Heat dissipating device, circuit board assembly, and electronic device

Abstract

This application provides a heat dissipation device, a circuit board assembly, and an electronic device. The heat dissipation device includes: a housing, comprising a connected outer cover and a mounting structure; the outer cover has a receiving cavity, an air inlet, and an air outlet, the air inlet and the air outlet being spaced apart; the air inlet communicating with both the receiving cavity and the outside of the housing; the air outlet communicating with both the receiving cavity and the outside of the housing; the mounting structure being disposed on the surface of the outer cover opposite to the receiving cavity; a fan blade assembly disposed within the receiving cavity and rotatably connected to the outer cover; and a drive mechanism supported on the housing, connected to the fan blade assembly, for driving the fan blade assembly to rotate relative to the housing to drive airflow. The heat dissipation device of this application has a small size and can be directly mounted on a circuit board close to the chip, providing better heat dissipation for the chip.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to a heat dissipation device, a circuit board assembly, and an electronic device. Background Technology

[0002] With the continuous development of electronic products, the integration and performance of chips are constantly improving, leading to a corresponding increase in chip power consumption. High power consumption generates a large amount of heat, and if it cannot be dissipated in a timely and effective manner, it will affect the chip's performance, reliability, and lifespan. In related technologies, the air-cooling devices for chips in electronic products typically use heat sinks to absorb the heat from the chip, and the airflow generated by a fan carries away the heat after passing over the heat sink, thus cooling the chip. However, this method has low heat dissipation efficiency and occupies a large space. Utility Model Content

[0003] This application provides a heat dissipation device with a small size, which can be directly mounted on a circuit board close to the chip, and has a better heat dissipation effect on the chip.

[0004] A first aspect of this application provides a heat dissipation device, the heat dissipation device comprising:

[0005] The housing includes a connected outer cover and a mounting structure. The outer cover has a receiving cavity, an air inlet, and an air outlet. The air inlet and the air outlet are spaced apart. The air inlet is connected to both the receiving cavity and the outside of the housing. The air outlet is connected to both the receiving cavity and the outside of the housing. The mounting structure is disposed on the surface of the outer cover opposite to the receiving cavity.

[0006] A fan blade assembly, wherein the fan blade assembly is disposed within the receiving cavity and is rotatably connected to the outer cover; and

[0007] A drive mechanism, which is supported on the housing and connected to the fan blade assembly, is used to drive the fan blade assembly to rotate relative to the housing in order to drive airflow.

[0008] Optionally, the fan blade assembly includes a first connecting portion, a second connecting portion, and a plurality of blades. The first connecting portion and the second connecting portion are spaced apart, and the plurality of blades are located between the first connecting portion and the second connecting portion. The first connecting portion is rotatably connected to the housing, and the second connecting portion is connected to the drive mechanism. Each blade extends along the arrangement direction of the first connecting portion and the second connecting portion. The opposite ends of each blade are respectively connected to the first connecting portion and the second connecting portion. The plurality of blades are arranged sequentially at intervals around the outer edge of the first connecting portion and the outer edge of the second connecting portion. The extension direction of the air outlet is parallel to the extension direction of the blades, and the air outlet direction intersects the extension direction of the air outlet.

[0009] Optionally, the outer cover has a bent and connected peripheral sidewall and an end sidewall; the air outlet and the air inlet both penetrate the peripheral sidewall of the outer cover, the air outlet and the air inlet are arranged at intervals in a counterclockwise direction around the outer periphery of the fan blade assembly, the blades are arc-shaped, the plurality of blades are arranged in a counterclockwise direction and the arc-shaped opening of the blades faces the counterclockwise direction;

[0010] or,

[0011] The outer cover has a bent and connected peripheral sidewall and an end sidewall; the air outlet and the air inlet both penetrate the peripheral sidewall of the outer cover; the air outlet and the air inlet are arranged at intervals in a clockwise direction around the outer periphery of the fan blade assembly, the blades are arc-shaped, the multiple blades are arranged in a clockwise direction and the arc-shaped opening of the blades faces the clockwise direction.

[0012] Optionally, the fan blade assembly further includes a first connecting shaft and a second connecting shaft. The first connecting shaft connects to the end of the first connecting portion opposite to the second connecting portion and is rotatably inserted through the outer cover. The second connecting shaft connects the first connecting portion and the second connecting portion. The plurality of blades are spaced apart around the outer periphery of the second connecting shaft. The fan blade assembly also has a through hole that passes through the second connecting portion and part of the second connecting shaft. The drive mechanism includes a drive portion and a power output shaft. The drive portion drives the power output shaft to rotate relative to the drive portion. The power output shaft passes through the through hole to drive the fan blade assembly to rotate.

[0013] Optionally, the fan blade assembly includes a first connecting shaft, a second connecting shaft, and a plurality of blades. The first connecting shaft and the second connecting shaft are arranged and connected along their extension direction. The plurality of blades are spaced around the outer periphery of the first connecting shaft and the second connecting shaft and are all connected to the first connecting shaft and the second connecting shaft. The end of the first connecting shaft opposite to the second connecting shaft is rotatably inserted through the outer cover, and the end of the second connecting shaft opposite to the first connecting shaft is connected to the drive mechanism.

[0014] Optionally, the second connecting shaft has interconnected through holes and multiple positioning holes. The through holes penetrate the surface of the second connecting shaft opposite to the first connecting shaft. The multiple positioning holes are spaced apart, and each positioning hole is connected to the through hole and penetrates the side wall of the second connecting shaft and the surface of the second connecting shaft opposite to the first connecting shaft. The driving mechanism includes a driving part and a power output shaft. The driving part is used to drive the power output shaft to rotate relative to the driving part. The power output shaft includes a shaft body and multiple positioning parts. The shaft body is connected to the driving part. The multiple positioning parts are spaced apart on the outer periphery of the shaft body. The shaft body passes through the through holes, and the positioning parts pass through the positioning holes, with each positioning part corresponding to one positioning hole.

[0015] Optionally, the mounting structure is a positioning post;

[0016] or,

[0017] The mounting structure includes an adapter, a first snap-fit ​​part, and a second snap-fit ​​part. One end of the adapter is connected to the outer cover. The first snap-fit ​​part and the second snap-fit ​​part are located on opposite sides of the adapter. The end of the first snap-fit ​​part facing away from the outer cover is connected to the end of the adapter that faces away from the outer cover. From the end of the adapter that faces away from the outer cover towards the end of the adapter that is connected to the outer cover, the distance between the first snap-fit ​​part and the adapter gradually increases. The end of the second snap-fit ​​part facing away from the outer cover is connected to the end of the adapter that faces away from the outer cover. From the end of the adapter that faces away from the outer cover towards the end of the adapter that is connected to the outer cover, the distance between the second snap-fit ​​part and the adapter gradually increases.

[0018] Optionally, the first snap-fit ​​portion includes a first snap-fit ​​sub-portion and a second snap-fit ​​sub-portion connected together. One end of the first snap-fit ​​sub-portion is connected to the adapter portion, and the second snap-fit ​​sub-portion is connected to the end of the first snap-fit ​​sub-portion that is away from the adapter portion. The first snap-fit ​​sub-portion protrudes in a direction away from the adapter portion relative to the second snap-fit ​​sub-portion.

