A blowing device for improving the surface cleanliness of a silicon wafer, improving yield and efficiency

Abstract

The utility model relates to the field of silicon wafer surface blowing equipment especially relates to a kind of blowing device of improving silicon wafer surface cleanliness and improving yield and efficiency. Including hard conduit, scraper and adjusting structure, the hard conduit's arc surface is glued with dustless cloth, the hard conduit's arc surface is glued with fixed plate, the hard conduit's arc surface is installed with hose, the upper surface of the scraper is fixed with hard conduit by adjusting structure, the upper surface of the scraper is equipped with adjusting structure, the adjusting structure includes auxiliary seat, the inner wall of the auxiliary seat is rotatably connected with rotating rod, the arc surface of the rotating rod is fixedly connected with link plate, the side of the link plate is fixedly connected with limit stop. The utility model provides a kind of blowing device of improving silicon wafer surface cleanliness and improving yield and efficiency, can conveniently replace scraper, avoid the phenomenon that scraper is abraded under long time use, and then improve the efficiency of replacing scraper.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer surface cleaning equipment, and in particular to a cleaning device that improves the cleanliness of silicon wafer surfaces and increases yield and efficiency. Background Technology

[0002] To effectively reduce the impact of particulate contamination on silicon wafers, the cell production process relies on efficient surface cleaning and purging technologies. The design of the purging device must consider factors such as airflow uniformity, the selection of purging media, and airflow intensity to ensure that particulate contaminants can be completely removed and to prevent secondary contamination. Advanced technologies such as plasma cleaning and ultrasonic cleaning can also remove tiny particles from the surface of silicon wafers at the micron level, improving the surface cleanliness of silicon wafers.

[0003] Existing technologies, such as the utility model with publication number CN214099617U, disclose a silicon wafer blowing and adsorption device. This patent includes a mounting plate with first clamping devices symmetrically arranged on both sides. Each first clamping device has a first air-blowing pipe and a second air-blowing pipe. A second clamping device is symmetrically arranged in the middle of the mounting plate, and a third air-blowing pipe is mounted on the second clamping device. This utility model has a reasonable and simple structure and is easy to operate. Through the combined use of the first and second clamping devices, silicon wafers can be clamped for transport. Simultaneously, the first and second air-blowing pipes fixed to the first clamping devices blow air onto the clamped silicon wafers, thereby removing dust from the silicon wafers on the first clamping devices. Similarly, the third air-blowing pipe fixed to the second clamping devices blows air onto the clamped silicon wafers, thereby removing dust from the silicon wafers on the second clamping devices, greatly improving the performance of the silicon wafers.

[0004] In the prior art, when cleaning silicon wafers using a purging device, the scraper effectively removes particulate contaminants from the silicon wafer surface by physically scraping, combined with appropriate pressure and angle. However, the traditional scraper installation method usually involves gluing it to a rigid conduit. This operation is cumbersome and time-consuming, reducing the overall operating efficiency. In addition, when the scraper wears out and needs to be replaced, the glue bonding method makes the disassembly process very inconvenient, thus affecting the replacement efficiency of the scraper. Utility Model Content

[0005] The purpose of this invention is to address the problem that the traditional scraper installation method in the prior art usually involves gluing the scraper to a rigid guide tube. This method is cumbersome and time-consuming, reducing overall operational efficiency. Furthermore, when the scraper wears out and needs to be replaced, the glue bonding method makes the disassembly process very inconvenient, thus affecting the replacement efficiency of the scraper. Therefore, this invention proposes a purging device that improves the surface cleanliness of silicon wafers and increases yield and efficiency.

[0006] To solve the above-mentioned technical problems, this utility model provides a purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency. The device includes a rigid guide tube, a scraper, and an adjustment structure. A lint-free cloth is bonded to the arc-shaped surface of the rigid guide tube, and a fixing plate is also bonded to the arc-shaped surface of the rigid guide tube. A flexible hose is installed on the arc-shaped surface of the rigid guide tube. The upper surface of the scraper is fixed to the rigid guide tube via the adjustment structure. The upper surface of the scraper is provided with the adjustment structure, which includes an auxiliary seat. A rotating rod is rotatably connected to the inner wall of the auxiliary seat, and a connecting rod is fixedly connected to the arc-shaped surface of the rotating rod. The connecting plate has a limiting plate fixedly connected to one side, and several fixing frames fixedly connected to the lower surface of the limiting plate. A fixing seat is fixedly connected to the upper surface of the scraper. A top plate is slidably connected to one side of the fixing seat. A positioning plate is fixedly connected to one side of the top plate. Two positioning rods are fixedly connected to one side of the fixing seat. The two positioning rods and the positioning plate are slidably connected. A spring is sleeved on the arc surface of the positioning rod. The two ends of the spring are fixedly connected to the fixing seat and the positioning plate, respectively. Several sleeves are fixedly connected to the arc surface of the rigid guide tube.

