A cleaning and drying apparatus and wafer thinning equipment

Abstract

This utility model relates to the field of semiconductor processing technology, and more particularly to a cleaning and drying apparatus and a wafer thinning device. The cleaning and drying apparatus includes a mounting base plate, and a wafer cleaning assembly, an adsorption tray cleaning assembly, and a drying assembly disposed on the mounting base plate. The wafer cleaning assembly includes a cleaning roller brush for rubbing against the surface of the wafer to clean it. The adsorption tray cleaning assembly is disposed near the cleaning roller brush and includes an oilstone and cleaning brushes for rubbing against the adsorption surface of the wafer adsorption tray to clean it. The drying assembly is disposed near the cleaning brushes and includes a nozzle for spraying high-pressure gas to dry the surface of the wafer or the adsorption surface of the wafer adsorption tray. Therefore, the wafer and the wafer adsorption tray can be cleaned and dried separately, removing silicon powder generated during the thinning process, preventing dust particles from spreading between wafers and silicon powder from accumulating on the wafer adsorption tray, thus improving the process efficiency of wafer processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a cleaning and drying apparatus and a wafer thinning device for a wafer thinning process. Background Technology

[0002] In existing technologies, when wafer thinning equipment is used to thin wafers, silicon powder adheres to the wafer surface and carries the wafer into the next process. On one hand, the silicon powder adhering to the front of the wafer affects the processing results of subsequent wafer fabrication. On the other hand, when wafers that have undergone thinning are held in place by wafer chucks, silicon powder from the back of the wafer adheres to the chucks, indirectly transferring it to wafers undergoing subsequent thinning, thus spreading dust particles. Furthermore, silicon powder continuously accumulates on the wafer chucks, affecting their flatness and increasing the risk of wafer cracking. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art or related technologies.

[0004] Therefore, this utility model provides a cleaning and drying device that can clean and dry the wafer and the wafer adsorption tray separately, remove the silicon powder generated during the thinning process, prevent dust particles from spreading between wafers and silicon powder from accumulating on the wafer adsorption tray, and improve the process effect of wafer processing.

[0005] This invention also provides a wafer thinning device that includes the above-mentioned cleaning and drying apparatus.

[0006] A cleaning and drying device according to a first aspect of the present invention includes a mounting base plate, and a wafer cleaning assembly, an adsorption plate cleaning assembly, and a drying assembly disposed on the mounting base plate; the wafer cleaning assembly includes a cleaning roller brush for rubbing against the surface of the wafer to clean the wafer; the adsorption plate cleaning assembly is disposed near the cleaning roller brush and includes an oilstone and a cleaning brush for rubbing against the adsorption surface of the wafer adsorption plate to clean the wafer adsorption plate; the drying assembly is disposed near the cleaning brush and includes a jet nozzle for spraying high-pressure gas to dry the surface of the wafer or the adsorption surface of the wafer adsorption plate.

[0007] Optionally, the wafer cleaning assembly also includes a roller brush shaft and a first support. The roller brush shaft is detachably connected to the first support via a quick-release assembly. The cleaning roller brush is sleeved on the roller brush shaft so that the roller brush shaft can drive the cleaning roller brush to rotate along its own axis.

[0008] Optionally, the quick-release assembly includes a first bearing and a locking handle. The end of the roller brush shaft has a mounting groove, and the first bearing is disposed in the mounting groove. A first mounting hole is provided on the first support, and the locking handle is slidably inserted into the first mounting hole. A clamping shaft is provided on the locking handle. A locking assembly is provided between the locking handle and the first support, and the locking assembly is used to lock and unlock the locking handle. When the locking handle is in the locked state, the clamping shaft clamps the inner ring of the first bearing.

[0009] Optionally, the locking assembly includes a first locking block disposed on the locking handle near one end of the roller brush shaft; a first slot is formed on the inner wall of the first mounting hole along the axial direction, the first slot matching the first locking block; a second slot is formed on the wall of the first support near the roller brush shaft, the second slot communicating with the first mounting hole; when the first locking block is slidably engaged in the first slot, the locking handle is in the unlocked state, and the locking handle can slide along the first mounting hole; when the locking handle slides along the first mounting hole until the first locking block extends out of the first slot, the locking handle is rotated to engage the first locking block in the second slot, thus locking the locking handle in the locked state.

[0010] Optionally, the quick-release assembly also includes a spring, a second mounting hole is provided on the locking handle along its own axis, and the clamping shaft is slidably inserted through the second mounting hole; a third slot is provided on the locking handle near the end of the roller brush shaft, and a second locking block is provided on the clamping shaft near the end of the roller brush shaft; the spring is sleeved on the clamping shaft, and the two ends of the spring abut against the third slot and the second locking block respectively; when the locking handle is in the locked state, the spring is in the compressed state.

[0011] Optionally, the wafer cleaning assembly also includes a water tank connected to the first support and located below the cleaning roller brush; the roller brush shaft is arranged horizontally, and when the roller brush shaft rotates, the bottom side of the cleaning roller brush is immersed in the water in the water tank.

