External handling system for semiconductor processing and semiconductor processing apparatus

Abstract

This application relates to an external handling system and semiconductor processing equipment for semiconductor processing, specifically in the field of semiconductor integrated circuit technology, to address the poor safety and stability issues of external SMIF wafer loading devices. In this external handling system for semiconductor processing, a conveying device is used to transport a wafer transport box, which contains a wafer loading component. The wafer loading component is used to load or unload wafers at a loading stage. A first clamp is used to move the wafer loading component between the wafer transport box and the loading stage. A first detection module is used to detect whether a second clamp in the semiconductor processing equipment is in a first preset position. The second clamp is used to grip the wafer, and the first preset position is a position where the second clamp obstructs the movement of the wafer loading component. A control module is electrically connected to at least the first clamp and the first detection module to prevent the first clamp from moving the wafer loading component when the second clamp is in the first preset position.

Description

Technical Field

[0001] This application relates to the field of semiconductor integrated circuit technology, and in particular to an external handling system and semiconductor processing equipment for semiconductor processing. Background Technology

[0002] In semiconductor processing equipment, the external SMIF (External SMIF Interface) is a standardized mechanical docking module integrated externally into semiconductor equipment. Its core definition is: through a detachable load port and a clean microenvironment, it enables automatic docking, opening and closing of the wafer pod (SMIF-Pod, also known as a wafer sealing box) and process equipment, as well as wafer transfer, while isolating external contaminants.

[0003] External SMIF interfaces prioritize contamination isolation and yield improvement, reconstructing the semiconductor manufacturing process through standardized mechanical interfaces and intelligent control. They are widely used in wafer fabrication equipment and testing / measuring equipment within the semiconductor industry, and can also be applied to production line upgrades. By using external SMIF-LPT modules, open wafer cassette equipment can be upgraded to SMIF interfaces, reducing production line modification costs. Their modular design offers good compatibility and security.

[0004] The stability of the external SMIF determines the production efficiency of the equipment, and the safety of loading directly affects the wafer yield. Semiconductor processing equipment can be divided into built-in SMIF loading equipment and external (attached) SMIF loading equipment according to the wafer loading and transfer structure. Since external SMIF loading equipment usually only serves as a wafer loading and unloading mechanism, the loading and unloading commands of the external SMIF loading equipment cannot be communicated with the host (i.e., the production line) in terms of signals. That is, while the host performs wafer loading and unloading operations through actuators such as robotic arms, the external SMIF loading equipment can still perform wafer loading and unloading operations.

[0005] For example, when a wafer loader is present on the loading platform of the host machine, the host machine's robotic arm places or removes the wafer at the loader. At this time, because the robotic arm or the part of the wafer being gripped is inserted into the wafer loader, if the external SIMF loading device simultaneously executes an unloading command to move the wafer loader, it will cause the robotic arm to break and the wafer to break, thereby causing damage to the product, raw materials, and equipment. Utility Model Content

[0006] This application provides an external handling system and semiconductor processing equipment for semiconductor processing, in order to solve the problem of poor safety and stability of external SMIF loading equipment for wafers.

[0007] In a first aspect, this application provides an external handling system for semiconductor processing, including a wafer transport box, a conveying device, a wafer loader, a loading stage, a first clamp, a first detection module, and a control module. The conveying device is used to transport the wafer transport box, which contains the wafer loader, which loads wafers. The wafer loader is used to load or unload wafers at the loading stage. The first clamp is used to move the wafer loader between the wafer transport box and the loading stage. The first detection module is used to detect whether a second clamp in the semiconductor processing equipment is in a first preset position. The second clamp is used to grip the wafer, and the first preset position is a position where the second clamp obstructs the movement of the wafer loader. The control module is electrically connected to at least the first clamp and the first detection module to prevent the first clamp from moving the wafer loader when the second clamp is in the first preset position.

[0008] In some embodiments, the first detection module includes a first photoelectric sensor and a first comparison circuit. The first photoelectric sensor is positioned toward a first preset position. The first comparison circuit is electrically connected to the first photoelectric sensor and the control module. When the second clamp is in the first preset position, the first photoelectric sensor outputs a first position signal, and the first comparison circuit receives the first position signal and outputs a first high-level signal. When the second clamp is not in the first preset position, the first photoelectric sensor outputs a second position signal, and the first comparison circuit receives the second position signal and outputs a first low-level signal.

[0009] The control module receives a first low-level signal and uses it to control the first fixture to perform an unloading step, which removes the wafer loader from the loading stage.

[0010] The control module receives a first high-level signal and uses it to prevent the first fixture from performing the unloading step.

