sound box

CN224746619UActive Publication Date: 2026-09-11HANGZHOU ROBAM APPLIANCES CO LTD
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Patent Information

Application Number
CN202522105043.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-09-11
Estimated Expiration
2035-09-29

AI Technical Summary

Technical Problem

[0003]本实用新型的目的在于提供一种音箱,以缓解现有的音箱中主板容易受热损坏的技术问题

Benefits of technology

本实用新型提供的音箱包括:外壳,以及位于所述外壳内部的主板、导热结构和压紧件,所述主板和压紧件均与所述外壳连接,所述导热结构位于所述主板和压紧件之间,所述压紧件用于将所述导热结构压紧在所述主板上。

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Abstract

The utility model provides a kind of sound box, it is related to the technical field of kitchen appliance, sound box includes: shell, and the mainboard, heat conduction structure and compression piece located in shell interior, mainboard and compression piece are connected with shell, heat conduction structure is located between mainboard and compression piece, compression piece is used to compress heat conduction structure on mainboard.
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Description

Technical Field

[0001] This utility model relates to the field of kitchen appliance technology, and in particular to a speaker. Background Technology

[0002] Due to structural space, size, and design limitations, smart cooking speakers often lack adequate heat dissipation space for electronic components. This can lead to high temperatures in key components such as the main chip, charging chip, and RF communication module on the motherboard, potentially causing the product to malfunction or become damaged. Utility Model Content

[0003] The purpose of this invention is to provide a speaker that can alleviate the technical problem of the motherboard in existing speakers being easily damaged by heat.

[0004] In a first aspect, the present invention provides a speaker, comprising: a shell, and a main board, a heat-conducting structure and a clamping member located inside the shell, wherein the main board and the clamping member are both connected to the shell, the heat-conducting structure is located between the main board and the clamping member, and the clamping member is used to press the heat-conducting structure onto the main board.

[0005] Furthermore, the motherboard has a heat dissipation device on the side facing the heat-conducting structure; The clamping member has a protruding structure on the side facing the heat-conducting structure. The protruding structure is directly opposite the device to be cooled and is used to press the heat-conducting structure toward the device to be cooled.

[0006] Furthermore, the motherboard has a device to be avoided on the side facing the heat-conducting structure, and the clamping member has a concave structure on the side facing the heat-conducting structure. The concave structure is directly opposite the device to be avoided, and is used to prevent the heat-conducting structure from squeezing the device to be avoided.

[0007] Furthermore, the clamping member is provided with a mounting groove that wraps around the top of the heat-conducting structure.

[0008] Furthermore, the outer shell includes an upper shell and a lower shell, which are connected vertically by threaded fittings; The clamping member is connected to the upper shell, and the main board is connected to the lower shell.

[0009] Furthermore, the side of the clamping member facing away from the heat-conducting structure is provided with a support protrusion, which abuts against the upper shell.

[0010] Furthermore, the number of the support protrusions is multiple.

[0011] Furthermore, the upper shell is provided with mounting posts for threaded connections; The clamping member is provided with a fixing hole sleeve that connects to the mounting column.

[0012] Furthermore, the inner diameter of the fixing hole sleeve is smaller than the outer diameter of the mounting post; The side wall of the fixing sleeve has a notch that runs through its upper and lower end faces.

[0013] Furthermore, the speaker also includes a button panel, and the vertical space between the clamping member and the upper shell accommodates the button panel.

[0014] This utility model has at least the following advantages or beneficial effects: The speaker provided by this utility model includes: a shell, and a main board, a heat-conducting structure and a clamping member located inside the shell. The main board and the clamping member are both connected to the shell. The heat-conducting structure is located between the main board and the clamping member. The clamping member is used to press the heat-conducting structure onto the main board.

[0015] After the speaker enclosure is formed, the clamping components press the heat-conducting structure firmly against the motherboard, ensuring full contact between the structure and the motherboard to absorb heat generated on the motherboard. This improves the motherboard's heat dissipation performance, reducing its temperature, enhancing the operational stability of components, and mitigating the issue of excessively high ambient temperatures around internal components. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 A schematic diagram of a speaker provided for an embodiment of this utility model; Figure 2 A diagram showing the connection between the upper and lower shells of a speaker provided for an embodiment of this utility model; Figure 3 for Figure 2 A schematic diagram showing the interior of the upper shell after an explosion. Figure 4 A schematic diagram of the clamping component of the speaker provided in an embodiment of this utility model; Figure 5 A top view of the clamping member of the speaker provided in an embodiment of this utility model.

[0018] Icons: 1000 - Top shell; 1002 - Button panel; 1003 - Data cable; 1004 - Clamping component; 1005 - Heat-conducting structure; 1006 - Mounting post; 2000 - Bottom shell; 2001 - Motherboard; 3-Fixing hole sleeve; 5-Protruding structure; 6-Concave structure; 7-Supporting protrusion. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] like Figure 1 and Figure 2 As shown, the speaker provided by this utility model includes: an outer shell, which is divided into an upper shell 1000 and a lower shell 2000. During assembly, the two shells are joined together and then connected by threaded parts (e.g., bolts).

[0026] like Figure 3 As shown, the upper shell 1000 contains a button panel 1002, a data cable 1003, a clamping component 1004, a heat-conducting structure 1005, etc. The heat-conducting structure 1005 is made of a flexible material with a thermal conductivity greater than that of air, such as a heat dissipation fin. The speaker, battery, motherboard 2001, charging board, etc., are assembled inside the lower shell 2000.

[0027] The keypad 1002 is assembled inside the upper housing 1000 and secured with screws. The keypad 1002 is electrically connected to the motherboard 2001 via a data cable 1003.