[0019] The second snap-fit ​​portion includes a third snap-fit ​​sub-portion and a fourth snap-fit ​​sub-portion connected together. One end of the third snap-fit ​​sub-portion is connected to the adapter portion, and the fourth snap-fit ​​sub-portion is connected to the end of the third snap-fit ​​sub-portion that is away from the adapter portion. The third snap-fit ​​sub-portion protrudes in a direction away from the adapter portion relative to the fourth snap-fit ​​sub-portion.

[0020] Optionally, the outer casing is a metal casing;

[0021] And / or,

[0022] The heat dissipation device also includes a dust filter, which is disposed at the air inlet.

[0023] Optionally, the receiving cavity includes a first receiving sub-cavity and a second receiving sub-cavity, and the outer cover includes a first cover portion and a second cover portion connected together. The first cover portion has a first receiving sub-cavity, the air inlet, and the air outlet. The air inlet and the air outlet are respectively connected to the first receiving sub-cavity. The first receiving sub-cavity is used to receive the fan blade assembly, and the mounting structure is disposed on the outer periphery of the surface opposite to the first receiving sub-cavity. The second cover portion includes a second receiving sub-cavity, which is used to receive part of the drive mechanism.

[0024] Optionally, the outer cover further includes a plurality of air guides, which are spaced apart at the air outlet and respectively connected to the first cover body.

[0025] And / or,

[0026] The housing also includes a plurality of stabilizing parts, which are spaced apart from the mounting structure and disposed on the same side of the first cover portion. The surfaces of the plurality of stabilizing parts are coplanar with respect to the first cover portion, and the side of the mounting structure opposite to the first cover portion protrudes from the plurality of stabilizing parts.

[0027] Optionally, the heat dissipation device further includes a temperature sensor, which is mounted on the housing and is used to detect the temperature of the environment in which the heat dissipation device is located.

[0028] Optionally, the heat dissipation device further includes an electrical connector, which is disposed on the same side of the housing as the mounting structure. The electrical connector is embedded in the housing and at least partially exposed outside the housing. The electrical connector is electrically connected to the drive mechanism for loading an electrical signal onto the drive mechanism.

[0029] A second aspect of this application provides a circuit board assembly comprising:

[0030] Circuit board, the circuit board having mounting holes;

[0031] A chip, which is mounted on the circuit board and is positioned close to the mounting hole;

[0032] A controller, which is mounted on the circuit board and electrically connected to the chip; and

[0033] The heat dissipation device described in this application is supported on the circuit board, the mounting structure passes through the mounting hole, the air outlet faces the chip, and the driving mechanism is electrically connected to the controller for working under the control of the controller.

[0034] A third aspect of this application provides an electronic device, which includes the circuit board assembly described in this application.

[0035] The heat dissipation device according to this application embodiment includes a housing, a fan blade assembly, and a drive mechanism. The housing includes a connected outer cover and a mounting structure. The outer cover has a receiving cavity, an air inlet, and an air outlet. The air inlet and the air outlet are spaced apart. The air inlet is connected to the outside of the receiving cavity and the housing, respectively. The air outlet is connected to the outside of the receiving cavity and the housing, respectively. The mounting structure is disposed on the surface of the outer cover opposite to the receiving cavity and is used to connect a circuit board. The fan blade assembly is disposed in the receiving cavity and is rotatably connected to the outer cover. The drive mechanism is supported on the housing and connected to the fan blade assembly, used to drive the fan blade assembly to rotate relative to the housing to drive airflow. The heat dissipation device of this application can be mounted on the circuit board, thereby directly mounting the heat dissipation device on the circuit board and blowing air onto the chip on the circuit board, which can better improve the heat dissipation efficiency of the heat dissipation device on the chip, thus making the chip have higher reliability and service life. In addition, the heat dissipation device of this application can be directly mounted on the circuit board, so that when the circuit board assembly is used in electronic devices, it does not occupy the extra volume outside the circuit board of the electronic device, which can better reduce the size of the electronic device. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the heat dissipation device according to an embodiment of this application.

[0038] Figure 2 This is a heat dissipation device according to an embodiment of this application. Figure 1 A schematic diagram of the explosion structure from a visual perspective.

[0039] Figure 3 This is another perspective structural schematic diagram of a heat dissipation device according to an embodiment of this application.

[0040] Figure 4 This is a heat dissipation device according to an embodiment of this application. Figure 3 A schematic diagram of the explosion structure from a visual perspective.

[0041] Figure 5 This is a schematic diagram of the structure of a fan blade assembly according to an embodiment of this application.

[0042] Figure 6 This is a heat dissipation device according to an embodiment of the present application. Figure 1 A cross-sectional view along the AA direction.

[0043] Figure 7 This is a cross-sectional structural schematic diagram of a heat dissipation device according to an embodiment of this application.

[0044] Figure 8 This is a schematic diagram of the heat dissipation device according to another embodiment of this application.

[0045] Figure 9 This is an exploded structural diagram of a heat dissipation device according to another embodiment of this application.

[0046] Figure 10 This is a schematic diagram of the structure of a fan blade assembly according to another embodiment of this application.

[0047] Figure 11 yes Figure 3 Enlarged view of the area within the dashed box I.

[0048] Figure 12 This is a schematic diagram of the heat dissipation device according to another embodiment of this application.

[0049] Figure 13 This is a schematic diagram of the structure of the outer casing according to an embodiment of this application.

[0050] Figure 14 This is a structural schematic diagram of the casing from another perspective of an embodiment of this application.

[0051] Figure 15 This is a schematic diagram of the heat dissipation device from another perspective, representing another embodiment of this application.

[0052] Figure 16 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of this application.

[0053] Figure 17 This application Figure 16 A partial exploded view of the circuit board assembly in the embodiment.

[0054] Figure 18 This is a schematic diagram of the structure of a circuit board assembly according to another embodiment of this application.

[0055] Figure 19 This application Figure 18 A partial exploded view of the circuit board assembly in the embodiment.

[0056] Figure 20 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0057] Explanation of reference numerals in the attached figures:

[0058] 100 - Heat dissipation device, 10 - Outer shell, 11 - Cover, 111 - Receiving cavity, 111a - First receiving sub-cavity, 111b - Second receiving sub-cavity, 112 - Air inlet, 113 - Air outlet, 114 - First cover section, 115 - Second cover section, 116 - Airflow guide section, 117 - Stabilizing section, 12 - Mounting structure, 121 - Adapter section, 122 - First snap-fit ​​section, 1221 - First snap-fit ​​sub-section, 1222 - Second snap-fit ​​section, 123 - Second snap-fit ​​section, 1231 - Third snap-fit ​​sub-section, 1232 - Fourth snap-fit ​​section, 13 - Peripheral sidewall, 14- End sidewall, 30- Fan blade assembly, 301- Through hole, 302- Positioning hole, 31- First connecting part, 32- Second connecting part, 33- Blade, 34- First connecting shaft, 35- Second connecting shaft, 50- Drive mechanism, 51- Drive part, 52- Power output shaft, 521- Shaft body part, 522- Positioning part, 60- Dustproof net, 70- Temperature sensor, 80- Electrical connector, 200- Circuit board assembly, 210- Circuit board, 211- Mounting hole, 220- Chip, 230- Controller, 300- Electronic device. Detailed Implementation

[0059] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0060] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0061] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0062] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0063] With the continuous development of electronic products, the integration and performance of chips are constantly improving, leading to a corresponding increase in chip power consumption. High power consumption generates a large amount of heat, and if it cannot be dissipated in a timely and effective manner, it will affect the chip's performance, reliability, and lifespan. In related technologies, the air-cooling devices for chips in electronic products typically use heat sinks to absorb the heat from the chip, and the airflow generated by a fan carries away the heat after passing over the heat sink, thus cooling the chip. However, this method has low heat dissipation efficiency and occupies a large space. In view of this, this application provides a heat dissipation device.