[0011] In some embodiments, the control module includes a first execution circuit and a second execution circuit. The first execution circuit is electrically connected to a first fixture and a first comparison circuit, and is used to control the first fixture to initiate an unloading step or a shutdown step. The second execution circuit is electrically connected to the first comparison circuit, and is also used to electrically connect to a second fixture.

[0012] In some implementations, when the first execution circuit controls the first fixture to initiate the unloading step, the first fixture contacts and moves the wafer loader, and the second execution circuit controls the second fixture and the first detection module to stop.

[0013] In some implementations, when the first execution circuit controls the first fixture to initiate the unloading step, if the first comparator circuit outputs a first high-level signal before the first fixture moves the wafer load, the first execution circuit cancels the execution of the unloading step.

[0014] In some embodiments, the external handling system for semiconductor processing includes a second detection module disposed at the loading stage and electrically connected to the control module, for detecting whether the loading stage is equipped with a wafer loader.

[0015] In some embodiments, the second detection module includes a second photoelectric sensor and a second comparison circuit. The second photoelectric sensor is disposed at the loading stage. The second comparison circuit is electrically connected to the second photoelectric sensor and the control module. When a wafer load is mounted on the loading stage, the second photoelectric sensor outputs a first status signal, and the second comparison circuit receives the first status signal and outputs a second high-level signal. When no wafer load is mounted on the loading stage, the second photoelectric sensor outputs a second status signal, and the second comparison circuit receives the second status signal and outputs a second low-level signal.

[0016] The control module receives a second low-level signal and uses it to control the first fixture to perform a loading step, which moves the wafer loader to the loading stage.

[0017] The control module receives a second high-level signal and uses it to prevent the first fixture from performing the loading step. In some embodiments, the control module includes a third execution circuit electrically connected to the first fixture and the second comparison circuit. The third execution circuit controls the first fixture to initiate the loading step.

[0018] In some implementations, the control module includes a first execution circuit and a second execution circuit. The second execution circuit receives a first low-level signal and is used to control the second fixture and the first detection module to stop. The third execution circuit controls the first fixture to perform the loading step.

[0019] Secondly, this application provides a semiconductor processing apparatus, including the external handling system for semiconductor processing, a processing table, and a second fixture as described in the first aspect. The processing table is used to process wafers. The second fixture is used to move the wafer between a wafer loader and the processing table. A first detection module is positioned toward a first preset position and is used to detect whether the second fixture is in the first preset position. The second fixture is electrically connected to a control module.

[0020] The technical solutions provided in this application have the following advantages compared with the prior art: The first detection module and control module are configured such that the control module is electrically connected to at least the first clamp and the first detection module. After applying the aforementioned external handling system to the semiconductor processing equipment, the first detection module is positioned towards a first preset position to detect the presence of a second clamp at that position, and the control module 27 can obtain the position signal of the second clamp through the first detection module. When the second clamp is at the first preset position, since the second clamp (including the clamped wafer) will partially contact or engage (or insert) the wafer loading device, the control module can issue a command based on the position signal to prevent the first clamp from moving the wafer loading device, thereby avoiding the situation where the second clamp and the first clamp operate simultaneously at the wafer loading device, i.e., an interlocking mechanism. This prevents at least one of the second clamp, the first clamp, the wafer loading device, and the wafer from breaking or being damaged.

[0021] This solution adds a first detection module and a control module to the external handling system to monitor the running position of the second fixture in the processing machine, thereby enabling collaborative operation between the external handling system and the processing machine. By monitoring the position status of key components (such as the second fixture) in real time and establishing an interlocking mechanism, mechanical interference between the wafer load and the second fixture in the processing machine is effectively avoided during the movement of the wafer load. This solves the equipment collision problem caused by signal asynchrony, thus giving the semiconductor processing equipment equipped with the external handling system higher safety and stability, while reducing the wafer breakage rate caused by operational conflicts, thereby improving the wafer processing yield. Attached Figure Description The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0024] Figure 1 A side view of a semiconductor processing apparatus provided in an embodiment of this application; Figure 2 A top view of a semiconductor processing apparatus provided in an embodiment of this application; Figure 3 This is a partial structural schematic diagram of a semiconductor processing equipment provided in an embodiment of this application; Figure 4 This is a schematic diagram of the connection structure of a semiconductor processing equipment provided in an embodiment of this application.

