A photoelectric sensing device employing an array of photosensitive field effect transistors
Patent Information
- Application Number
- CN202521275775.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-06-20
AI Technical Summary
[0005]为了弥补以上不足，本实用新型提供了一种采用阵列式光敏场效应管布局的光电感应装置，旨在改善现有技术中过度屏蔽会阻碍装置内部热量散发，造成局部温度积累，加速元件老化，无法有效采集精确的信号的问题
1、本实用新型中，导热板贴合基板底部，硅脂填补缝隙提升导热效率，将基板热量传导至环形铜管，管内导热流体转移热量，外壁散热片增大空气接触面积加快散热，形成从热量传导、转移到散发的完整路径，有效散出装置运行产生的热量，维持装置温度稳定，避免屏蔽罩阻碍装置内部热量散发，减小降低局部温度积累，保护元件正常工作，有效采集精确的信号。
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Figure CN224746796U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photoelectric sensing technology, and in particular to a photoelectric sensing device using an array of photosensitive field-effect transistors. Background Technology
[0002] A photoelectric sensor is a device that uses the photoelectric effect to convert light signals into electrical signals. It consists of a photosensitive element and related circuits, and can sense the intensity, presence, and changes of light. It is used in automatic control, photoelectric detection, and security monitoring, and can realize the functions of light-controlled switching and object detection.
[0003] The photoelectric sensing device with an array of photosensitive field-effect transistors is designed to improve the photosensitive accuracy and spatial resolution through multi-unit integration, and to realize the two-dimensional distribution detection of light signals. It allows the device to sense spatial changes in light intensity, object shape and motion trajectory. Compared with a single component, it can also enhance anti-interference ability and improve signal stability, meeting the requirements of high sensitivity and spatial resolution in imaging and precision measurement scenarios.
[0004] When photoelectric sensing devices operate in complex electromagnetic environments, they are susceptible to electromagnetic interference, which affects signal transmission and processing, causing noise, stripes, and erroneous output signals in the image, thus reducing the reliability of the device. In existing technologies, electromagnetic interference propagation is suppressed by using metal shielding covers or shielding meshes to wrap components, circuits, and cables, and by using materials with electromagnetic shielding properties to make the device shell, effectively improving the stability of the device in complex electromagnetic environments. However, in actual use, excessive shielding can hinder the dissipation of heat inside the device, causing local temperature accumulation, accelerating component aging, and making it impossible to effectively collect accurate signals. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a photoelectric sensing device with an array of photosensitive field-effect transistors, which aims to improve the problem in the prior art that excessive shielding will hinder the dissipation of heat inside the device, causing local temperature accumulation, accelerating component aging, and making it impossible to effectively collect accurate signals.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a photoelectric sensing device with an array of photosensitive field-effect transistors, comprising a substrate, a plurality of pillars fixedly connected to the top of the substrate, a heat dissipation mechanism provided at the bottom of the substrate for dissipating the heat generated by the device, a surface layer mechanism provided at the top of the substrate, a photosensitive mechanism provided at the top of the surface layer mechanism, a protective mechanism provided on the outer side of the top of the surface layer mechanism, a housing mechanism provided at the top of the pillars for protecting the normal operation of the device, and a processing mechanism provided on the top right side of the substrate; The heat dissipation mechanism includes a heat-conducting plate, the top of which is fixedly connected to the bottom of the substrate. Silicone grease is fixedly connected to the top of the heat-conducting plate, and an annular copper tube is fixedly connected to the bottom of the heat-conducting plate. Multiple heat sinks are fixedly connected to the outer wall of the annular copper tube, and an installation assembly is provided at the bottom of the heat-conducting plate.
[0007] As a further description of the above technical solution: The outer casing mechanism includes a lower casing, the inner bottom of which is disposed at the bottom of the substrate, an upper casing frame is fixedly connected to the top of the lower casing, a diffuser plate is fixedly connected to the inner side of the upper casing frame, a plurality of conical grooves are provided on the top of the diffuser plate, and a sealing assembly is provided on the top of the lower casing.