[0064] Please see Figures 1 to 4 This application provides a heat dissipation device 100, which includes a housing 10, a fan blade assembly 30, and a drive mechanism 50. The housing 10 includes a connected outer cover 11 and a mounting structure 12. The outer cover 11 has a receiving cavity 111, an air inlet 112, and an air outlet 113. The air inlet 112 and the air outlet 113 are spaced apart. The air inlet 112 is connected to the outside of the receiving cavity 111 and the housing 10, respectively. The air outlet 113 is connected to the outside of the receiving cavity 111 and the housing 10, respectively. The mounting structure 12 is disposed on the surface of the outer cover 11 away from the receiving cavity 111 and is used to connect a circuit board. The fan blade assembly 30 is disposed in the receiving cavity 111 and is rotatably connected to the outer cover 11. The drive mechanism 50 is supported on the housing 10 and connected to the fan blade assembly 30, and is used to drive the fan blade assembly 30 to rotate relative to the housing 10 to drive airflow.

[0065] The heat dissipation device 100 of this application embodiment can be applied to a circuit board assembly of an electronic device and can be directly disposed on the circuit board of the circuit board assembly to dissipate heat for the chips on the circuit board. When the heat dissipation device 100 is mounted on the circuit board, the air outlet 113 is oriented towards the chip. When the heat dissipation device 100 is mounted on the circuit board, the driving mechanism 50 of the heat dissipation device 100 can be electrically connected to the power supply circuit of the circuit board, and the power supply circuit of the circuit board directly supplies power to the driving mechanism 50.

[0066] Optionally, the chip can be, but is not limited to, a memory chip, a system-on-a-chip, a processor, or other chip that generates a large amount of heat.

[0067] Understandably, the air inlet 112 and the air outlet 113 respectively penetrate the outer cover 11 to connect the receiving cavity 111 with the outside of the outer shell 10.

[0068] Understandably, the outer casing 10 surrounds the outer periphery of the fan blade assembly 30. It is also understood that the outer casing 10 has a hollow structure.

[0069] Optionally, the drive mechanism 50 is also located within the receiving cavity 111, and both the fan blade assembly 30 and the drive mechanism 50 are housed within the outer casing 10. This allows for a more compact overall arrangement of the heat dissipation device 100, further reducing its size. In other embodiments, the drive mechanism 50 may also be located on one side of the outer casing 10.

[0070] It should be noted that when the drive mechanism 50 is started, the drive airflow enters the receiving cavity 111 from the air inlet 112 and flows out from the air outlet 113. When the heat dissipation device 100 is installed on the circuit board, the airflow from the air outlet 113 flows towards the chip and blows directly onto the chip, thereby better dissipating heat from the chip and improving heat dissipation efficiency.

[0071] Optionally, the number of mounting structures 12 can be one or more (i.e., greater than or equal to two). When the number of mounting structures 12 is multiple, the multiple mounting structures 12 are arranged on the same side of the outer cover 11 and spaced apart.

[0072] The heat dissipation device 100 of this application embodiment includes a housing 10, a fan blade assembly 30, and a drive mechanism 50. The housing 10 includes a connected outer cover 11 and a mounting structure 12. The outer cover 11 has a receiving cavity 111, an air inlet 112, and an air outlet 113. The air inlet 112 and the air outlet 113 are spaced apart. The air inlet 112 is connected to the outside of the receiving cavity 111 and the housing 10, respectively. The air outlet 113 is connected to the outside of the receiving cavity 111 and the housing 10, respectively. The mounting structure 12 is disposed on the surface of the outer cover 11 away from the receiving cavity 111 and is used to connect a circuit board. The fan blade assembly 30 is disposed in the receiving cavity 111 and is rotatably connected to the outer cover 11. The drive mechanism 50 is supported on the housing 10 and connected to the fan blade assembly 30, and is used to drive the fan blade assembly 30 to rotate relative to the housing 10 to drive airflow. The mounting structure 12 of the heat dissipation device 100 of this application can be installed on the circuit board, thereby directly mounting the heat dissipation device 100 on the circuit board and blowing air onto the chip on the circuit board, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the chip, thus making the chip have higher reliability and service life; in addition, the heat dissipation device 100 of this application can be directly mounted on the circuit board, so that when the circuit board assembly is used in electronic devices, it does not occupy additional volume outside the circuit board of the electronic device, and can better reduce the size of the electronic device.

[0073] Please see Figure 5In some embodiments, the fan blade assembly 30 includes a first connecting portion 31, a second connecting portion 32, and a plurality of blades 33. The first connecting portion 31 and the second connecting portion 32 are spaced apart, and the plurality of blades 33 are all located between the first connecting portion 31 and the second connecting portion 32. The first connecting portion 31 is rotatably connected to the housing 10, and the second connecting portion 32 is connected to the drive mechanism 50. Each blade 33 extends along the arrangement direction of the first connecting portion 31 and the second connecting portion 32. The opposite ends of each blade 33 are respectively connected to the first connecting portion 31 and the second connecting portion 32. The plurality of blades 33 are arranged sequentially and spaced apart around the outer edge of the first connecting portion 31 and the outer edge of the second connecting portion 32. The extending direction of the air outlet 113 is parallel to the extending direction of the blades 33, and the air outlet direction of the air outlet 113 intersects with the extending direction of the air outlet 113.

[0074] In one embodiment, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 can be an integral structure, that is, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 are different parts of the same component. In another embodiment, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 can be at least partially composed of multiple independent components, which are then assembled together.

[0075] Understandably, the first connecting part 31, the plurality of blades 33 and the second connecting part 32 are arranged and connected in sequence.

[0076] It should be noted that each blade 33 extends along the arrangement direction of the first connecting part 31 and the second connecting part 32.

[0077] Optionally, the air outlet 113 is perpendicular to the extension direction of the air outlet 113.

[0078] Optionally, the fan blade assembly 30 has a central axis parallel to the arrangement direction of the first connecting portion 31 and the second connecting portion 32, and multiple blades 33 are arranged at intervals around the outer periphery of the central axis to form a circular structure. When the fan blade assembly 30 rotates under the drive of the drive mechanism 50, the fan blade assembly 30 rotates around the central axis. It should be noted that the central axis can be a virtual axis or a physical axis.

[0079] The term "multiple" means two or more, such as, but not limited to, two, three, four, five, six, seven, eight, etc. In some embodiments, the fan blade assembly 30 includes eight blades 33.

[0080] In this embodiment, the fan blade assembly 30 includes a first connecting portion 31, a second connecting portion 32, and multiple blades 33. The arrangement of the multiple blades 33 makes the structure of the fan blade assembly 30 more compact, and the heat dissipation device 100 more miniaturized. Furthermore, by making the extension direction of the air outlet 113 parallel to the extension direction of the blades 33, air can flow out along the extension direction of the air outlet 113 after the heat dissipation device 100 is activated. When applied to circuit board assemblies, since the chips on the circuit board assembly are usually flat (e.g., square), making the extension direction of the air outlet 113 parallel to the extension direction of the chip or one side allows more air from the heat dissipation device 100 to reach the chip, thereby better dissipating heat and improving heat dissipation efficiency.

