penetrates the outer shell. The heat dissipation groove is correspondingly arranged with the groove, and the heat dissipation groove is located above the groove.
[0009] Furthermore, a sealing frame is installed on the inner wall of the outer casing near the heat dissipation groove, and the sealing frame is bonded to the outer casing with sealant. A pressure groove is formed on the top inner wall of the sealing frame, and there are multiple pressure grooves, which are evenly distributed on the top inner wall of the sealing frame. A dustproof net is snapped onto the top inner wall of the sealing frame, and the dustproof net is set corresponding to the heat dissipation groove.
[0010] Furthermore, a positioning frame is snapped into the bottom of the dustproof net, and the outer wall of the positioning frame is in contact with the inner wall of the sealing frame. A pressing block is fixedly connected to the top of the positioning frame, and the top of the pressing block passes through the dustproof net and connects to the inside of the pressing groove. The dustproof net is located between the top of the positioning frame and the top of the sealing frame.
[0011] Furthermore, the positioning frame is fixedly connected to a connecting ear plate, and there are two connecting ear plates, which are symmetrically distributed on both sides of the positioning frame. The connecting ear plates are connected to the outer shell by bolts, and the connecting ear plates extend out of the side of the sealing frame. A slot is opened on one side of the sealing frame, and there are two slots, which are symmetrically distributed on both sides of the sealing frame. The connecting ear plates are engaged inside the slots.
[0012] The technical effects and advantages of this utility model are as follows: This utility model supports the heat dissipation copper fins by setting two sets of I-shaped support frames, thereby increasing the space between the heat dissipation copper fins and the outer shell. The I-shaped support frames connect the heat dissipation copper fins and the outer shell, thereby improving the heat dissipation effect of the heat dissipation copper fins on the main body of the equipment. In addition, the grooves and heat dissipation slots set by the invention allow heat to be discharged, preventing heat from accumulating inside the outer shell and affecting the service life of the main body of the equipment. The positioning frame and sealing frame are used to position and connect the dustproof net, so that the dustproof net is set in accordance with the heat dissipation slot, thereby achieving the dustproof effect of the heat dissipation slot and preventing dust from entering the interior of the outer shell through the heat dissipation slot during use, which would cause dust to accumulate on the main body of the equipment and affect the heat dissipation effect of the device. Attached Figure Description
[0013] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.
[0014] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0015] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model.
[0016] Figure 2 This is a schematic diagram of the main body of the adapter of this utility model.
[0017] Figure 3 This is a schematic diagram of the heat dissipation component of this utility model.
[0018] Figure 4 This is a schematic diagram of the structure of the dustproof component of this utility model.
[0019] The attached diagram is labeled as follows: 1. Adapter body; 2. Outer shell; 3. Copper heat sink; 4. Equipment body; 5. Heat dissipation component; 6. I-shaped support frame; 7. Cavity; 8. Groove; 9. Heat dissipation slot; 10. Dustproof component; 11. Sealing frame; 12. Dustproof net; 13. Positioning frame; 14. Extrusion block; 15. Pressure groove; 16. Connecting ear plate; 17. Slot. Detailed Implementation
[0020] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0021] like Figure 1 , Figure 2As shown, the specific implementation method is as follows: This utility model provides an intelligent adapter with adaptive virtual impedance control, including an adapter body 1, the adapter body 1 including an outer shell 2, a heat dissipation copper fin 3 is provided inside the outer shell 2, and a device body 4 is provided in the middle of the heat dissipation copper fin 3. A heat dissipation component 5 is provided between the outer shell 2 and the heat dissipation copper fin 3. There are two outer shells 2, which are symmetrically distributed outside the heat dissipation copper fin 3, and the heat dissipation copper fin 3 is located in the middle of the two outer shells 2. The device body 4 is installed in the middle of the heat dissipation copper fin 3, and the heat dissipation copper fin 3 is wrapped around the outside of the device body 4. A certain distance is provided between the heat dissipation copper fin 3 and the inner wall of the two outer shells 2. The side wall of the outer shell 2 can be drilled as needed to install connecting wires.
