Cooking appliance

Abstract

The utility model provides a kind of cooking utensil.The specific cooking utensil includes: baking tray assembly, baking tray assembly at least includes baking tray seat, baking tray and temperature controller, wherein, temperature controller is set in baking tray seat, temperature controller is set in the side where baking tray bottom is, and temperature controller is located at the geometric center position of baking tray, and temperature controller is at least used to monitor the temperature of baking tray.The present application solves the problem of inaccurate temperature measurement and error caused by the off-center position of the temperature controller in the prior art.

Description

Technical Field

[0001] This utility model relates to the field of cooking equipment technology, and more specifically, to a cooking utensil. Background Technology

[0002] In existing technologies, baking pans are typically heated by embedding a heating element in the bottom of a cast aluminum pan. This design is mature and widely used in various baking pan products on the market. However, for iron and stainless steel baking pans, due to limitations in their material properties and manufacturing processes, it is not possible to directly use a heating element attached to the bottom for heating. This is mainly because the thermal conductivity of iron and stainless steel differs significantly from that of aluminum, resulting in uneven heat distribution and affecting cooking results.

[0003] Furthermore, in traditional baking pan designs, the thermostat is often not located in the center of the pan, but rather off-center on one side or at the bottom edge. This placement can lead to inaccurate temperature measurements during heating. In particular, when the thermostat comes into contact with the pan's extension column or other non-heated areas, the real-time temperature feedback will be interfered with, resulting in significant measurement errors and consequently affecting the temperature control accuracy throughout the entire cooking process.

[0004] No effective solution has yet been proposed to address the above issues. Utility Model Content

[0005] The main purpose of this utility model is to provide a cooking appliance to solve the problem of inaccurate temperature measurement and errors caused by the non-centered position of the thermostat in the prior art.

[0006] To achieve the above objectives, according to one aspect of the present invention, a cooking appliance is provided, comprising: a baking pan assembly, the baking pan assembly including at least a baking pan base, a baking pan, and a thermostat, wherein the thermostat is disposed within the baking pan base, the thermostat is disposed on one side where the bottom of the baking pan is located, and the thermostat is located at the geometric center of the baking pan, and the thermostat is used at least for monitoring the temperature of the baking pan.

[0007] Furthermore, the baking tray base includes an upper baking tray base and a lower baking tray base, the baking tray includes an upper baking tray and a lower baking tray, and the temperature controller includes an upper baking tray temperature controller and a lower baking tray temperature controller. The upper baking tray is connected to the upper baking tray base, the lower baking tray is connected to the lower baking tray base, the upper baking tray temperature controller is connected to the upper baking tray base, and the upper baking tray temperature controller is located at the geometric center of the upper baking tray. And / or, the lower baking tray temperature controller is connected to the lower baking tray base, and the lower baking tray temperature controller is located at the geometric center of the lower baking tray.

[0008] Furthermore, the cooking appliance includes: an upper baking pan heating module, which is connected to an upper baking pan base and located at the bottom of the upper baking pan. The upper baking pan heating module is used to heat the upper baking pan. The upper baking pan heating module is laid inside the cavity of the upper baking pan, and the upper baking pan thermostat is located in the middle of the heating area formed by the upper baking pan heating module inside the upper baking pan.

[0009] Furthermore, the cooking appliance also includes: a lower baking pan heating module, which is connected to the lower baking pan base and located at the bottom of the lower baking pan. The lower baking pan heating module is used to heat the lower baking pan. The lower baking pan heating module is laid inside the cavity of the lower baking pan, and the lower baking pan thermostat is located in the middle of the heating area formed by the lower baking pan heating module inside the lower baking pan.

[0010] Furthermore, the upper baking pan heating module is an electric heating tube heating module, or an induction cooker heating module, or an electric ceramic cooker heating module.

[0011] Furthermore, the lower baking pan heating module is an electric heating tube heating module, or an induction cooker heating module, or an electric ceramic cooker heating module.

[0012] Furthermore, the upper baking tray is integrally formed from iron material, or integrally formed from aluminum material, or integrally formed from stainless steel material.