[0081] Please see Figure 1 and Figure 6 In some embodiments, the outer cover 11 has a bent and connected peripheral sidewall 13 and an end sidewall 14; the air outlet 113 and the air inlet 112 both penetrate the peripheral sidewall 13 of the outer cover 11; the air outlet 113 and the air inlet 112 are arranged around the outer periphery of the fan blade assembly 30 in a counterclockwise direction (as shown by arrow M in the figure), the blade 33 has an arc-shaped structure, the plurality of blades 33 are arranged in a counterclockwise direction and the arc-shaped opening of the blade 33 faces the counterclockwise direction.

[0082] Understandably, the air outlet 113 and the air inlet 112 are spaced counterclockwise around the central axis of the fan blade assembly 30.

[0083] Optionally, the blade 33 has an arc-shaped structure.

[0084] It should be noted that in this embodiment, both the air outlet 113 and the air inlet 112 extend along the extension direction of the blade 33.

[0085] Understandably, each blade 33 bends in a counterclockwise direction, thus giving the blade 33 an arc-shaped structure.

[0086] In this embodiment, the air outlet 113 and the air inlet 112 are arranged counterclockwise around the outer periphery of the fan blade assembly 30. The blades 33 have an arc-shaped structure, and the plurality of blades 33 are arranged counterclockwise with their arc-shaped openings facing counterclockwise. Thus, when the drive mechanism 50 drives the fan blade assembly 30 to rotate counterclockwise, a larger airflow can be driven to enter from the air inlet 112 and exit from the air outlet 113, increasing the airflow of the heat dissipation device 100 and thereby improving its heat dissipation efficiency.

[0087] Please see Figure 1 and Figure 7 In other embodiments, the outer cover 11 has a bent and connected peripheral sidewall 13 and an end sidewall 14; the air outlet 113 and the air inlet 112 both penetrate the peripheral sidewall 13 of the outer cover 11; the air outlet 113 and the air inlet 112 are arranged around the outer periphery of the fan blade assembly 30 in a clockwise direction (as shown by arrow N in the figure), the blades 33 have an arc-shaped structure, the plurality of blades 33 are arranged in a clockwise direction and the arc-shaped opening of the blades 33 faces the clockwise direction.

[0088] Understandably, the air outlet 113 and the air inlet 112 are spaced apart clockwise around the central axis of the fan blade assembly 30.

[0089] Optionally, the blade 33 has an arc-shaped structure.

[0090] It should be noted that, in this embodiment, both the air outlet 113 and the air inlet 112 extend along the extension direction of the blade 33.

[0091] Understandably, each blade 33 bends in a clockwise direction, thus giving the blade 33 an arc-shaped structure.

[0092] In this embodiment, the air outlet 113 and the air inlet 112 are arranged clockwise around the outer periphery of the fan blade assembly 30. The blades 33 have an arc-shaped structure, and the plurality of blades 33 are arranged clockwise with their arc-shaped openings facing clockwise. Thus, when the drive mechanism 50 drives the fan blade assembly 30 to rotate clockwise, a larger airflow can be driven to enter from the air inlet 112 and exit from the air outlet 113, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0093] In other embodiments, the air inlet 112 may be provided on at least one of the peripheral sidewall 13 and the end sidewall 14.

[0094] Please see again Figure 4 and Figure 5In some embodiments, the fan blade assembly 30 further includes a first connecting shaft 34 and a second connecting shaft 35. The first connecting shaft 34 is connected to the end of the first connecting portion 31 opposite to the second connecting portion 32 and is rotatably inserted through the outer cover 11. The second connecting shaft 35 connects the first connecting portion 31 and the second connecting portion 32. The plurality of blades 33 are spaced apart around the outer periphery of the second connecting shaft 35. The fan blade assembly 30 also has a through hole 301, which passes through the second connecting portion 32 and part of the second connecting shaft 35. The drive mechanism 50 includes a drive portion 51 and a power output shaft 52. The drive portion 51 is used to drive the power output shaft 52 to rotate relative to the drive portion 51. The power output shaft 52 passes through the through hole 301 to drive the fan blade assembly 30 to rotate.

[0095] Optionally, the drive unit 51 is a motor.

[0096] In one embodiment, the first connecting shaft 34, the second connecting shaft 35, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 can be an integral structure, that is, the first connecting shaft 34, the second connecting shaft 35, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 are different parts of the same component. In another embodiment, the first connecting shaft 34, the second connecting shaft 35, the first connecting portion 31, the second connecting portion 32, and the plurality of blades 33 can be at least partially composed of multiple independent components, which are then assembled together.

[0097] Understandably, the mounting hole is a blind hole.

[0098] In this embodiment, the cooperation of the first connecting shaft 34 and the second connecting shaft 35 allows the fan blade assembly 30 to be rotatably mounted on the outer cover 11. Furthermore, by setting the second connecting shaft 35, it is beneficial to increase the connection length between the power output shaft 52 of the drive mechanism 50 and the fan blade assembly 30, thereby better driving the fan blade assembly 30 to rotate. Moreover, the second connecting shaft 35 is located between the first connecting part 31 and the second connecting part 32, and will not occupy additional space or increase the volume of the fan blade assembly 30.

[0099] Please see Figure 8 and Figure 9In other embodiments, the fan blade assembly 30 includes a first connecting shaft 34, a second connecting shaft 35, and a plurality of blades 33. The first connecting shaft 34 and the second connecting shaft 35 are arranged and connected along their extension direction. The plurality of blades 33 are spaced around the outer periphery of the first connecting shaft 34 and the second connecting shaft 35 and are all connected to the first connecting shaft 34 and the second connecting shaft 35. The end of the first connecting shaft 34 facing away from the second connecting shaft 35 is rotatably inserted through the outer cover 11. The end of the second connecting shaft 35 facing away from the first connecting shaft 34 is connected to the drive mechanism 50.

[0100] It should be noted that, in Figure 9 In the schematic diagram of the accompanying drawings, the number of blades 33 is two. However, the number of blades 33 in this application can be at least two, that is, it can also be other numbers besides two.

[0101] It should be noted that the extending directions of the first connecting shaft 34, the second connecting shaft 35, and the plurality of blades 33 are all parallel to the central axis. In this embodiment, the plurality of blades 33 may have the first connecting shaft 34 and the second connecting shaft 35 as their central axes.

[0102] Understandably, the end of the second connecting shaft 35 opposite to the first connecting shaft 34 is connected to the power output shaft 52 of the drive mechanism 50.

[0103] In this embodiment, the fan blade assembly 30 includes a first connecting shaft 34, a second connecting shaft 35, and a plurality of blades 33. The first connecting shaft 34 and the second connecting shaft 35 are arranged and connected along their extending directions. The plurality of blades 33 are spaced apart around the outer periphery of the first connecting shaft 34 and the second connecting shaft 35, and are all connected to the first connecting shaft 34 and the second connecting shaft 35. The fan blade assembly 30 of this embodiment has a simple structure and small size, which is beneficial to the miniaturization of the heat dissipation device 100.