[0012] Optionally, the wafer cleaning assembly further includes a rotation drive assembly, which includes a first drive motor, a first pulley, a second pulley, and a timing belt. The first drive motor is connected to a first support, the first pulley is connected to the output end of the first drive motor, the second pulley is keyed to the roller brush shaft, and the timing belt is sleeved on the first pulley and the second pulley.

[0013] Optionally, the wafer cleaning assembly further includes a first lifting assembly, which includes a first lifting cylinder and a guide sleeve. Both the first lifting cylinder and the guide sleeve are connected between the mounting base and the first support. The first lifting cylinder is used to drive the first support to move up and down along the extension and retraction direction of the guide sleeve to adjust the height of the cleaning roller brush relative to the oilstone and the cleaning brush.

[0014] Optionally, the suction cup cleaning assembly also includes a second support, a second drive motor, and a second bearing. A first guide rail is provided on the mounting base plate, and the second support is slidably connected to the first guide rail. The oilstone is connected to the second support, and a slotted hole is provided at one end of the second support. The second drive motor is connected to the mounting base plate, and an eccentric shaft is connected to the output end of the second drive motor. The second bearing is slidably engaged in the slotted hole and is also connected to the eccentric shaft. When the second drive motor drives the eccentric shaft to rotate, the eccentric shaft drives the second bearing to slide along the slotted hole, so that the second support swings along the first guide rail.

[0015] Optionally, the suction cup cleaning assembly further includes a second lifting assembly and a third lifting assembly. The second lifting assembly includes a third support and a second lifting cylinder. A second guide rail is provided on the mounting base plate, and the third support is slidably connected to the second guide rail. The oilstone is connected to the third support. The second lifting cylinder is connected between the mounting base plate and the third support and is used to drive the third support to slide along the second guide rail to adjust the height of the oilstone relative to the cleaning roller brush and the cleaning brush. The third lifting assembly includes a fourth support and a third lifting cylinder. A third guide rail is provided on the mounting base plate, and the fourth support is slidably connected to the third guide rail. The cleaning brush is connected to the fourth support. The third lifting cylinder is connected between the mounting base plate and the fourth support and is used to drive the fourth support to slide along the third guide rail to adjust the height of the cleaning brush relative to the cleaning roller brush and the oilstone.

[0016] Optionally, a process tank is provided on the oilstone; the adsorption plate cleaning assembly also includes a rinsing assembly, which includes multiple high-pressure nozzles for spraying high-pressure water to clean the adsorption surfaces of the process tank and the wafer adsorption plate.

[0017] Optionally, the cleaning roller brush, oilstone, and cleaning brush are all distributed along the first direction, and the length direction of the cleaning roller brush, the length direction of the oilstone, and the length direction of the cleaning brush are all arranged along the second direction, with the first direction perpendicular to the second direction.

[0018] The wafer thinning apparatus according to a second aspect of the present invention includes an apparatus body and a cleaning and drying device as described in the first aspect of the present invention, wherein the apparatus body is provided with a wafer adsorption disk.

[0019] One of the above technical solutions has at least the following advantages or beneficial effects: According to an embodiment of the present invention, a cleaning and drying device is provided on a mounting base plate, which can clean and dry the wafer and the wafer adsorption plate respectively, remove the silicon powder generated during the thinning process, prevent dust particles from spreading between wafers and silicon powder from accumulating on the wafer adsorption plate, and improve the process effect of wafer processing.

[0020] The cleaning roller brush is a consumable material. This invention can quickly remove and install the roller brush shaft from the first support by setting a quick-release component, so as to facilitate quick replacement of the cleaning roller brush. By setting a first locking block in the locking component, and the first locking block cooperating with the first and second locking slots, the locking handle can be reliably locked and unlocked.

[0021] In particular, for wafer thinning equipment where the wafer adsorption plate itself cannot rotate, this utility model can convert the rotation of the drive motor output into linear motion by setting a matching eccentric shaft and strip hole, which drives the oilstone to swing along the guide rail, thereby improving the cleaning effect of the adsorption plate cleaning component.

[0022] In particular, for wafer thinning equipment where the wafer adsorption disk itself can rotate, this utility model sets up an oilstone and a cleaning brush driven by an independent lifting cylinder, which can form an adjustable height difference between the cleaning roller, oilstone and cleaning brush, thereby realizing the integrated layout of the cleaning and drying device and effectively reducing the space occupied.

[0023] The wafer thinning equipment provided in this embodiment of the present invention is equipped with the cleaning and drying device described above. Since the cleaning and drying device has the above-mentioned technical effects, the wafer thinning equipment equipped with the cleaning and drying device should also have the corresponding technical effects. Attached Figure Description

[0024] Figure 1 A schematic diagram of the structure of a cleaning and drying device according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of the structure of a cleaning and drying device according to another embodiment of the present invention is shown; Figure 3 A schematic diagram of the structure of the wafer cleaning assembly according to an embodiment of the present invention is shown; Figure 4 An exploded view of the quick-release assembly according to an embodiment of the present invention is shown. Figure 5 A cross-sectional structural schematic diagram of the locking assembly in the unlocked state according to an embodiment of the present invention is shown; Figure 6 A cross-sectional structural diagram of the locking assembly in the locked state according to an embodiment of the present invention is shown; Figure 7 An exploded view of some parts of the adsorption plate cleaning assembly according to an embodiment of the present invention is shown. Figure 8 A schematic diagram of the structure of the adsorption plate cleaning assembly according to an embodiment of the present invention is shown.

