Electrical connector, circuit board, backlight module and display device

Abstract

The embodiment of the present application provides an electrical connector, a circuit board, a backlight module and a display device, and relates to the technical field of display devices. The electrical connector is used for the circuit board. One side of the circuit board is provided with a copper foil layer. The copper foil layer comprises a plurality of copper foil conductors. The electrical connector comprises a film substrate and a conductive layer. The film substrate is insulatively arranged. The conductive layer is arranged on one side in the thickness direction of the film substrate and is used for electrically connecting at least part of the copper foil conductors of the circuit board. In the scheme of the embodiment, the electrical connector is composed of the film substrate and the conductive layer arranged on one side in the thickness direction of the film substrate. The thickness can be made thinner, and the problem of optical shadow can be effectively alleviated.

Description

Technical Field

[0001] This application relates to the technical field of display devices, specifically to an electrical connector, circuit board, backlight module, and display device. Background Technology

[0002] The thicker or taller the circuit board of a display device, the closer it is to the liquid crystal screen or optical film, which makes it easier for optical shadows to appear on the display screen.

[0003] To address the aforementioned issues, the first thought is to use a single-layer substrate and jumpers on that substrate to implement complex wiring. Compared to multi-layer boards, this effectively reduces the overall thickness of the circuit board and improves optical shadowing to some extent. However, the electrical connectors on display devices, especially the LED boards of Mini LED displays, are more prone to optical shadowing due to the large number of LEDs. Therefore, the single-layer substrate and jumpers on it may still cause optical shadowing issues in Mini LED displays. Utility Model Content

[0004] This application provides an electrical connector, a circuit board, a backlight module, and a display device, aiming to improve the optical shadow problem of existing display devices.

[0005] In a first aspect, embodiments of this application provide an electrical connector for a circuit board, one side of which is provided with a copper foil layer, the copper foil layer including a plurality of copper foil conductors, and the electrical connector comprising:

[0006] A thin film substrate, wherein the thin film substrate is provided with insulation; and,

[0007] A conductive layer is disposed on one side of the thin film substrate in the thickness direction for electrical connection with at least a portion of the copper foil conductors of the circuit board.

[0008] In some embodiments, the thin film substrate comprises a flexible thin film.

[0009] In some embodiments, the electrical connector further includes a reinforcing structure located on a thin film substrate.

[0010] In some embodiments, the reinforcing structure includes a reinforcing sheet.

[0011] In some embodiments, a first insulating layer is provided on the side of the conductive layer away from the thin film substrate;

[0012] The first insulating layer has through holes that expose the conductive layer.

[0013] In some embodiments, a first insulating layer is provided on the side of the conductive layer away from the thin film substrate;

[0014] The conductive layer extends at least partially beyond the first insulating layer.

[0015] In some embodiments, the conductive layer extends beyond both ends of the first insulating layer along its length.

[0016] In some embodiments, the conductive layer is provided in multiple layers, the multiple conductive layers are arranged at least partially spaced apart, the gaps between the multiple conductive layers are filled with insulating material, and the multiple conductive layers are electrically connected to each other; and / or,

[0017] The conductive layer is bonded to the thin film substrate with insulating adhesive.

[0018] Secondly, embodiments of this application provide a circuit board, the circuit board comprising:

[0019] A substrate layer, wherein a copper foil layer is coated thereon, and a plurality of copper foil conductors are formed thereon; and,

[0020] At least one electrical connector is disposed outside the copper foil layer for electrical connection with a plurality of copper foil conductors.

[0021] In some embodiments, the electrical connector includes a thin film substrate and a conductive layer, the thin film substrate being insulated; the conductive layer is disposed on one side of the thin film substrate in the thickness direction for electrical connection with at least a portion of the copper foil conductors of the circuit board.

[0022] In some embodiments, there is no electrical connection between the copper foil wires connected by the electrical connector within the copper foil layer.

[0023] In some embodiments, at least one copper foil wire that is not electrically connected to the electrical connector is included between the connection point of the electrical connector and the copper foil wire.

[0024] In some embodiments, a first insulating layer is provided on the side of the conductive layer away from the thin film substrate.

[0025] In some embodiments, the circuit board is a single-sided board.

[0026] In some embodiments, the circuit board further includes LEDs and a driver IC, all of which are mounted on the side of the circuit board with a copper foil layer and are electrically connected to the copper foil lines within the copper foil layer.

[0027] In some embodiments, the maximum thickness of the electrical connector is less than 350 μm; and / or,

[0028] The thickness of the conductive layer is 9–50 μm.

[0029] In some embodiments, the thin film substrate includes a flexible film with a thickness of 25–125 μm.

[0030] In some embodiments, the electrical connector includes a reinforcing plate with a thickness of 0.03–100 μm.

[0031] In some embodiments, the electrical connector includes a plurality of connecting portions and a conductive portion that conducts through the plurality of connecting portions, the connecting portions being used for electrical connection with the copper foil conductor;

[0032] The connecting part and the conductive part are integrated into one unit.

[0033] In some embodiments, the conductive portion extends outward along its width direction to form a plurality of extensions, the plurality of extensions being spaced apart.

[0034] In some embodiments, the two connecting portions of at least one of the electrical connectors are configured with different shapes.