[0025] Explanation of reference numerals in the attached figures: 10. Processing machine; 20. External handling system; 21. Wafer transport box; 22. Conveying device; 23. Wafer loading device; 24. Loading platform; 25. First fixture; 26. First detection module; 261. First photoelectric sensor; 262. First comparison circuit; 27. Control module; 271. First execution circuit; 272. Second execution circuit; 273. Third execution circuit; 28. Second detection module; 281. Second photoelectric sensor; 282. Second comparison circuit; 30. Second clamp; 200. Wafer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0028] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0029] Figure 1 This is a side view of a semiconductor processing apparatus provided in an embodiment of this application. Figure 2 This is a top view of a semiconductor processing apparatus provided in an embodiment of this application. Figure 3 This is a partial structural schematic diagram of a semiconductor processing equipment provided in an embodiment of this application. Figure 4 This is a schematic diagram of the connection structure of a semiconductor processing equipment provided in an embodiment of this application.

[0030] Please see Figures 1 to 4 This application provides an external handling system and semiconductor processing equipment for semiconductor processing, in order to solve the problem of poor safety and stability of external SMIF loading equipment for wafers.

[0031] like Figure 1 The embodiments shown in this application provide a semiconductor processing apparatus, including a processing table 10, an external transport system for semiconductor processing (hereinafter referred to as the external transport system 20), and a second fixture 30. The processing table 10 is used to process wafers 200.

[0032] like Figure 1 , Figure 2 and Figure 4 As shown, the external handling system 20 includes a wafer transport box 21, a conveying device 22, a wafer loading component 23, a loading platform 24, a first fixture 25, a first detection module 26, and a control module 27.

[0033] The wafer transport box 21 is a sealed loading and transport container used to store and accommodate wafer loaders 23. Driven by the conveyor 22, it reciprocates between the loading platform 24 and a corresponding position. During its movement toward the loading platform 24, the wafer transport box 21 can remain open after approaching the platform, allowing the wafer loaders 23 within it to be transported onto the platform 24 using tools such as the first clamp 25. This moves the wafer 200 (located within the wafer loader 23) to be processed onto the platform 24, enabling the processing machine 10 to control the second clamp 30 to remove the wafer 200 from the wafer loader 23 at the platform 24 for loading. After the processing machine 10 processes the wafer 200, the processed wafers 200 are stacked within the wafer loader 23 using the second clamp 30 to complete the unloading process. Subsequently, the wafer loader 23 can be moved into the wafer transport box 21 to transport the processed wafer 200 from the loading stage 24 to the corresponding location such as storage.

[0034] During the movement of the wafer transport box 21 and the internal wafer loading unit 23, the wafer transport box 21 is in a closed state. A locking mechanism can also be used to position and lock the internal wafer loading unit 23 to prevent external vibrations and contamination from interfering with the internally stored wafers 200, such as affecting the cleanliness of the wafer 200 surface. During the removal or placement of the wafer loading unit 23 from the wafer transport box 21, the wafer transport box 21 remains open to facilitate the removal and placement of the wafer loading unit 23.

[0035] The conveying device 22 is used to move the wafer transport box 21. The conveying device 22 can be one or more of the following power devices: conveyor belt, elevator, robotic arm, and powered trolley, or a combination of at least two of them. As long as it meets the requirements, it is not limited in this respect.

[0036] The wafer loader 23 refers to a carrier that holds the wafer 200 and is used to load the wafer 200. The wafer loader 23 may have slots or brackets inside for the insertion and positioning of the wafer 200 to achieve the spaced stacking of multiple wafers. The wafer loader 23 may be made of metal, plastic or ceramic components, etc., and there is no limitation on the type.

[0037] like Figure 3 As shown, the wafer loader 23 is used to load and unload wafers 200 at the loading stage 24. If the loading stage 24 is a platform of an external handling system 20, it is used to place the wafer loader 23 so that the wafers 200 stacked within the wafer loader 23 can be loaded onto the processing machine 10 via the second clamp 30. Alternatively, wafers 200 processed within the processing machine 10 can be unloaded into the wafer loader 23 via the second clamp 30 for stacking and storage.

[0038] The first clamp 25, part of the external handling system 20, is used to move the wafer loader 23 between the wafer transport box 21 and the loading stage 24. When the conveyor 22 moves the wafer transport box 21 to the vicinity of the loading stage 24, the first clamp 25 moves the wafer loader 23 from the wafer transport box 21 to the corresponding position on the loading stage 24, so that the wafers 200 to be processed in the wafer loader 23 can be loaded at the loading stage 24 by the second clamp 30. Alternatively, the first clamp 25 can move the wafer loader 23 containing the processed wafers 200 from the loading stage 24 into the wafer transport box 21.

[0039] The first clamp 25 and the second clamp 30 can be corresponding robotic arms, robotic hands, or multi-axis moving chucks, etc. The first clamp 25 is only required to meet the needs of transporting the wafer loading component 23, and the second clamp 30 is used to clamp the wafer 200 to move the wafer between the wafer loading component 23 and the processing table 10, thereby meeting the needs of loading and unloading the wafer 200. There are no restrictions on this.