[0025] Explanation of reference numerals in the attached figures: 100. Install the base plate; 200. Wafer cleaning assembly; 210. Cleaning roller brush; 220. Roller brush shaft; 221. Mounting slot; 230. First support; 231. First mounting hole; 232. First slot; 233. Second slot; 240. Water tank; 250. Rotation drive assembly; 251. First drive motor; 252. First pulley; 253. Second pulley; 254. Synchronous belt; 261. First lifting cylinder; 262. Guide sleeve; 300. Adsorption plate cleaning assembly; 310. Oilstone; 311. Process tank; 320. Cleaning brush; 330. Second support; 331. First guide rail; 332. Strip hole; 340. Second drive motor; 341. Eccentric shaft; 350. Second bearing; 361. Third support; 362. Second lifting cylinder; 363. Second guide rail; 371. Fourth support; 372. Third lifting cylinder; 373. Third guide rail; 380. Flushing assembly; 381. High-pressure nozzle; 410. Air jet nozzle; 500, Quick-release assembly; 510, First bearing; 520, Locking handle; 521, Second mounting hole; 522, Third slot; 530, Pressure shaft; 531, Second locking block; 541, First locking block; 550, Spring. Detailed Implementation

[0026] To better explain and facilitate understanding of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] When wafers are thinned using wafer thinning equipment, silicon powder adhering to the wafer surface will follow the wafer into the next process. On one hand, silicon powder adhering to the front of the wafer will affect the processing results of subsequent wafer fabrication. On the other hand, when wafers that have undergone thinning are picked up using wafer pick-up trays, silicon powder on the back of the wafer will adhere to the trays, indirectly transferring it to wafers undergoing subsequent thinning, thus spreading dust particles. Furthermore, silicon powder will continuously accumulate on the wafer pick-up trays, affecting the flatness of the trays and increasing the risk of wafer cracking.

[0028] To address at least one of the technical problems existing in the prior art or related technologies, this utility model provides a cleaning and drying device, including a mounting base plate, and a wafer cleaning component, an adsorption tray cleaning component, and a drying component disposed on the mounting base plate. The wafer cleaning component includes a cleaning roller brush for rubbing against the surface of the wafer to clean it. The adsorption tray cleaning component is disposed near the cleaning roller brush and includes an oilstone and a cleaning brush for rubbing against the adsorption surface of the wafer adsorption tray to clean it. The drying component is disposed near the cleaning brush and includes a jet nozzle for spraying high-pressure gas to dry the surface of the wafer or the adsorption surface of the wafer adsorption tray. The device provided by this application can clean and dry the wafer and the wafer adsorption tray separately, remove silicon powder generated during thinning processing, prevent dust particles from spreading between wafers and silicon powder from accumulating on the wafer adsorption tray, and improve the process effect of wafer processing.

[0029] The following description, with reference to the accompanying drawings, describes a cleaning and drying apparatus and a wafer thinning device according to some embodiments of the present invention.

[0030] See Figures 1 to 2 This utility model provides a cleaning and drying device, including a mounting base plate 100 for connection to a wafer thinning device; and a wafer cleaning assembly 200, an adsorption tray cleaning assembly 300, and a drying assembly disposed on the mounting base plate 100. The wafer cleaning assembly 200 includes a cleaning roller brush 210 for rubbing against the surface of the wafer to clean it. The adsorption tray cleaning assembly 300 is disposed near the cleaning roller brush 210 and includes an oilstone 310 and a cleaning brush 320 for rubbing against the adsorption surface of the wafer adsorption tray to clean it. The drying assembly is disposed near the cleaning brush 320 and includes a jet nozzle 410 for spraying high-pressure gas to dry the surface of the wafer or the adsorption surface of the wafer adsorption tray.

[0031] Therefore, the cleaning and drying device provided by this utility model can clean and dry the wafer and the wafer adsorption plate separately, remove the silicon powder generated during the thinning process, prevent dust particles from spreading between wafers and silicon powder from accumulating on the wafer adsorption plate, and improve the process effect of wafer processing.

[0032] It should be noted that a feasible method is provided here to clean the wafer surface and the mating surface of the wafer adsorption pad using a cleaning and drying device.

[0033] Wafer cleaning methods: Step 1-1: Start the wafer thinning equipment and use the adsorption surface of the wafer adsorption plate to adsorb the wafer to be cleaned; control the wafer adsorption plate to move forward to the central axis position of the cleaning roller brush 210, and press down a certain height so that the wafer adsorption plate contacts the cleaning roller brush 210.

[0034] Steps 1-2: Activate the cleaning and drying device and control the rotation of the cleaning roller brush 210 so that its rotation direction is consistent with the movement direction of the wafer adsorption disk, thereby completing the cleaning of the wafer surface. Here, the rotation direction of the cleaning roller brush 210 is consistent with the movement direction of the wafer adsorption disk, which can avoid damage to the wafer due to inconsistent force directions.

[0035] Steps 1-3: Control the wafer adsorption disk to continue moving forward so that the center of the wafer adsorption disk is above the jet nozzle 410. The jet nozzle 410 continuously outputs high-pressure gas, thereby drying the wafer surface.