[0013] Furthermore, the lower baking pan is integrally formed from iron, aluminum, or stainless steel.

[0014] Furthermore, the lower baking pan heating module has a ring structure, and the lower baking pan heating module is protrudingly located at the bottom of the lower baking pan base. The lower baking pan temperature controller is located at the geometric center of the inner ring of the lower baking pan heating module.

[0015] Furthermore, the upper baking pan heating module has a ring structure, and the upper baking pan heating module is protruding from the bottom of the lower baking pan base. The upper baking pan temperature controller is located at the geometric center of the inner ring of the upper baking pan heating module.

[0016] By applying the technical solution of this utility model, the thermostat is placed inside the baking pan base, specifically at the geometric center of one side of the bottom of the baking pan. This design overcomes the temperature measurement errors caused by the non-centered position of the thermostat and uneven contact with the heating element, ensuring the accuracy of temperature monitoring. This application solves the problem of inaccurate temperature measurement and errors caused by the non-centered position of the thermostat in the prior art. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0018] Figure 1 A structural schematic diagram of an embodiment of a cooking appliance according to the prior art is shown;

[0019] Figure 2 A schematic diagram of the structure of a first embodiment of a cooking appliance according to the present invention is shown;

[0020] Figure 3 A schematic diagram of the structure of a second embodiment of the cooking appliance according to the present invention is shown.

[0021] The above figures include the following reference numerals:

[0022] 10. Baking tray assembly;

[0023] 11. Baking tray stand;

[0024] 111. Place the baking tray on top;

[0025] 112. Place the lower baking tray on the baking tray;

[0026] 12. Baking tray;

[0027] 121. Place on a baking tray;

[0028] 122. Place the food on the baking tray;

[0029] 13. Thermostat;

[0030] 131. Top baking pan temperature controller;

[0031] 132. Lower baking pan thermostat;

[0032] 20. Upper baking tray heating module;

[0033] 30. Lower baking tray heating module;

[0034] 40. Columns. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0038] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions may be exaggerated, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0039] Combination Figures 2 to 3 As shown, according to a specific embodiment of this application, a cooking utensil is provided.

[0040] Specifically, such as Figure 2 As shown, the cooking appliance includes a baking pan assembly 10, which includes at least a baking pan base 11, a baking pan 12, and a thermostat 13. The thermostat 13 is disposed within the baking pan base 11, and is disposed on one side of the bottom of the baking pan 12. The thermostat 13 is located at the geometric center of the baking pan 12, and is used to monitor the temperature of the baking pan 12.

[0041] By applying the technical solution of this utility model, the thermostat 13 is placed inside the baking tray base 11, and located at the geometric center of one side of the bottom of the baking tray 12. This design overcomes the temperature measurement errors caused by the non-centered position of the thermostat and uneven contact with the heating element in the original technology, ensuring the accuracy of temperature monitoring. This application solves the problem of inaccurate temperature measurement and errors caused by the non-centered position of the thermostat in the prior art.

[0042] Specifically, such as Figure 3 As shown, the baking tray base 11 includes an upper baking tray base 111 and a lower baking tray base 112, the baking tray 12 includes an upper baking tray 121 and a lower baking tray 122, and the temperature controller 13 includes an upper baking tray temperature controller 131 and a lower baking tray temperature controller 132. The upper baking tray 121 is connected to the upper baking tray base 111, the lower baking tray 122 is connected to the lower baking tray base 112, the upper baking tray temperature controller 131 is connected to the upper baking tray base 111, and the upper baking tray temperature controller 131 is located at the geometric center of the upper baking tray 121, and / or, the lower baking tray temperature controller 132 is connected to the lower baking tray base 112, and the lower baking tray temperature controller 132 is located at the geometric center of the lower baking tray 122.