[0040] The first detection module 26 is positioned towards a first preset position to detect whether the second clamp 30 in the semiconductor processing equipment is in the first preset position. This first detection position is a preset calibration position, that is, a movement position that the second clamp 30 inevitably passes through during loading and unloading. When the second clamp 30 is in the second preset position, the end of the second clamp 30 or the wafer 200 it grips partially contacts or is in a snap-fit ​​(or plug-in) state with the wafer loader 23, so that the wafer loader 23 at the loading stage 24 cannot move smoothly to the wafer transport box 21, or the wafer loader 23 inside the wafer transport box 21 cannot move smoothly to the loading stage 24. In other words, the second clamp 30 in the first preset position will obstruct the movement of the wafer loader 23.

[0041] Thus, through the configuration of the first detection module 26 and the control module 27, the control module 27 is electrically connected to at least the first clamp 25 and the first detection module 26. After the external handling system 20 is applied to the semiconductor processing equipment, the first detection module 26 is positioned towards a first preset position to detect whether the second clamp 30 exists at the first preset position, and the control module 27 can obtain the position signal of the second clamp 30 through the first detection module 26. When the second clamp 30 is at the first preset position, since the second clamp 30 (including the clamped wafer 200) will partially contact or engage (or insert) the wafer loading component 23, the control module 27 can issue a command based on the position signal to prevent the first clamp 25 from moving the wafer loading component 23, thereby avoiding the situation where the second clamp 30 and the first clamp 25 are operating at the wafer loading component 23 simultaneously, i.e., an interlocking mechanism. This will prevent at least one of the second clamp 30, the first clamp 25, the wafer loading component 23, and the wafer 200 from breaking or being damaged.

[0042] This solution adds a first detection module 26 and a control module 27 to the external handling system 20 to monitor the running position of the second fixture 30 in the processing machine 10, thereby enabling collaborative operation between the external handling system 20 and the processing machine 10. By monitoring the position status of key components (such as the second fixture 30) in real time and establishing an interlocking mechanism, mechanical interference between the wafer loading component 23 and the second fixture 30 in the processing machine 10 during movement is effectively avoided. This solves the equipment collision problem caused by signal asynchrony, thus giving the semiconductor processing equipment equipped with the external handling system 20 higher safety and stability. At the same time, it reduces the wafer 200 breakage rate caused by operational conflicts, thereby improving the yield of wafer 200 processing.

[0043] The first detection module 26 can be an image acquisition device, such as a camera or a high-speed camera, to cooperate with the control module 27 to analyze the acquired image at the first preset position, thereby determining whether the second clamp 30 exists at the first preset position.

[0044] Alternatively, the first detection module 26 can be a button sensor, meaning the sensing end of the first detection module 26 is located at a first preset position. When the second clamp 30 moves to the first preset position, the second clamp 30 contacts the aforementioned sensing end, causing the first detection module 26 to send a position signal to the control module 27 indicating that the second clamp 30 is at the first preset position.

[0045] In some embodiments, such as Figure 4As shown, the first detection module 26 includes a first photoelectric sensor 261 and a first comparison circuit 262. The first photoelectric sensor 261 is positioned towards a first preset position. The first comparison circuit 262 is electrically connected to the first photoelectric sensor 261 and the control module 27. Figure 1 When the second clamp 30 is in the first preset position, the first photoelectric sensor 261 outputs a first position signal, and the first comparison circuit 262 receives the first position signal and outputs a first high-level signal. When the second clamp 30 is not in the first preset position, the first photoelectric sensor 261 outputs a second position signal, and the first comparison circuit 262 receives the second position signal and outputs a first low-level signal. The control module 27 receives the first low-level signal and controls the first clamp 25 to perform an unloading step, which removes the wafer loader 23 from the loading stage 24. The control module 27 receives the first high-level signal and prevents the first clamp 25 from performing the unloading step. In this embodiment, the first photoelectric sensor 261 can be a through-beam, diffuse reflection, or specular reflection type, etc., and can be flexibly selected according to different needs. For example, the E3JK-DR12 diffuse reflective photoelectric sensor includes a light emitter and a light receiver. The light emitter emits a 624nm light source from a red light-emitting diode and shines it forward. When it hits an object, the light diffuses back. The light receiver then determines whether the object has received the light emitted by the light emitter, thereby determining whether the circuit is on or off.

