Circuit board with enhanced adhesive strength
Patent Information
- Application Number
- CN202521988799.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-16
AI Technical Summary
尽管液态树脂在初始状态下具备一定的附着力，可在固化前粘附于导体表面，但在后续切割和研磨过程中以及使用过程中，由于机械应力或界面结合强度不足，薄绝缘层容易与槽孔侧壁发生分层或脱落，影响线路板的可靠性和产品质量
Smart Images
Figure CN224746696U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical equipment technology, and in particular to a circuit board that enhances bonding strength. Background Technology
[0002] The main processes used in manufacturing circuit boards include the following steps:
[0003] First, conductor 1 is cut into a predetermined shape, and the required slot 4 is machined, such as... Figure 1 As shown in (a); then as Figure 1 As shown in (b), the formed slots 4 are filled with insulating material 2—usually liquid resin, which is injected into the slots by printing or spraying. After being completely filled, it is cured into a solid state. An ink layer 3 is printed on the outside of the entire composite structure of conductor 1 and insulating material 2, forming a structure as shown in (b). Figure 1 The circuit board shown in (c); finally, as shown in... Figure 1 As shown in (d), the insulating material 2 is cut to remove the excess part, leaving only a thin layer of insulating layer 5 bonded to the side wall of the slot 4.
[0004] The longitudinal section of the finished circuit board is as follows Figure 1 As shown in (e), the main problem with this structure is the insufficient adhesion between the insulating layer 5 and the sidewall of the slot 4, especially in the gold finger section of the circuit board, where the longitudinal section is shown in Figure 4. Figure 2 As shown in (a), the cross-section is as follows Figure 2 As shown in (b). Although the liquid resin has a certain adhesion in its initial state and can adhere to the conductor surface before curing, during subsequent cutting and grinding processes and during use, due to mechanical stress or insufficient interfacial bonding strength, the thin insulating layer is prone to delamination or detachment from the slot sidewalls, affecting the reliability of the circuit board and product quality. Utility Model Content
[0005] The technical problem to be solved by this utility model is to propose a circuit board with enhanced bonding strength that can prevent the insulation layer from delaminating or falling off from the conductor, in light of the above-mentioned technical status.
[0006] The technical solution adopted by this utility model to solve the above-mentioned technical problems is: a circuit board with enhanced bonding strength, comprising...
[0007] The conductor has multiple slots with openings facing the sides along its side edges;
[0008] An insulating layer is bonded to the sidewall of the slot in the conductor;
[0009] An ink layer covers the upper and lower surfaces of the composite structure formed by the conductor and the insulating layer;
[0010] Its features are,
[0011] A reinforcing structure is provided between the conductor and the insulating layer and / or between the ink layer and the insulating layer to increase the contact area with the insulating layer.
[0012] Preferably, the reinforcing structure includes: the sidewalls of the slot are uneven and non-planar, and the surface of the insulating layer matches the morphology of the sidewalls of the slot, thereby increasing the contact area between the conductor and the insulating layer. The sidewall morphology of the slot can be fabricated by methods such as circuit exposure, development, etching, laser cutting, and die stamping.
[0013] Furthermore, a recess is provided at the intersection of the conductor and the side of the slot, and the contact surface between the conductor and the slot forms the non-planar structure through the recess.
[0014] Preferably, the reinforcing structure includes:
[0015] The upper surface of the insulating layer is higher than the upper surface of the conductor, and / or the lower surface of the insulating layer is lower than the lower surface of the conductor, to form a conductor thinning zone;
[0016] The side portion of the insulating layer adjacent to the conductor is exposed inside and outside the conductor thinning region;
[0017] The ink layer fills the conductor thinning area and contacts the exposed side portion of the insulating layer to increase the contact area between the insulating layer and the ink layer.
[0018] Single-sided or double-sided conductor thinning is performed after the insulating material fills the slots and before ink printing. Therefore, the height of the insulating layer is the same as the height of the conductor before thinning. Ink printing is performed after the conductor is thinned, so the ink layer can fill the conductor thinning area and contact the exposed side portion of the insulating layer.
[0019] To further increase the contact area between the insulation layer and the conductor, preferably, the reinforcement structure includes: the insulation layer extending outward from the opening of the slot along the conductor side edge between adjacent slots.
[0020] Furthermore, the insulating layer forms a continuous insulating structure between adjacent slots. Under this structure, the insulating layer on the sidewalls of the slots is held tightly to the conductor by lateral mutual tension, thus preventing the insulating layer from easily detaching.
