A heat dissipation device and an epilator

Abstract

The utility model provides a kind of heat sink and epilator, wherein, heat sink includes refrigeration module and laser heat dissipation module, refrigeration module includes semiconductor refrigerating sheet, semiconductor refrigerating sheet includes middle galvanic couple layer and two ends hot face and cold face, hot face contact is provided with first heat conduction part, laser heat dissipation module includes heat dissipation fan, radiator and with the second heat conduction part of the heating end contact of epilator laser module, the groove of heat dissipation fin perpendicular to radiator is provided on radiator, groove divides radiator into first radiating portion connected with second heat conduction part and second radiating portion connected with second heat conduction part, heat dissipation fan is located in one side of radiator, and second radiating portion is located between first radiating portion and heat dissipation fan. For the utility model, the installation space inside epilator is greatly reduced, and heat dissipation fan can radiate heat dissipation fin, which greatly improves the heat dissipation efficiency of cold sheet radiating structure.

Description

Technical Field

[0001] This utility model relates to the field of hair removal device technology, and in particular to a heat dissipation device and a hair removal device. Background Technology

[0002] Existing hair removal devices generally have a cooling plate heat dissipation structure and a laser heat dissipation structure. These two heat dissipation structures are independent of each other and each has its own heat dissipation fins. Therefore, it is necessary to put the above two sets of heat dissipation structures inside the hair removal device, which will undoubtedly result in a large overall size of the hair removal device.

[0003] In addition, hair removal devices are generally equipped with a set of cooling fans, which are usually located in the laser heat dissipation structure. These fans can only dissipate the heat generated by the laser module. The cooling of the cooling chip module can only be achieved through the heat dissipation fins, resulting in poor heat dissipation performance of the cooling chip heat dissipation structure.

[0004] Therefore, existing technologies need to be improved and enhanced. Utility Model Content

[0005] In view of the shortcomings of the prior art, the present invention provides a heat dissipation device and a hair removal device, which can integrate the heat dissipation fins of the traditional cooling plate heat dissipation structure and the laser heat dissipation structure into one unit, greatly reducing the installation space inside the hair removal device, and the cooling fan can dissipate heat from the heat dissipation fins, greatly improving the heat dissipation efficiency of the cooling plate heat dissipation structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A heat dissipation device includes a cooling module and a laser heat dissipation module. The cooling module includes a semiconductor cooling chip, which includes an intermediate thermocouple layer and hot and cold surfaces at both ends. A first thermal conductive element is disposed in contact with the hot surface. The laser heat dissipation module includes a cooling fan, a heat sink, and a second thermal conductive element that contacts the heat-generating end of a laser module for a hair removal device. The heat sink has grooves perpendicular to its heat dissipation fins, dividing it into a first heat dissipation section connected to the second thermal conductive element and a second heat dissipation section connected to the second thermal conductive element. The cooling fan is located on one side of the heat sink, and the second heat dissipation section is located between the first heat dissipation section and the cooling fan.

[0007] Furthermore, the cooling fan is a blower, and the airflow of the cooling fan blows from the second heat dissipation part to the first heat dissipation part.

[0008] Furthermore, the cross-section of a single heat dissipation fin of the heat sink is an inverted L-shape.

[0009] Furthermore, an airflow guide shroud is provided between the cooling fan and the second heat dissipation unit.

[0010] Furthermore, the diameter of the airflow guide shroud near the cooling fan is larger than the diameter of the airflow guide shroud near the second heat dissipation part.

[0011] Furthermore, the first heat-conducting component includes a first heat-conducting sheet, a second heat-conducting sheet, and a heat-conducting pipe. The first heat-conducting sheet is in contact with the hot surface of the semiconductor cooling chip, the second heat-conducting sheet is in contact with the top of the heat dissipation fins of the second heat dissipation part, and the two ends of the heat-conducting pipe are respectively connected to the first heat-conducting sheet and the second heat-conducting sheet.

