A circuit board press device

Abstract

A circuit board pressing device includes: a base, a pressing mechanism slidably connected to the base, the pressing mechanism including a first pneumatic arm slidably connected to the base, a pressure cover fixedly connected to the first pneumatic arm, and a pressure plate slidably connected to the pressure cover and located on the side of the pressure cover opposite to the first pneumatic arm; and a transport mechanism fixedly connected to the base and located on the side of the pressing mechanism opposite to the base, the transport mechanism including a base plate fixedly connected to the base, a slide rail fixedly connected to the base plate, and a support portion slidably connected to the slide rail; wherein, a plurality of electromagnets are fixedly connected inside the support portion, the electromagnets attract circuit boards located inside the support portion, the pressure cover abuts against the support portion to form a sealed space, and after the gas in the sealed space is extracted, the pressure plate presses the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of production machinery, and in particular to a circuit board pressing device. Background Technology

[0002] The PCB lamination unit is a key piece of equipment in printed circuit board (PCB) manufacturing, primarily used for laminating multilayer boards. Its working principle involves applying high temperature, high pressure, and a vacuum environment to melt and flow the prepreg, filling the gaps between layers and firmly bonding it to the copper foil and core board, ultimately forming a highly reliable multilayer PCB structure. The lamination process directly affects the interlayer bonding strength, signal integrity, and mechanical stability of the PCB, and is particularly crucial in high-density interconnect boards, high-frequency boards, and flexible circuit boards.

[0003] Currently, PCB lamination technology is mainly divided into two categories: non-vacuum lamination and vacuum lamination. However, both technologies have significant drawbacks during implementation. Non-vacuum lamination, lacking a vacuum environment, cannot effectively remove interlayer air and resin volatiles, leading to residual air bubbles and uneven resin filling on the PCB. These problems can cause interlayer delamination and ultimately reduce the stability of high-frequency signal transmission. Furthermore, uneven pressure distribution under normal pressure can easily cause loss of board thickness tolerance, severely affecting the reliability of high-precision PCBs. While vacuum lamination can solve the air bubble problem, when processing ultra-thin flexible PCBs, the vacuum adsorption force and thermal stress can easily cause material wrinkling or interlayer displacement. This can lead to dynamic stress during vacuum lamination potentially causing microcracks or component damage.

[0004] Therefore, it is necessary to provide a circuit board pressing device that can avoid the reduction of signal transmission stability and effectively prevent circuit board damage. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board pressing device that can avoid the reduction of signal transmission stability and effectively prevent circuit board damage.

[0006] According to one aspect of this application, a circuit board laminating apparatus is provided, the apparatus comprising:

[0007] Matrix

[0008] A pressing mechanism is slidably connected to the base. The pressing mechanism includes a first pneumatic arm slidably connected to the base, a pressure cover fixedly connected to the first pneumatic arm, and a pressure plate slidably connected to the pressure cover and located on the side of the pressure cover away from the first pneumatic arm.

[0009] The shipping mechanism is fixedly connected to the base and located on the side of the pressing mechanism away from the base. The shipping mechanism includes a base plate fixedly connected to the base, a slide rail fixedly connected to the base plate, and a load-bearing part slidably connected to the slide rail.

[0010] The support section is fixedly connected with several electromagnets, which attract the circuit board located in the support section. The pressure cover abuts against the support section to form a sealed space. After the gas in the sealed space is extracted, the pressure plate presses the circuit board.

[0011] More preferably, the first pneumatic arm extends along a first direction perpendicular to the surface of the cap and drives the cap to move along the first direction.

[0012] More preferably, the pressing mechanism further includes a limiting part, one end of which is fixedly connected to the pressure cover and located on the side of the pressure cover away from the pressure plate;

[0013] When the first pneumatic arm drives the pressure cap to move along the first direction, the other end of the limiting part abuts against the base to limit the first pneumatic arm.

[0014] More preferably, the pressing mechanism further includes a second pneumatic arm, one end of which is fixedly connected to the pressure plate and the other end of which is fixedly connected to the pressure cap.

[0015] More preferably, the second pneumatic arm extends perpendicular to the first direction and drives the pressure plate to move in the first direction.