[0043] The upper baking tray base 111 serves as the supporting structure for the baking tray heating system. It primarily supports the upper baking tray 121 and ensures its stability and compatibility. It may include mounting slots or special positioning devices to precisely fix the upper baking tray and ensure even heating. The upper baking tray 121 is tightly connected to the upper baking tray base and typically has a smooth metal surface (ensuring smooth inner and outer walls) for directly placing and heating food. The upper baking tray thermostat 131 is located at the geometric center of the upper baking tray to achieve more accurate temperature measurement and control. The central location reduces edge effects, i.e., the influence of temperature changes at the edges of the baking tray on the measurement results, thereby improving the temperature uniformity of the entire heating process and the reliability of the cooking effect. The connection between the thermostat and the baking tray base must ensure good thermal conductivity and electrical insulation.

[0044] The lower baking tray base 112 is similar to the upper baking tray base. Its design aims to support and stabilize the lower baking tray. The lower baking tray 122 also features a smooth metal surface that contacts the bottom of the food, enabling bottom-up heating. The lower baking tray thermostat 132 is connected to the lower baking tray base and positioned at the geometric center of the lower baking tray. This layout ensures more accurate temperature monitoring of the bottom heating, avoiding food cooking problems caused by uneven heating.

[0045] It should be further explained that the lower baking pan 122 and the upper baking pan 121 are integrally molded. This one-piece design provides a more robust and stable structure, reducing the risk of deformation and damage due to prolonged use or temperature changes. The seamless, one-piece design makes the baking pan surface smoother, reducing corners where food residue, oil stains, or dirt can hide, thus greatly simplifying the cleaning process. Compared to traditional component welding or assembly, the one-piece manufacturing process significantly improves production efficiency.

[0046] Specifically, the cooking appliance includes an upper baking pan heating module 20, which is connected to an upper baking pan base 111. The upper baking pan heating module 20 is located at the bottom of the upper baking pan 121 and is used to heat the upper baking pan 121. The upper baking pan heating module 20 is laid inside the cavity of the upper baking pan 121, and the upper baking pan thermostat 131 is located in the center of the heating area formed by the upper baking pan heating module 20 within the upper baking pan 121. Because the upper baking pan heating module is located at the bottom of the upper baking pan and the upper baking pan thermostat is located in the center of the heating area, this design effectively improves the uniformity of heating the upper baking pan, avoids inconsistent heating of the food surface or bottom, and improves cooking results. The centrally located layout of the upper baking pan thermostat 131, combined with its close cooperation with the upper baking pan heating module 20, makes temperature control more precise and reduces temperature fluctuations during cooking.

[0047] The upper baking pan heating module 20 is connected to the upper baking pan base 111. This connection method ensures the upper baking pan heating module 20 is firmly fixed, while also facilitating uniform heat distribution and heat dissipation of the upper baking pan base 111. The connection can be direct fixing or isolation through insulating material to ensure electrical safety. The upper baking pan heating module 20 is located at the bottom of the upper baking pan 121, allowing heat to radiate directly and evenly onto the surface of the upper baking pan 121, improving heating efficiency and reducing heat loss. The upper baking pan heating module 20 is laid inside the cavity of the upper baking pan 121, which not only saves space and makes the baking pan assembly more compact, but also ensures that the contact area between the upper baking pan heating module 20 and the upper baking pan 121 is maximized, thereby promoting rapid and uniform heat conduction and avoiding local overheating or uneven heating.

[0048] Specifically, the cooking appliance also includes a lower baking pan heating module 30, which is connected to the lower baking pan base 112. The lower baking pan heating module 30 is located at the bottom of the lower baking pan 122 and is used to heat the lower baking pan 122. The lower baking pan heating module 30 is laid inside the cavity of the lower baking pan 122, and the lower baking pan thermostat 132 is located in the center of the heating area formed by the lower baking pan heating module 30 within the lower baking pan 122. Because the lower baking pan heating module is located at the bottom of the lower baking pan and the lower baking pan thermostat is located in the center of the heating area, this design effectively improves the uniformity of heating the lower baking pan, avoids inconsistent heating of the food surface or bottom, and improves cooking results. The centrally located lower baking pan thermostat 132, combined with its close cooperation with the lower baking pan heating module 30, makes temperature control more precise and reduces temperature fluctuations during cooking.