[0028] The upper shell 1000 is provided with a mounting post 1006 for threaded connection (e.g., bolt). After the upper shell 1000 and the lower shell 2000 are connected, the bolt is inserted from the bottom of the lower shell 2000 and then connected to the screw hole on the mounting post 1006 to achieve locking.

[0029] like Figure 2 and Figure 5 As shown, the clamping member 1004 is provided with a fixing sleeve 3 that connects to the mounting post 1006. The fixing sleeve 3 is fitted onto the outside of the mounting post 1006. To increase the connection strength between the fixing sleeve 3 and the mounting post 1006, the inner diameter of the fixing sleeve 3 is smaller than the outer diameter of the mounting post 1006. A notch is formed on the side wall of the fixing sleeve 3, penetrating its upper and lower end faces. During installation, the mounting post 1006 expands the portions on both sides of the notch outwards, thereby allowing the fixing sleeve 3 to tighten around the mounting post 1006, increasing friction.

[0030] The heat-conducting structure 1005 is covered by the groove at the bottom of the clamping member 1004 to position the heat-conducting structure 1005 and prevent it from moving laterally.

[0031] When the upper shell 1000 and the lower shell 2000 are combined, the heat-conducting structure 1005 is pressed firmly against the motherboard 2001 by the clamping member 1004. This allows the heat-conducting structure 1005 to fully contact the motherboard 2001 and absorb the heat generated on the motherboard 2001. This improves the heat dissipation performance of the motherboard 2001, thereby reducing the temperature of the motherboard 2001, improving the operational stability of the components on the motherboard 2001, and optimizing the problem of high ambient temperature around the internal components.

[0032] like Figure 4 As shown, the motherboard 2001 has a heat-dissipating device on the side facing the heat-conducting structure 1005. This heat-dissipating device is a major heat-generating device or a device easily affected by temperature. The clamping member 1004 has a protruding structure 5 on the side facing the heat-conducting structure 1005. The protruding structure 5 is directly opposite the heat-dissipating device. When the speaker is assembled, the protruding structure 5 presses the heat-conducting structure 1005 towards the heat-dissipating device, thereby further increasing the contact.

[0033] In contrast to the convex structure 5, the motherboard 2001 has a device to be avoided on the side facing the heat-conducting structure 1005, and the clamping member 1004 has a concave structure 6 on the side facing the heat-conducting structure 1005. Similarly, the device to be avoided on the motherboard 2001 is easily damaged by compression. Therefore, the concave structure 6 is used to form a clearance, so as to avoid the clamping member 1004 from applying excessive compressive force to the device to be avoided through the heat-conducting structure 1005.

[0034] The clamping member 1004 has a support protrusion 7 on the side facing away from the heat-conducting structure 1005, and the support protrusion 7 abuts against the upper shell 1000. Multiple support protrusions 7 provide support, enhance the overall strength of the clamping member 1004, and prevent the heat-conducting structure 1005 from failing to adhere tightly to the motherboard 2001 after deformation, thus rendering the heat-conducting structure 1005 ineffective. Furthermore, there are multiple support protrusions 7, which are evenly distributed.

[0035] Supported by the support protrusion 7, a gap is formed between the clamping member 1004 and the top plate of the upper shell 1000, and the keypad 1002 can be installed in the gap, which also facilitates the routing of the data cable 1003.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A speaker, characterized in that, include: The housing, and a main board (2001), a heat-conducting structure (1005), and a clamping member (1004) located inside the housing, the main board (2001) and the clamping member (1004) being connected to the housing, the heat-conducting structure (1005) being located between the main board (2001) and the clamping member (1004), and the clamping member (1004) being used to press the heat-conducting structure (1005) onto the main board (2001).

2. The speaker according to claim 1, characterized in that, The motherboard (2001) has a heat dissipation device on the side facing the heat conduction structure (1005); The clamping member (1004) has a protruding structure (5) on the side facing the heat-conducting structure (1005). The protruding structure (5) is directly opposite the heat-dissipating device and is used to press the heat-conducting structure (1005) toward the heat-dissipating device.

3. The sound box of claim 1, wherein, The motherboard (2001) has a device to be avoided on the side facing the heat-conducting structure (1005), and the clamping member (1004) has a concave structure (6) on the side facing the heat-conducting structure (1005). The concave structure (6) is directly opposite the device to be avoided and is used to prevent the heat-conducting structure (1005) from squeezing the device to be avoided.

4. The speaker according to claim 1, characterized in that, The clamping member (1004) is provided with an installation groove that wraps around the top of the heat-conducting structure (1005).

5. The sound box of claim 1, wherein, The outer shell includes an upper shell (1000) and a lower shell (2000), which are connected vertically by threaded parts; The clamping member (1004) is connected to the upper shell (1000), and the main board (2001) is connected to the lower shell (2000).

6. The sound box of claim 5, wherein, The clamping member (1004) has a support protrusion (7) on the side facing away from the heat-conducting structure (1005), and the support protrusion (7) abuts against the upper shell (1000).

7. The sound box of claim 6, wherein, The number of the support protrusions (7) is multiple.

8. The speaker according to claim 5, characterized in that, The upper shell (1000) is provided with a mounting post (1006) for threaded connection. The clamping member (1004) is provided with a fixing hole sleeve (3) that is connected to the mounting post (1006).

9. The speaker according to claim 8, characterized in that, The inner diameter of the fixing hole sleeve (3) is smaller than the outer diameter of the mounting post (1006); The fixing sleeve (3) has a notch on its side wall that extends through its upper and lower end faces.

10. The sound box of claim 5, wherein, The speaker also includes a keypad (1002), and the vertical space between the clamping member (1004) and the upper shell (1000) accommodates the keypad (1002).