[0016] More preferably, the support portion is also integrally formed with a pressing edge, which is located at the edge of the support portion and outside the electromagnet when viewed along the first direction;

[0017] The pressed edge is integrally formed with air holes, through which gas in the sealed space is extracted.

[0018] More preferably, the slide rail extends along a second direction parallel to the surface of the base plate and drives the bearing portion to move along the second direction.

[0019] More preferably, when viewed along the second direction, the projections of the pressing edge and the pressure plate in the first direction do not coincide, and the projection of the pressure plate is located inside the projection of the pressing edge, the second pneumatic arm drives the pressing edge to press down along the first direction.

[0020] More preferably, the device further includes:

[0021] A guide shaft extends along the first direction, with one end of the guide shaft fixedly connected to the base body and the other end fixedly connected to the bottom plate;

[0022] The pressure cap is slidably connected to the guide shaft.

[0023] More preferably, the device further includes:

[0024] A vacuum generator is fixedly connected to the support unit and connected to the air vent pipe;

[0025] The vacuum generator extracts gas from the sealed space.

[0026] This utility model has the following beneficial effects:

[0027] The circuit board located within the support section is fixed by an electromagnet, preventing material wrinkling or interlayer displacement and effectively preventing damage after pressure. Furthermore, by extracting the gas from the sealed space and then pressing the circuit board with a pressure plate, a vacuum environment is created within the sealed space, effectively preventing delamination and ensuring stable signal transmission. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a three-dimensional structural diagram of the device described in one embodiment of this application;

[0030] Figure 2 This is a schematic diagram showing the state of the pressing mechanism not pressing the bearing part after the substrate is disassembled in one embodiment of the present application.

[0031] Figure 3 This is a schematic diagram showing the state of the pressing mechanism pressing the bearing part after the device described in one embodiment of this application disassembles the substrate;

[0032] Figure 4 This is a planar structural schematic diagram of the device described in one embodiment of this application from a top view perspective;

[0033] Explanation of reference numerals: 100, Device; 10, Base; 20, Pressing mechanism; 21, First pneumatic arm; 22, Pressure cap; 23, Pressure plate; 24, Limiting part; 25, Second pneumatic arm; 30, Transport mechanism; 31, Base plate; 32, Slide rail; 33, Bearing part; 33A, Electromagnet; 33B, Pressing edge; 33C, Air hole; 40, Sealed space; 50, Guide shaft; 60, Vacuum generator; F1, First direction; F2, Second direction. Detailed Implementation

[0034] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0035] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] Please refer to Figure 1 - Figure 4 One embodiment of this application provides a circuit board pressing device 100, which includes a substrate 10, a pressing mechanism 20, and a transport mechanism 30.

[0038] The pressing mechanism 20 is slidably connected to the base 10. The pressing mechanism 20 includes a first pneumatic arm 21 slidably connected to the base 10, a pressure cover 22 fixedly connected to the first pneumatic arm 21, and a pressure plate 23 slidably connected to the pressure cover 22 and located on the side of the pressure cover 22 away from the first pneumatic arm 21. The transport mechanism 30 is fixedly connected to the base 10 and located on the side of the pressing mechanism 20 away from the base 10. The transport mechanism 30 includes a base plate 31 fixedly connected to the base 10, a slide rail 32 fixedly connected to the base plate 31, and a support portion 33 slidably connected to the slide rail 32. A plurality of electromagnets 33A are fixedly connected inside the support portion 33. The electromagnets 33A attract circuit boards located inside the support portion 33. The pressure cover 22 abuts against the support portion 33 to form a sealed space 40. After the gas in the sealed space 40 is extracted, the pressure plate 23 presses the circuit board.