[0046] It should be noted that, as Figure 1 and Figure 2 As shown, taking the side of the loading stage 24 facing the processing table 10 as the front side as an example, the second clamp 30 approaches the wafer loader 23 from front to back to pick up and place the wafer 200. At this time, the position 5 to 10 centimeters away from the loading stage 24 (or the wafer loader 23) on the side of the loading stage 24 facing the processing table 10 is the center position that the second clamp 30 must pass through. If the first photoelectric sensor 261 is a through-beam structure, one part of the first photoelectric sensor 261 can be installed in an area 10-50 cm above the above-mentioned center position, and another part of the first photoelectric sensor 261 can be installed in an area 10-50 cm below the above-mentioned center position. That is, both the upper and lower areas of the center position represent the first preset position. This ensures that while the first photoelectric sensor 261 avoids the second clamp 30, the second clamp 30 must pass through and block the through-beam of the first photoelectric sensor 261 during the picking up and placing of the wafer 200, thereby triggering the first high-level signal.

[0047] If the first photoelectric sensor 261 has a specular reflection or diffuse reflection structure, the detection distance of the aforementioned area from the center position can be adjusted to 20-30cm, which is beneficial for receiving the reflected identification light signal. The aforementioned first preset position can also be located on either side of the center position in the left-right direction, and the first photoelectric sensor 261 can be installed therein; there is no limitation on this.

[0048] For example, if the receiver receives light emitted by the emitter, it indicates that the second clamp 30 is at the first preset position. The receiver outputs a first position signal to the first comparison circuit, causing the first comparison circuit to turn on and output a first high-level signal. If the receiver does not receive light emitted by the emitter, it indicates that the second clamp 30 has not moved to the first preset position. At this time, the receiver outputs a second position signal to the first comparison circuit, causing the first comparison circuit to remain off and output a first low-level signal.

[0049] Thus, by setting the first detection module as a photoelectric sensor structure, the presence of the second clamp 30 at the first preset position can be quickly and accurately identified through the conversion of photoelectric signals.

[0050] Based on this, such as Figure 4 As shown, the control module 27 includes a first execution circuit 271 and a second execution circuit 272. The first execution circuit 271 is electrically connected to the first clamp 25 and the first comparison circuit 262. The first execution circuit 271 is used to receive a first low-level signal and a first high-level signal to control the first clamp 25 to start or not start the unloading step. The second execution circuit 272 is electrically connected to the first comparison circuit 262, and the second execution circuit 272 is also used to electrically connect to the second clamp 30.

[0051] For example, the first execution circuit 271 and the second execution circuit 272 can be a relay structure or a semiconductor switch structure, so as to control the corresponding first clamp 25 and second clamp 30 to perform action steps through signal current (or signal voltage) such as the first high-level signal and the first low-level signal.

[0052] Alternatively, the first execution circuit 271 and the second execution circuit 272 can also be part of the analog circuitry of the control module 27. In this way, the control module 27 can be programmed with a preset program to control the first clamp 25 and the second clamp 30 to perform corresponding action steps according to the first high-level signal and the first low-level signal.

[0053] Thus, when the first comparison circuit 262 outputs a first low-level signal, it indicates that the first preset position is not occupied by the second clamp 30. At this time, the first execution circuit 271 receives the first low-level signal to keep the first clamp 25 energized and can control the first clamp 25 to perform the unloading step. This allows the wafer loader 23 to be moved from the loading stage 24 to the wafer transport box 21 as needed, thereby achieving smooth operation of the unloading step under the interlocking mechanism.

[0054] Specifically, when the second execution circuit 272 receives a first low-level signal, or when the first clamp 25 is performing an unloading or loading step, the second execution circuit 272 can control the second clamp 30 and the first detection module 26 to stop, that is, the second clamp 30 and the first detection module 26 are in a power-off state or a shutdown step is performed. At this time, under the control of the first execution circuit 271, the first clamp 25 can smoothly perform the unloading step. Alternatively, under the control of the third execution circuit 273, the first clamp 25 can smoothly perform the loading step.

[0055] The shutdown of the second fixture 30 prevents the first fixture 25 from approaching or contacting the wafer loader 23 during its movement. Similarly, the shutdown of the first detection module 26 prevents interference from error signals caused by the first fixture 25 approaching or passing the first preset position during the movement of the wafer loader 23. This allows the first fixture 25 to smoothly load and unload the wafer loader 23.

[0056] It should be noted that, in the embodiments of this application, the execution circuit can be used to control the first clamp 25 or the second clamp 30 to turn on or off the power supply, and subsequently, operation instructions to execute the corresponding steps can be issued through other parts of the control module 27.

[0057] Alternatively, preset step programs can be built into the first clamp 25 and the second clamp 30, such as the unloading step, loading step, and shutdown step of the first clamp 25, and the loading step, unloading step, and shutdown step of the second clamp 30. In this case, the execution circuit can output corresponding step instructions according to the different level signals received, so that the first clamp 25 and the second clamp 30 can perform the corresponding steps.