[0008] As a further description of the above technical solution: The mounting assembly includes multiple bolts, the outer walls of which are threaded to the bottom of the heat-conducting plate, and the bottom of the heat-conducting plate has multiple mounting holes.
[0009] As a further description of the above technical solution: The sealing assembly includes a sealing ring, the bottom of which is fixedly connected to the top of the lower housing, and a sealing groove is provided on the top of the lower housing.
[0010] As a further description of the above technical solution: The photosensitive mechanism includes multiple electrodes, the bottom of which is fixedly connected to the top of the substrate, and a photosensitive tube is fixedly connected to the top of each of the electrodes.
[0011] As a further description of the above technical solution: The processing mechanism includes a signal processing element, the bottom of which is fixedly connected to the top right side of the substrate, and an interface is fixedly connected to the right side of the signal processing element.
[0012] As a further description of the above technical solution: The protective mechanism includes a shield, the bottom of which is fixedly connected to the top outer side of the substrate, and a plurality of insulating rings are fixedly connected to the top inner side of the shield.
[0013] As a further description of the above technical solution: The surface structure includes an insulating layer, the bottom of which is fixedly connected to the top of the substrate, and a moisture-proof layer is fixedly connected to the top of the insulating layer.
[0014] This utility model has the following beneficial effects: 1. In this utility model, the heat-conducting plate is attached to the bottom of the substrate, and the silicone grease fills the gaps to improve the heat conduction efficiency, conducting the heat of the substrate to the annular copper tube. The heat-conducting fluid inside the tube transfers the heat, and the heat sink on the outer wall increases the air contact area to accelerate heat dissipation, forming a complete path from heat conduction to dissipation, effectively dissipating the heat generated by the device operation, maintaining the device temperature stability, avoiding the shielding cover from hindering the heat dissipation inside the device, reducing local temperature accumulation, protecting the normal operation of the components, and effectively acquiring accurate signals.
[0015] 2. In this utility model, the lower shell is fastened to the bottom of the substrate, and the upper shell frame is sealed to it to form a complete protective frame. The diffuser is installed inside the upper shell frame to absorb additional reflected light. The conical groove at the top positions and protects the photosensitive tube to avoid light interference, ensure photosensitive accuracy, create a stable environment for the normal operation of the device, and protect the internal components of the device in all aspects. Attached Figure Description
[0016] Figure 1 This is a perspective view of a photoelectric sensing device using an array of photosensitive field-effect transistors proposed in this utility model. Figure 2 This is a bottom view of a photoelectric sensing device using an array of photosensitive field-effect transistors as proposed in this utility model. Figure 3 This is an exploded view of the protection mechanism in a photoelectric sensing device with an array of photosensitive field-effect transistors proposed in this utility model. Figure 4 This is an exploded view of the housing mechanism in a photoelectric sensing device with an array of photosensitive field-effect transistors proposed in this utility model. Figure 5 This is an exploded view of the heat dissipation mechanism in a photoelectric sensing device with an array-type photosensitive field-effect transistor layout proposed in this utility model.