[0022] like Figure 1 , Figure 2 , Figure 3 As shown, the specific implementation method is as follows: the heat dissipation assembly 5 includes an I-shaped support frame 6, a cavity 7 is provided in the middle of the I-shaped support frame 6, and a groove 8 is provided at the top of the I-shaped support frame 6. A dustproof assembly 10 is provided above the I-shaped support frame 6. There are two I-shaped support frames 6, which are symmetrically distributed on the inner walls of opposite sides of the two outer shells 2. The groove 8 is opened at the top of one of the I-shaped support frames 6 near the outer shell 2. The cavity 7 is opened in the middle of the I-shaped support frame 6 and penetrates the I-shaped support frame 6. The outer shell 2 near the groove 8 A heat dissipation groove 9 is provided on one side, and the heat dissipation groove 9 penetrates the outer shell 2. The heat dissipation groove 9 is correspondingly arranged with the groove 8, and the heat dissipation groove 9 is located above the groove 8. The heat dissipation copper fin 3 is supported by two sets of I-shaped support frames 6, thereby increasing the space between the heat dissipation copper fin 3 and the outer shell 2. The I-shaped support frames 6 connect the heat dissipation copper fin 3 and the outer shell 2, thereby improving the heat dissipation effect of the heat dissipation copper fin 3 on the main body of the equipment 4. The heat dissipation groove 8 and the heat dissipation groove 9 are used to dissipate heat and prevent heat from accumulating inside the outer shell 2, which would affect the service life of the main body of the equipment 4.
[0023] Two sets of I-shaped support frames 6 are used to clamp the heat dissipation copper fins 3, placing them between the two outer shells 2. The I-shaped support frames 6 support the heat dissipation copper fins 3 and the main body of the equipment 4, while increasing the space between the heat dissipation copper fins 3 and the outer shells 2, thus improving the heat dissipation effect of the outer shells 2. The two outer shells 2 are then snapped together to form the device. One of the outer shells 2 has a heat dissipation groove 9 on its top, which facilitates the discharge of heat from the inside of the outer shell 2 and reduces the accumulation of heat inside the outer shell 2, thus reducing the impact on the service life of the main body of the equipment 4.
[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, the specific implementation method is as follows: The dustproof component 10 includes a sealing frame 11, a dustproof net 12 is provided at the bottom of the sealing frame 11, and a positioning frame 13 is provided at the bottom of the dustproof net 12. A pressing block 14 is provided at the top of the positioning frame 13, and a connecting ear plate 16 is provided on one side of the positioning frame 13. The sealing frame 11 is installed on the inner wall of the outer shell 2 near the heat dissipation groove 9, and the sealing frame 11 and the outer shell 2 are bonded together with sealant. A pressure groove 15 is formed on the top inner wall of the sealing frame 11, and the pressure groove 15... Multiple dustproof nets 12 are evenly distributed on the top inner wall of the sealing frame 11. A dustproof net 12 is snapped onto the top inner wall of the sealing frame 11, and the dustproof net 12 is correspondingly set with the heat dissipation groove 9. A positioning frame 13 is snapped onto the bottom of the dustproof net 12, and the outer wall of the positioning frame 13 is in contact with the inner wall of the sealing frame 11. A pressing block 14 is fixedly connected to the top of the positioning frame 13, and the top of the pressing block 14 passes through the dustproof net 12 and connects to the inside of the pressing groove 15. The dustproof net 12 is located between the positioning frame 13 and the top of the sealing frame 11.
[0025] The positioning frame 13 has two connecting ear plates 16 fixedly connected to its side, which are symmetrically distributed on both sides of the positioning frame 13. The connecting ear plates 16 are connected to the outer shell 2 by bolts, and the connecting ear plates 16 extend out of the side of the sealing frame 11. The sealing frame 11 has two slots 17 on one side, which are symmetrically distributed on both sides of the sealing frame 11. The connecting ear plates 16 are engaged inside the slots 17. The positioning frame 13 and the sealing frame 11 are used to position and connect the dustproof net 12, so that the dustproof net 12 is correspondingly set with the heat dissipation groove 9, thereby achieving the dustproof effect of the heat dissipation groove 9 and preventing dust from entering the interior of the outer shell 2 through the heat dissipation groove 9 during use, which would cause dust to accumulate on the main body 4 of the equipment and affect the heat dissipation effect of the device.