[0058] When the first execution circuit 271 and the second execution circuit 272 receive the first high-level signal, the second clamp 30 is in the first preset position. At this time, the second execution circuit 272 controls the second clamp 30 to maintain its current state, such as performing the wafer 200 loading or unloading step. Meanwhile, the first execution circuit 271 controls the first clamp 25 to be in a stopped state, such as the first clamp 25 being in a power-off state or performing a stop step (not performing any action).

[0059] The first execution circuit 271 and the second execution circuit 272 are connected in parallel to the output of the first comparison circuit 262.

[0060] Before the first execution circuit 271 and the second execution circuit 272 receive the first low-level signal, but before the first fixture 25 performs the unloading and loading steps (i.e., before the first fixture 25 moves the wafer loader 23), if the first detection module 26 and the second fixture 30 have not stopped, and the second fixture 30 is performing the loading or unloading step, the second fixture 30 will move to the first preset position, and the first comparison circuit 262 will output the first high-level signal. At this time, the first execution circuit 271 will cancel the execution of the unloading or loading step, thereby preventing the first fixture 25 and the second fixture 30 from contacting the wafer loader 23 simultaneously. During the application of the external handling system 20 in semiconductor processing equipment, the unloading and loading steps of the wafer loader 23 itself also need to avoid interference.

[0061] like Figure 1 , Figure 2 and Figure 3 As shown, the external handling system 20 includes a second detection module 28, which is located at the loading platform 24 and connected to the control module 27 (see reference). Figure 4 Electrical connection, used to detect whether the loading stage 24 is equipped with wafer loading component 23.

[0062] Thus, by setting up the second detection module 28, the control module 27 can monitor the position of the wafer loader 23 at the loading stage 24. When a wafer loader 23 is placed at the loading stage 24, the second detection module 28 sends a position signal to the control module 27, causing the control module 27 to prevent the first fixture 25 from performing the loading step, thus avoiding two wafer loaders 23 at the loading stage 24 simultaneously. This prevents the two wafer loaders 23 from colliding at the loading stage 24 and causing damage to the wafer 200 substrate. This helps improve the yield of wafer 200 processing and further enhances the safety and stability of the semiconductor processing equipment equipped with the external handling system 20.

[0063] The second detection module 28 can be configured as an image acquisition device or a button sensor, similar to the first detection module 26.

[0064] Or, such as Figure 4 As shown, the second detection module 28 includes a second photoelectric sensor 281 and a second comparison circuit 282. The second photoelectric sensor 281 is disposed on the loading stage 24 (e.g., Figure 1(As shown). The second comparison circuit 282 is electrically connected to the second photoelectric sensor 281 and the control module 27. When the loading stage 24 has a wafer loader 23, the second photoelectric sensor 281 outputs a first status signal, and the second comparison circuit 282 receives the first status signal and outputs a second high-level signal. When the loading stage 24 does not have a wafer loader 23, the second photoelectric sensor 281 outputs a second status signal, and the second comparison circuit 282 receives the second status signal and outputs a second low-level signal. The control module 27 receives the second low-level signal and uses it to control the first fixture 25 to perform a loading step, which moves the wafer loader 23 to the loading stage 24. The control module 27 receives the second high-level signal and uses it to prevent the first fixture 25 from performing the loading step.

[0065] In this embodiment, the second photoelectric sensor 281 can be a through-beam, diffuse reflection, or specular reflection type, and can be flexibly selected according to different needs. For example, the E3JK-DR12 diffuse reflection type photoelectric sensor includes a emitter and a receiver. The emitter emits a 624nm light source from a red light-emitting diode and emits it forward. After hitting an object, the light diffuses back. The receiver then determines whether it has received the light emitted by the emitter, thereby determining whether the circuit is on or off.

[0066] It should be noted that, as Figure 2 and Figure 4 As shown, the loading stage 24 is positioned with its front side facing the processing table 10, and is used for picking up and placing wafers 200 via the second clamp 30. The rear side of the loading stage 24 is used to transport wafer loaders 23 via wafer transport boxes 21. Based on this, second photoelectric sensors 281 can be installed on the left and right sides of the loading stage 24.

[0067] If the second photoelectric sensor 281 is a through-beam structure, that is, its transmitter and receiver can be respectively set on the left and right sides of the loading stage 24 and facing the central area for placing the wafer loader 23. When the wafer loader 23 is present on the loading stage 24, the wafer loader 23 will block the receiver from receiving the light signal from the transmitter, so as to output a first state signal and a first high-level signal.