[0017] Legend: 1. Substrate; 2. Column; 3. Heat dissipation mechanism; 301. Heat-conducting plate; 302. Silicone grease; 303. Annular copper tube; 304. Heat sink; 305. Mounting assembly; 3051. Bolt; 3052. Mounting hole; 4. Housing mechanism; 401. Lower housing; 402. Upper housing frame; 403. Diffuser plate; 404. Conical groove; 405. Sealing assembly; 4051. Sealing ring; 4052. Sealing groove; 5. Photosensitive mechanism; 501. Electrode; 502. Phototube; 6. Processing mechanism; 601. Signal processing element; 602. Interface; 7. Protection mechanism; 701. Shielding cover; 702. Insulating ring; 8. Surface mechanism; 801. Insulating layer; 802. Moisture-proof layer. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Reference Figure 1 , Figure 2 and Figure 5 The present invention provides an embodiment of a photoelectric sensing device using an array of photosensitive field-effect transistors, comprising a substrate 1, which carries top components, a plurality of pillars 2 fixedly connected to the top of the substrate 1, the pillars 2 supporting the substrate 1 and the outer shell mechanism 4, a heat dissipation mechanism 3 provided at the bottom of the substrate 1 for dissipating heat generated by the device, a surface mechanism 8 provided at the top of the substrate 1 for protecting the circuit board, a photosensitive mechanism 5 provided at the top of the surface mechanism 8 for serving as the photosensitive part of the device, a protective mechanism 7 provided on the outer side of the top of the surface mechanism 8 for protecting the photosensitive mechanism 5, an outer shell mechanism 4 provided at the top of the pillars 2 for protecting the normal operation of the device, and a processing mechanism 6 provided on the right side of the top of the substrate 1 for processing the collected data. The heat dissipation mechanism 3 includes a heat-conducting plate 301, which is tightly attached to the bottom of the substrate 1. The top of the heat-conducting plate 301 is fixedly connected to the bottom of the substrate 1. A piece of thermal grease 302 is fixedly connected to the top of the heat-conducting plate 301, filling the gap between the heat-conducting plate 301 and the substrate 1. An annular copper pipe 303 is fixedly connected to the bottom of the heat-conducting plate 301. The annular copper pipe 303 contains a heat-conducting fluid, and heat is transferred from the heat-conducting plate 301 to the annular copper pipe 303. The outer wall of the annular copper pipe 303 is fixedly connected to... There are multiple heat sinks 304, which are fixed to the outer wall of the annular copper tube 303 to increase the contact area with air. The bottom of the heat conduction plate 301 is provided with a mounting assembly 305, which includes multiple bolts 3051. The bolts 3051 fix the heat conduction plate 301 to the bottom of the substrate 1. The outer walls of the multiple bolts 3051 are threaded to the bottom of the heat conduction plate 301. The bottom of the heat conduction plate 301 is provided with multiple mounting holes 3052, which facilitate the installation of the bolts 3051. Specifically, the substrate 1 supports the top components and provides a mounting base for them. Multiple columns 2 are fixedly connected to the top of the substrate 1, supporting the substrate 1 and the outer shell mechanism 4, thus connecting and supporting the substrate 1 and the outer shell mechanism 4. A heat dissipation mechanism 3 is provided at the bottom of the substrate 1 to dissipate the heat generated by the device and ensure stable temperature during device operation. A surface mechanism 8 is provided on the top of the substrate 1 to protect the circuit board from external damage. A photosensitive mechanism 5 is provided on the top of the surface mechanism 8, serving as the photosensitive part of the device to collect light signals. A protective mechanism 7 is provided on the outer side of the top of the surface mechanism 8 to protect the photosensitive mechanism 5 from external factors. An outer shell mechanism 4 is provided on the top of the columns 2 to protect the normal operation of the device and provide protection for the internal components. A processing mechanism 6 is provided on the right side of the top of the substrate 1 to process the collected data and analyze the light signal data. The heat dissipation mechanism 3 includes a heat-conducting plate 301, which is tightly attached to the bottom of the substrate 1. The top of the heat-conducting plate 301 is fixedly connected to the bottom of the substrate 1, thus achieving a fixed connection between the heat-conducting plate 301 and the substrate 1. Silicone grease 302 is fixedly connected to the top of the heat-conducting plate 301, filling the gap between the heat-conducting plate 301 and the substrate 1 to improve heat conduction efficiency. An annular copper pipe 303 is fixedly connected to the bottom of the heat-conducting plate 301. The annular copper pipe 303 contains a heat-conducting fluid, allowing heat to be transferred from the heat-conducting plate 301 to the annular copper pipe 303, achieving heat conduction and transfer. Multiple heat sinks 304 are fixedly connected to the wall of the heat-conducting plate 301. The heat sinks 304 are fixed to the outer wall of the annular copper tube 303 to increase the contact area with air and accelerate the dissipation of heat. The bottom of the heat-conducting plate 301 is provided with a mounting component 305, which includes multiple bolts 3051. The bolts 3051 fix the heat-conducting plate 301 to the bottom of the base plate 1. The outer walls of the multiple bolts 3051 are threaded to the bottom of the heat-conducting plate 301. Multiple mounting holes 3052 are opened at the bottom of the heat-conducting plate 301 to facilitate the installation of the bolts 3051 and achieve stable installation of the heat-conducting plate 301.