[0036] Steps 1-4: Control the wafer adsorption tray to place the cleaned wafers onto the cleaning tray for the next process.

[0037] Wafer suction pad cleaning method: Step 2-1: Control the wafer adsorption disk to move directly above the oilstone 310 and press it down to a certain height so that a compression is formed between the wafer adsorption disk and the oilstone 310 to achieve friction cleaning.

[0038] Step 2-2: Control the wafer adsorption disk to continue moving, and continuously spray a fluid mixture of water and gas while moving, thereby cleaning the adsorption surface of the wafer adsorption disk.

[0039] Steps 2-3: Control the wafer adsorption disk to move directly above the cleaning brush 320 and press it down to a certain height to create compression between the wafer adsorption disk and the cleaning brush 320; control the wafer adsorption disk to continuously spray out a fluid mixture of water and gas, and use the cleaning brush 320 to perform a secondary cleaning of the wafer adsorption disk to remove residual particles on the adsorption surface of the wafer adsorption disk.

[0040] Steps 2-4: After cleaning the entire wafer adsorption pad's contact surface, the wafer adsorption pad removes the next wafer, and the wafer cleaning process is repeated.

[0041] In some possible implementations, see [link to relevant documentation]. Figures 1 to 3The wafer cleaning assembly 200 also includes a roller brush shaft 220 and a first support 230. The roller brush shaft 220 is detachably connected to the first support 230 via a quick-release assembly 500, allowing the roller brush shaft 220 to be quickly removed from or installed onto the first support 230. A cleaning roller brush 210 is fitted onto the roller brush shaft 220, enabling the roller brush shaft 220 to drive the cleaning roller brush 210 to rotate along its own axis. When the wafer adsorption plate presses down, causing the cleaning roller brush 210 to press against the lower surface of the wafer, the cleaning roller brush 210 rotates, allowing its surface to generate friction on the wafer surface along its own tangential direction, thereby completing the cleaning of the wafer.

[0042] It should be noted that since the cleaning roller brush 210 cleans by rubbing against the wafer surface, it is a consumable material. The quick-release structure facilitates easy replacement of the cleaning roller brush 210. Preferably, the cleaning roller brush 210 is made of sponge.

[0043] In some possible implementations, see [link to relevant documentation]. Figures 4 to 6 The quick-release assembly 500 includes a first bearing 510, a locking handle 520, and a locking component. A mounting groove 221 is provided at the end of the roller brush shaft 220, and the first bearing 510 is disposed within the mounting groove 221. A first mounting hole 231 is provided on the first support 230, and the locking handle 520 is slidably inserted into the first mounting hole 231. A clamping shaft 530 is provided on the locking handle 520, which cooperates with the first bearing 510 to allow the roller brush shaft 220 to be installed onto the first support 230 via the quick-release assembly 500.

[0044] In this embodiment, a locking assembly is provided between the locking handle 520 and the first support 230. The locking assembly is used to lock and unlock the locking handle 520. Specifically, when the locking assembly is adjusted so that the locking handle 520 is in the locked state, the clamping shaft 530 clamps the inner ring of the first bearing 510. At this time, the roller brush shaft 220 is fixed on the first support 230, and the cleaning roller brush 210 can be used to clean the surface of the wafer. When the locking assembly is adjusted so that the locking handle 520 is in the unlocked state, the locking handle 520 is slid along the first mounting hole 231, so that the clamping shaft 530 moves away from the first bearing 510, thereby removing the roller brush shaft 220 to replace the cleaning roller brush 210.

[0045] In some possible implementations, see [link to relevant documentation]. Figures 5 to 6The locking assembly includes a first locking block 541. The first locking block 541 is disposed on the locking handle 520 near one end of the roller brush shaft 220. A first slot 232 is formed along the axial direction on the inner wall of the first mounting hole 231. The first slot 232 matches the first locking block 541, allowing the first locking block 541 to slide along the first slot 232 when the locking handle 520 slides along the first mounting hole 231 without obstructing the locking handle 520. A second slot 233 is formed on the wall of the first support 230 near the roller brush shaft 220, and the second slot 233 communicates with the first mounting hole 231.

[0046] Specifically, when the first locking block 541 is slidably engaged in the first slot 232, the locking handle 520 is in the unlocked state, and the locking handle 520 can slide along the first mounting hole 231 to replace the cleaning roller brush 210. When the locking handle 520 slides along the first mounting hole 231 toward the side closer to the roller brush shaft 220 until the first locking block 541 extends out of the first slot 232, the locking handle 520 is rotated to engage the first locking block 541 in the second slot 233. At this time, the pressing shaft 530 presses the inner ring of the first bearing 510, so that the locking handle 520 is in the locked state.

[0047] It should be noted that the second slot 233 connects to the first mounting hole 231, so that when the locking handle 520 passes through the first mounting hole 231, the first locking block 541 on the locking handle 520 can be locked into the second slot 233 by rotating the locking handle 520. The second slot 233 is not connected to the first slot 232, which prevents the first locking block 541 from rotating when the brush shaft 220 rotates, causing it to disengage from the second slot 233 and enter the first slot 232, thus preventing locking failure.