[0049] The lower baking pan heating module 30 is connected to the lower baking pan base 112. This connection method ensures the lower baking pan heating module 30 is firmly fixed, while also facilitating uniform heat distribution and heat dissipation of the lower baking pan base 112. The connection can be direct fixing or isolation through insulating material to ensure electrical safety. The lower baking pan heating module 30 is located at the bottom of the lower baking pan 122, allowing heat to radiate directly and evenly to the surface of the lower baking pan 122, improving heating efficiency and reducing heat loss. The lower baking pan heating module 30 is laid inside the cavity of the lower baking pan 122, which not only saves space and makes the overall baking pan assembly more compact, but also ensures that the contact area between the lower baking pan heating module 30 and the lower baking pan 122 is maximized, thereby promoting rapid and uniform heat conduction and avoiding local overheating or uneven heating.

[0050] Specifically, such as Figure 3 As shown, the upper baking pan heating module 20 is an electric heating tube heating module, or an induction cooker heating module, or an electric ceramic cooker heating module.

[0051] Specifically, such as Figure 3 As shown, the lower baking pan heating module 30 is an electric heating tube heating module, or an induction cooker heating module, or an electric ceramic cooker heating module.

[0052] The electric heating element module mainly consists of an electric heating element and insulating materials. The electric heating element is the core heating component, typically composed of resistance wire wrapped inside a metal tube (such as stainless steel), with the outer surface of the metal tube in contact with the baking pan. The insulating material isolates the heating element from direct contact with the baking pan base, preventing electrical safety hazards. The electric heating element module is suitable for cooking scenarios requiring stable and uniform heating, such as baking bread, cakes, or roasting meats. Because the electric heating element provides continuous and stable heat output with even heating distribution, it is particularly suitable for cooking processes requiring prolonged heating and precise temperature control. The electric heating element has high heating efficiency, quickly reaching the preset temperature, and is also easy to clean and maintain.

[0053] The heating module of an induction cooker mainly consists of an induction coil and a control circuit. The induction coil generates an alternating magnetic field, which, when in contact with a ferromagnetic material (such as iron or stainless steel) at the bottom of the baking pan, induces eddy currents, thus generating heat. The control circuit monitors the magnetic field strength and adjusts the heating power to ensure the controllability of the heating process. The induction cooker heating module is suitable for scenarios requiring rapid heating and precise temperature control, such as quickly frying food or cooking processes that need to reach high temperatures in a short time. Electromagnetic heating is characterized by its fast heating speed, high energy efficiency, and the ability to easily control the heating power by adjusting the magnetic field strength, achieving precise temperature control. Furthermore, electromagnetic heating has minimal impact on ambient temperature, making it suitable for enclosed spaces or temperature-sensitive cooking environments.

[0054] The heating module of an electric ceramic cooktop mainly consists of an electric ceramic heating element and a ceramic plate. The electric ceramic heating element generates heat through electric current, while the ceramic plate serves as the heat transfer medium between the heating element and the baking pan, featuring high temperature resistance and uniform heat conduction. Electric ceramic cooktop heating modules are suitable for cooking scenarios requiring gentle and uniform heating, such as low-temperature cooking, baking, or heat preservation. The advantages of electric ceramic heating are stable heating, minimal temperature fluctuations, and the ability to maintain a constant low temperature for extended periods, making it suitable for cooking processes that require gentle handling of ingredients to preserve their nutrients and flavor. Furthermore, due to the aesthetic appeal of ceramic materials, electric ceramic cooktop heating modules are also frequently used in the design of cooking appliances where a pleasing appearance is important.

[0055] Different types of upper baking pan heating modules each have their own characteristics and applicable scenarios. Electric heating element modules are suitable for cooking processes requiring stable and even heating; induction cooktop heating modules are suitable for needs of rapid heating and precise temperature control; and ceramic cooktop heating modules are suitable for scenarios requiring gentle and even heating. The heating modules for the upper and lower baking pans can be selected from electric heating elements, induction heating, or ceramic heating modules, respectively. These modules can be used individually or in combination, adapting to different cooking needs and scenarios, demonstrating the versatility and flexibility of the solution.