[0007] The effect achieved by the above components is that the scraper can be easily replaced by setting an adjustment structure, avoiding wear and tear on the scraper after long-term use, thereby improving the efficiency of scraper replacement.

[0008] Preferably, a plurality of ball bearings are fixedly connected to one side of the top plate, and the ball bearings have a circular cross-section.

[0009] The effect achieved by the above components is that the ball bearings can reduce the friction between the top plate and the limiting plate, making the top plate move more smoothly.

[0010] Preferably, the arc surface of the rotating rod is fitted with two coil springs, and the two ends of the coil springs are fixedly connected to the auxiliary seat and the connecting plate, respectively.

[0011] The effect achieved by the above components is that the coil spring can increase the torsional force of the connecting plate, making the connecting plate more stable during use.

[0012] Preferably, a handle is fixedly connected to one side of the positioning plate.

[0013] The effect achieved by the above components is that the handle can drive the positioning plate to move, thus facilitating the control of the positioning plate.

[0014] Preferably, the upper surface of the fixing plate is provided with an auxiliary structure, the auxiliary structure including a screw, the screw and the fixing plate being rotatably connected, the arc surface of the screw being threadedly connected to the auxiliary plate, a plurality of sliding rods being fixedly connected to the upper surface of the fixing plate, the plurality of sliding rods being slidably connected to the auxiliary plate, and a connecting plate being fixedly connected to the arc surface of the screw.

[0015] The effect achieved by the above components is that by setting up the auxiliary structure, excessively long hoses can be easily wound up, avoiding the phenomenon of tangling and knotting due to excessive hose length, making the hose more stable during use.

[0016] Preferably, the arc surface of the slide bar is provided with anti-slip texture, and the anti-slip texture is evenly distributed on the slide bar.

[0017] The effect achieved by the above components is that the anti-slip texture can increase the friction of the slide bar, making the hose more stable on the slide bar.

[0018] Preferably, a soft pad, which is a rubber pad, is fixedly connected to the lower surface of the auxiliary plate.

[0019] The effect achieved by the above components is that the soft pad can prevent the auxiliary plate from directly contacting the hose, thereby preventing the hose from being worn.

[0020] Compared with related technologies, the purging device provided by this utility model for improving the surface cleanliness of silicon wafers and increasing yield and efficiency has the following beneficial effects:

[0021] This invention provides a purging device that improves the surface cleanliness of silicon wafers, thereby increasing yield and efficiency. By setting an adjustment structure, the scraper can be easily replaced, effectively avoiding wear on the scraper during long-term use, thus improving scraper replacement efficiency and reducing downtime.

[0022] By setting up an auxiliary structure, excessively long hoses can be easily rolled up, effectively avoiding problems such as tangling and knotting caused by excessive length, thereby ensuring the stability and smoothness of the hose during use and improving operational efficiency. Attached Figure Description

[0023] Figure 1 A schematic diagram of the structure of a purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency, provided by this utility model;

[0024] Figure 2 for Figure 1 The diagram shows the structural schematic of the adjustment structure.

[0025] Figure 3 for Figure 2 Enlarged view of point A;

[0026] Figure 4 for Figure 2 A partial structural diagram of the adjustment structure shown;

[0027] Figure 5 for Figure 1 The diagram shows the structure of the auxiliary structure.

[0028] The following are the labeling elements in the diagram: 1. Rigid conduit; 2. Fixing plate; 3. Dust-free cloth; 4. Scraper; 5. Adjustment structure; 501. Auxiliary seat; 502. Rotating rod; 503. Connecting plate; 504. Limiting plate; 505. Fixing frame; 506. Fixing seat; 507. Top plate; 508. Positioning plate; 509. Positioning rod; 510. Spring; 511. Handle; 512. Ball bearing; 513. Coil spring; 514. Sleeve; 6. Auxiliary structure; 61. Screw; 62. Connecting plate; 63. Auxiliary plate; 64. Slide rod; 65. Anti-slip texture; 66. Soft pad; 7. Flexible hose. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0031] Please see Figures 1 to 5 This utility model provides a blowing device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency. It includes: a rigid guide tube 1, a scraper 4, and an adjustment structure 5. A lint-free cloth 3 is glued to the arc surface of the rigid guide tube 1, a fixing plate 2 is glued to the arc surface of the rigid guide tube 1, and a flexible hose 7 is installed on the arc surface of the rigid guide tube 1. The upper surface of the scraper 4 is fixed to the rigid guide tube 1 by means of the adjustment structure 5. The upper surface of the scraper 4 is provided with the adjustment structure 5, and the upper surface of the fixing plate 2 is provided with an auxiliary structure 6.