[0026] The top of the sealing frame 11 is connected to the top inner wall of the outer shell 2, and the positioning frame 13 is inserted into the bottom of the sealing frame 11. The sealing frame 11 and the positioning frame 13 achieve positioning and clamping of the dustproof net 12, so that the squeezing block 14 on the top of the positioning frame 13 squeezes the dustproof net 12 into the interior of the pressure groove 15, thereby preventing the dustproof net 12 from falling off during use and affecting the use of the device. In addition, the side of the positioning frame 13 is fixedly connected to the connecting ear plate 16, which is installed on the top inner wall of the outer shell 2 by bolts, thereby achieving dust protection for the heat dissipation groove 9 and preventing dust from entering the interior of the outer shell 2 through the heat dissipation groove 9.
[0027] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.
Claims
1. An intelligent adapter with adaptive virtual impedance control, comprising an adapter body (1), characterized in that: The adapter body (1) includes an outer shell (2), a heat dissipation copper fin (3) is provided inside the outer shell (2), and a device body (4) is provided in the middle of the heat dissipation copper fin (3). A heat dissipation component (5) is provided between the outer shell (2) and the heat dissipation copper fin (3). The heat dissipation assembly (5) includes an I-shaped support frame (6), with a cavity (7) in the middle of the I-shaped support frame (6) and a groove (8) on the top of the I-shaped support frame (6). A dustproof assembly (10) is provided above the I-shaped support frame (6). The dustproof component (10) includes a sealing frame (11), a dustproof net (12) is provided at the bottom of the sealing frame (11), and a positioning frame (13) is provided at the bottom of the dustproof net (12). A pressing block (14) is provided at the top of the positioning frame (13), and a connecting ear plate (16) is provided on one side of the positioning frame (13).
2. The intelligent adapter with adaptive virtual impedance control of claim 1, wherein: There are two outer shells (2), which are symmetrically distributed outside the heat dissipation copper plate (3) and the heat dissipation copper plate (3) is located in the middle of the two outer shells (2). The device body (4) is installed in the middle of the heat dissipation copper plate (3) and the heat dissipation copper plate (3) is wrapped around the outside of the device body (4). A certain distance is provided between the heat dissipation copper plate (3) and the inner wall of the two outer shells (2).
3. The intelligent adapter of claim 1, wherein: There are two I-shaped support frames (6), which are symmetrically distributed on the inner walls of the two outer shells (2) on opposite sides. One of the I-shaped support frames (6) has a groove (8) on the top of the side of the outer shell (2) and a cavity (7) is provided in the middle of the I-shaped support frame (6). The cavity (7) penetrates the I-shaped support frame (6).
4. The intelligent adapter of adaptive virtual impedance control according to claim 3, wherein: The outer shell (2) has a heat dissipation groove (9) on the side near the groove (8), and the heat dissipation groove (9) penetrates the outer shell (2). The heat dissipation groove (9) is correspondingly arranged with the groove (8), and the heat dissipation groove (9) is located above the groove (8).
5. The intelligent adapter of claim 1, wherein: A sealing frame (11) is installed on the inner wall of the outer shell (2) near the heat dissipation groove (9), and the sealing frame (11) is bonded to the outer shell (2) with sealant. A pressure groove (15) is provided on the top inner wall of the sealing frame (11), and there are multiple pressure grooves (15) evenly distributed on the top inner wall of the sealing frame (11). A dustproof net (12) is snapped onto the top inner wall of the sealing frame (11), and the dustproof net (12) is correspondingly set with the heat dissipation groove (9).
6. The intelligent adapter of adaptive virtual impedance control according to claim 5, wherein: The bottom of the dustproof net (12) is fitted with a positioning frame (13), and the outer wall of the positioning frame (13) is in contact with the inner wall of the sealing frame (11). The top of the positioning frame (13) is fixedly connected with a pressing block (14), and the top of the pressing block (14) passes through the dustproof net (12) and connects to the inside of the pressure groove (15). The dustproof net (12) is located between the top of the positioning frame (13) and the top of the sealing frame (11).
7. The intelligent adapter with adaptive virtual impedance control according to claim 6, characterized in that: The positioning frame (13) is fixedly connected to a connecting ear plate (16) on its side. There are two connecting ear plates (16), which are symmetrically distributed on both sides of the positioning frame (13). The connecting ear plates (16) are connected to the outer shell (2) by bolts. The connecting ear plates (16) extend out of the side of the sealing frame (11). A slot (17) is provided on one side of the sealing frame (11). There are two slots (17), which are symmetrically distributed on both sides of the sealing frame (11). The connecting ear plates (16) are engaged inside the slots (17).