[0068] If the second photoelectric sensor 281 is a diffuse reflection or specular reflection type, that is, the transmitter and receiver are integrated, the second photoelectric sensor 281 can be arranged on the left or right side of the loading stage 24, close to and facing the area for placing the wafer load 23. A closer installation distance is beneficial for receiving reflected light signals. For example, if the receiver receives light emitted by the emitter, it indicates that a wafer load 23 is present at the loading stage 24. The receiver outputs a first status signal to the second comparison circuit 282, so that the second comparison circuit 282 is turned on and outputs a second high-level signal. If the receiver does not receive light emitted by the emitter, it indicates that no wafer load 23 is present at the loading stage 24. The receiver then outputs a second status signal to the second comparison circuit 282, so that the second comparison circuit 282 remains off and outputs a second low-level signal.

[0069] Thus, by setting the second detection module as a photoelectric sensor structure, the presence of wafer loader 23 at the loading stage 24 can be quickly and accurately identified through the conversion of photoelectric signals, thereby avoiding the situation where the two wafer loaders 23 collide and break at the loading stage 24 due to repeated loading steps.

[0070] Based on this, such as Figure 3 As shown, the control module 27 includes a third execution circuit 273, which is electrically connected to the first clamp 25 and the second comparison circuit 282. The third execution circuit 273 is used to receive a second low-level signal and a second high-level signal to control the first clamp 25 to start or not start the loading step.

[0071] For example, the third execution circuit 273 may be a relay structure or a semiconductor switch structure, so as to control the corresponding first clamp 25 to perform action steps through signal current (or signal voltage) such as the second high-level signal and the second low-level signal.

[0072] Alternatively, the third execution circuit 273 can also be a part of the analog circuitry of the control module 27. In this way, the control module 27 can be programmed with a preset program to control the first clamp 25 to perform corresponding action steps based on the second high-level signal and the second low-level signal.

[0073] Thus, when the second comparator circuit 282 outputs a second low-level signal, it indicates that there is no wafer loader 23 at the loading stage 24. At this time, the third execution circuit 273 receives the second low-level signal to keep the first clamp 25 energized and to control the first clamp 25 to perform the loading step. If the second comparator circuit 282 outputs a second high-level signal, it indicates that a wafer loader 23 has been placed at the loading stage 24. At this time, the third execution circuit 273 receives the second high-level signal to cause the first clamp 25 to perform an unloading step or a shutdown step. This avoids the possibility of the two wafer loaders 23 colliding and breaking at the loading stage 24 due to repeated loading steps.

[0074] The loading step can refer to the step where the first clamp 25 moves the wafer loader 23 from the wafer transport box 21 to the loading stage 24. The corresponding unloading step is the step where the first clamp 25 moves the wafer loader 23 from the loading stage 24 to the wafer transport box 21.

[0075] In some other embodiments, the wafer transport box 21, the conveying device 22, and the wafer loader 23 have a first conveying step and a second conveying step.

[0076] The loading step also includes a first transfer step, in which: an unprocessed wafer 200 is loaded into the wafer loader 23, the wafer transport box 21 stores the wafer loader 23, and the transfer device 22 moves the wafer transport box 21 to the vicinity of the loading stage 24.

[0077] The unloading step also includes a second transfer step, which is as follows: the processed wafer 200 is loaded into the wafer loader 23, the wafer transport box 21 stores the wafer loader 23, and the transfer device 22 transports the wafer transport box 21 out of the loading table 24.

[0078] Based on this, the control module 27 is also electrically connected to the conveying device 22 at least. This allows the control module 27 to prevent the conveying device 22 from moving the wafer transport cassette 21, which includes the wafer loader 23, to a position adjacent to the loading stage 24 after receiving a second high-level signal. Alternatively, after receiving a second low-level signal, the control module 27 controls the conveying device 22 to move the wafer transport cassette 21, which includes the wafer loader 23, away from the position adjacent to the loading stage 24.

[0079] Thus, in the semiconductor processing equipment provided in the embodiments of this application: 1. When there is no wafer loading component 23 at the loading stage 24, the control module 27 can control the execution of the loading steps.

[0080] 2. When a wafer loading component 23 is installed at the loading stage 24, the control module 27 cannot control the execution of the loading steps.

[0081] 3. When the wafer loading component 23 is provided at the loading stage 24, if the second clamp 30 moves to the first preset position, the control module 27 cannot control the execution of the unloading step, and the control module 27 also cannot control the execution of the loading step.

[0082] 4. When the wafer loading component 23 is provided at the loading stage 24, if the second clamp 30 does not move to the first preset position, the control module 27 can control the execution of the unloading step.