[0032] In the embodiments of this utility model, please refer to Figures 2 to 4The adjusting structure 5 includes an auxiliary seat 501, a rotating rod 502 rotatably connected to the inner wall of the auxiliary seat 501, a connecting plate 503 fixedly connected to the arc surface of the rotating rod 502, a limiting plate 504 fixedly connected to one side of the connecting plate 503, several fixing frames 505 fixedly connected to the lower surface of the limiting plate 504, a fixing seat 506 fixedly connected to the upper surface of the scraper 4, a top plate 507 slidably connected to one side of the fixing seat 506, a positioning plate 508 fixedly connected to one side of the top plate 507, two positioning rods 509 fixedly connected to one side of the fixing seat 506, the two positioning rods 509 and the positioning plate 508 slidably connected, a spring 510 sleeved on the arc surface of the positioning rod 509, the two ends of the spring 510 fixedly connected to the fixing seat 506 and the positioning plate 508 respectively, and several sleeves 514 fixedly connected to the arc surface of the rigid guide tube 1. The adjustment structure 5 allows for easy replacement of the scraper 4, preventing wear and tear during prolonged use and improving the efficiency of scraper 4 replacement. Several ball bearings 512 are fixedly connected to one side of the top plate 507. The ball bearings 512 have a circular cross-section and can reduce the friction between the top plate 507 and the limiting plate 504, making the top plate 507 move more smoothly. Two coil springs 513 are sleeved on the arc surface of the rotating rod 502. The two ends of the coil springs 513 are fixedly connected to the auxiliary seat 501 and the connecting plate 503, respectively. The coil springs 513 can increase the torsional force of the connecting plate 503, making the connecting plate 503 more stable during use. A handle 511 is fixedly connected to one side of the positioning plate 508. The handle 511 can drive the positioning plate 508 to move, achieving the effect of convenient control of the positioning plate 508.

[0033] In the embodiments of this utility model, please refer to Figure 5 The auxiliary structure 6 includes a screw 61, which is rotatably connected to a fixing plate 2. An auxiliary plate 63 is threadedly connected to the arc surface of the screw 61. Several sliding rods 64 are fixedly connected to the upper surface of the fixing plate 2, and the sliding rods 64 are slidably connected to the auxiliary plate 63. A connecting disc 62 is fixedly connected to the arc surface of the screw 61. By setting the auxiliary structure 6, the excessively long hose 7 can be easily wound up, avoiding the phenomenon of the hose 7 becoming tangled and knotted, making the hose 7 more stable during use. The arc surface of the sliding rod 64 is provided with anti-slip textures 65, which are evenly distributed on the sliding rod 64. The anti-slip textures 65 can increase the friction of the sliding rod 64, making the hose 7 more stable on the sliding rod 64. A soft pad 66 is fixedly connected to the lower surface of the auxiliary plate 63. The soft pad 66 is a rubber pad, which can prevent the auxiliary plate 63 from directly contacting the hose 7, thereby preventing the hose 7 from being worn.

[0034] The working principle of the purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency provided by this utility model is as follows: By setting the adjustment structure 5, the scraper 4 is first moved to a suitable position. Then, the limiting plate 504 is rotated to drive the connecting plate 503 to rotate. At the same time, the connecting plate 503 drives the rotating rod 502 to rotate inside the auxiliary seat 501. When the limiting plate 504 rotates, it also drives the fixing frame 505 to rotate, so that the fixing frame 505 is inserted into the sleeve 514 of the rigid guide tube 1. At the same time, when the limiting plate 504 rotates, it will contact the top plate 507. At the same time, the top plate 507 will move inside the fixing seat 506. When the top plate 507 moves, it will drive the positioning plate 508 to move on the positioning rod 509. At the same time, the positioning plate 508 will drive the spring 510 to stretch until the limiting plate 504 rotates to the top plate 507. Next, the spring 510 will drive the positioning plate 508 to move, and the positioning plate 508 will drive the top plate 507 to move inside the fixed seat 506, so that the top plate 507 limits the limit plate 504. At this time, the scraper 4 and the hard tube 1 are fixed. Then, the fixed plate 2 fixes them in a suitable position. Then, the equipment blows air into the hose 7, and then the air enters into the hard tube 1, so that the hard tube 1 on the clean cloth 3 blows air onto the silicon wafer. Among them, the ball 512 can reduce the friction between the top plate 507 and the limit plate 504, so that the top plate 507 moves more smoothly. The coil spring 513 can increase the torsional force of the connecting plate 503, so that the connecting plate 503 is more stable during use. The handle 511 can drive the positioning plate 508 to move, so as to facilitate the control of the positioning plate 508.