[0048] Preferably, a limiting member is provided on the side of the first slot 232 away from the roller brush shaft 220, which can prevent the locking handle 520 from falling out of the first mounting hole 231 when it slides along the first mounting hole 231.

[0049] In some possible implementations, see [link to relevant documentation]. Figures 5 to 6The quick-release assembly 500 also includes a spring 550. A second mounting hole 521 is provided on the locking handle 520 along its own axis. The clamping shaft 530 is slidably inserted through the second mounting hole 521, allowing the clamping shaft 530 to extend and retract relative to the locking handle 520. A third slot 522 is provided on the locking handle 520 near the end of the roller brush shaft 220. A second locking block 531 is also provided on the end of the clamping shaft 530 near the roller brush shaft 220. The spring 550 is sleeved on the clamping shaft 530, with its two ends abutting against the third slot 522 and the second locking block 531, respectively. When the locking handle 520 is in the locked state, the spring 550 is in a compressed state, causing the clamping shaft 530 to remain extended relative to the locking handle 520 and providing sufficient pressure to clamp the first bearing 510. The roller brush shaft 220 can rotate along its own axis without dislodging from the quick-release assembly 500.

[0050] It should be noted that when unlocking the locking handle 520, simply push the locking handle 520 towards one side of the roller brush shaft 220 and rotate it a short distance to disengage the first locking block 541 from the second locking slot 233. Then, slowly rotate the locking handle 520 to allow the first locking block 541 to slide along the end face of the first support 230. Since a spring 550 is provided between the pressing shaft 530 and the locking handle 520, when the first locking block 541 rotates to the position of the first locking slot 232, the locking handle 520 will pop out along the first mounting hole 231 under the action of the spring 550, thereby unlocking the device.

[0051] In some possible implementations, see [link to relevant documentation]. Figure 1 and Figure 3 The wafer cleaning assembly 200 also includes a water tank 240. The water tank 240 is connected to the first support 230 and is located below the cleaning roller brush 210. By continuously filling the water tank 240 with water, the cleaning roller brush 210 can be cleaned, allowing the cleaning roller brush 210 to clean the wafer while immersed, which can improve the cleaning effect and prevent the dirt on the cleaning roller brush 210 itself from contaminating the wafer.

[0052] Here, the roller brush shaft 220 is set in the horizontal direction. When the roller brush shaft 220 rotates to clean the wafer, the bottom side of the cleaning roller brush 210 is immersed in the water in the water tank 240, so that the cleaning roller brush 210 is cleaned simultaneously while cleaning the wafer.

[0053] In some possible implementations, see [link to relevant documentation]. Figures 3 to 4The wafer cleaning assembly 200 also includes a rotation drive assembly 250 for rotating the roller brush shaft 220 along its own axis. The rotation drive assembly 250 includes a first drive motor 251, a first pulley 252, a second pulley 253, and a timing belt 254. The first drive motor 251 is fixedly connected to the first support 230, the first pulley 252 is fixedly connected to the output end of the first drive motor 251, the second pulley 253 is keyed to the roller brush shaft 220, and the timing belt 254 is sleeved on the first pulley 252 and the second pulley 253. Thus, the torque at the output end of the first drive motor 251 is transmitted to the roller brush shaft 220 through the pulley assembly composed of the first pulley 252, the second pulley 253, and the timing belt 254, thereby driving the cleaning roller brush 210 to rotate to clean the wafer.

[0054] It should be noted that the synchronous belt 254 is made of an elastic material, which can effectively absorb the vibration generated by the operation of the first drive motor 251, making the rotation of the roller brush shaft 220 more stable. At the same time, the pulley assembly has low requirements for manufacturing and installation precision, which can reduce manufacturing costs and maintenance difficulty.

[0055] The second pulley 253 is keyed to the brush shaft 220, which enables the brush shaft 220 and the second pulley 253 to be detachably connected while transmitting torque.

[0056] The rotation direction of the output end of the first drive motor 251 is such that the initial rotation direction of the upper surface of the cleaning roller brush 210 is consistent with the moving direction of the wafer adsorption disk.

[0057] In some possible implementations, see [link to relevant documentation]. Figure 1 The wafer cleaning assembly 200 also includes a first lifting assembly, which includes a first lifting cylinder 261 and a guide sleeve 262. Both the first lifting cylinder 261 and the guide sleeve 262 are connected between the mounting base 100 and the first support 230. The first lifting cylinder 261 is used to drive the first support 230 to move up and down along the extension and retraction direction of the guide sleeve 262 to adjust the height of the cleaning roller brush 210 relative to the oilstone 310 and the cleaning brush 320.

[0058] Specifically, the first lifting cylinder 261 is adjusted to raise the cleaning roller brush 210 along the extension and retraction direction of the guide sleeve 262 to a position higher than the oilstone 310 and the cleaning brush 320. At this time, the wafer adsorption tray with the wafer adsorbed is controlled to move above the cleaning roller brush 210 and begin to descend. During the descent, the wafer first contacts the highest position among the three (cleaning roller brush 210, oilstone 310, and cleaning brush 320), thereby achieving the cleaning of the wafer surface using the cleaning roller brush 210. Similarly, when the cleaning roller brush 210 is lowered to a position lower than the oilstone 310 and the cleaning brush 320, the oilstone 310 and the cleaning brush 320 can be used to clean the wafer adsorption tray respectively.