[0056] like Figure 1The diagram shows the structure of a prior art cooking appliance, illustrating its basic framework, including a baking pan 12 and a baking pan base 11. The lower baking pan is detachable from the lower baking pan base to accommodate different cleaning and maintenance needs. The lower baking pan heating module 30 is located at the bottom of the baking pan 12 and connected to it. The lower baking pan heating module 30 is used to heat the baking pan 12. In this technology, the lower baking pan heating module 30 is a heating tube, which is arranged around the center area of ​​the lower baking pan. The thermostat 13 is connected to the lower baking pan base and is located at the edge of one side of the bottom of the baking pan 12. Multiple pillars 40 are provided at the bottom of the baking pan, spaced circumferentially. When the baking pan is connected to the baking pan base, the pillars 40 contact the thermostat 13 to measure the temperature of the baking pan. However, this method has errors that lead to inaccurate measurement results. Figure 1 The cooking appliance shown is limited by the fact that the heating element is located at the bottom of the baking pan, so it can only be made of iron or stainless steel.

[0057] Specifically, the upper baking tray 121 is integrally formed from iron material, or the upper baking tray 121 is integrally formed from aluminum material, or the upper baking tray 121 is integrally formed from stainless steel material.

[0058] Specifically, the lower baking pan 122 is integrally formed from iron material, or it is integrally formed from aluminum material, or it is integrally formed from stainless steel material.

[0059] By selecting iron, aluminum, or stainless steel as the material for the baking pan and employing a one-piece molding manufacturing process, not only can the pan's properties be customized to specific cooking needs (such as heating speed, weight, durability, and appearance), but the overall performance of the cooking appliance can also be significantly improved, including heating efficiency, temperature uniformity, and product lifespan. One-piece molding reduces subsequent welding and assembly steps, lowering the complexity of the production process and reducing the risk of potential manufacturing defects. This simplifies the production process and reduces manufacturing costs. In this embodiment, the baking pan can be made of iron, stainless steel, or aluminum, but is not limited to these three materials.

[0060] Specifically, the lower baking pan heating module 30 has a ring structure and is protrudingly disposed at the bottom of the lower baking pan base 112. The lower baking pan temperature controller 132 is located at the geometric center of the inner ring of the lower baking pan heating module 30.

[0061] Specifically, the upper baking pan heating module 20 has a ring structure and is protrudingly disposed at the bottom of the lower baking pan base 112. The upper baking pan temperature controller 131 is located at the geometric center of the inner ring of the upper baking pan heating module 20.

[0062] Optionally, the heating module adopts a ring design, where the heating elements (such as electric heating tubes, electromagnetic heating coils, or ceramic heating elements) are arranged in a ring shape, rather than in a traditional planar distribution. This design increases the contact area between the heating elements and the bottom of the baking pan, which is beneficial for the even distribution of heat, avoids the formation of "hot spots" or "cold spots," and ensures that the food is heated more evenly.

[0063] The heating module protrudes from the bottom of the baking pan base. This design provides a better heat conduction path, allowing heat to be transferred more directly from the heating module to the bottom of the baking pan, thus improving heating efficiency. Furthermore, the protruding structure better protects the heating module from damage during handling or cleaning.

[0064] Placing the thermostats (either the upper baking pan thermostat 131 or the lower baking pan thermostat 132) precisely at the geometric center of the inner ring of the annular heating module means that the thermostats can most directly monitor the temperature of the central area of ​​the baking pan, which is usually the part of the baking pan with the most even heat distribution. A thermostat in the center position can more accurately reflect the average temperature of the entire baking pan, effectively avoiding the edge effect, i.e., the problem that the temperature at the edge of the baking pan may differ significantly from the center.

[0065] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0066] 1. The heating module is placed inside the baking pan base and connected to the baking pan base. This solves the problem of the existing technology that uses a heating tube attached to the bottom for heating, which limits the materials that can be used to manufacture the baking pan. This solution can use a variety of materials to make the baking pan in one piece.

[0067] 2. By setting the thermostat at the geometric center of the baking pan, the overall temperature of the baking pan can be monitored and controlled more accurately, reducing uneven temperature distribution and errors, and achieving more precise temperature control.