[0020] Reference Figure 1 , Figure 2 and Figure 4The outer casing mechanism 4 includes a lower casing 401, which is fastened to the bottom of the substrate 1. The bottom inner side of the lower casing 401 is located at the bottom of the substrate 1. An upper casing frame 402 is fixedly connected to the top of the lower casing 401. The upper casing frame 402 is connected and installed to the upper casing frame 402 through a sealing assembly 405. A diffuser plate 403 is fixedly connected to the inner side of the upper casing frame 402. The diffuser plate 403 absorbs additional reflected light to prevent it from affecting the photosensitive tube 502. The top of the diffuser plate 403 is provided with multiple conical grooves 404. The top of the photosensitive tube 502 is placed inside the conical grooves 404. A sealing assembly 405 is provided on the top of the lower casing 401. The sealing assembly 405 includes a sealing ring 4051. The sealing ring 4051 prevents impurities from entering the device. The bottom of the sealing ring 4051 is fixedly connected to the top of the lower casing 401. A sealing groove 4052 is provided on the top of the lower casing 401. Specifically, the lower housing 401 is fastened to the bottom of the substrate 1, and the inner bottom of the lower housing 401 is set at the bottom of the substrate 1 to protect the bottom of the substrate 1. The top of the lower housing 401 is fixedly connected to the upper housing frame 402, which is connected and installed to the lower housing 401 through the sealing assembly 405, providing a protective frame for the top of the device. The inner side of the upper housing frame 402 is fixedly connected to the diffuser plate 403, which absorbs additional reflected light to prevent it from affecting the phototube 502 and ensure the photosensitive accuracy of the phototube 502. The top of the 03 has multiple conical grooves 404. The top of the photosensitive tube 502 is placed inside the conical grooves 404, which provides positioning and protection for the photosensitive tube 502. The top of the lower housing 401 is provided with a sealing component 405, which includes a sealing ring 4051. The sealing ring 4051 prevents impurities from entering the device and ensures that the device is clean. The bottom of the sealing ring 4051 is fixedly connected to the top of the lower housing 401. The top of the lower housing 401 has a sealing groove 4052 to achieve the installation and fixation of the sealing ring 4051.
[0021] Reference Figure 1 , Figure 2 and Figure 3 The photosensitive mechanism 5 includes multiple electrodes 501, which are welded to the top of the substrate 1. The bottoms of the multiple electrodes 501 are fixedly connected to the top of the substrate 1. A photosensitive tube 502 is fixedly connected to the top of the multiple electrodes 501. The processing mechanism 6 includes a signal processing element 601, which processes the collected light signal. The bottom of the signal processing element 601 is fixedly connected to the top right side of the substrate 1. An interface 602 is fixedly connected to the right side of the signal processing element 601. The interface 602 is used to supply power to the device and transmit data. Specifically, electrodes 501 are welded to the top of substrate 1, and the bottoms of multiple electrodes 501 are fixedly connected to the top of substrate 1 to achieve fixed installation of electrodes 501 on substrate 1. Phototubes 502 are fixedly connected to the tops of multiple electrodes 501, and the phototubes 502 are electrically connected to substrate 1 through electrodes 501. The processing mechanism 6 includes a signal processing element 601, which processes the collected light signal and the light signal collected by phototubes 502. The bottom of the signal processing element 601 is fixedly connected to the top right side of substrate 1 to achieve fixed installation of the signal processing element 601. An interface 602 is fixedly connected to the right side of the signal processing element 601. The interface 602 is used to supply power to the device and transmit data to realize the power supply and data interaction of the device.
