A heat dissipation device for a therapeutic instrument

Abstract

The utility model relates to medical instrument technical field, more particularly, relate to a heat abstractor for therapeutic instrument, including therapeutic instrument body and main control box, be equipped with circuit board in main control box, heat abstractor part embeds main control box cavity, and heat abstractor includes: semiconductor refrigeration piece, one side is pasted circuit board heat -generating surface, heat -conducting gasket, one side is pasted semiconductor refrigeration piece, and the other side has heat dissipation frame and is used for heat conduction, heat dissipation frame, one side wall is equipped with opening, and its installation cavity can detachably connect heat dissipation fin, base, is elastically connected in heat dissipation frame bottom, and the side portion is through pressing piece and opening joint, and base pops up when through pressing piece solution limit, and heat dissipation fin is pushed out, fan, is opposite heat dissipation fin and is set through main control box inner wall, and the application aims at providing a heat abstractor for therapeutic instrument that can effectively improve heat dissipation efficiency and is convenient for cleaning.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, and more specifically, to a heat dissipation device for a therapeutic instrument. Background Technology

[0002] The Meridian Flow Acupoint Therapy Device is a medical device that uses electrical current to stimulate specific acupoints on the human body, combined with the traditional theory of meridian flow to achieve therapeutic effects. This device effectively improves the flow of Qi and blood in the body's meridians, relieves pain, promotes local blood circulation and tissue repair. Due to its ease of operation and significant effects, it is widely used in orthopedic rehabilitation, pain management, and as an adjunct treatment for some chronic diseases. With the development of modern electrotherapy technology and the increasing understanding of meridian therapy, the clinical application value and market potential of the Meridian Flow Acupoint Therapy Device are gradually becoming more prominent.

[0003] Application number CN202321939566.1 discloses a meridional flow low-frequency therapeutic instrument, comprising an instrument body and connecting wires for transmitting low-frequency current. The instrument body has multiple take-up grooves at its bottom, each containing a winding mechanism for winding the connecting wires. This invention, by creating multiple take-up grooves at the bottom of the instrument body and adding winding mechanisms within them, allows the connecting wires to be wound into the grooves when not in use, preventing breakage or scattering due to external impacts. A locking mechanism limits the connecting wires when they are pulled out, preventing automatic retraction. A cycloidal winding mechanism ensures the connecting wires are evenly wound onto the winding drum during winding, preventing tangling.

[0004] In existing meridian flow acupoint therapy devices, the heat dissipation device is usually located inside the device, relying on a fan to force airflow to reduce temperature. However, because the heat dissipation device is placed in a semi-enclosed cavity, dust is easily introduced during airflow and accumulates in the heat dissipation fins and internal structure. Dust accumulation reduces the heat conduction efficiency of the heat dissipation fins, resulting in a decrease in overall heat dissipation. This not only affects the stable operation and lifespan of electronic components but also the heat dissipation performance of the therapy device. Therefore, how to effectively solve the problem of dust accumulation inside the heat dissipation device and simultaneously improve heat dissipation efficiency has become an urgent technical problem to be solved. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a heat dissipation device for therapeutic instruments that is easy to clean and can effectively improve heat dissipation efficiency.

[0006] This utility model adopts the following technical solution: a heat dissipation device for a therapeutic instrument, including a therapeutic instrument body and a main control box. The main control box contains a circuit board, and the heat dissipation device is partially embedded in the cavity of the main control box. The heat dissipation device includes: a semiconductor cooling chip, one side of which is attached to the heating surface of the circuit board for actively cooling the circuit board; a thermally conductive pad, one side of which is attached to the semiconductor cooling chip and the other side of which abuts against a heat sink frame for conducting heat; a heat sink frame, one side wall of which has an opening, and a heat sink fin can be detachably connected to its mounting cavity; a base, which is elastically connected to the bottom of the heat sink frame, and its side is engaged with the opening via a pressing member. When the pressing member is released, the base springs up, pushing the heat sink fin out; a fan, which is positioned directly opposite the heat sink fin and penetrates the inner wall of the main control box for achieving air convection; wherein, the semiconductor cooling chip absorbs the heat generated by the circuit board, transfers it to the heat sink frame via the thermally conductive pad, and dissipates heat in conjunction with the fan through the detachable heat sink fins.

[0007] As a preferred technical solution of this utility model, the heat sink is hollow between the two side walls, and its ends are respectively provided with slots, and the heat-conducting pads abut against the slots.