[0039] The innovative structure of the carrier section 33 with its built-in electromagnet 33A fundamentally solves the displacement problem of thin circuit boards, especially flexible boards, during vacuum pressing. Electromagnetic adsorption provides a uniformly distributed fixing force, reducing local stress compared to traditional mechanical clamps. When the pressure cap 22 and the carrier section 33 form a sealed space 40, and the electromagnet 33A maintains the flatness of the board while allowing the vacuum system to efficiently pump air, this combination allows the diameter of interlayer bubbles to be controlled very small, with minimal displacement. The hierarchical structure of the pressure plate 23, driven by the first pneumatic arm 21 and independently controlled by the second pneumatic arm 25, achieves precise mechanical control of the pressing process. The first pneumatic arm 21 is responsible for establishing the initial seal, while the second pneumatic arm 25 performs progressive pressing to press the circuit board. This design of sealing before pressing, combined with the vacuum environment, improves the uniformity of resin filling and avoids material slippage on the circuit board. The carrier section 33 guided by the slide rail 32 and the pressure cap 22 positioned by the guide shaft 50 constitute a two-dimensional precision motion system. The slide rail 32 enables precise positioning of the bearing portion 33 in the horizontal plane, while the vertical guide shaft 50 ensures that the pressure cap 22 is not skewed during the pressing process. This split motion design allows the device to precisely press the circuit board located in the bearing portion 33 through the pressure plate 23 after the pressure cap 22 presses and forms a closed space with the pressing edge 33B.

[0040] More preferably, the first pneumatic arm 21 extends along a first direction F1 perpendicular to the surface of the pressure cap 22 and drives the pressure cap 22 to move along the first direction F1.

[0041] Vertical force application ensures that the pressure vector acts entirely on the pressing surface. This design uses a rigid guide structure to control angular deviation within a very small error range, improving the actual transmission efficiency of the pressing force. A certain sealing pressure must be maintained between the pressure cap 22 and the bearing part 33. Vertical movement allows for uniform compression of the sealing ring on the bearing part 33.

[0042] More preferably, the pressing mechanism 20 further includes a limiting part 24, one end of which is fixedly connected to the pressure cover 22 and located on the side of the pressure cover 22 opposite to the pressure plate 23. When the first pneumatic arm 21 drives the pressure cover 22 to move along the first direction F1, the other end of the limiting part 24 abuts against the base 10 to limit the first pneumatic arm 21.

[0043] The limiting part 24, acting as a physical stop structure, rigidly contacts the base 10 at the end of the stroke of the first pneumatic arm 21, precisely limiting the maximum downward stroke of the pressure cap 22. When the pressure sensor fails, this structure prevents system overpressure and avoids direct metal-to-metal collision between the pressure plate 23 and the support part 33. During the process of forming a sealed space 40 between the pressure cap 22 and the support part 33, the limiting part 24 ensures the sealing ring achieves optimal compression ratio by precisely controlling the compression amount. This mechanical limiting is more reliable than pure pressure sensor control. Furthermore, when the first pneumatic arm 21 resets vertically upwards, the limiting part 24 acts as a contact point with the base 10, preventing the pressure cap 22 from over-resetting and damaging the structure.

[0044] More preferably, the pressing mechanism 20 further includes a second pneumatic arm 25, one end of which is fixedly connected to the pressure plate 23 and the other end is fixedly connected to the pressure cover 22.

[0045] The second pneumatic arm 25 independently drives the pressure plate 23, forming a two-stage pressure system with the first pneumatic arm 21 for frame pre-tightening and board surface pressing. The first pneumatic arm 21 is responsible for maintaining the stability of the sealing frame with constant pressure, ensuring that the sealed space 40 is effectively evacuated, while the second pneumatic arm 25 can achieve progressive pressing of the circuit board. For circuit boards with bump structures or embedded components, the second pneumatic arm 25 can work with a pressure sensor array to achieve local pressure compensation. For example, when an increase in pressure is detected in the component area, the pneumatic arm can automatically reduce the pressure at the corresponding position in a short time, avoiding the risk of pressure damage to the packaged components.

[0046] More preferably, the second pneumatic arm 25 extends in a direction perpendicular to the first direction F1 and drives the pressure plate 23 to move in the first direction F1.

[0047] The coaxial arrangement ensures that the thrust vectors of the two pneumatic arms are completely aligned. When the second pneumatic arm 25 has an angular deviation, the pressure component is converted into a harmful lateral force, causing micro-displacement of the flexible sheet. This design uses a high-precision linear guide to ensure pure axial movement. During the pressing cycle, the first pneumatic arm 21 descends rapidly to establish a seal, and the second pneumatic arm 25 then precisely presses the circuit board. The coaxial structure allows for seamless connection between the two stages of movement, minimizing transition time and preventing vacuum leakage due to action delays.