[0059] The extension and retraction direction of the first lifting cylinder 261 and the guide sleeve 262 is preferably along the vertical direction.

[0060] In the above embodiments, for some models of wafer thinning equipment, the wafer adsorption disk itself cannot rotate. See [link to relevant documentation]. Figures 7 to 8 The suction cup cleaning assembly 300 provided by this utility model also includes a second support 330, a second drive motor 340, and a second bearing 350. A first guide rail 331 is provided on the mounting base 100. The second support 330 is slidably connected to the first guide rail 331. An oilstone 310 is connected to the second support 330. One end of the second support 330 also has a slotted hole 332. The second drive motor 340 is connected to the mounting base 100, and its output end is connected to an eccentric shaft 341. The second bearing 350 is slidably engaged within the slotted hole 332 and is also connected to the eccentric shaft 341. When the second drive motor 340 drives the eccentric shaft 341 to rotate, the eccentric shaft 341 causes the second bearing 350 to slide along the slotted hole 332, causing the second support 330 to swing along the first guide rail 331.

[0061] It should be noted that when the second drive motor 340 drives the eccentric shaft 341 to rotate, the second bearing 350 connected to the eccentric shaft 341 will rotate along with the eccentric shaft 341. Since the second bearing 350 is also engaged within the slotted hole 332, the movement of the second bearing 350 relative to the second support 330 is restricted within the range of the slotted hole 332, that is, the second bearing 350 slides along the slotted hole 332 or abuts against the inner wall of the slotted hole 332. Since the second support 330 is slidably connected to the first guide rail 331, when the second bearing 350 abuts against the inner wall of the slotted hole 332, the second support 330 can be driven to swing along the first guide rail 331, thereby converting the rotation of the output end of the second drive motor 340 into the linear motion of the second support 330. The second support 330 drives the oilstone 310 to swing, thus achieving the cleaning of the wafer adsorption disk.

[0062] In other words, for wafer thinning equipment where the wafer adsorption disk itself cannot rotate, this utility model can convert the rotation of the output end of the second drive motor 340 into linear motion along the first guide rail 331 by setting a matching eccentric shaft 341 and strip hole 332, and improve the cleaning effect of the adsorption disk cleaning component 300 by the swing of the oilstone 310.

[0063] In other possible implementations, see [link to relevant documentation]. Figure 2This invention provides another configuration for the wafer cleaning assembly 200 and the adsorption plate cleaning assembly 300, applicable to wafer thinning equipment where the wafer adsorption plate itself can rotate. Specifically, the adsorption plate cleaning assembly 300 provided by this invention further includes a second lifting assembly and a third lifting assembly. The second lifting assembly includes a third support 361 and a second lifting cylinder 362. A second guide rail 363 in the vertical direction is provided on the mounting base 100. The third support 361 is slidably connected to the second guide rail 363, and the oilstone 310 is connected to the third support 361. The second lifting cylinder 362 is connected between the mounting base 100 and the third support 361, used to drive the third support 361 to slide along the second guide rail 363 to adjust the height of the oilstone 310 relative to the cleaning roller brush 210 and the cleaning brush 320.

[0064] The third lifting assembly includes a fourth support 371 and a third lifting cylinder 372. A third guide rail 373 running vertically is provided on the mounting base 100. The fourth support 371 is slidably connected to the third guide rail 373, and the cleaning brush 320 is connected to the fourth support 371. The third lifting cylinder 372 is connected between the mounting base 100 and the fourth support 371, and is used to drive the fourth support 371 to slide along the third guide rail 373 to adjust the height of the cleaning brush 320 relative to the cleaning roller brush 210 and the oilstone 310.

[0065] In this embodiment, the second lifting cylinder 362 is adjusted so that the third support 361 lifts the oilstone 310 along the second guide rail 363 to a position higher than the cleaning roller brush 210 and the cleaning brush 320. At this time, the wafer adsorption disk is controlled to move above the oilstone 310 and begin to descend, so that the wafer adsorption disk first contacts the oilstone 310 during the descent, thereby achieving the cleaning of the adsorption surface of the wafer adsorption disk using the oilstone 310. The third lifting cylinder 372 is adjusted so that the fourth support 371 lifts the cleaning brush 320 along the third guide rail 373 to a position higher than the cleaning roller brush 210 and the oilstone 310. At this time, the wafer adsorption disk is controlled to move above the cleaning brush 320 and begin to descend, so that the wafer adsorption disk first contacts the cleaning brush 320 during the descent, thereby achieving the cleaning of the adsorption surface of the wafer adsorption disk using the cleaning brush 320.

[0066] In other words, for wafer thinning equipment where the wafer adsorption disk itself can rotate, this utility model sets up an oilstone 310 and a cleaning brush 320 driven by independent lifting cylinders, which can form an adjustable height difference between the cleaning roller brush 210, the oilstone 310 and the cleaning brush 320, so as to achieve cleaning of the wafer and the wafer adsorption disk in the same space, thereby realizing the integrated layout of the cleaning and drying device and effectively reducing the space occupied.