[0008] As a preferred technical solution of this utility model, the side wall with an opening on the heat sink is the first side wall, and the side opposite the first side wall is the second side wall. A plurality of heat dissipation holes are provided above the opening on the first side wall. Sliding grooves are provided on the inner sides of the first side wall and the second side wall respectively. The sliding groove of the first side wall is adapted to the pressing member, and the sliding groove of the second side wall is adapted to the side of the base. The base can be raised and lowered vertically within the heat sink through the sliding grooves on both sides.

[0009] As a preferred technical solution of this utility model, the heat dissipation fins are tightly attached to the thermal pad through the hollow part of the heat dissipation frame, and are composed of a number of sinusoidal metal fins arranged in an array along the length of the heat dissipation frame. The gaps between adjacent metal fins form a wave-shaped airflow channel to increase the heat dissipation area and improve the heat dissipation efficiency.

[0010] As a preferred technical solution of this utility model, an outlet is provided through the main control box above the heat sink, and a flip cover is provided at the outlet; a through strip-shaped slot is provided on the side of the main control box, so that the heat dissipation hole and the pressing part can be exposed through the slot.

[0011] As a preferred technical solution of this utility model, the pressing surface of the pressing member includes: a recessed portion in the middle and end faces on both sides, and universal ball bearings are respectively provided on the end faces.

[0012] As a preferred technical solution of this utility model, the side wall with the opening is provided with a groove corresponding to the lifting path of the universal ball. The groove is provided through the side wall, with a dustproof net on its outer side and a pressing member below on its inner side. A limit is provided in the middle of the groove along its length, so that the universal ball can slide up and down along the inner side of the groove.

[0013] As a preferred technical solution of this utility model, the therapeutic instrument body is further provided with a main unit, and the main control box is fixedly connected to the back side of the main unit. The main unit includes a touch screen and a sound outlet below the touch screen.

[0014] As a preferred technical solution of this utility model, the main control box is also provided with electrode wire sockets and wiring holes. Electrode wire sockets are electrically connected to electrode connection wires. The upper two sides of the therapeutic instrument body are provided with wire receiving parts for storing electrode connection wires.

[0015] As a preferred technical solution of this utility model, the front side of the therapeutic instrument body is provided with a drawer, which is divided into a first drawer at the top and a second drawer at the bottom.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This application utilizes a push-in mechanism that engages with the base's limiting structure. Users can release the base's limiting position simply by pushing inward using the exposed push-in mechanism on the side of the main control box. This allows the elastic structure to drive the base up and down, propelling the heat dissipation fins. Combined with a through-hole opening on the top of the main control box, this enables convenient replacement and cleaning of the heat dissipation fins without disassembling the main control box, effectively solving the problem of dust accumulation inside existing heat dissipation devices. Simultaneously, the sinusoidal wave metal heat dissipation fins arrayed along the length of the heat sink significantly expand the effective heat exchange area, forming wave-shaped airflow channels between the fins. With the tight fit between the thermal pads and the wave-shaped fins, heat can be efficiently transferred to the wave-shaped fin assembly via the semiconductor cooling chip and thermal pads. The fan then guides the airflow, creating directional turbulence that enhances the heat exchange between the air and the fins, greatly improving heat dissipation efficiency, ensuring stable operation of electronic components, and extending the lifespan of the therapeutic device.

[0017] The specific technical solution and beneficial effects of this utility model will be described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the therapeutic device of this application. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the therapeutic device of this application. Figure 2 ; Figure 3 This is a rear view of the overall structure of the treatment device of this application; Figure 4 This is a schematic diagram of the heat dissipation device in Embodiment 1; Figure 5 This is a schematic diagram of the internal structure of the heat sink in Embodiment 1; Figure 6 This is a schematic diagram of the heat dissipation device in Embodiment 2; Figure 7 This is a structural diagram of a preferred embodiment of the pressing component of this application; In the diagram: 1. Treatment device body; 11. Cable retraction section; 12. Drawer; 13. Movable base; 2. Main control box; 21. Electrode wire socket; 22. Wiring hole; 3. Heat dissipation device; 31. Semiconductor cooling chip; 32. Thermal pad; 33. Heat sink; 34. Heat dissipation fins; 35. Base; 36. Pressing component; 361. Recessed surface; 362. Universal ball bearing; 37. Spring; 38. Fan; 331. First side wall; 332. Second side wall; 333. Heat dissipation hole; 4. Flip cover; 5. Main unit; 51. Touch screen; 52. Sound outlet; Detailed Implementation To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Please see Figures 1 to 5As shown in Embodiment 1 of this application, a heat dissipation device for a therapeutic instrument is provided. The heat dissipation device 3 includes a semiconductor cooling chip 31, a thermal pad 32, a heat sink frame 33, heat dissipation fins 34, and a fan 38. Specifically, the heat dissipation device 3 is partially embedded in the cavity of the main control box 2 of the therapeutic instrument. The main control box 2 has a circuit board inside. The semiconductor cooling chip 31 is energized and closely adheres to the heating surface of the circuit board to achieve active heat absorption. The heat is transferred from the semiconductor cooling chip 31 to the thermal pad 32. The thermal pad 32 is fixed to the slot at the end of the heat sink frame 33 by abutment, transferring the heat to the heat dissipation fins 34 in the heat sink frame 33. The heat sink frame 33 has a hollow structure between its two side walls. The heat dissipation fins 34 are installed in the mounting cavity of the heat sink frame 33 and are fully adhered to the thermal pad 32 through the hollow structure, allowing the heat to be directly transferred to the heat dissipation fins 34, achieving efficient heat transfer.