[0068] 3. The heating modules of the upper and lower baking pans adopt a ring structure, which increases the contact area with the baking pan, optimizes the heat conduction path, makes the heating more uniform, improves heating efficiency, and shortens cooking time.

[0069] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0070] In addition to the above, it should be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this utility model.

[0071] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0072] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cooking utensil, characterized in that, include: A baking pan assembly (10) includes at least a baking pan base (11), a baking pan (12), and a temperature controller (13). The temperature controller (13) is disposed within the baking pan base (11), and is disposed on one side of the bottom of the baking pan (12). The temperature controller (13) is located at the geometric center of the baking pan (12). The temperature controller (13) is used at least to monitor the temperature of the baking pan (12).

2. The cooking utensil according to claim 1, characterized in that, The baking tray stand (11) includes an upper baking tray stand (111) and a lower baking tray stand (112), the baking tray (12) includes an upper baking tray (121) and a lower baking tray (122), and the temperature controller (13) includes an upper baking tray temperature controller (131) and a lower baking tray temperature controller (132). The upper baking tray (121) is connected to the upper baking tray stand (111), the lower baking tray (122) is connected to the lower baking tray stand (112), the upper baking tray temperature controller (131) is connected to the upper baking tray stand (111), and the upper baking tray temperature controller (131) is located at the geometric center of the upper baking tray (121), and / or, the lower baking tray temperature controller (132) is connected to the lower baking tray stand (112), and the lower baking tray temperature controller (132) is located at the geometric center of the lower baking tray (122).

3. The cooking utensil according to claim 2, characterized in that, The cooking appliance includes: The upper baking pan heating module (20) is connected to the upper baking pan base (111). The upper baking pan heating module (20) is located at the bottom of the upper baking pan (121). The upper baking pan heating module (20) is used to heat the upper baking pan (121). The upper baking pan heating module (20) is laid in the inner cavity of the upper baking pan (121), and the upper baking pan temperature controller (131) is located in the middle of the heating area formed by the upper baking pan heating module (20) in the upper baking pan (121).

4. The cooking utensil according to claim 3, characterized in that, The cooking appliance also includes: The lower baking pan heating module (30) is connected to the lower baking pan base (112). The lower baking pan heating module (30) is located at the bottom of the lower baking pan (122). The lower baking pan heating module (30) is used to heat the lower baking pan (122). The lower baking pan heating module (30) is laid in the inner cavity of the lower baking pan (122), and the lower baking pan temperature controller (132) is located in the middle of the heating area formed by the lower baking pan heating module (30) in the lower baking pan (122).

5. The cooking utensil according to claim 4, characterized in that, The upper baking pan heating module (20) is an electric heating tube heating module, or, The upper baking tray heating module (20) is an induction cooker heating module, or, The upper baking pan heating module (20) is an electric ceramic stove heating module.

6. The cooking utensil according to claim 4, characterized in that, The lower baking pan heating module (30) is an electric heating tube heating module, or... The lower baking tray heating module (30) is an induction cooker heating module, or... The lower baking pan heating module (30) is an electric ceramic stove heating module.

7. The cooking utensil according to any one of claims 2 to 6, characterized in that, The upper baking tray (121) is integrally formed from iron material, or, The upper baking tray (121) is integrally formed from aluminum material, or, The upper baking tray (121) is integrally formed from stainless steel.

8. The cooking utensil according to claim 7, characterized in that, The lower baking pan (122) is integrally formed from iron material, or... The lower baking tray (122) is integrally formed from aluminum material, or, The lower baking pan (122) is integrally formed from stainless steel.

9. The cooking utensil according to claim 4, characterized in that, The lower baking pan heating module (30) has a ring structure. The lower baking pan heating module (30) is protrudingly disposed at the bottom of the lower baking pan base (112). The lower baking pan temperature controller (132) is located at the geometric center of the inner ring of the lower baking pan heating module (30).

10. The cooking utensil according to claim 3, characterized in that, The upper baking pan heating module (20) has a ring structure. The upper baking pan heating module (20) is protrudingly disposed at the bottom of the lower baking pan base (112). The upper baking pan temperature controller (131) is located at the geometric center of the inner ring of the upper baking pan heating module (20).

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