[0083] 4.1 If the second clamp 30 moves to the first preset position before the moving wafer loader 23, the unloading step is cancelled.

[0084] 4.2 Before moving the wafer loader 23, if the second clamp 30 has not moved to the first preset position, the control module 27 controls the execution of the unloading step. Otherwise, the control module 27 controls the first clamp 25 to stop moving at any time.

[0085] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “” used herein may also indicate the inclusion of the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated, unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0086] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0087] The above are merely specific embodiments of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An external handling system for semiconductor processing, characterized in that, include: Wafer transport box; A conveying device for transporting the wafer transport box; A wafer loader, wherein the wafer transport box is used to store the wafer loader, and the wafer loader is used to load wafers; A loading stage, wherein the wafer loading component is used to load or unload wafers at the loading stage; A first clamp is used to move the wafer loader between the wafer transport box and the loading stage; The first detection module is used to detect whether the second clamp in the semiconductor processing equipment is in a first preset position. The second clamp is used to clamp the wafer. The first preset position is the position where the second clamp obstructs the movement of the wafer loading component. The control module is electrically connected to at least the first fixture and the first detection module to prevent the first fixture from moving the wafer loader when the second fixture is in a first preset position.

2. The external handling system for semiconductor processing according to claim 1, characterized in that, The first detection module includes: The first photoelectric sensor is positioned toward the first preset position; The first comparison circuit is electrically connected to the first photoelectric sensor and the control module. When the second clamp is in the first preset position, the first photoelectric sensor outputs a first position signal, and the first comparison circuit receives the first position signal and outputs a first high-level signal. When the second clamp is not in the first preset position, the first photoelectric sensor outputs a second position signal, and the first comparison circuit receives the second position signal and outputs a first low-level signal. The control module receives the first low-level signal and controls the first fixture to perform an unloading step, the unloading step being used to remove the wafer loader from the loading stage; The control module receives the first high-level signal and is used to prevent the first fixture from performing the unloading step.

3. The external handling system for semiconductor processing according to claim 2, characterized in that, The control module includes: A first execution circuit is electrically connected to the first fixture and the first comparison circuit. The first execution circuit is used to control the first fixture to start the unloading step or the shutdown step. And a second execution circuit, which is electrically connected to the first comparison circuit and is used to electrically connect the second clamp.

4. The external handling system for semiconductor processing according to claim 3, characterized in that, When the first execution circuit controls the first fixture to initiate the unloading step; The first fixture contacts and moves the wafer loader, and the second execution circuit controls the second fixture and the first detection module to stop.

5. The external handling system for semiconductor processing according to claim 3, characterized in that, When the first execution circuit controls the first fixture to initiate the unloading step; If the first comparison circuit outputs a first high-level signal before the first fixture moves the wafer loader, the first execution circuit cancels the unloading step.

6. The external handling system for semiconductor processing according to any one of claims 1-5, characterized in that, The external handling system for semiconductor processing includes: The second detection module is located at the loading stage and electrically connected to the control module, and is used to detect whether the loading stage is equipped with the wafer loading component.

7. The external handling system for semiconductor processing according to claim 6, characterized in that, The second detection module includes: A second photoelectric sensor is disposed at the loading platform; The second comparison circuit is electrically connected to the second photoelectric sensor and the control module. When the loading stage is equipped with the wafer loading component, the second photoelectric sensor outputs a first status signal, and the second comparison circuit receives the first status signal and outputs a second high-level signal. When the loading stage is not equipped with the wafer loading component, the second photoelectric sensor outputs a second status signal, and the second comparison circuit receives the second status signal and outputs a second low-level signal. The control module receives the second low-level signal and controls the first fixture to perform a loading step, the loading step being used to move the wafer loader to the loading stage; The control module receives the second high-level signal and is used to prevent the first fixture from performing the loading step.

8. The external handling system for semiconductor processing according to claim 7, characterized in that, The control module includes: A third execution circuit is electrically connected to the first fixture and the second comparison circuit; the third execution circuit is used to control the first fixture to initiate the loading step.

9. The external handling system for semiconductor processing according to claim 8, characterized in that, In the case where the control module includes a first execution circuit and a second execution circuit; The second execution circuit receives a first low-level signal and is used to control the second fixture and the first detection module to stop. The third execution circuit controls the first fixture to perform the loading step.

10. A semiconductor processing apparatus, characterized in that, include: External handling system for semiconductor processing as described in any one of claims 1-9; A processing machine for processing the wafer; And a second fixture for moving the wafer between the wafer loader and the processing table; The first detection module is positioned toward the first preset position and is used to detect whether the second clamp is in the first preset position. The second clamp is electrically connected to the control module.

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