[0035] By setting the auxiliary structure 6, the excess hose 7 is first wound around the screw 61 and the slide bar 64. Then, the connecting plate 62 drives the screw 61 to rotate, so that the screw 61 drives the auxiliary plate 63 to move on the slide bar 64, so that the auxiliary plate 63 limits the hose 7. The anti-slip texture 65 can increase the friction of the slide bar 64, making the hose 7 more stable on the slide bar 64. The soft pad 66 can prevent the auxiliary plate 63 from directly contacting the hose 7, thereby preventing the hose 7 from being worn.

[0036] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0037] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency, characterized in that, include: The rigid conduit (1), scraper (4), and adjustment structure (5) are provided. A lint-free cloth (3) is glued to the arc surface of the rigid conduit (1). A fixing plate (2) is glued to the arc surface of the rigid conduit (1). A flexible hose (7) is installed on the arc surface of the rigid conduit (1). The upper surface of the scraper (4) is fixed to the rigid conduit (1) via the adjustment structure (5). The upper surface of the scraper (4) is provided with the adjustment structure (5). The adjustment structure (5) includes an auxiliary seat (501). A rotating rod (502) is rotatably connected to the inner wall of the auxiliary seat (501). A connecting plate (503) is fixedly connected to the arc surface of the rotating rod (502). A limiting plate (504) is fixedly connected to one side of the connecting plate (503). The limiting plate (504) is... The lower surface of the scraper (4) is fixedly connected to several fixed frames (505), the upper surface of the scraper (4) is fixedly connected to a fixed seat (506), a top plate (507) is slidably connected to one side of the fixed seat (506), a positioning plate (508) is fixedly connected to one side of the top plate (507), two positioning rods (509) are fixedly connected to one side of the fixed seat (506), the two positioning rods (509) and the positioning plate (508) are slidably connected, a spring (510) is sleeved on the arc surface of the positioning rod (509), the two ends of the spring (510) are fixedly connected to the fixed seat (506) and the positioning plate (508) respectively, and several sleeves (514) are fixedly connected to the arc surface of the hard guide tube (1).

2. The device according to claim 1, wherein the device is characterized by: A number of ball bearings (512) are fixedly connected to one side of the top plate (507), and the cross-section of the ball bearings (512) is circular.

3. The device according to claim 1, wherein the device is characterized by: The arc surface of the rotating rod (502) is fitted with two coil springs (513), and the two ends of the coil springs (513) are fixedly connected to the auxiliary seat (501) and the connecting plate (503) respectively.

4. The device according to claim 1, wherein the device is characterized by: A handle (511) is fixedly connected to one side of the positioning plate (508).

5. The purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency according to claim 1, characterized in that, The upper surface of the fixing plate (2) is provided with an auxiliary structure (6), the auxiliary structure (6) includes a screw (61), the screw (61) and the fixing plate (2) are rotatably connected, the arc surface of the screw (61) is threadedly connected to an auxiliary plate (63), the upper surface of the fixing plate (2) is fixedly connected to a plurality of sliding rods (64), the plurality of sliding rods (64) and the auxiliary plate (63) are slidably connected, and the arc surface of the screw (61) is fixedly connected to a connecting plate (62).

6. The purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency according to claim 5, characterized in that, The slide bar (64) has anti-slip textures (65) on its arc surface, and the anti-slip textures (65) are evenly distributed on the slide bar (64).

7. The purging device for improving the surface cleanliness of silicon wafers and increasing yield and efficiency according to claim 5, characterized in that, A soft pad (66) is fixedly connected to the lower surface of the auxiliary plate (63), and the soft pad (66) is a rubber pad.

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