[0035] In some embodiments, the outer surface of the electrical connector is white; and / or,

[0036] The outer surface of the electrical connector is frosted or mirrored.

[0037] Thirdly, embodiments of this application provide a backlight module, including any of the circuit boards described above.

[0038] Fourthly, embodiments of this application provide a display device including a backlight module as described above.

[0039] In this embodiment, the electrical connector consists of the thin-film substrate and a conductive layer disposed on one side of the thin-film substrate in the thickness direction. Compared to the metal tab solution, its thickness can be made thinner, allowing the circuit board using this electrical connector to have a thinner overall thickness or a lower overall height. Especially when applied to single-layer circuit boards, it can result in a thinner circuit board. Applying this circuit board to LED display devices, particularly MINI LED display devices, can effectively alleviate the problem of optical shadows. Furthermore, since the electrical connector is composed of a thin-film substrate and a conductive layer, compared to the metal tab solution, the thin-film substrate is softer and generally will not physically damage the solder mask layer of the circuit board substrate, even under heavy pressure. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of an existing metal swivel piece;

[0042] Figure 2 This is a structural diagram of the electrical connectors provided in this application during installation;

[0043] Figure 3 This is a schematic diagram of the structure of the first embodiment of the electrical connector provided in this application;

[0044] Figure 4 This is a schematic diagram of the structure of the second embodiment of the electrical connector provided in this application;

[0045] Figure 5 This is a structural schematic diagram of the third embodiment of the electrical connector provided in this application;

[0046] Figure 6 This is a structural schematic diagram of the fourth embodiment of the electrical connector provided in this application;

[0047] Figure 7 This is a structural schematic diagram of the fifth embodiment of the electrical connector provided in this application;

[0048] Figure 8 This is a structural schematic diagram of the sixth embodiment of the electrical connector provided in this application;

[0049] Figure 9 This is a structural schematic diagram of the seventh embodiment of the electrical connector provided in this application;

[0050] Figure 10 This is a schematic diagram of the structure of the eighth embodiment of the electrical connector provided in this application;

[0051] Figure 11 This is a structural schematic diagram of the ninth embodiment of the electrical connector provided in this application;

[0052] Figure 12 This is a structural schematic diagram of the tenth embodiment of the electrical connector provided in this application;

[0053] Figure 13 This is a schematic diagram of the eleventh embodiment of the electrical connector provided in this application;

[0054] Figure 14This is a schematic diagram of the structure of the twelfth embodiment of the electrical connector provided in this application;

[0055] Figure 15 This is a schematic diagram of the thirteenth embodiment of the electrical connector provided in this application;

[0056] Figure 16 This is a schematic diagram of the structure of the fourteenth embodiment of the electrical connector provided in this application;

[0057] Figure 17 This is a schematic diagram of the structural optical path of the fourteenth embodiment of the electrical connector provided in this application;

[0058] Figure 18 This is a schematic diagram of the structure of the fifteenth embodiment of the electrical connector provided in this application;

[0059] Figure 19 This is a schematic diagram of the structure of the sixteenth embodiment of the electrical connector provided in this application;

[0060] Figure 20 This is a schematic diagram of the structural optical path of the sixteenth embodiment of the electrical connector provided in this application;

[0061] Figure 21 This is a schematic diagram of the structure of the seventeenth embodiment of the electrical connector provided in this application;

[0062] Figure 22 This is a schematic diagram of the structural optical path of the seventeenth embodiment of the electrical connector provided in this application;

[0063] Figure 23 This is a schematic diagram of the structure of the first embodiment of the circuit board provided in this application.

[0064] Explanation of key component symbols:

[0065] 1 Metal clip 100 circuit board 10 Electrical connectors 11 Thin film substrate 12 conductive layer 13 Reinforcing sheet 50 insulating adhesive 15 First insulating layer 16 thin film layer 151 Through hole 21 Connection part 22 Conducting part 23 extension 30 Copper foil wire 40 Soldering Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0067] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0068] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0069] The use of "applies to" or "configured to" in this application implies open and inclusive language, which does not exclude the applicability to or configuration to devices performing additional tasks or steps. Additionally, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0070] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0071] The thicker or taller the circuit board of a display device, the closer it is to the liquid crystal screen or optical film, which makes it easier for optical shadows to appear on the display screen.

[0072] Please see Figure 1To solve the above problems, the first thought is to use a single-layer substrate and a common metal jumper 1 on the single-layer substrate to achieve complex wiring. Compared with the multi-layer board solution, it can effectively reduce the overall thickness of the circuit board and improve the optical shadow phenomenon to a certain extent. However, the electrical connectors of the circuit boards of current display devices, especially the circuit boards of MINI LED lamp boards, are more prone to optical shadow phenomena due to the large number of LEDs. The single-layer substrate and the common metal jumper 1 solution on the single-layer substrate may still produce optical shadow problems in MINI LED display devices.

[0073] For this, please refer to Figures 2 to 5 An embodiment of this application provides an electrical connector 10 for a circuit board 100. One side of the circuit board 100 is provided with a copper foil layer, and the copper foil layer includes a plurality of copper foil conductors 30. The electrical connector 10 includes a thin film substrate 11 and a conductive layer 12. The thin film substrate 11 is insulated. The conductive layer 12 is disposed on one side of the thin film substrate 11 in the thickness direction and is used for electrical connection with at least a portion of the copper foil conductors 30 of the circuit board 100.

