A vehicle-mounted camera module structure capable of solving heat dissipation problem

Abstract

The utility model provides a can solve the heat dissipation problem's vehicle camera module structure relates to camera element technical field, including PCBA mainboard, the center installation of PCBA mainboard has the chip, the both sides of chip are provided with gold wire, the welding between gold wire and PCBA mainboard, the upside of PCBA mainboard is provided with quick heat conduction component, quick heat conduction component includes the encapsulation resin that smears in PCBA mainboard surface, through even smearing in PCBA mainboard surface with encapsulation resin, form a layer of firm and the protection layer of good heat conduction performance, protect PCBA mainboard, and improve the heat dissipation effect to component, fill the resin chassis inside through heat conduction resin and encapsulation resin simultaneously, reduce the air content in the inside, avoid the heat that chip and electrical component produce gathers in resin chassis, improve the effect of heat conduction.

Description

Technical Field

[0001] This utility model relates to the field of camera component technology, and in particular to a vehicle-mounted camera module structure that can solve the heat dissipation problem. Background Technology

[0002] With the development trend of automotive intelligence, in-vehicle cameras are widely used as important sensing components. Traditional in-vehicle camera modules usually adopt conventional packaging methods, such as using ordinary plastic shells to wrap PCBA motherboards and various components. In order to solve the problem of cameras being unable to image due to frost and snow on the camera surface in rainy or snowy weather, the current in-vehicle camera industry is gradually adopting internal / external heating in-vehicle camera modules. However, the module itself is relatively complex in design and generates a lot of heat. The module design may have problems such as frame rate loss and failure to light up due to excessive heat.

[0003] However, existing internally heated / externally heated camera modules generate a lot of heat themselves. The outer plastic / metal shell often has a hollow structure in the middle, which contains a lot of air. However, air has the worst thermal conductivity, so after being heated, the heat cannot be dissipated in time, leading to problems such as inability to form an image.

[0004] Therefore, we provide a vehicle camera module structure that can solve the heat dissipation problem and address the above issues. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a vehicle-mounted camera module structure that can solve the heat dissipation problem, aiming to address the aforementioned issues.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: it includes a PCBA motherboard, a chip is installed at the center of the PCBA motherboard, gold wires are arranged on both sides of the chip, the gold wires are soldered to the PCBA motherboard, a fast heat conduction component is arranged on the upper side of the PCBA motherboard, the fast heat conduction component includes an encapsulating resin coated on the surface of the PCBA motherboard, a resin base is installed on the upper side of the encapsulating resin, and a thermally conductive resin is arranged on the inner side of the resin base.

[0007] Preferably, the encapsulating resin is produced using a molding process, the encapsulating resin is made of modified epoxy resin and aluminum nitride filler is added, and the encapsulating resin is tightly bonded to the components on the PCBA motherboard.

[0008] Preferably, the thermally conductive resin is made of the same material as the encapsulating resin, and the thermally conductive resin is bonded to the upper surface of the chip.

[0009] Preferably, a CG sheet is installed at the top of the resin base, the CG sheet is tightly fitted to the resin base, and the inner side of the resin base forms a sealed structure through the CG sheet.

[0010] Preferably, a heat-conducting ring is attached to the outer side of the resin base, and thermal grease is applied between the heat-conducting ring and the resin base.

[0011] Preferably, heat dissipation fins are installed on the outer side of the heat-conducting ring frame, and the heat dissipation fins are made of high thermal conductivity aluminum alloy.

[0012] Preferably, a resin top frame is provided on the upper side of the resin base frame, a camera lens is provided inside the resin top frame, and a heat dissipation ring is installed on the outer side of the resin top frame.

[0013] This invention provides a vehicle-mounted camera module structure that can solve the heat dissipation problem. Compared with the prior art, it has the following advantages:

[0014] 1. This vehicle camera module structure, which can solve the heat dissipation problem, forms a robust and thermally conductive protective layer by uniformly applying encapsulating resin to the surface of the PCBA motherboard. This protects the PCBA motherboard and improves the heat dissipation of components. At the same time, the chip is protected by the resin base and thermally conductive resin, which quickly conducts the heat generated by the chip. Furthermore, the inside of the resin base is filled with thermally conductive resin and encapsulating resin to reduce the internal air content and prevent the heat generated by the chip and electrical components from accumulating inside the resin base, thereby improving the heat conduction effect.