[0067] In some possible implementations, see [link to relevant documentation]. Figures 7 to 8The oilstone 310 has a process groove 311, which enhances the friction between the oilstone 310 and the adhesion surface of the wafer adsorption disk, resulting in better cleaning. However, when using the oilstone 310 with the process groove 311 to clean the wafer adsorption disk, dirt tends to accumulate more easily in the process groove 311. The adsorption disk cleaning assembly 300 of this invention also includes a rinsing assembly 380, which includes multiple high-pressure nozzles 381. The high-pressure nozzles 381 are used to spray high-pressure water to clean the process groove 311 and the adhesion surface of the wafer adsorption disk.

[0068] It should be noted that the rinsing components 380 are preferably arranged on both sides of the oilstone 310. When the wafer adsorption disk is moved to clean the adsorption surface of the wafer adsorption disk, the high-pressure nozzles 381 are controlled to spray high-pressure water towards the oilstone 310 and the wafer adsorption disk. This can provide flowing water to the process tank 311 on the oilstone 310 and the gaps on the adsorption surface of the wafer adsorption disk for cleaning, and wash away any dirt that may remain.

[0069] In some possible implementations, see [link to relevant documentation]. Figures 1 to 2 The cleaning roller brush 210, the oilstone 310 and the cleaning brush 320 are all distributed along the first direction, and the length direction of the cleaning roller brush 210, the length direction of the oilstone 310 and the length direction of the cleaning brush 320 are all arranged along the second direction, with the first direction perpendicular to the second direction.

[0070] It should be noted that the wafer adsorption disk used to adsorb wafers on the wafer thinning equipment typically only has translational freedom in a single direction, vertical freedom in a direction perpendicular to the translational direction, and rotational freedom in the direction of its own axis. By arranging the cleaning roller brush 210, oilstone 310, and cleaning brush 320 in the above directions, the cleaning and drying device can ensure the cleaning effect on the wafer and wafer adsorption disk.

[0071] One embodiment of the wafer thinning apparatus of this utility model includes an apparatus body and a cleaning and drying device as described in any of the above embodiments. The apparatus body is provided with a wafer adsorption disk. The wafer adsorption disk has a translational degree of freedom along a first direction.

[0072] Since the wafer thinning equipment of this embodiment includes any of the cleaning and drying devices in the first aspect described above, it has the beneficial effects of any of the above embodiments, which will not be repeated here.

[0073] Here, when the wafer adsorption disk on the device body also has the degree of freedom of rotation along its own axis, a long strip of cleaning sponge can be used instead of the cleaning roller brush 210, which can reduce costs; by driving the wafer adsorption disk to contact the sponge and rotate at high speed at the same time, a similar cleaning effect can be achieved.

[0074] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0075] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0076] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0077] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "exemplary embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0078] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cleaning and drying apparatus, characterized in that, It includes a mounting base plate (100), and a wafer cleaning assembly (200), an adsorption plate cleaning assembly (300), and a drying assembly disposed on the mounting base plate (100); The wafer cleaning assembly (200) includes a cleaning roller brush (210) for rubbing against the surface of the wafer to clean the wafer; The adsorption disk cleaning assembly (300) is disposed close to the cleaning roller brush (210). The adsorption disk cleaning assembly (300) includes an oilstone (310) and a cleaning brush (320). The oilstone (310) and the cleaning brush (320) are used to rub against the adsorption surface of the wafer adsorption disk to clean the wafer adsorption disk. The drying assembly is positioned close to the cleaning brush (320), and the drying assembly includes a nozzle (410) for spraying high-pressure gas to dry the surface of the wafer or the adhesion surface of the wafer adsorption disk.

2. The cleaning and drying apparatus according to claim 1, characterized in that, The wafer cleaning assembly (200) also includes: A roller brush shaft (220) and a first support (230) are provided. The roller brush shaft (220) is detachably connected to the first support (230) via a quick-release assembly (500). The cleaning roller brush (210) is sleeved on the roller brush shaft (220) so that the roller brush shaft (220) can drive the cleaning roller brush (210) to rotate along its own axis.

3. The cleaning and drying apparatus according to claim 2, characterized in that, The quick-release assembly (500) includes: The first bearing (510) is provided with a mounting groove (221) at the end of the roller brush shaft (220), and the first bearing (510) is disposed in the mounting groove (221); The locking handle (520) has a first mounting hole (231) on the first support (230), and the locking handle (520) is slidably inserted through the first mounting hole (231). The locking handle (520) is provided with a clamping shaft (530). A locking assembly is provided between the locking handle (520) and the first support (230), the locking assembly being used to lock and unlock the locking handle (520); when the locking handle (520) is in the locked state, the pressing shaft (530) presses against the inner ring of the first bearing (510).

4. The cleaning and drying apparatus according to claim 3, characterized in that, The locking assembly includes: A first locking block (541) is disposed on the locking handle (520) at one end near the roller brush shaft (220); a first locking groove (232) is provided on the inner wall of the first mounting hole (231) along the axial direction, and the first locking groove (232) matches the first locking block (541); a second locking groove (233) is provided on the wall surface of the first support (230) near the roller brush shaft (220), and the second locking groove (233) communicates with the first mounting hole (231); When the first locking block (541) is slidably locked in the first slot (232), the locking handle (520) is in the unlocked state, and the locking handle (520) can slide along the first mounting hole (231); When the locking handle (520) slides along the first mounting hole (231) until the first locking block (541) extends out of the first slot (232), the locking handle (520) is rotated so that the first locking block (541) is locked in the second slot (233), so that the locking handle (520) is in a locked state.