[0074] It should be noted that the electrical connector 10 refers to a connecting line at least partially located outside the substrate of the circuit board 100. It can be integrally attached to the substrate of the circuit board 100, or at least partially spaced from the substrate; this is not limited here. The circuit board 100 can be a single-layer board or a multi-layer board; this is not limited here. The specific formation method of the conductive layer 12 is not limited. It can be a copper foil layer disposed on the thin film substrate 11, or the conductive layer 12 can be imprinted on the thin film substrate 11 using an imprinting technique. Specifically, the conductive layer 12 can be a copper layer, a silver layer, etc.; this is not limited here. The specific implementation form of the thin film substrate 11 is not limited. It can be in the form of a PI film (polyimide film), a PET (polyethylene terephthalate) film, a BT (bismaleimide triazine resin) film, etc.; this is not limited here. The thin film substrate 11 is insulated. It can be made of insulating material or it can be made of non-insulating material and then subjected to insulation treatment, such as coating an insulating layer on the outer surface of a non-insulating material, etc. There is no limitation here.

[0075] Please see Figure 1Currently, the electrical connectors 10 of the circuit board 100 are generally made of a metal jumper piece, which is relatively thick, generally greater than 0.5mm. In use, due to its height, it will cause optical shadows. Furthermore, if the height is reduced, the metal jumper piece may physically damage the solder mask layer of the substrate under heavy pressure, resulting in defects such as micro-short circuits.

[0076] In this embodiment, the electrical connector 10 is composed of the thin film substrate 11 and a conductive layer 12 disposed on one side of the thin film substrate 11 in the thickness direction. Compared to a single metal tab, its thickness can be made thinner, allowing the circuit board 100 using the electrical connector 10 to have a thinner overall thickness or a lower overall height. Especially when applied to a single-layer circuit board 100, a thinner circuit board 100 can be obtained. Applying this circuit board 100 to LED display devices, particularly MINI LED display devices, can effectively alleviate the problem of optical shadows. Furthermore, since the electrical connector 10 is composed of a thin film substrate 11 and a conductive layer 12, compared to a single metal tab, the thin film substrate 11 is softer and generally will not physically damage the solder mask layer of the circuit board 100 substrate, even under heavy pressure.

[0077] It is understandable that the maximum thickness of the electrical connector 10 cannot be too large. Otherwise, when the electrical connector 10 is placed on the substrate of the circuit board 100, it will have a significant impact on the overall thickness or height of the circuit board 100 and may also lead to light and shadow phenomena.

[0078] In some embodiments, the thin film substrate 11 includes a flexible thin film.

[0079] Specifically, the form of the flexible film is not limited; it can be a PI film or other flexible insulating films, such as polyester film, etc., and is not limited here.

[0080] In this embodiment, by setting the thin film substrate 11 as a flexible film, since the flexible film is soft, even if it is pressed down, it will not damage the solder resist layer of the substrate of the circuit board 100, thus effectively avoiding the short circuit caused by the solder resist layer of the substrate.

[0081] In some embodiments, the electrical connector 10 further includes a reinforcing structure located on the thin film substrate 11.

[0082] In this embodiment, by providing the reinforcing structure, the strength of the thin film substrate 11 can be increased at least, effectively avoiding the phenomenon of soft collapse and adhesion between the middle of the thin film substrate 11 and the circuit board 100 when it is mounted on the circuit board 100.

[0083] Furthermore, in some embodiments, the flexible film includes a PI film, and the reinforcing structure is disposed at least in the middle of the film substrate 11 along its length direction to at least increase the strength of the middle of the film substrate 11.

[0084] It should be noted that PI film is currently widely used in various fields, so it is easy to obtain, has low cost, and is relatively soft, so it will not cause physical damage to the substrate bonding layer when pressed.

[0085] Therefore, in this embodiment, PI film is used as the flexible film. However, PI film itself is relatively soft. If the length of the electrical connector 10 is long, the middle of the electrical connector 10 is prone to collapse and stick to the substrate of the circuit board 100. Once sticking occurs, the heat of the electrical connector 10 itself is easily transferred to the circuit board 100, or the electrical connector 10 is easily heated by the circuit board 100, affecting heat dissipation and the long-term stability of the circuit board 100.

[0086] Therefore, in this embodiment, by providing the reinforcing structure, and by providing the reinforcing structure at least in the middle of the electrical connector 10 along its length, the strength of the middle part of the electrical connector 10 can be increased at least, effectively avoiding the phenomenon of the middle part collapsing and basically sticking to the circuit board 100 when the electrical connector 10 is installed on the circuit board 100.

[0087] Specifically, the specific implementation of the reinforcing structure is not limited. It can be that a reinforcing sheet 13 is provided on the flexible film, such as coating it with some hard material, or adding some metal reinforcing sheets 13, etc. There is no limitation here.

[0088] In some embodiments, the reinforcing structure includes a reinforcing sheet 13.