[0048] More preferably, the supporting part 33 also integrally forms a pressing edge 33B. When viewed along the first direction F1, the pressing edge 33B is located at the edge of the supporting part 33 and outside the electromagnet 33A. The pressing edge 33B also integrally forms an air hole 33C, through which gas in the sealed space 40 is extracted.

[0049] The pressing edge 33B is integrally cast from high-strength alloy steel and the bearing part 33, forming a continuous sealing strip. This structure provides linear sealing force while its rigid support effectively maintains the parallelism of the pressing surface. Compared to split sealing strips, the integrated design improves the dimensional stability of the vacuum cavity. Laser-drilled air holes 33C are arranged along the pressing edge 33B, forming a single-channel evacuation channel. The electromagnet 33A is designed inside the pressing edge 33B. When the electromagnet 33A magnetically attracts the circuit board and the pressure plate 23 presses the circuit board downwards, the pressure plate 23 can enter the inner side of the pressing edge 33B and effectively press the circuit board, preventing the spread surface of the circuit board from exceeding the surface of the pressure plate 23.

[0050] More preferably, the slide rail 32 extends along a second direction F2 parallel to the surface of the base plate 31 and drives the bearing part 33 to move along the second direction F2.

[0051] The horizontal slide rail 32 allows the bearing part 33 to move vertically downwards along the direction from the base 10 to the pressing mechanism 20, achieving a linear layout for the dual-axis workstation. This layout effectively reduces the space occupied by the device 100. The slide rail 32 uses double precision roller linear guides, reducing the displacement error of the bearing part 33 after movement. The second direction F2 and the first direction F1 form an orthogonal mechanical system, so that the pressing force is entirely borne by the vertical guide shaft 50, while the slide rail 32 only needs to bear the weight of the bearing part 33. This load distribution improves the service life of the pressing mechanism 20.

[0052] More preferably, when viewed along the second direction F2, the projections of the pressing edge 33B and the pressure plate 23 on the first direction F1 do not coincide, and the projection of the pressure plate 23 is located inside the projection of the pressing edge 33B, the second pneumatic arm 25 drives the pressing edge 33B to press down along the first direction F1.

[0053] When the projection of the pressure plate 23 is completely inside the projection of the pressing edge 33B, the pressing edge 33B is responsible for establishing a vacuum seal, and the pressure plate 23 independently performs resin pressing. The stepped layout of the pressing edge 33B and the pressure plate 23 forms a mechanical adhesive-resistant structure. During the pressing process, the pressing edge 33B first contacts the pressure cap 22 to form a closed space, and after forming a vacuum space, the pressure plate 23 then presses down to allow the resin to flow towards the center. Production verification shows that this design reduces the width of adhesive overflow at the plate edge, saves the difficulty of subsequent edge milling work, and eliminates the mold contamination problem caused by adhesive overflow and sticking.

[0054] More preferably, the device 100 further includes a guide shaft 50.

[0055] The guide shaft 50 extends along the first direction F1, with one end fixedly connected to the base 10 and the other end fixedly connected to the bottom plate 31. The pressure cap 22 is slidably connected to the guide shaft 50.

[0056] The guide shaft 50 is made of high-carbon chromium bearing steel, cryogenically treated and then ground, resulting in excellent straightness. The preload of the linear bearing connected to the pressure cap 22 can be controlled at the micrometer level, effectively reducing the sway angle of the pressure cap 22 under load. Furthermore, the reduction in sway angle also helps to reduce interlayer misalignment in the multi-layer structure of the circuit board. The guide shaft 50 is fixed at both ends to the base 10 and the bottom plate 31, effectively improving the stability of the guide shaft 50 in use. The diameter and span of the guide shaft 50 are designed according to the ratio of rigidity criteria, and its natural frequency can reach several hundred hertz, while the operating frequency far from the pressing mechanism can also be controlled within a certain range.

[0057] More preferably, the device 100 further includes a vacuum generator 60.