[0021] Compared with existing technologies, the beneficial effects of this invention are as follows: by providing reinforcing structures between the conductor and the insulating layer and / or between the ink layer and the insulating layer, the contact area between the conductor and the insulating layer, and between the ink layer and the insulating layer, is effectively increased. The increased contact area significantly enhances the adhesion strength between the insulating layer and the circuit board as a whole, thereby greatly reducing the risk of the insulating layer detaching from the circuit board. Attached Figure Description
[0022] Figure 1 The diagram below is a schematic diagram of the circuit board structure described in the background art, wherein (a) is a circuit board after slots are cut into the conductor, (b) is a circuit board after the insulating layer fills the slots, (c) is a circuit board after ink printing, (d) is a circuit board after excess insulating material is removed by laser cutting, and (e) is a longitudinal section of the circuit board in (d).
[0023] Figure 2 This is a schematic diagram of the circuit board described in the background art, where (a) is a longitudinal section and (b) is a cross section;
[0024] Figure 3 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 1 of this utility model, where (a) is a longitudinal section and (b) is a cross section;
[0025] Figure 4 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 2 of this utility model, where (a) is a longitudinal section and (b) is a cross section;
[0026] Figure 5 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 3 of this utility model, where (a) is a longitudinal section and (b) is a cross section;
[0027] Figure 6 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 4 of this utility model, where (a) is a longitudinal section and (b) is a cross section;
[0028] Figure 7 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 5 of this utility model, where (a) is a longitudinal section and (b) is a cross section;
[0029] Figure 8 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 6 of the present invention, where (a) is a longitudinal section and (b) is a cross section;
[0030] Figure 9 This is a schematic diagram of the gold finger area of the circuit board in Embodiment 7 of this utility model, where (a) is a longitudinal section and (b) is a cross section; Detailed Implementation
[0031] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
[0032] Example 1
[0033] like Figure 3 The diagram shows a preferred embodiment of a circuit board with enhanced bonding strength according to the present invention.
[0034] The circuit board of this embodiment includes a conductor 1, an insulating layer 5, and an ink layer 3. Multiple slots 4 with openings facing the sides are cut into the side edges of the conductor 1, with the remaining portion serving as the gold fingers of the circuit board. The insulating layer 5 is bonded to the sidewalls of the slots 4 of the conductor 1. The ink layer 3 covers the upper and lower surfaces of the composite structure formed by the conductor 1 and the insulating layer 5. A reinforcing structure is provided between the ink layer 3 and the insulating layer 5 to increase the contact area with the insulating layer 5.
[0035] The reinforcement structure is as follows: the upper surface of the insulating layer 5 is higher than the upper surface of the conductor 1, and the lower surface of the insulating layer 5 is lower than the lower surface of the conductor 1, so as to form a conductor thinning region 6; the side portion of the insulating layer 5 adjacent to the conductor 1 is exposed inside and outside the conductor thinning region 6; the ink layer 3 fills the conductor thinning region 6 and contacts the exposed side portion of the insulating layer 5 to increase the contact area between the insulating layer 5 and the ink layer 3.
[0036] In this embodiment, during processing, after the insulating material fills the slot 4 and before ink printing, the double-sided conductor is thinned. Therefore, the height of the insulating layer 5 is the same as the height of the conductor 1 before thinning. After the conductor 1 is thinned, ink printing is performed. Therefore, the ink layer 3 can fill the conductor thinning area 6 and contact the exposed side portion of the insulating layer 5.
[0037] Example 2
[0038] like Figure 4 As shown, this is another preferred embodiment of the present invention.
[0039] The difference between this embodiment and embodiment 1 is that a reinforcing structure for increasing the contact area between the conductor 1 and the insulating layer 5 is provided in this embodiment.
[0040] The reinforcement structure is as follows: the sidewall of the slot 4 is made into an uneven, non-planar structure, and the surface of the insulating layer 5 matches the morphology of the sidewall of the slot 4 to increase the contact area between the conductor 1 and the insulating layer 5. A recess 8 is provided at the intersection of the conductor 1 and the side of the slot 4, and the contact surface between the conductor 1 and the slot 4 forms the aforementioned non-planar structure through the recess 8.
[0041] The sidewall morphology of slot 4 can be fabricated by means of line exposure, development, etching, laser cutting, die stamping, etc.
[0042] Example 3
[0043] like Figure 5 As shown, this is another preferred embodiment of the present invention.
[0044] The difference between this embodiment and embodiment 1 is that, in this embodiment, reinforcing structures are provided between the conductor 1 and the insulating layer 5, and between the ink layer 3 and the insulating layer 5, to increase the contact area with the insulating layer 5.