[0089] In the scheme of this embodiment, by setting the reinforcing structure as a reinforcing sheet 13, the reinforcing sheet 13 can be directly placed on the thin film substrate 11 during the manufacturing process, which simplifies the manufacturing process.

[0090] In some further embodiments, please refer to Figures 5 to 8The reinforcing sheet 13 is disposed on the side of the thin film substrate 11 away from the conductive layer 12. In this embodiment, by disposing the reinforcing sheet 13 on the side of the thin film substrate 11 away from the conductive layer 12, the strength of the flexible film can be enhanced by the reinforcing sheet 13. Furthermore, the reinforcing sheet 13 and the conductive layer 12 are disposed on opposite sides of the thin film substrate 11, which can prevent mutual interference between the two.

[0091] Furthermore, in the actual production process, the reinforcing sheet 13 is first set on the thin film substrate 11, which can effectively improve the flatness problem of PI film such as warping, so that the conductive layer 12 can be better set on the thin film substrate 11.

[0092] Please see Figure 9 In some further embodiments, the reinforcing sheet 13 is disposed between the conductive layer 12 and the thin film substrate 11.

[0093] In this embodiment, the reinforcing sheet 13 is disposed between the conductive layer 12 and the thin film substrate 11. This can effectively improve the flatness problem of the PI film, such as warping, during the actual production and manufacturing process, thereby enabling the conductive layer 12 to be better disposed on the thin film substrate 11.

[0094] It should be noted that there may be only one reinforcing sheet 13. For example, it may be disposed on the side of the thin film substrate 11 away from the conductive layer 12, or it may be disposed between the conductive layer 12 and the thin film substrate 11. There may be multiple reinforcing sheets 13, which is not limited here.

[0095] Please see Figure 5 In some embodiments, the reinforcing structure includes a reinforcing sheet 13, and along the thickness direction of the electrical connector 10, the projection of the conductive layer 12 on the thin film substrate 11 falls within the projection of the reinforcing sheet 13.

[0096] It should be noted that when the first reinforcing piece 13 and / or the second reinforcing piece 13 are provided, the reinforcing piece 13 can be either the first reinforcing piece 13 or the second reinforcing piece 13, or it can be a collective term for both, which is not limited here.

[0097] In the scheme of this embodiment, along the thickness direction of the electrical connector 10, the projection of the conductive layer 12 on the thin film substrate 11 falls within the projection of the reinforcing sheet 13. That is, the reinforcing sheet 13 can unfold the thin film substrate 11 for the installation of the conductive layer 12, thereby effectively improving the flatness problems such as warping of the installation area of ​​the conductive layer 12.

[0098] Specifically, the projections of the reinforcing sheet 13 and the conductive layer 12 can completely overlap. In this case, the reinforcing sheet 13 requires less material and has a better effect on improving flatness. Of course, the area of ​​the reinforcing sheet 13 can also be larger than the area of ​​the conductive layer 12, which is not limited here.

[0099] It is understandable that the thickness of the reinforcing plate 13 cannot be too thin, otherwise the reinforcement effect will be poor and the central part will easily collapse. It also cannot be too thick, otherwise it will easily lead to optical shadows. Therefore, in some embodiments, the thickness of the reinforcing plate 13 is 0.03 to 100 μm. Correspondingly, the thickness of the reinforcing plate 13 is greater than or equal to 0.03 μm to ensure its reinforcement effect, while the thickness of the reinforcing plate 13 is less than or equal to 100 μm to avoid the phenomenon of optical shadows caused by making the electrical connector 10 too thick due to the setting of the reinforcing plate 13.

[0100] Please see Figure 5 , Figure 7 , Figures 9 to 15 In some embodiments, a first insulating layer 15 is disposed on a layer of the conductive layer 12 away from the thin film substrate 11.

[0101] In the solution of this embodiment, by setting the first insulating layer 15, on the one hand, the conductive layer 12 can be insulated to prevent leakage, or to conduct electricity to other components; on the other hand, the conductive layer 12 can be sealed to prevent oxidation.

[0102] In a further embodiment, the first insulating layer 15 has a through hole 151 that exposes the conductive layer 12. With this configuration, during electrical connection, the conductive end of the copper foil wire 30 can be inserted into the through hole 151 to make an electrical connection with the conductive layer 12, or the copper foil wire 30 can be soldered 40 through the through hole 151, resulting in good connection stability.

[0103] In a further embodiment, the conductive layer 12 extends at least partially beyond the first insulating layer 15. With this configuration, the portion of the conductive layer 12 located outside the first insulating layer 15 can be directly connected to the copper foil wire 30, making the connection method simpler.

[0104] Specifically, the specific implementation of the first insulating layer 15 is not limited. It can be a ceramic insulating layer, which can increase the strength of the electrical connector 10 while providing insulation. It can also be coated with TPI adhesive, or it can be a solder resist layer, etc. There are no limitations here.

[0105] Of course, in some embodiments, the conductive layer 12 may extend beyond both ends of the first insulating layer 15 along its length to expose both ends of the conductive layer 12 along its length. In this way, during the electrical connection process, the two ends of the conductive layer 12 along its length can be directly contacted with the copper foil wire 30, or soldered 40, to complete the electrical connection, which is simple and convenient.