5. The cleaning and drying apparatus according to claim 3, characterized in that, The quick-release assembly (500) also includes: The spring (550) and the locking handle (520) have a second mounting hole (521) along their own axis, and the pressing shaft (530) is slidably inserted through the second mounting hole (521); the locking handle (520) has a third slot (522) at one end near the roller brush shaft (220), and the pressing shaft (530) also has a second locking block (531) at one end near the roller brush shaft (220); The spring (550) is sleeved on the clamping shaft (530), and the two ends of the spring (550) abut against the third slot (522) and the second block (531) respectively; when the locking handle (520) is in the locked state, the spring (550) is in the compressed state.

6. The cleaning and drying apparatus according to claim 2, characterized in that, The wafer cleaning assembly (200) also includes: A water tank (240) is connected to the first support (230), and the water tank (240) is located below the cleaning roller brush (210); the roller brush shaft (220) is arranged in a horizontal direction, and when the roller brush shaft (220) rotates, the bottom side of the cleaning roller brush (210) is immersed in the water in the water tank (240).

7. The cleaning and drying apparatus according to claim 2, characterized in that, The wafer cleaning assembly (200) also includes: The rotation drive assembly (250) includes a first drive motor (251), a first pulley (252), a second pulley (253), and a timing belt (254). The first drive motor (251) is connected to the first support (230), the first pulley (252) is connected to the output end of the first drive motor (251), the second pulley (253) is keyed to the roller brush shaft (220), and the timing belt (254) is sleeved on the first pulley (252) and the second pulley (253).

8. The cleaning and drying apparatus according to any one of claims 2 to 7, characterized in that, The wafer cleaning assembly (200) also includes: The first lifting assembly includes a first lifting cylinder (261) and a guide sleeve (262). The first lifting cylinder (261) and the guide sleeve (262) are both connected between the mounting base plate (100) and the first support (230). The first lifting cylinder (261) is used to drive the first support (230) to lift and lower along the extension and retraction direction of the guide sleeve (262) to adjust the height of the cleaning roller brush (210) relative to the oilstone (310) and the cleaning brush (320).

9. The cleaning and drying apparatus according to claim 8, characterized in that, The suction cup cleaning assembly (300) also includes: The second support (330) is provided on the mounting base plate (100) with a first guide rail (331). The second support (330) is slidably connected to the first guide rail (331). The oilstone (310) is connected to the second support (330). A strip hole (332) is also provided at one end of the second support (330). The second drive motor (340) is connected to the mounting base plate (100), and the output end of the second drive motor (340) is connected to an eccentric shaft (341). The second bearing (350) is slidably mounted in the strip hole (332), and the second bearing (350) is also connected to the eccentric shaft (341); When the second drive motor (340) drives the eccentric shaft (341) to rotate, the eccentric shaft (341) drives the second bearing (350) to slide along the strip hole (332), so that the second support (330) swings along the first guide rail (331).

10. The cleaning and drying apparatus according to any one of claims 2 to 7, characterized in that, The suction cup cleaning assembly (300) also includes: The second lifting assembly includes a third support (361) and a second lifting cylinder (362). A second guide rail (363) is provided on the mounting base plate (100). The third support (361) is slidably connected to the second guide rail (363). The oilstone (310) is connected to the third support (361). The second lifting cylinder (362) is connected between the mounting base plate (100) and the third support (361) and is used to drive the third support (361) to slide along the second guide rail (363) to adjust the height of the oilstone (310) relative to the cleaning roller brush (210) and the cleaning brush (320). The third lifting assembly includes a fourth support (371) and a third lifting cylinder (372). A third guide rail (373) is provided on the mounting base plate (100). The fourth support (371) is slidably connected to the third guide rail (373). The cleaning brush (320) is connected to the fourth support (371). The third lifting cylinder (372) is connected between the mounting base plate (100) and the fourth support (371) for driving the fourth support (371) to slide along the third guide rail (373) to adjust the height of the cleaning brush (320) relative to the cleaning roller brush (210) and the oilstone (310).

11. The cleaning and drying apparatus according to claim 1, characterized in that, A process groove (311) is provided on the oilstone (310); The suction cup cleaning assembly (300) also includes: The rinsing assembly (380) includes a plurality of high-pressure nozzles (381) for spraying high-pressure water streams to clean the process tank (311) and the adhesion surface of the wafer adsorption disk.

12. The cleaning and drying apparatus according to claim 1, characterized in that, The cleaning roller brush (210), the oilstone (310), and the cleaning brush (320) are all distributed along a first direction, and the length direction of the cleaning roller brush (210), the length direction of the oilstone (310), and the length direction of the cleaning brush (320) are all arranged along a second direction, with the first direction perpendicular to the second direction.

13. A wafer thinning apparatus, characterized in that, include: The device body is equipped with a wafer adsorption disk; And a cleaning and drying apparatus as described in any one of claims 1 to 12.

Images