[0104] Please see Figure 9 and Figure 10In some embodiments, the second connecting shaft 35 has interconnected through holes 301 and multiple positioning holes 302. The through holes 301 penetrate the surface of the second connecting shaft 35 away from the first connecting shaft 34. The multiple positioning holes 302 are spaced apart, and each positioning hole 302 communicates with the through holes 301 and penetrates the sidewall of the second connecting shaft 35 and the surface of the second connecting shaft 35 away from the first connecting shaft 34. The driving mechanism 50 includes a driving part 51 and a power output shaft 52. The driving part 51 is used to drive the power output shaft 52 to rotate relative to the driving part 51. The power output shaft 52 includes a shaft body 521 and a plurality of positioning parts 522. The shaft body 521 is connected to the driving part 51. The plurality of positioning parts 522 are spaced apart on the outer periphery of the shaft body 521. The shaft body 521 passes through the through hole 301. The positioning parts 522 pass through the positioning holes 302, and the positioning parts 522 correspond one-to-one with the positioning holes 302.

[0105] Understandably, the second connecting shaft 35 is sleeved on the outer periphery of the shaft body portion 521 of the power output shaft 52.

[0106] Optionally, the number of positioning holes 302 and positioning parts 522 can be two, three, four, etc. In the schematic drawings of this application, two positioning holes 302 and two positioning parts 522 are used as examples for illustration, and should not be construed as a limitation on the fan blade assembly 30 and drive mechanism 50 of the embodiments of this application.

[0107] It should be noted that the positioning part 522 corresponds one-to-one with the positioning hole 302. Understandably, one positioning part 522 corresponds to one positioning hole 302, and different positioning parts 522 are set in different positioning holes 302.

[0108] In this embodiment, the second connecting shaft 35 has a through hole 301 and multiple positioning holes 302. The power output shaft 52 includes a shaft body 521 and multiple positioning parts 522. Through the design and coordination of the structures of the second connecting shaft 35 and the power output shaft 52 of the drive mechanism 50, the installation and connection between the fan blade assembly 30 and the drive mechanism 50 can be better realized. When the drive mechanism 50 is started and the power output shaft 52 rotates, the multiple positioning parts 522 are engaged in the multiple positioning holes 302. Through the cooperation between the positioning parts 522 and the positioning holes 302, relative sliding or movement between the power output shaft 52 and the second connecting shaft 35 is avoided, thereby better driving the fan blade assembly 30 to rotate, which is beneficial to the transmission of force and can better ensure the stability of the air outlet of the heat dissipation device 100.

[0109] Optionally, the radial dimension of the second connecting shaft 35 is larger than that of the first connecting shaft 34. This can better ensure the mechanical strength and rigidity of the second connecting shaft 35 and improve the service life of the fan blade assembly 30.

[0110] Please see again Figure 8 and Figure 9 In some embodiments, the mounting structure 12 is a positioning post.

[0111] Optionally, the positioning post can be at least one of a cylinder, a rectangular post, a triangular post, etc.

[0112] When the heat sink 100 is mounted on the circuit board, the positioning posts can pass through the mounting holes of the circuit board, thereby positioning the heat sink 100 and the circuit board to prevent misalignment. The structure is simple and easy to install, further simplifying the installation of the heat sink 100. Furthermore, the mounting structure 12 can also be soldered to the circuit board (e.g., connected to the circuit board via surface mount technology (SMT)) to achieve connection with the circuit board, or connected to the circuit board via other connectors.

[0113] Please see Figure 11 In other embodiments, the mounting structure 12 includes an adapter 121, a first latching portion 122, and a second latching portion 123. One end of the adapter 121 is connected to the outer cover 11. The first latching portion 122 and the second latching portion 123 are located on opposite sides of the adapter 121. The end of the first latching portion 122 facing away from the outer cover 11 is connected to the end of the adapter 121 facing away from the outer cover 11. In the direction from the end of the adapter 121 connected to the end of the outer cover 11, the distance between the first snap-fit ​​part 122 and the adapter 121 gradually increases; the end of the second snap-fit ​​part 123 opposite to the outer cover 11 is connected to the end of the adapter 121 opposite to the outer cover 11, and in the direction from the end of the adapter 121 opposite to the outer cover 11 connected to the end of the outer cover 11, the distance between the second snap-fit ​​part 123 and the adapter 121 gradually increases.

[0114] Understandably, the dimensions of the mounting structure 12 gradually increase from the end furthest from the outer cover 11 toward the end connected to the outer cover 11. This makes it easier for the mounting structure 12 to pass through the mounting holes of the circuit board.

[0115] Optionally, the first snap-fit ​​portion 122 and the second snap-fit ​​portion 123 have a certain degree of bendability and resilience.

[0116] Optionally, the adapter 121, the first snap-fit ​​part 122, and the second snap-fit ​​part 123 can be an integral structure.

[0117] It should be noted that the end of the first snap-fit ​​portion 122 away from the adapter portion 121 is spaced apart from the outer cover 11, and the end of the second snap-fit ​​portion 123 away from the adapter portion 121 is spaced apart from the outer cover 11.

[0118] When the heat dissipation device 100 is installed on the circuit board, the end of the mounting structure 12 facing away from the outer cover 11 enters the mounting hole of the circuit board. As the mounting structure 12 is gradually inserted, the first latching part 122 and the second latching part 123 both abut against the circuit board and gradually undergo elastic deformation. When the mounting structure 12 is inserted to the point where the first latching part 122 and the second latching part 123 are located on the other side of the circuit board, the first latching part 122 and the second latching part 123 return to their original positions and are latched on the other side of the circuit board. At this time, the outer cover 11 is located on one side of the circuit board, and the first latching part 122 and the second latching part 123 are at least partially located on the other side of the circuit board.

[0119] In this embodiment, the mounting structure 12 includes an adapter 121, a first snap-fit ​​part 122, and a second snap-fit ​​part 123. When the heat dissipation device 100 is mounted on the circuit board, the outer cover 11 is located on one side of the circuit board, and the first snap-fit ​​part 122 and the second snap-fit ​​part 123 are at least partially located on the other side of the circuit board and snap-fitted to the circuit board. Through the cooperation of the first snap-fit ​​part 122 and the second snap-fit ​​part 123, the heat dissipation device 100 can be mounted on the circuit board without soldering or setting other mounting structures 12, which simplifies the installation of the heat dissipation device 100 and improves the assembly efficiency of the heat dissipation device 100 and the circuit board.

[0120] Please see Figure 11 In some embodiments, the first latching portion 122 includes a first latching sub-portion 1221 and a second latching sub-portion 1222 connected together. One end of the first latching sub-portion 1221 is connected to the adapter portion 121, and the second latching sub-portion 1222 is connected to the end of the first latching sub-portion 1221 opposite to the adapter portion 121. The first latching sub-portion 1221 protrudes in a direction opposite to the adapter portion 121 relative to the second latching sub-portion 1222.

[0121] The second latching portion 123 includes a third latching portion 1231 and a fourth latching portion 1232 connected together. One end of the third latching portion 1231 is connected to the adapter portion 121, and the fourth latching portion 1232 is connected to the end of the third latching portion 1231 that is away from the adapter portion 121. The third latching portion 1231 protrudes in a direction away from the adapter portion 121 compared to the fourth latching portion 1232.

[0122] It should be noted that when the heat dissipation device 100 is installed on the circuit board, the second snap-fit ​​part 1222 and the fourth snap-fit ​​part 1232 are both located inside the mounting hole of the circuit board and both abut against the inner wall of the mounting hole of the circuit board.

[0123] It should be noted that, along the arrangement direction of the second latching portion 1222 and the fourth latching portion 1232, the maximum distance between the surface of the second latching portion 1222 facing away from the fourth latching portion 1232 and the surface of the fourth latching portion 1232 facing away from the second latching portion 1222 is greater than the radial dimension of the mounting hole of the circuit board.