[0015] 2. This vehicle-mounted camera module structure, which solves the heat dissipation problem, conducts heat outward from the resin base through a heat-conducting ring frame. Simultaneously, the application of thermal grease improves the heat transfer efficiency between the two. After the heat is conducted out through the heat-conducting ring frame, the heat dissipation fins made of high thermal conductivity aluminum alloy quickly disperse the heat into the surrounding air, further enhancing the heat dissipation effect. During camera use, the resin top frame fixes and protects the camera lens, while the heat dissipation ring assists in heat dissipation, dissipating some of the heat generated during camera lens operation and reducing heat accumulation inside the module. Combined with the heat-conducting resin and encapsulating resin using the molding process, this reduces the air content inside the encapsulation while improving the overall thermal conductivity, ensuring stable and reliable operation of the camera module in various complex environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall appearance structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall disassembled structure of this utility model;

[0018] Figure 3 This is a schematic diagram showing the disassembled structure of the resin base, CG sheet, and chip of this utility model;

[0019] Figure 4 This is a schematic diagram showing the disassembled structure of the PCBA motherboard, encapsulation resin, and resin base frame of this utility model.

[0020] The following are the labels in the diagram: 1. PCBA motherboard; 2. Chip; 3. Gold wire; 4. Fast heat conduction component; 401. Encapsulation resin; 402. Resin base frame; 403. Thermally conductive resin; 404. CG sheet; 405. Thermally conductive ring frame; 406. Heat sink fins; 407. Resin top frame; 408. Camera lens; 409. Heat sink ring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4 This utility model provides a technical solution: a vehicle camera module structure that can solve the heat dissipation problem, including a PCBA motherboard 1, a chip 2 installed in the center of the PCBA motherboard 1, gold wires 3 arranged on both sides of the chip 2, the gold wires 3 and the PCBA motherboard 1 are soldered together, a fast heat conduction component 4 is arranged on the upper side of the PCBA motherboard 1, the fast heat conduction component 4 includes an encapsulating resin 401 coated on the surface of the PCBA motherboard 1, a resin base 402 is installed on the upper side of the encapsulating resin 401, and a heat-conducting resin 403 is arranged on the inner side of the resin base 402.

[0023] The encapsulation resin 401 is made using a molding process. The encapsulation resin 401 is made of modified epoxy resin and contains aluminum nitride filler. The encapsulation resin 401 is tightly bonded to the components on the PCBA motherboard 1.

[0024] When needed, the PCBA motherboard 1 is first pre-treated to ensure that its surface is clean and free of impurities. Then, the encapsulating resin 401 is evenly applied to the surface of the PCBA motherboard 1 so that it adheres tightly to the components on the PCBA motherboard 1, forming a strong protective layer with good thermal conductivity, which protects the PCBA motherboard 1 and improves the heat dissipation effect on the components.

[0025] The thermally conductive resin 403 is made of the same material as the encapsulation resin 401, and the thermally conductive resin 403 is bonded to the upper surface of the chip 2.

[0026] A resin base 402 is installed on the upper side of the encapsulating resin 401. Then, thermally conductive resin 403 is applied to the upper surface of the chip 2. The chip 2 is protected by the resin base 402 and the thermally conductive resin 403. At the same time, the heat generated by the chip 2 can be quickly conducted. The inner side of the resin base 402 is filled by the thermally conductive resin 403 and the encapsulating resin 401, reducing the internal air content and preventing the heat generated by the chip 2 and electrical components from accumulating in the resin base 402, thereby improving the heat conduction effect.

[0027] A CG sheet 404 is installed on the top of the resin base 402. The CG sheet 404 and the resin base 402 are tightly fitted together, and the inner side of the resin base 402 is sealed by the CG sheet 404.

[0028] The CG sheet 404 forms a sealed structure on the inside of the resin base 402, preventing external dust and liquid from entering and damaging the chip 2 and components.

[0029] A thermally conductive ring 405 is attached to the outside of the resin base 402, and thermal grease is applied between the thermally conductive ring 405 and the resin base 402.

[0030] During use, the heat inside the resin base 402 is conducted outward through the heat-conducting ring 405, and the heat transfer efficiency between the two is improved by the applied thermal grease.

[0031] Heat dissipation fins 406 are installed on the outer side of the heat conduction ring bracket 405. The heat dissipation fins 406 are made of high thermal conductivity aluminum alloy.