[0012] Furthermore, two cooling fans are provided, and the two cooling fans are stacked together.

[0013] Furthermore, the depth of the trench is less than the height of the heat dissipation fins.

[0014] Furthermore, in the horizontal direction, the ratio of the area of ​​the first heat dissipation part to that of the second heat dissipation part is 1.5-2.3.

[0015] A hair removal device includes a body, wherein the body is provided with the heat dissipation device described above.

[0016] Compared to existing technologies, the heat dissipation device provided by this utility model includes a cooling module and a laser heat dissipation module. The cooling module includes a semiconductor cooling chip, which includes an intermediate thermocouple layer and hot and cold surfaces at both ends. A first heat-conducting element is disposed in contact with the hot surface. The laser heat dissipation module includes a cooling fan, a heat sink, and a second heat-conducting element that contacts the heating end of the laser module of the hair removal device. The heat sink has grooves perpendicular to the heat dissipation fins, which divide the heat sink into a first heat dissipation part connected to the second heat-conducting element and a second heat dissipation part connected to the second heat-conducting element. The cooling fan is located on one side of the heat sink, and the second heat dissipation part is located between the first heat dissipation part and the cooling fan. According to this utility model, the cooling fan can simultaneously dissipate heat from the first heat dissipation part and the heat dissipation part, making the heat dissipation effect of the cooling module better. Moreover, the groove can prevent the heat from the second heat dissipation part from being conducted back to the first heat dissipation part. That is, the heat dissipation fins of the traditional cooling chip heat dissipation structure and the laser heat dissipation structure can be integrated into one, which greatly reduces the installation space inside the hair removal device. Furthermore, the cooling fan can dissipate heat from the heat dissipation fins, which greatly improves the heat dissipation efficiency of the cooling chip heat dissipation structure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the heat dissipation device provided by this utility model.

[0019] Figure 2 A partial structural schematic diagram of the heat dissipation device provided by this utility model.

[0020] Figure 3 A schematic diagram of the structure of the laser heat dissipation module of the heat dissipation device provided by this utility model.

[0021] Figure 4 for Figure 3 Enlarged diagram of point A in the middle.

[0022] Explanation of reference numerals in the attached diagram: Cooling module-1, laser heat dissipation module-2, semiconductor cooling chip-3, first heat conduction component-4, cooling fan-5, heat sink-6, second heat conduction component-7, heat dissipation fins-8, groove-9, first heat dissipation section-10, second heat dissipation section-11, airflow guide shroud-12, first heat conduction sheet-13, second heat conduction sheet-14, heat conduction pipe-15, heat conduction block-16, copper pipe-17. Detailed Implementation

[0023] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0025] In this utility model, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this utility model and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0026] Furthermore, the terms “first” and “second” as used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are used only to distinguish one element from another. When used herein, the singular forms “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having” specify the presence of the stated features, integrals, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integrals, steps, operations, components, parts, or combinations thereof.

[0027] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0028] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] like Figure 1 and Figure 2As shown, the heat dissipation device provided by this utility model includes a cooling module 1 and a laser heat dissipation module 2. The cooling module 1 includes a semiconductor cooling chip 3, which includes an intermediate thermocouple layer and hot and cold surfaces at both ends. A first heat-conducting element 4 is disposed in contact with the hot surface. The laser heat dissipation module 2 includes a cooling fan 5, a heat sink 6, and a second heat-conducting element 7 that contacts the heating end of the laser module of the hair removal device. The heat sink 6 is provided with grooves 9 perpendicular to the heat dissipation fins 8 of the heat sink 6. The grooves 9 divide the heat sink 6 into a first heat dissipation part 10 connected to the second heat-conducting element 7 and a second heat dissipation part 11 connected to the second heat-conducting element 7. The cooling fan 5 is located on one side of the heat sink 6, and the second heat dissipation part 11 is located between the first heat dissipation part 10 and the cooling fan 5.