[0106] The conductive layer 12 can be a single layer or multiple layers; this is not limited here. Please refer to [link / reference]. Figure 13 and Figure 14 In some embodiments, the conductive layer 12 is provided in multiple layers, the multiple conductive layers 12 are arranged at least partially spaced apart, the gaps between the multiple conductive layers 12 are filled with insulating material, and the multiple conductive layers 12 are electrically connected to each other.

[0107] It should be noted that in some scenarios, large-capacity transmission is required. In such cases, the requirements for the conductive layer 12 are higher, and a thicker conductive layer 12 is needed for conduction. If a single-layer conductive layer 12 is used for transmission, the thickness of the conductive layer 12 is too large, which makes it prone to warping and causes stress concentration, resulting in lower long-term stability of the electrical connector 10.

[0108] In this embodiment, by setting multiple interconnected conductive layers 12, the warping phenomenon caused by a single conductive layer 12 is avoided, and the needs of high-capacity transmission can be well met. Furthermore, the gaps between the multiple conductive layers 12 are filled with insulating material, which can effectively relieve stress.

[0109] In some embodiments, the conductive layer 12 is bonded to the thin film substrate 11 by an insulating adhesive 50. (See also...) Figure 5 During the manufacturing process, an insulating adhesive 50 can be coated onto the thin film substrate 11, and then the conductive layer 12 can be pressed into the insulating adhesive 50, thereby achieving the connection between the conductive layer 12 and the thin film substrate 11. This setup simplifies production and processing, and also allows the insulating adhesive 50 to seal the conductive layer 12, preventing oxidation. Please refer to [link to relevant documentation]. Figure 15 Alternatively, the conductive layer 12 and the thin film substrate 11 can be separated by the insulating adhesive 50.

[0110] Please see Figure 23 The present invention also proposes a circuit board 100, which includes a substrate layer and at least one electrical connector 10. The substrate layer is covered with a copper foil layer, and a plurality of copper foil conductors 30 are formed on the copper foil layer. The electrical connector 10 is disposed outside the copper foil layer and is used for electrical connection with the plurality of copper foil conductors 30.

[0111] It should be noted that the electrical connector 10 can be any of the electrical connectors 10 described above, or it can be in the form of a special metal jumper piece, such as an ultra-thin metal jumper piece, a metal jumper piece with a special shape, etc., which is not limited here.

[0112] In the scheme of this embodiment, the circuit board 100 includes a substrate layer and at least one electrical connector 10. By using the electrical connector 10 for external wiring, the overall thickness of the circuit board 100 can be reduced, thereby reducing the material cost of the circuit board 100. Furthermore, it can improve the phenomenon of optical shadows to a certain extent.

[0113] Furthermore, in some embodiments, the electrical connector 10 may be any of the electrical connectors 10 described above, that is, the electrical connector 10 includes a thin film substrate 11 and a conductive layer 12, the thin film substrate 11 being insulated; the conductive layer 12 is disposed on one side of the thin film substrate 11 in the thickness direction and is used to electrically connect with at least a portion of the copper foil conductors 30 of the circuit board 100.

[0114] With this configuration, the electrical connector 10 consists of the thin film substrate 11 and a conductive layer 12 disposed on one side of the thin film substrate 11 in the thickness direction. Compared to a single metal tab, its thickness can be made thinner, thus allowing the circuit board 100 using the electrical connector 10 to be thinner overall. Correspondingly, the thinner overall thickness of the circuit board 100, when applied to LED display devices, especially MINI LED display devices, can effectively alleviate the problem of optical shadows. Furthermore, since the electrical connector 10 is composed of a thin film substrate 11 and a conductive layer 12, compared to a single metal tab, the thin film substrate 11 is softer and generally will not physically damage the solder mask layer of the circuit board 100 substrate, even under heavy pressure.

[0115] In some embodiments, the copper foil wires 30 connected by the electrical connector 10 are not electrically connected within the copper foil layer. With this configuration, by setting the electrical connector 10, the copper foil wires 30 that were not electrically connected in the original substrate layer can be electrically connected. On the one hand, the circuit board 100 can be made thinner, saving materials. On the other hand, the design difficulty of the circuit board 100 can be reduced.

[0116] In some embodiments, the connection between the electrical connector 10 and the copper foil conductor 30 includes at least one copper foil conductor 30 that is not electrically connected to the electrical connector 10.

[0117] It should be noted that, since the connection between the electrical connector 10 and the copper foil conductor 30 includes at least one copper foil conductor 30 that is not electrically connected to the electrical connector 10, if the electrical connector 10 is not provided, then multiple copper foil conductors 30 can only be placed in different copper foil layers of the circuit board 100, or an additional insulating layer and copper foil layer can be provided on the circuit board 100 to prevent the connection line from being connected to the copper foil conductor 30 at the connection between the electrical connector 10 and the copper foil conductor 30.

[0118] In this embodiment, by setting the jumper, the circuit board 100, which originally required a multi-layer design, can be changed to a single-layer design, or in other words, the number of design layers of the circuit board 100 can be reduced, effectively reducing the thickness and cost of the circuit board 100.

[0119] Please see Figure 5 , Figure 7 , Figures 9 to 15 In some embodiments, a first insulating layer 15 is disposed on a layer of the conductive layer 12 away from the thin film substrate 11.