[0022] Reference Figure 1 , Figure 2 and Figure 3 The protection mechanism 7 includes a shield 701, which covers the electrode 501. The bottom of the shield 701 is fixedly connected to the top outer side of the substrate 1. Multiple insulating rings 702 are fixedly connected to the top inner side of the shield 701. A photosensitive tube 502 is sleeved inside the insulating rings 702. The surface mechanism 8 includes an insulating layer 801, which covers the top of the substrate 1. The bottom of the insulating layer 801 is fixedly connected to the top of the substrate 1. A moisture-proof layer 802 is fixedly connected to the top of the insulating layer 801 to prevent the substrate 1 from getting damp. Specifically, a shielding cover 701 covers the electrode 501, and the bottom of the shielding cover 701 is fixedly connected to the top outer side of the substrate 1 to achieve electromagnetic shielding of the electrode 501 and the phototube 502. Multiple insulating rings 702 are fixedly connected to the top inner side of the shielding cover 701, and the phototube 502 is sleeved inside the insulating rings 702 to prevent the phototube 502 from making electrical contact with the shielding cover 701. The surface mechanism 8 includes an insulating layer 801, which covers the top of the substrate 1. The bottom of the insulating layer 801 is fixedly connected to the top of the substrate 1 to achieve insulation protection for the circuit on the top of the substrate 1. A moisture-proof layer 802 is fixedly connected to the top of the insulating layer 801 to prevent the substrate 1 from getting damp and avoid circuit failure caused by moisture.
[0023] Working Principle: When external light shines on the photosensitive mechanism 5, the phototube 502 in the photosensitive mechanism 5 is welded to the top of the substrate 1 through the electrode 501. Under the action of light, an electrical signal is generated. The electrode 501 realizes the electrical connection between the phototube 502 and the substrate 1, and transmits the electrical signal converted from the light signal to the processing mechanism 6. The signal processing element 601 of the processing mechanism 6 is fixed on the top right side of the substrate 1. It processes, analyzes and converts the collected light-induced electrical signal. The processed signal is output as data through the interface 602. At the same time, the interface 602 can also provide power to the device to ensure continuous and stable operation. During the operation of the device, the components on the substrate 1 will generate heat. The heat dissipation mechanism 3 will start to play its role. The heat conduction plate 301 is tightly attached to the bottom of the substrate 1. The gaps are filled with silicone grease 302 to improve the heat conduction efficiency and conduct the heat of the substrate 1 to the heat conduction plate 301. The annular copper tube 303 at the bottom of the heat conduction plate 301 contains heat-conducting fluid, which absorbs the heat of the heat conduction plate 301 and conducts it. The heat sink 304 on the outer wall of the annular copper tube 303 increases the contact area with air, accelerating heat dissipation to the external environment and ensuring stable temperature during device operation. The lower shell 401 of the outer shell mechanism 4 is fastened to the bottom of the substrate 1. The upper shell frame 402 is connected to the lower shell 401 through the sealing assembly 405 to form a closed space. The diffuser plate 403 is fixed inside the upper shell frame 402 to absorb additional reflected light. The conical groove 404 at the top positions and protects the phototube 502. The sealing ring 4051 is installed in the sealing groove 4052 at the top of the lower shell 401 to prevent impurities from entering the device. The shielding cover 701 of the protection mechanism 7 covers the electrode 501 to electromagnetically shield the electrode 501 and the phototube 502. The insulating ring 702 prevents the phototube 502 from making electrical contact with the shielding cover 701. The insulating layer 801 of the surface mechanism 8 covers the top of the substrate 1 to achieve circuit insulation. The moisture-proof layer 802 prevents the substrate 1 from getting damp, realizing efficient acquisition, processing and stable output of light signals by the device.