[0045] The reinforcement structure is as follows: the upper surface of the insulating layer 5 is higher than the upper surface of the conductor 1, and the lower surface of the insulating layer 5 is lower than the lower surface of the conductor 1, forming a conductor thinning region 6; the side portion of the insulating layer 5 adjacent to the conductor 1 is exposed inside and outside the conductor thinning region 6; the ink layer 3 fills the conductor thinning region 6 and contacts the exposed side portion of the insulating layer 5 to increase the contact area between the insulating layer 5 and the ink layer 3; the sidewall of the slot 4 is made into an uneven, non-planar structure, and the surface of the insulating layer 5 matches the morphology of the sidewall of the slot 4 to increase the contact area between the conductor 1 and the insulating layer 5. A recess 8 is provided at the intersection of the conductor 1 and the side of the slot 4, and the contact surface between the conductor 1 and the slot 4 forms the aforementioned non-planar structure through the recess 8.
[0046] Example 4
[0047] like Figure 6 As shown, this is another preferred embodiment of the present invention.
[0048] The difference between this embodiment and embodiment 1 is that a reinforcing structure for increasing the contact area between the conductor 1 and the insulating layer 5 is provided in this embodiment.
[0049] The reinforcement structure is as follows: the insulating layer 5 extends outward from the opening of the slot 4 along the side edge of the conductor 1 between adjacent slots 4 to form a connecting portion 7, thereby forming a continuous insulating structure between adjacent slots 4.
[0050] Example 5
[0051] like Figure 7 As shown, this is another preferred embodiment of the present invention.
[0052] The difference between this embodiment and embodiment 2 is that the above-mentioned enhanced structure further includes: the insulating layer 5 extends outward from the opening of the slot 4 along the side edge of the conductor 1 between adjacent slots 4 to form a connecting portion 7, thereby forming a continuous insulating structure between adjacent slots 4.
[0053] Example 6
[0054] like Figure 8 As shown, this is another preferred embodiment of the present invention.
[0055] The difference between this embodiment and embodiment 3 is that the above-mentioned enhanced structure further includes: the insulating layer 5 extends outward from the opening of the slot 4 along the side edge of the conductor 1 between adjacent slots 4 to form a connecting portion 7, thereby forming a continuous insulating structure between adjacent slots 4.
[0056] Example 7
[0057] like Figure 9 As shown, this is another preferred embodiment of the present invention.
[0058] The difference between this embodiment and embodiment 4 is that the above-mentioned enhanced structure further includes: the insulating layer 5 extends outward from the opening of the slot 4 along the side edge of the conductor 1 between adjacent slots 4 to form a connecting portion 7, thereby forming a continuous insulating structure between adjacent slots 4.
Claims
1. A circuit board for enhancing adhesive strength, comprising: The conductor (1) has multiple slots (4) with openings facing the side edges on its side edges; An insulating layer (5) is bonded to the sidewall of the slot (4) of the conductor (1); An ink layer (3) covers the upper and lower surfaces of the composite structure formed by the conductor (1) and the insulating layer (5); Its features are, A reinforcing structure for increasing the contact area with the insulating layer (5) is provided between the conductor (1) and the insulating layer (5) and / or between the ink layer (3) and the insulating layer (5); The reinforcing structure includes: the sidewall of the slot (4) is an uneven, non-planar structure, and the surface of the insulating layer (5) matches the morphology of the sidewall of the slot (4) to increase the contact area between the conductor (1) and the insulating layer (5); The enhancement structure includes: The upper surface of the insulating layer (5) is higher than the upper surface of the conductor (1), and / or the lower surface of the insulating layer (5) is lower than the lower surface of the conductor (1) to form a conductor thinning region (6); The side portion of the insulating layer (5) adjacent to the conductor (1) is exposed inside and outside the conductor thinning area (6); The ink layer (3) fills the conductor thinning area (6) and partially contacts the exposed side of the insulating layer (5) to increase the contact area between the insulating layer (5) and the ink layer (3).
2. The enhanced adhesion strength printed circuit board according to claim 1, wherein A recess (8) is provided at the intersection of the conductor (1) and the side of the slot (4), and the contact surface between the conductor (1) and the slot (4) forms the non-planar structure through the recess (8).
3. The enhanced adhesion strength printed circuit board of claim 2, wherein, The reinforcement structure includes an insulating layer (5) extending outward from the opening of the slot (4) along the conductor (1) side edge between adjacent slots (4).
4. The enhanced adhesion strength printed circuit board according to claim 3, wherein The insulating layer (5) forms a continuous insulating structure between adjacent slots (4).