[0124] In this embodiment, the first latching portion 122 includes a first latching sub-portion 1221 and a second latching sub-portion 1222 connected together, and the second latching portion 123 includes a third latching sub-portion 1231 and a fourth latching sub-portion 1232 connected together. When the heat dissipation device 100 is mounted on the circuit board, the first latching sub-portion 1221 and the third latching sub-portion 1231 abut against or latch onto the circuit board facing the outer cover 11, thereby preventing the heat dissipation device 100 from falling off the circuit board; the second latching sub-portion 1222 and the fourth latching sub-portion 1232 abut against the inner wall of the mounting hole of the circuit board, thereby preventing the heat dissipation device 100 from shaking or moving relative to the circuit board. Through the cooperation of the first latching sub-portion 1221, the second latching sub-portion 1222, the third latching sub-portion 1231 and the fourth latching sub-portion 1232, the heat dissipation device 100 can be mounted on the circuit board more securely, preventing relative movement or shaking between the heat dissipation device 100 and the circuit board. Furthermore, the cooperation of the second latching portion 1222 and the fourth latching portion 1232 can also prevent the first latching portion 122 and the second latching portion 123 from opening outward when the heat dissipation device 100 is pulled away from the circuit board after it is installed on the circuit board, thereby causing the first latching portion 122 and the second latching portion 123 to break.

[0125] In some embodiments, the housing 10 is a metal housing 10. Understandably, the housing 10 is made of a metal material, which can improve the thermal conductivity of the housing 10, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0126] Optionally, the fan blade assembly 30 may be made of lightweight, high-strength materials and aerodynamically optimized to reduce wind resistance and increase airflow.

[0127] Please see Figure 12 In some embodiments, the heat dissipation device 100 further includes a dust filter 60, which is disposed at the air inlet 112. In this embodiment, by providing a dust filter 60 at the air inlet 112, dust is prevented from entering the interior of the housing 10, affecting the normal operation of the fan blade assembly 30, and improving the stability and service life of the air outlet of the heat dissipation device 100.

[0128] Optionally, the dust filter 60 can be detachably connected to the outer cover 11. This facilitates the removal of the dust filter 60, making it easier to clean regularly, preventing the dust filter 60 from becoming clogged and affecting the airflow of the heat dissipation device 100, and further improving the stability of the airflow from the heat dissipation device 100.

[0129] Please see Figure 1 and Figure 13 In some embodiments, the receiving cavity 111 includes a first receiving sub-cavity 111a and a second receiving sub-cavity 111b, and the outer cover 11 includes a first cover portion 114 and a second cover portion 115 connected together. The first cover portion 114 has a first receiving sub-cavity 111a, an air inlet 112 and an air outlet 113. The air inlet 112 and the air outlet 113 are respectively connected to the first receiving sub-cavity 111a. The first receiving sub-cavity 111a is used to receive the fan blade assembly 30, and the mounting structure 12 is disposed on the outer periphery of the surface opposite to the first receiving sub-cavity 111a. The second cover portion 115 includes a second receiving sub-cavity 111b, which is used to receive the drive mechanism 50.

[0130] It should be noted that the drive unit 51 of the drive mechanism 50 is located in the second receiving sub-cavity 111b, and the power output shaft 52 of the drive mechanism 50 passes through the through hole 301 of the fan blade assembly 30 located in the first receiving sub-cavity 111a.

[0131] In this embodiment, by providing a first receiving cavity 111a to house the fan blade assembly 30 and a second receiving cavity 111b to house the drive mechanism 50, the structure of the heat dissipation device 100 can be made more compact and smaller. Furthermore, by housing both the fan blade assembly 30 and the drive mechanism 50 within the outer casing 10, the aging of the fan blade assembly 30 and the drive mechanism 50 can be better delayed, thus extending the service life of the heat dissipation device 100.

[0132] Please see Figure 14 In some embodiments, the outer cover 11 further includes a plurality of air guides 116, which are spaced apart from the air outlet 113 and respectively connected to the first cover portion 114.

[0133] Optionally, a plurality of air guides 116 are arranged at intervals along the extension direction of the air outlet 113, and each air guide 116 is parallel to the air outlet direction of the air outlet 113.

[0134] In this embodiment, by providing multiple airflow guides 116, the airflow inside the outer cover 11 can be better directed to the air outlet 113, and the airflow flowing through the air outlet 113 can be better guided to flow out in a preset direction, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0135] In some embodiments, the housing 10 further includes a plurality of stabilizing portions 117, which are spaced apart from the mounting structure 12 and disposed on the same side of the first cover portion 114. The surfaces of the plurality of stabilizing portions 117 are coplanar with respect to the first cover portion 114, and the side of the mounting structure 12 opposite to the first cover portion 114 protrudes from the plurality of stabilizing portions 117.

[0136] Optionally, the stabilizing part 117 and the mounting structure 12 are arranged alternately in sequence.

[0137] In some embodiments, the stabilizing part 117 can be used as a pin for SMT soldering, for soldering onto a circuit board.

[0138] In this embodiment, by providing multiple stabilizing parts 117, when the heat dissipation device 100 is installed on the circuit board, the positioning post can pass through the mounting hole of the circuit board to position the heat dissipation device 100 and the circuit board, thereby preventing misalignment between the heat dissipation device 100 and the circuit board. The multiple stabilizing parts 117 facing away from the surface of the outer cover 11 can abut against the surface of the circuit board. Through the cooperation of the multiple stabilizing parts 117, the heat dissipation device 100 can be better prevented from tilting or shaking relative to the circuit board. In addition, the side of the mounting structure 12 facing away from the first cover part 114 protrudes from the multiple stabilizing parts 117, that is, the length of the mounting structure 12 is greater than the length of the stabilizing parts 117, so that the stabilizing parts 117 will not hinder the installation of the mounting structure 12.

[0139] Please see Figure 14 In some embodiments, the heat dissipation device 100 further includes a temperature sensor 70, which is carried on the housing 10 and is used to detect the temperature of the environment in which the heat dissipation device 100 is located.

[0140] Optionally, the temperature sensor 70 can be located on the side of the housing 10 near the air outlet 113. This way, when the heat sink 100 is mounted on the circuit board, the temperature sensor 70 is closer to the chip, allowing for more accurate detection of the chip's temperature and the temperature of the environment in which the chip is located.

[0141] Optionally, when the heat dissipation device 100 is mounted on the circuit board, the temperature sensor 70 can be set on the chip of the circuit board to detect the temperature of the chip.

[0142] It should be noted that when the heat dissipation device 100 is mounted on the circuit board, the temperature sensor 70 can be electrically connected to the controller on the circuit board to transmit the detected temperature information to the controller, so that the controller can determine whether to start the drive mechanism 50 based on the detected temperature. For example, when the temperature sensor 70 detects that the temperature exceeds a preset threshold (e.g., exceeding 40°C, 45°C, or 50°C, etc.), the drive mechanism 50 is started to dissipate heat from the chips on the circuit board; when the temperature sensor 70 detects that the temperature is below the preset threshold, the drive mechanism 50 is turned off, and passive heat dissipation is achieved by utilizing the natural convection and thermal radiation of the housing 10, thereby saving energy.

[0143] Please see Figure 9 and Figure 15 In some embodiments, the heat dissipation device 100 further includes an electrical connector 80, which is disposed on the same side of the housing 10 as the mounting structure 12. The electrical connector 80 is embedded in the housing 10 and at least partially exposed on the housing 10. The electrical connector 80 is electrically connected to the drive mechanism 50 and is used to load an electrical signal onto the drive mechanism 50.