[0021] The first side wall 331 of the heat sink 33 has an opening, and a heat dissipation hole 333 is provided above the opening. A pressing element 36 is provided inside the opening. The end of the pressing element 36 is engaged with the side of the base 35 and is kept in a limited position by a spring 37. When the pressing element 36 is pushed inward, the limiting relationship between the pressing element 36 and the opening is released. Since the bottom of the base 35 is elastically connected to the bottom of the heat sink 33 by the spring 37, the base 35 rises vertically along the heat sink 33, which facilitates the removal, disassembly and cleaning of the heat sink fins 34. The sliding groove of the first side wall 331 is adapted to the contour of the pressing element 36 to ensure that the pressing element 36 can rise and fall synchronously with the base 35 after the limiting is released. The sliding groove of the second side wall 332 is only used to provide smooth guidance when the base 35 is raised and lowered. The fan 38 is located on the inner wall of the main control box 2 and faces the heat sink fins 34. It achieves air convection through the through outlet at the top of the main control box 2. The side of the main control box 2 has a strip-shaped slot so that the heat dissipation hole 333 and the pressing element 36 are exposed for heat dissipation.

[0022] Working principle of Example 1: First, place the necessary medications for treatment in drawer 12. Push the treatment device 1 to the working position. Connect the electrode connection wire to the electrode wire socket 21 to output electromagnetic waves for treatment. When heat dissipation is required, activate the heat dissipation device 3. After the semiconductor cooling chip 31 is powered on, it actively absorbs the heat from the surface of the circuit board inside the main control box 2. The heat is efficiently transferred to the hollow heat sink 33 via the thermal pad 32, and then transferred to the surface of the heat sink fins 34. The fan 38 is positioned directly opposite the fins, and the airflow passes through the heat dissipation channel, carrying the heat away from the inside of the main control box 2 through the heat dissipation holes 333. When it is necessary to replace and clean the heat sink fins 34 later, the pressing part 36 and the base 35 structure allow for convenient disassembly and cleaning of the fins and internal dust.

[0023] See further Figure 6As shown, in another embodiment of this application, the heat dissipation fins 34 of Embodiment 2 employ a plurality of sinusoidal wave metal fins arranged in an array along the length of the heat sink 33. Each metal fin maintains a uniform spacing and is installed inside the hollow heat sink 33, tightly fitting against the thermal pad 32 to ensure efficient heat transfer from the thermal pad 32 to the entire wave fin assembly. Thus, the gaps between adjacent metal fins form a wavy airflow channel, which significantly increases the heat dissipation surface area and generates a turbulence effect, allowing the air blown by the fan 38 to exchange more fully with the fin surface when passing through the wavy channel, thereby improving heat exchange efficiency.

[0024] Working principle of Example 2: After the semiconductor cooling chip 31 absorbs the heat from the circuit board, it comes into full contact with the wave-shaped fins through the thermal pad 32. The heat is rapidly diffused through the large-area sinusoidal wave metal fins. When the fan 38 blows air, the airflow passes through the wave-shaped channel, which significantly increases the contact area and disturbance between the air and the fin surface, thereby greatly enhancing the cooling effect.

[0025] See further Figure 7 As shown, in a preferred embodiment of the pressing component, since the pressing component will contact the inner wall during lifting and lowering, the pressing surface of the pressing component is configured to include: a central recessed portion and two end faces on both sides. Universal ball bearings are respectively provided on the end faces. The recessed portion serves as the pressing part for the user, while the universal ball bearings serve as structural components that slide against the inner wall of the heat sink during lifting and lowering. By rolling instead of sliding, friction is reduced. To accommodate this pressing component, a groove is provided on the side wall of the heat sink corresponding to the lifting path of the universal ball bearings. The groove extends through the side wall, with a dustproof net on its outer side and a connection to the pressing component below on its inner side. A limit is provided in the middle of the groove along its length to guide the universal ball bearings to smoothly lift and slide along the inner side of the groove. This allows the groove to serve as a moving structural component and also as an outlet for heat dissipation from inside the heat sink.