[0120] In the solution of this embodiment, by setting the first insulating layer 15, on the one hand, the conductive layer 12 can be insulated to prevent leakage, or to conduct electricity to other components; on the other hand, the conductive layer 12 can be sealed to prevent oxidation.

[0121] Furthermore, by providing the first insulating layer 15, insulation can be provided between the electrical connector 10 and the copper foil wire 30 at the connection between the electrical connector 10 and the copper foil wire 30.

[0122] In some embodiments, the circuit board 100 is a single-sided board. By setting the circuit board 100 as a single-sided board, the thickness and cost of the circuit board 100 can be effectively reduced.

[0123] Furthermore, the circuit board 100 includes a substrate, the copper foil layer is formed on the surface of the substrate, the circuit board 100 has only one substrate, and the substrate has only one layer of the copper foil layer.

[0124] In the scheme of this embodiment, the circuit board 100 is provided with only one substrate, and the substrate is provided with only one copper foil layer. That is, the circuit board 100 is a single-layer board. By using a single-layer board and the electrical connector 10 provided in the above embodiment, the overall thickness of the circuit board 100 can be made thinner. When applied to ultra-thin display devices, it can effectively solve the problem of optical shadows.

[0125] Specifically, the substrate is an aluminum substrate.

[0126] In some embodiments, the circuit board 100 further includes LED lights and driver ICs, all of which are mounted on the side of the circuit board 100 with a copper foil layer and are electrically connected to the copper foil lines within the copper foil layer.

[0127] In this embodiment, the circuit board 100 also includes LED lights and a driver IC, so that the circuit board 100 can be used as an LED light board in LED display products, which can effectively solve optical shadows and reduce costs.

[0128] In some embodiments, the LED light includes a mini LED backlight panel.

[0129] It should be noted that the MINI LED backlight panel has more LEDs, making it more prone to optical shadows. Therefore, using the electrical connector 10 provided in this application can effectively avoid the problem of optical shadows, resulting in better application performance.

[0130] In some embodiments, the maximum thickness of the electrical connector 10 is less than 350 μm. In this embodiment, by setting the maximum thickness of the electrical connector 10 to less than 350 μm, compared to the current thickness of more than 500 μm, the thickness is reduced by more than 150 μm. When using this electrical connector 10 in an LED backlight panel, the distance between the electrical connector 10 and the optical film or liquid crystal screen is also increased by more than 150 μm, thereby effectively alleviating the problem of optical shadows.

[0131] Please see Figure 3 and Figure 4 In a further embodiment, the electrical connector 10 may consist only of the thin film substrate 11 and the conductive layer 12. In this case, the thickness of the thin film substrate 11 can be controlled within the range of 25 to 125 μm, and the thickness of the conductive layer 12 can be controlled within the range of 9 to 35 μm. Thus, the thickness of the electrical connector 10 can be controlled within the range of 34 to 160 μm, resulting in the thinnest overall thickness and the best effect in mitigating optical shadows.

[0132] It should be emphasized that the thickness of the thin film substrate 11 is not limited and can be any value less than 500um, such as 100um, 200um, etc., and is not limited here.

[0133] In some embodiments, the thin film substrate 11 includes a flexible film with a thickness of 25–125 μm.

[0134] Specifically, the form of the flexible film is not limited; it can be a PI film or other flexible insulating films, such as polyester film, etc., and is not limited here.

[0135] It is understandable that the thickness of the flexible film cannot be too thin. If it is too thin, the overall strength will be too weak, and it will be easily deformed or torn. Therefore, the thickness of the flexible film is greater than or equal to 25 μm, so as to ensure that the overall strength of the electrical connector 10 is not too low and will not be easily torn. However, the thickness of the flexible film cannot be too thick either, otherwise it will affect the overall thickness of the electrical connector 10, thus causing the problem of optical shadows.

[0136] Please refer to this carefully. Figures 10 to 12 In some embodiments, the thin film substrate 11 includes a BT film or a BT-like film, such as an ABF material film, and the first insulating layer 15 includes a solder resist layer. Corresponding to the solution in this embodiment, since the thin film substrate 11 includes a BT film or a BT-like film, and the BT film or BT-like film itself has a certain strength, when it is made into an electrical connector 10, even without a reinforcing structure, there will be no central collapse. Therefore, the reinforcing structure can be omitted, resulting in a smaller overall thickness and better overall performance of the electrical connector 10.

[0137] Please refer to this carefully. Figure 15 In some embodiments, the first insulating layer 15 includes an insulating adhesive 50, and a thin film layer 16 is also provided on the side of the first insulating layer 15 away from the conductive layer 12.

[0138] In the solution of this embodiment, by setting the thin film layer 16, on the one hand, the toughness of the electrical connector 10 can be enhanced, and the phenomenon of short circuit of other components due to the exposure of the conductive layer 12 can be effectively avoided. On the other hand, it can also improve the anti-oxidation effect of the conductive layer 12.

[0139] It should be emphasized that the thickness of the conductive layer 12 should not be too thick, as this can easily lead to stress concentration and warping of the conductive layer 12. Nor should it be too thin, as this will result in excessive resistance and heat generation, which will not meet the requirements for transmission.