[0144] It should be noted that when the heat dissipation device 100 is installed on the circuit board, the electrical connector 80 is soldered to the power supply pad on the circuit board, thereby electrically connecting to the power supply circuit of the circuit board to load voltage, current and other electrical signals onto the drive mechanism 50.

[0145] Optionally, the electrical connector 80 may also be at least partially embedded in the stabilizing part 117 and exposed on the surface of the stabilizing part 117 away from the outer cover 11.

[0146] Optionally, the electrical connector 80 is electrically connected to the drive mechanism 50 via a cable.

[0147] In this embodiment, by providing the electrical connector 80, when the heat dissipation device 100 is mounted on the circuit board, the electrical connector 80 can be soldered to the power pad of the circuit board, thereby achieving an electrical connection with the circuit board. This makes the electrical connection between the heat dissipation device 100 and the circuit board more stable, eliminating the need for external cables for electrical connection and simplifying the cable arrangement of the heat dissipation device 100. Furthermore, in this embodiment, the stabilizing part 117 can be soldered to the circuit board, or it can be soldered solely through the electrical connector 80.

[0148] Please see Figures 16 to 19This application also provides a circuit board assembly 200, which includes: a circuit board 210, a chip 220, a controller 230, and a heat dissipation device 100 as described in this application embodiment. The circuit board 210 has a mounting hole 211; the chip 220 is supported on the circuit board 210 and is disposed close to the mounting hole 211; the controller 230 is supported on the circuit board 210 and electrically connected to the chip 220; the heat dissipation device 100 is supported on the circuit board 210, the mounting structure 12 passes through the mounting hole 211, the air outlet 113 faces the chip 220, and the drive mechanism 50 is electrically connected to the controller 230 for working under the control of the controller 230.

[0149] Optionally, the chip 220 may be, but is not limited to, a memory chip, a system-on-a-chip, a processor, or other chip 220 that generates a large amount of heat.

[0150] Optionally, the length of the air outlet 113 along its extension direction (i.e., perpendicular to the air outlet direction) is greater than or equal to the length of the chip 220. This can better improve the heat dissipation efficiency of the heat dissipation device 100 for the chip 220.

[0151] For a detailed description of other aspects of the heat dissipation device 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0152] It should be noted that the number of mounting holes 211 corresponds one-to-one with the number of mounting structures 12 of the heat dissipation device 100, or the number of mounting holes 211 is equal to the number of mounting structures 12 of the heat dissipation device 100, with one mounting structure 12 passing through one mounting hole 211, and different mounting structures 12 being set in different mounting holes 211.

[0153] Optionally, the controller 230 may include, but is not limited to, one or more general-purpose processors. These general-purpose processors can be any type of device capable of processing electronic instructions, including central processing units (CPUs), microprocessors, microcontrollers, main processors, controllers, and ASICs, etc. The processor executes various types of digital storage instructions, such as software or firmware programs stored in memory, enabling the computing device to provide a wide range of services.

[0154] The circuit board assembly 200 of this application embodiment includes a circuit board 210, a chip 220, a controller 230, and a heat dissipation device 100 as described in this application embodiment. The air outlet 113 of the heat dissipation device 100 faces directly towards the chip 220, so that the airflow from the heat dissipation device 100 directly dissipates heat from the chip 220, which can better improve heat dissipation efficiency and dissipate the heat generated by the chip 220 in a timely manner, preventing the chip 220 from overheating and affecting its performance and lifespan. In addition, the heat dissipation device 100 is directly mounted on the circuit board 210, which makes the structure more compact and does not occupy extra space. This can greatly reduce the size of the circuit board assembly 200 and the size of the electronic device using the circuit board assembly 200, making the electronic device more miniaturized. Furthermore, the heat dissipation device 100 of this application can be integrated into the circuit board 210 by SMT soldering or clip-on, without the need for additional installation space and fixing devices, reducing the design and manufacturing complexity of the electronic device.

[0155] Please see Figure 20 This application also provides an electronic device 300, which includes the circuit board assembly 200 described in this application embodiment.

[0156] Optionally, the electronic device 300 may be, but is not limited to, a portable electronic device 300 such as a mobile phone, computer, tablet computer, or laptop computer. Optionally, the electronic device 300 may be, but is not limited to, a transportation device such as a car, sedan, truck, van, or electric vehicle.

[0157] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form yet another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0158] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A heat dissipating device (100), characterized in that, The heat dissipation device (100) includes: The outer casing (10) includes a connected outer cover (11) and a mounting structure (12). The outer cover (11) has a receiving cavity (111), an air inlet (112), and an air outlet (113). The air inlet (112) and the air outlet (113) are spaced apart. The air inlet (112) is connected to the outside of the receiving cavity (111) and the outer casing (10), respectively. The air outlet (113) is connected to the outside of the receiving cavity (111) and the outer casing (10), respectively. The mounting structure (12) is disposed on the surface of the outer cover (11) opposite to the receiving cavity (111). A fan blade assembly (30), the fan blade assembly (30) being disposed within the receiving cavity (111) and rotatably connected to the outer cover (11); and A drive mechanism (50) is mounted on the housing (10) and connected to the fan blade assembly (30) for driving the fan blade assembly (30) to rotate relative to the housing (10) to drive airflow.

2. The heat dissipation device (100) according to claim 1, characterized in that, The fan blade assembly (30) includes a first connecting part (31), a second connecting part (32), and a plurality of blades (33). The first connecting part (31) and the second connecting part (32) are spaced apart, and the plurality of blades (33) are all located between the first connecting part (31) and the second connecting part (32). The first connecting part (31) is rotatably connected to the housing (10), and the second connecting part (32) is connected to the drive mechanism (50). Each blade (33) is along the first connecting part (31). The blades (33) extend in the direction of the arrangement of the first connecting part (31) and the second connecting part (32), respectively connecting the two ends of each blade (33) to the first connecting part (31) and the second connecting part (32). Multiple blades (33) are arranged in sequence at intervals around the outer edge of the first connecting part (31) and the outer edge of the second connecting part (32). The extension direction of the air outlet (113) is parallel to the extension direction of the blades (33), and the air outlet direction of the air outlet (113) intersects with the extension direction of the air outlet (113).

3. The heat dissipating device (100) according to claim 2, characterized in that The outer cover (11) has a bent and connected peripheral sidewall (13) and end sidewall (14); the air outlet (113) and the air inlet (112) both penetrate the peripheral sidewall (13) of the outer cover (11); the air outlet (113) and the air inlet (112) are arranged counterclockwise around the outer periphery of the fan blade assembly (30); the blade (33) has an arc-shaped structure; the plurality of blades (33) are arranged counterclockwise and the arc-shaped opening of the blade (33) faces counterclockwise. or, The outer cover (11) has a bent and connected peripheral sidewall (13) and end sidewall (14); the air outlet (113) and the air inlet (112) both penetrate the peripheral sidewall (13) of the outer cover (11); the air outlet (113) and the air inlet (112) are arranged around the outer periphery of the fan blade assembly (30) in a clockwise direction, the blade (33) has an arc-shaped structure, the plurality of blades (33) are arranged in a clockwise direction and the arc-shaped opening of the blade (33) faces the clockwise direction.