[0032] After the heat is conducted away by the heat conduction ring 405, the overall heat dissipation area is increased by the heat dissipation fins 406. The heat dissipation fins 406, made of high thermal conductivity aluminum alloy, quickly disperse the heat into the surrounding air, further improving the heat dissipation effect and ensuring that the camera module can maintain a stable operating temperature even in high-temperature environments.

[0033] A resin top frame 407 is provided on the upper side of the resin base frame 402. A camera lens 408 is provided inside the resin top frame 407, and a heat dissipation ring 409 is installed on the outer side of the resin top frame 407.

[0034] When the camera is in use, the camera lens 408 is fixed and protected by the resin top bracket 407. At the same time, the heat dissipation ring 409 can assist in heat dissipation, dissipating some of the heat generated by the camera lens 408 during operation, reducing the accumulation of heat inside the module. This, together with the heat dissipation fins 406, provides multiple heat dissipation, ensuring that the camera module can operate stably and reliably in various complex environments, extending the service life of the camera module, and improving its working performance and stability.

[0035] Working principle: First, the PCBA motherboard 1 is pre-treated to ensure that its surface is clean and free of impurities. Then, the encapsulating resin 401 is evenly applied to the surface of the PCBA motherboard 1, so that it adheres tightly to the components on the PCBA motherboard 1, forming a strong protective layer with good thermal conductivity. Then, the thermally conductive resin 403 is applied to the upper surface of the chip 2, thereby protecting the chip 2 through the resin base 402 and the thermally conductive resin 403. At the same time, it can quickly conduct the heat generated by the chip 2. Furthermore, the thermally conductive resin 403 and the encapsulating resin 401 fill the inside of the resin base 402, reducing the internal air content and preventing the heat generated by the chip 2 and electrical components from accumulating in the resin base 402, thus improving the heat conduction effect.

[0036] During use, the heat absorbed by the resin base 402 is transferred to the heat dissipation fins 406 through the heat conduction ring 405. The heat dissipation fins 406, made of high thermal conductivity aluminum alloy, quickly disperse the heat into the surrounding air, further improving the heat dissipation effect and ensuring that the camera module can maintain a stable operating temperature even in high-temperature environments.

[0037] When the camera is in use, the camera lens 408 is fixed and protected by the resin top bracket 407. At the same time, the heat dissipation ring 409 can assist in heat dissipation, dissipating some of the heat generated by the camera lens 408 during operation, reducing the accumulation of heat inside the module. In conjunction with the heat dissipation fins 406, multiple heat dissipation is carried out to ensure that the camera module can operate stably and reliably in various complex environments.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted camera module structure that can solve the heat dissipation problem, comprising a PCBA motherboard (1), wherein a chip (2) is mounted at the center of the PCBA motherboard (1), and gold wires (3) are arranged on both sides of the chip (2), wherein the gold wires (3) are soldered to the PCBA motherboard (1), characterized in that: A fast heat conduction component (4) is provided on the upper side of the PCBA motherboard (1). The fast heat conduction component (4) includes an encapsulating resin (401) coated on the surface of the PCBA motherboard (1). A resin base (402) is installed on the upper side of the encapsulating resin (401). A thermally conductive resin (403) is provided on the inner side of the resin base (402).

2. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 1, characterized in that, The encapsulation resin (401) is made using a molding process. The encapsulation resin (401) is made of modified epoxy resin and contains aluminum nitride filler. The encapsulation resin (401) is tightly bonded to the components on the PCBA motherboard (1).

3. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 1, characterized in that, The thermally conductive resin (403) is made of the same material as the encapsulation resin (401), and the thermally conductive resin (403) is bonded to the upper surface of the chip (2).

4. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 1, characterized in that, A CG sheet (404) is installed at the top of the resin base (402). The CG sheet (404) is tightly fitted to the resin base (402), and the inner side of the resin base (402) is sealed by the CG sheet (404).

5. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 1, characterized in that, A heat-conducting ring (405) is attached to the outside of the resin base (402), and thermal grease is applied between the heat-conducting ring (405) and the resin base (402).

6. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 5, characterized in that, The heat-conducting ring (405) is equipped with heat dissipation fins (406) on its outer side, and the heat dissipation fins (406) are made of high thermal conductivity aluminum alloy.

7. The vehicle-mounted camera module structure that can solve the heat dissipation problem according to claim 1, characterized in that, A resin top frame (407) is provided on the upper side of the resin base frame (402), a camera lens (408) is provided inside the resin top frame (407), and a heat dissipation ring (409) is installed on the outer side of the resin top frame (407).

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