[0140] Therefore, in some embodiments, the thickness of the conductive layer 12 is 9 to 50 μm. In the scheme of this embodiment, the thickness of the conductive layer 12 is greater than or equal to 9 μm to ensure that its resistance is not too small and can meet certain transmission requirements. The thickness is less than or equal to 50 μm to avoid the phenomenon of warping of the conductive layer 12 due to excessive thickness.

[0141] The shape of the electrical connector 10 is not limited; it can be a regular elongated shape or other shapes, such as an I-shaped shape, etc., and is not limited here.

[0142] Please see Figure 16 and 17 In some embodiments, the electrical connector 10 is arranged in a long strip shape. This arrangement makes the manufacturing process the simplest and the cost the lowest. Correspondingly, when the OD distance is greater than 3mm, the use of this electrical connector 10 makes it less likely to cause optical shadows due to the large OD distance, thus enabling it to be adapted to some thinner display devices.

[0143] Please see Figures 18 to 22 In some embodiments, the electrical connector 10 includes a plurality of connecting portions 21 and a conductive portion 22 that conducts the plurality of connecting portions 21. The connecting portions 21 are used for electrical connection with the copper foil conductor 30. The connecting portions 21 and the conductive portion 22 are integrally formed.

[0144] It should be noted that the electrical connector 10 can be any of the electrical connectors 10 described above, or it can be in the form of a special metal jumper piece, such as an ultra-thin metal jumper piece, a metal jumper piece with a special shape, etc., which is not limited here.

[0145] It should be noted that when the thin film substrate 11 and the conductive layer 12 are included, the conductive part 22 and the connecting part 21 may be formed by the conductive layer 12, or the thin film substrate 11 and the conductive layer 12 may be formed together, and no limitation is made here.

[0146] In this embodiment, by integrating the connecting part 21 and the conductive part 22, the connection strength between the two can be improved.

[0147] In some embodiments, the minimum width of the connecting portion 21 is greater than the minimum width of the conductive portion 22.

[0148] In the scheme of this embodiment, by minimizing the width of the connecting part 21, the coverage area of ​​the electrical connector 10 can be made smaller. When the OD is slightly smaller, for example, 2-3mm, the phenomenon of optical shadows is not easy to occur, thus making it suitable for some ultra-thin display devices. On the other hand, the width of the connecting part 21 is larger, so that more area can be electrically connected to the copper foil wire 30, improving the stability of the connection.

[0149] Please see Figures 19 to 22 Furthermore, in some embodiments, the conductive portion 22 extends outward on both sides along its width direction to form a plurality of extension portions 23, and the plurality of extension portions 23 are arranged at intervals.

[0150] In the scheme of this embodiment, by providing the extension 23, the extension 23 can refract or reflect light, thereby spreading the light in all directions, effectively avoiding the occurrence of optical shadows. Furthermore, it can be adapted to some display devices with smaller OD, improving the display effect of ultra-thin display devices.

[0151] Specifically, the shape of the extension 23 is not limited. In some embodiments, the outer contour of the extension 23 is arc-shaped. With this design, the arc-shaped extension 23 can diffuse light more evenly. Even when applied to display devices with ultra-short OD, such as display devices with an OD value of 0 to 2 mm, it is not easy to produce optical shadows.

[0152] Please see Figure 19 and Figure 20 Of course, in some embodiments, the extension 23 is arranged in a triangular shape. Corresponding to the solution in this embodiment, the extension 23 is arranged in a triangular shape, which can weaken the regularity of the structure on the optical path and thus eliminate the shadow at the boundary.

[0153] Of course, other shapes are also possible, such as rectangles, ovals, etc., and there are no restrictions here.

[0154] In addition, the minimum width of the conductive part 22 cannot be too small, otherwise it is easy to have excessive partial pressure and local high temperature. Therefore, in some embodiments, the minimum width of the conductive part 22 is greater than 0.2 mm. With this setting, the overall width of the conductive part 22 is larger, which can avoid the phenomenon of local high temperature.

[0155] The connecting part 21 needs to be electrically connected to the copper foil conductor 30 of the circuit board 100. Correspondingly, the area of ​​the connecting part 21 cannot be too small, otherwise the connection stability will be poor. Therefore, in some embodiments, the length of the connecting part 21 is greater than 0.5mm. This setting can effectively increase the area of ​​the connecting part 21 and ensure the stability of the electrical connection.

[0156] It should be noted that the specific color of the electrical connector 10 is not limited. In some embodiments, the thin film substrate 11 is in the form of a PI film and the conductive layer 12 is in the form of a copper layer. In this combination, the electrical connector 10 is yellow. In some display devices, where optical films such as reflectors are provided, yellow electrical connectors 10 can be used directly.

[0157] In some embodiments, the shapes of the two connecting portions 21 in at least one of the electrical connectors 10 are different, that is, the shape of at least one connecting portion 21 in the same electrical connector 10 is different from that of the other connecting portions 21, so as to adapt to the electrical connection of various copper foil wires 30 on the circuit board 100.

[0158] Of course, in some embodiments, the outer surface of the electrical connector 10 is white. In this case, white can reflect light and improve the uniformity of the emitted light. This is especially true in some display devices without reflective sheets, where it can further improve the light efficiency.