4. The heat dissipating device (100) according to claim 2, characterized in that The fan blade assembly (30) further includes a first connecting shaft (34) and a second connecting shaft (35). The first connecting shaft (34) is connected to the end of the first connecting part (31) away from the second connecting part (32) and is rotatably inserted through the outer cover (11). The second connecting shaft (35) is connected between the first connecting part (31) and the second connecting part (32). The plurality of blades (33) are spaced around the outer periphery of the second connecting shaft (35). The fan blade assembly (30) also has a through hole (301) that passes through the second connecting part (32) and part of the second connecting shaft (35). The drive mechanism (50) includes a drive part (51) and a power output shaft (52). The drive part (51) is used to drive the power output shaft (52) to rotate relative to the drive part (51). The power output shaft (52) passes through the through hole (301) to drive the fan blade assembly (30) to rotate.

5. The heat dissipating device (100) according to claim 1, characterized in that The fan blade assembly (30) includes a first connecting shaft (34), a second connecting shaft (35), and a plurality of blades (33). The first connecting shaft (34) and the second connecting shaft (35) are arranged and connected along their extension direction. The plurality of blades (33) are spaced around the outer periphery of the first connecting shaft (34) and the second connecting shaft (35) and are all connected to the first connecting shaft (34) and the second connecting shaft (35). The end of the first connecting shaft (34) facing away from the second connecting shaft (35) is rotatably inserted through the outer cover (11). The end of the second connecting shaft (35) facing away from the first connecting shaft (34) is connected to the drive mechanism (50).

6. The heat dissipating device (100) according to claim 2, characterized in that The second connecting shaft (35) has interconnected through holes (301) and multiple positioning holes (302). The through holes (301) penetrate the surface of the second connecting shaft (35) away from the first connecting shaft (34). The multiple positioning holes (302) are spaced apart, and each positioning hole (302) is connected to the through holes (301) and penetrates the side wall of the second connecting shaft (35) and the surface of the second connecting shaft (35) away from the first connecting shaft (34). The driving mechanism (50) includes a driving part (51) and a power output shaft (52). The part (51) is used to drive the power output shaft (52) to rotate relative to the drive part (51). The power output shaft (52) includes a shaft body part (521) and a plurality of positioning parts (522). The shaft body part (521) is connected to the drive part (51). The plurality of positioning parts (522) are spaced apart on the outer periphery of the shaft body part (521). The shaft body part (521) passes through the through hole (301). The positioning parts (522) pass through the positioning holes (302). The positioning parts (522) correspond one-to-one with the positioning holes (302).

7. The heat dissipation device (100) according to claim 1, characterized in that, The installation structure (12) is a positioning post, which includes at least one of a cylindrical column, a rectangular column, and a triangular column; or, The mounting structure (12) includes a connecting part (121), a first snap-fit ​​part (122), and a second snap-fit ​​part (123). One end of the connecting part (121) is connected to the outer cover (11). The first snap-fit ​​part (122) and the second snap-fit ​​part (123) are located on opposite sides of the connecting part (121). The end of the first snap-fit ​​part (122) facing away from the outer cover (11) is connected to the end of the connecting part (121) facing away from the outer cover (11). In the direction where part (121) is connected to one end of the outer cover (11), the distance between the first snap-fit ​​part (122) and the adapter part (121) gradually increases; the end of the second snap-fit ​​part (123) away from the outer cover (11) is connected to the end of the adapter part (121) away from the outer cover (11); from the end of the adapter part (121) away from the outer cover (11) to the end of the adapter part (121) connected to the outer cover (11), the distance between the second snap-fit ​​part (123) and the adapter part (121) gradually increases.

8. The heat dissipating device (100) according to claim 7, characterized in that The first snap-fit ​​portion (122) includes a first snap-fit ​​sub-portion (1221) and a second snap-fit ​​sub-portion (1222) connected together. One end of the first snap-fit ​​sub-portion (1221) is connected to the adapter portion (121), and the second snap-fit ​​sub-portion (1222) is connected to the end of the first snap-fit ​​sub-portion (1221) opposite to the adapter portion (121). The first snap-fit ​​sub-portion (1221) protrudes in a direction opposite to the adapter portion (121) compared to the second snap-fit ​​sub-portion (1222). The second latching portion (123) includes a third latching sub-portion (1231) and a fourth latching sub-portion (1232) connected together. One end of the third latching sub-portion (1231) is connected to the adapter portion (121), and the fourth latching sub-portion (1232) is connected to the end of the third latching sub-portion (1231) that is away from the adapter portion (121). The third latching sub-portion (1231) protrudes in a direction away from the adapter portion (121) compared to the fourth latching sub-portion (1232).

9. The heat dissipating device (100) according to claim 1, characterized in that The outer casing (10) is a metal casing (10); And / or, The heat dissipation device (100) also includes a dustproof net (60), which is disposed at the air inlet (112).

10. The heat dissipating device (100) according to claim 1, characterized in that The receiving cavity (111) includes a first receiving sub-cavity (111a) and a second receiving sub-cavity (111b). The outer cover (11) includes a first cover portion (114) and a second cover portion (115) connected together. The first cover portion (114) has a first receiving sub-cavity (111a), an air inlet (112), and an air outlet (113). The air inlet (112) and the air outlet (113) are respectively connected to the first receiving sub-cavity (111a). The first receiving sub-cavity (111a) is used to receive the fan blade assembly (30). The mounting structure (12) is disposed on the outer periphery of the surface opposite to the first receiving sub-cavity (111a). The second cover portion (115) includes a second receiving sub-cavity (111b). The second receiving sub-cavity (111b) is used to receive part of the drive mechanism (50).

11. The heat dissipating device (100) according to claim 10, characterized in that The outer cover (11) also includes a plurality of air guides (116), which are spaced apart from the air outlet (113) and are respectively connected to the first cover body (114); And / or, The outer casing (10) further includes a plurality of stabilizing parts (117), which are spaced apart from the mounting structure (12) on the same side of the first cover part (114). The surfaces of the plurality of stabilizing parts (117) facing away from the first cover part (114) are coplanar, and the side of the mounting structure (12) facing away from the first cover part (114) protrudes from the plurality of stabilizing parts (117).

12. The heat dissipating device (100) according to any one of claims 1-11, characterized in that The heat dissipation device (100) also includes a temperature sensor (70), which is carried on the housing (10) and is used to detect the temperature of the environment in which the heat dissipation device (100) is located.

13. The heat dissipating device (100) according to any one of claims 1-11, characterized in that The heat dissipation device (100) further includes an electrical connector (80), which is disposed on the same side of the housing (10) as the mounting structure (12). The electrical connector (80) is embedded in the housing (10) and at least partially exposed outside the housing (10). The electrical connector (80) is electrically connected to the drive mechanism (50) and is used to load an electrical signal onto the drive mechanism (50).

14. A circuit board (210) assembly (200), characterized by include: A circuit board (210) having mounting holes (211); A chip (220) is mounted on the circuit board (210) and is disposed near the mounting hole (211); A controller (230), which is mounted on the circuit board (210) and electrically connected to the chip (220); and The heat dissipation device (100) according to any one of claims 1-11 is supported on the circuit board (210), the mounting structure (12) passes through the mounting hole (211), the air outlet (113) faces the chip (220), and the driving mechanism (50) is electrically connected to the controller (230) for working under the control of the controller (230).

15. An electronic device (300), characterized by The electronic device (300) includes the circuit board (210) assembly (200) as described in claim 14.

Images