[0024] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A photoelectric sensing device employing an array of photosensitive field effect transistors layout comprising a substrate (1), characterized in that: The top of the substrate (1) is fixedly connected to multiple columns (2), the bottom of the substrate (1) is provided with a heat dissipation mechanism (3), the heat dissipation mechanism (3) is used to dissipate the heat generated by the device, the top of the substrate (1) is provided with a surface mechanism (8), the top of the surface mechanism (8) is provided with a photosensitive mechanism (5), the outer side of the top of the surface mechanism (8) is provided with a protective mechanism (7), the top of the columns (2) is provided with a shell mechanism (4), the shell mechanism (4) is used to protect the normal operation of the device, and the right side of the top of the substrate (1) is provided with a processing mechanism (6). The heat dissipation mechanism (3) includes a heat-conducting plate (301), the top of which is fixedly connected to the bottom of the substrate (1), a silicone grease (302) is fixedly connected to the top of the heat-conducting plate (301), an annular copper tube (303) is fixedly connected to the bottom of the heat-conducting plate (301), and multiple heat sinks (304) are fixedly connected to the outer wall of the annular copper tube (303). An installation assembly (305) is provided at the bottom of the heat-conducting plate (301).
2. A photoelectric sensing device employing an array of photosensitive field effect transistors as recited in claim 1, wherein: The outer shell mechanism (4) includes a lower shell (401), the inner bottom of the lower shell (401) is disposed at the bottom of the substrate (1), the top of the lower shell (401) is fixedly connected to an upper shell frame (402), the inner side of the upper shell frame (402) is fixedly connected to a diffuser plate (403), the top of the diffuser plate (403) is provided with a plurality of conical grooves (404), and the top of the lower shell (401) is provided with a sealing assembly (405).
3. A photoelectric sensing device employing an array of photosensitive field effect transistors as recited in claim 1, wherein: The mounting assembly (305) includes a plurality of bolts (3051), the outer walls of which are threaded to the bottom of the heat-conducting plate (301), and the bottom of the heat-conducting plate (301) has a plurality of mounting holes (3052).
4. A photoelectric sensing device employing an array of photosensitive field effect transistors as recited in claim 2, wherein: The sealing assembly (405) includes a sealing ring (4051), the bottom of which is fixedly connected to the top of the lower housing (401), and a sealing groove (4052) is provided on the top of the lower housing (401).
5. A photoelectric sensing device employing an array of photosensitive field effect transistors as recited in claim 1, wherein: The photosensitive mechanism (5) includes multiple electrodes (501), the bottom of each of the multiple electrodes (501) is fixedly connected to the top of the substrate (1), and a photosensitive tube (502) is fixedly connected to the top of each of the multiple electrodes (501).
6. A photoelectric sensing device employing an array of photosensitive field effect transistors according to claim 1, wherein: the array of photosensitive field effect transistors is arranged in a two-dimensional array. The processing mechanism (6) includes a signal processing element (601), the bottom of which is fixedly connected to the top right side of the substrate (1), and an interface (602) is fixedly connected to the right side of the signal processing element (601).
7. The photoelectric sensing device of claim 1, wherein: the plurality of photosensitive field effect transistors are arranged in an array. The protection mechanism (7) includes a shield (701), the bottom of which is fixedly connected to the top outer side of the substrate (1), and a plurality of insulating rings (702) are fixedly connected to the top inner side of the shield (701).
8. The photoelectric sensing device of claim 1, wherein: the array of photosensitive field effect transistors are arranged in a two-dimensional array. The surface structure (8) includes an insulating layer (801), the bottom of which is fixedly connected to the top of the substrate (1), and a moisture-proof layer (802) is fixedly connected to the top of the insulating layer (801).