[0058] The vacuum generator 60 is fixedly connected to the support part 33 and is connected to the air vent 33C pipeline. The vacuum generator 60 extracts gas from the sealed space 40.

[0059] The vacuum generator 60 is directly integrated into the support unit 33, shortening the evacuation path. This short-path design allows for the extraction of gas from the sealed space 40 in a shorter time, ensuring sufficiently small synchronization errors in the resin flow front. The vacuum generator 60 is fixedly connected to the support unit 33. Simultaneously, the aluminum alloy heat sink housing of the vacuum generator 60 is thermally insulated from the support unit 33, stabilizing the operating temperature. The vacuum generator 60 is a servo-controlled scroll vacuum generator 60, capable of controlling the operating mode and automatically adjusting the power according to the actual vacuuming conditions.

[0060] In this way, the circuit board located within the support portion 33 is attracted by the electromagnet 33A, thus fixing the circuit board and preventing material wrinkling or interlayer displacement, effectively preventing damage to the circuit board after pressure. Furthermore, by extracting the gas from the sealed space 40 and then pressing the circuit board with the pressure plate 23, a vacuum environment is created within the sealed space 40, effectively preventing interlayer delamination on the circuit board and avoiding a decrease in signal transmission stability.

[0061] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A circuit board press bonding apparatus characterized by comprising: The device includes: Matrix A pressing mechanism is slidably connected to the base. The pressing mechanism includes a first pneumatic arm slidably connected to the base, a pressure cover fixedly connected to the first pneumatic arm, and a pressure plate slidably connected to the pressure cover and located on the side of the pressure cover away from the first pneumatic arm. The shipping mechanism is fixedly connected to the base and located on the side of the pressing mechanism away from the base. The shipping mechanism includes a base plate fixedly connected to the base, a slide rail fixedly connected to the base plate, and a load-bearing part slidably connected to the slide rail. The support section is fixedly connected with several electromagnets, which attract the circuit board located in the support section. The pressure cover abuts against the support section to form a sealed space. After the gas in the sealed space is extracted, the pressure plate presses the circuit board.

2. The circuit board press according to claim 1, wherein The first pneumatic arm extends along a first direction perpendicular to the surface of the pressure cap and drives the pressure cap to move along the first direction.

3. The circuit board press according to claim 2, wherein The pressing mechanism also includes a limiting part, one end of which is fixedly connected to the pressure cover and located on the side of the pressure cover away from the pressure plate. When the first pneumatic arm drives the pressure cap to move along the first direction, the other end of the limiting part abuts against the base to limit the first pneumatic arm.

4. The circuit board laminating device according to claim 3, characterized in that, The pressing mechanism also includes a second pneumatic arm, one end of which is fixedly connected to the pressure plate and the other end of which is fixedly connected to the pressure cover.

5. A circuit board pressing device according to claim 4, characterized in that, The second pneumatic arm extends perpendicular to the first direction and drives the pressure plate to move along the first direction.

6. The circuit board laminating device according to claim 5, characterized in that, The supporting part is also integrally formed with a pressing edge. When viewed along the first direction, the pressing edge is located at the edge of the supporting part and is located outside the electromagnet. The pressed edge is integrally formed with air holes, through which gas in the sealed space is extracted.

7. A circuit board pressing device according to claim 6, characterized in that, The slide rail extends along a second direction parallel to the surface of the base plate and drives the bearing part to move along the second direction.

8. A circuit board pressing device according to claim 7, characterized in that, When viewed along the second direction, the projections of the pressing edge and the pressure plate in the first direction do not coincide, and the projection of the pressure plate is located inside the projection of the pressing edge, the second pneumatic arm drives the pressing edge to press down along the first direction.

9. A circuit board pressing device according to claim 2, characterized in that, The device further includes: A guide shaft extends along the first direction, with one end of the guide shaft fixedly connected to the base body and the other end fixedly connected to the bottom plate; The pressure cap is slidably connected to the guide shaft.

10. A circuit board pressing device according to claim 6, characterized in that, The device further includes: A vacuum generator is fixedly connected to the support unit and connected to the air vent pipe; The vacuum generator extracts gas from the sealed space.

Images