[0159] Specifically, the implementation of the white outer surface of the electrical connector 10 is not limited. It can be achieved by coating the outer surface of the electrical connector 10 with a white ink layer, by bonding white material to the outer surface of the electrical connector 10, or by directly using a white thin film substrate 11, etc., and is not limited here.

[0160] The form of the outer surface of the electrical connector 10 is not limited. In some embodiments, the outer surface of the electrical connector 10 is frosted. The frosted surface can diffuse light, and its application in display devices can prevent glare and is more eye-friendly to users.

[0161] Of course, in some other embodiments, the outer surface of the electrical connector 10 is mirrored. The mirrored surface can better reflect light, make the image clearer, and improve the light effect.

[0162] This utility model also proposes a backlight module, which includes a circuit board 100. The specific structure of the circuit board 100 is as described in the above embodiments. Since this backlight module adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0163] This utility model also proposes a display device, which includes a backlight module. The specific structure of the backlight module is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0164] Specifically, the specific implementation of the display device is not limited. It can be a television, a computer screen, an in-vehicle display device, a flexible display device, a wearable display device, etc. There is no limitation here. In some embodiments, the display device includes a television.

[0165] The electrical connectors, circuit boards, backlight modules, and display devices provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electrical connector, characterized by For use in circuit boards, one side of the circuit board is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil conductors, and the electrical connector includes: A thin film substrate, wherein the thin film substrate is provided with insulation; and, A conductive layer is disposed on one side of the thin film substrate in the thickness direction for electrical connection with at least a portion of the copper foil conductors of the circuit board.

2. An electrical connector as claimed in claim 1, wherein The thin film substrate includes a flexible thin film.

3. The electrical connector as described in claim 2, characterized in that, The electrical connector also includes a reinforcing structure located on the thin film substrate.

4. An electrical connector as claimed in claim 3, wherein the electrical connector is a plug connector. The reinforcing structure includes a reinforcing sheet.

5. The electrical connector of claim 1, wherein, A first insulating layer is provided on the side of the conductive layer away from the thin film substrate; The first insulating layer has through holes that expose the conductive layer.

6. The electrical connector of claim 1, wherein, A first insulating layer is provided on the side of the conductive layer away from the thin film substrate; The conductive layer extends at least partially beyond the first insulating layer.

7. The electrical connector as described in claim 6, characterized in that, The conductive layer extends beyond both ends of the first insulating layer along its length.

8. The electrical connector of claim 1, wherein, The conductive layer is provided in multiple layers, the multiple conductive layers are arranged at least partially spaced apart, the gaps between the multiple conductive layers are filled with insulating material, and the multiple conductive layers are electrically connected to each other; and / or The conductive layer is bonded to the thin film substrate with insulating adhesive.

9. A circuit board, characterized in that, The circuit board includes: A substrate layer, wherein a copper foil layer is coated thereon, and a plurality of copper foil conductors are formed thereon; and, At least one electrical connector is disposed outside the copper foil layer for electrical connection with a plurality of copper foil conductors.

10. The circuit board of claim 9, wherein, The electrical connector includes a thin film substrate and a conductive layer. The thin film substrate is insulated. The conductive layer is disposed on one side of the thin film substrate in the thickness direction and is used for electrical connection with at least a portion of the copper foil conductors of the circuit board.

11. The circuit board of claim 9, wherein, There is no electrical connection between the copper foil wires connected by the electrical connector within the copper foil layer.

12. The circuit board as described in claim 9, characterized in that, The connection between the electrical connector and the copper foil conductor includes at least one copper foil conductor that is not electrically connected to the electrical connector.

13. The circuit board as described in claim 10, characterized in that, A first insulating layer is provided on the side of the conductive layer away from the thin film substrate.

14. The circuit board as described in claim 9, characterized in that, The circuit board is a single-sided board.

15. The circuit board of claim 9, wherein, The circuit board also includes LED lights and driver ICs. The LED lights and driver ICs are all mounted on the side of the circuit board with a copper foil layer and are electrically connected to the copper foil lines in the copper foil layer.

16. The circuit board of claim 10, wherein, The maximum thickness of the electrical connector is less than 350 μm; and / or, The thickness of the conductive layer is 9–50 μm.

17. The circuit board of claim 10, wherein, The thin film substrate includes a flexible thin film with a thickness of 25–125 μm.

18. The circuit board of claim 9 or 17, wherein, The electrical connector includes a reinforcing plate with a thickness of 0.03–100 μm.

19. The circuit board of claim 9, wherein, The electrical connector includes multiple connecting parts and a conductive part that conducts through the multiple connecting parts, the connecting parts being used for electrical connection with the copper foil conductor; The connecting part and the conductive part are integrally formed.

20. The circuit board of claim 19, wherein, The conductive portion extends outward along its width to form multiple extension portions, which are spaced apart.

21. The circuit board of claim 19, wherein, At least one of the electrical connectors has two connectors with different shapes.

22. The circuit board as described in claim 9, characterized in that, The outer surface of the electrical connector is white; and / or, The outer surface of the electrical connector is frosted or mirrored.

23. A backlight module, comprising: A circuit board comprising any one of claims 9 to 22.

24. A display device comprising: A backlight module comprising claim 23.

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