[0026] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0027] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for a therapeutic instrument, comprising a therapeutic instrument body (1) and a main control box (2), the main control box (2) being provided with a circuit board, and the heat dissipation device (3) being partially embedded in a cavity of the main control box (2), characterized in that, The heat dissipation device (3) includes: A semiconductor cooling chip (31) is attached to the heating surface of the circuit board on one side for active cooling of the circuit board; A thermal pad (32) is attached to a semiconductor cooling chip (31) on one side and a heat sink (33) on the other side; The heat sink (33) has an opening on one side wall, and heat sink fins (34) are detachably installed in its mounting cavity; The base (35) is elastically connected to the bottom of the heat sink (33), and the side is snapped into the opening via a pressing member (36). When the pressing member (36) is released, the base (35) springs up and pushes the heat sink fins (34) out. The fan (38) is positioned directly opposite the heat sink fins (34) and extends through the inner wall of the main control box (2); The semiconductor cooling chip (31) absorbs the heat generated by the circuit board and transfers it to the heat sink (33) via the thermal pad (32), and works in conjunction with the fan (38) to dissipate heat through the detachable heat sink fins (34).

2. The heat dissipating device for therapeutic apparatus according to claim 1, wherein The heat sink (33) is hollow between its two side walls, and its ends are respectively provided with slots, and the heat-conducting pad (32) abuts against the slots.

3. The heat dissipating device for therapeutic apparatus according to claim 2, wherein On the heat sink (33), the side wall with an opening is the first side wall (331), and the opposite side of the first side wall (331) is the second side wall (332). Above the opening on the first side wall (331) are a plurality of heat dissipation holes (333). Slide grooves are provided on the inner sides of the first side wall (331) and the second side wall (332), wherein the slide groove of the first side wall (331) is adapted to the pressing member (36), and the slide groove of the second side wall (332) is adapted to the side of the base (35). Through the slide grooves on both sides, the base (35) can be raised and lowered vertically within the heat sink (33).

4. The heat dissipating device for therapeutic apparatus according to claim 3, wherein The heat dissipation fins (34) are tightly attached to the heat-conducting pads (32) through the hollow part of the heat dissipation frame (33), and are composed of a number of sinusoidal metal fins arranged in an array along the length of the heat dissipation frame (33). The gaps between adjacent metal fins form a wave-shaped airflow channel to increase the heat dissipation area and improve the heat dissipation efficiency.

5. The heat dissipating device for therapeutic apparatus according to claim 4, wherein On the main control box (2), an outlet is provided above the heat sink (33), and a flip cover (4) is provided at the outlet; a through strip-shaped slot is provided on the side of the main control box (2), so that the heat sink (333) and the pressing part (36) can be exposed through the slot.

6. A heat sink (3) for a therapeutic apparatus according to claim 5, characterized in that The pressing surface of the pressing member (36) includes a central recess (361) and two end faces, on which universal ball bearings (362) are respectively provided.

7. A heat sink (3) for a therapeutic apparatus according to claim 6, characterized in that The side wall with an opening is provided with a groove corresponding to the lifting path of the universal ball (362). The groove is provided through the side wall, with a dustproof net on its outer side and a pressing member (36) below on its inner side. A limit is provided in the middle of the groove along its length, so that the universal ball (362) can slide up and down along the inner side of the groove.

8. The heat dissipating device for therapeutic apparatus according to claim 1, wherein The therapeutic instrument body (1) is also provided with a host (5), and the host (5) is fixedly connected to the back of the main control box (2). The host (5) includes a touch screen (51) and a sound outlet (52) below the touch screen (51).

9. The heat dissipating device for therapeutic apparatus according to claim 1, wherein The main control box (2) is also provided with an electrode wire socket (21) and a wiring hole (22). The electrode wire socket (21) is electrically connected to an electrode connection wire, and the upper two sides of the therapeutic instrument body (1) are provided with a wire receiving part (11) for storing the electrode connection wire.

10. The heat dissipating device for therapeutic apparatus according to claim 1, wherein The front side of the treatment device body (1) is provided with a drawer (12), which is divided into a first drawer (12) at the top and a second drawer (12) at the bottom.

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