[0030] It is understood that the second heat-conducting component 7 includes a heat-conducting block 16 and a copper pipe 17. The heat-conducting block 16 is in contact with the heating end of the laser module of the hair removal device. One end of the copper pipe 17 is connected to the heat-conducting block 16, and the other end of the copper pipe 17 is connected to the heat sink 6. The cooling fan 5 can simultaneously dissipate heat from the first heat sink 10 and the second heat sink 11, thereby improving the heat dissipation efficiency of the cooling module 1. The groove 9 can prevent the heat from the second heat sink 11 from being conducted to the first heat sink 10, thus resulting in a poor effect of the first heat sink 10. The groove 9 is perpendicular to the heat dissipation fins 8 and can play a role in isolating heat conduction, that is, preventing the heat from the second heat sink 11 from being conducted to the first heat sink 10.

[0031] Compared with the prior art, the technical solution of this application can integrate the heat dissipation fins 8 of the traditional cooling chip heat dissipation structure and the laser heat dissipation structure into one unit, which greatly reduces the installation space inside the hair removal device, and the cooling fan 5 can dissipate heat from the heat dissipation fins 8, which greatly improves the heat dissipation efficiency of the cooling chip heat dissipation structure.

[0032] Furthermore, the cooling fan 5 is a blower, that is, the air intake direction of the cooling fan 5 is perpendicular to the air outlet direction, the airflow of the cooling fan 5 blows from the second heat dissipation part 11 to the first heat dissipation part 10, and the heat dissipation fins 8 are parallel to the airflow direction of the cooling fan 5, which can ensure that the air carries away the heat from the surface of the heat dissipation fins 8.

[0033] Furthermore, the cross-section of each heat dissipation fin 8 of the radiator 6 is an inverted L-shape. It can be understood that the inverted L-shaped heat dissipation fins 8 can form a relatively complete "U"-shaped channel, which can ensure that air passes through the channel. Compared with the traditional "U"-shaped channel, the solution of this application can better prevent air diffusion and prevent the airflow velocity from decreasing, thus effectively improving the heat dissipation effect.

[0034] Furthermore, an airflow guide shroud 12 is provided between the cooling fan 5 and the second heat dissipation unit 11. The airflow guide shroud 12 can guide the airflow from the cooling fan 5 to the heat sink 6, preventing the airflow from dissipating heat during its flow to the heat sink 6, which would result in poor heat dissipation of the heat sink 6.

[0035] Furthermore, the diameter of the airflow guide shroud 12 near the cooling fan 5 is larger than the diameter of the airflow guide shroud 12 near the second heat dissipation part 11, which can change the airflow speed, that is, increase the airflow speed from the airflow guide shroud 12, so that the airflow speed to the radiator 6 is greater, which greatly improves the heat dissipation effect of the radiator 6.

[0036] Furthermore, the first heat-conducting component 4 includes a first heat-conducting sheet 13, a second heat-conducting sheet 14, and a heat-conducting pipe 15. The first heat-conducting sheet 13 is in contact with the hot surface of the thermoelectric cooler 3, and the second heat-conducting sheet 14 is in contact with the top of the heat dissipation fins 8 of the second heat dissipation section 11. The two ends of the heat-conducting pipe 15 are respectively connected to the first heat-conducting sheet 13 and the second heat-conducting sheet 14. It can be understood that the first heat-conducting sheet 13 guides the heat from the hot surface of the thermoelectric cooler 3 to the heat-conducting pipe 15, the heat-conducting pipe 15 guides the heat to the second heat-conducting sheet 14, and finally the heat-conducting sheet guides the heat to the second heat dissipation section 11 for heat dissipation.

[0037] Furthermore, two cooling fans 5 are provided, and the two cooling fans 5 are stacked. It should be noted that the number of cooling fans 5 operating can be determined according to the actual heat generation. Specifically, if the heat generated by the cooling module 1 and the laser module is high, both cooling fans 5 can be controlled to operate simultaneously. If the heat generated by the cooling module 1 and the laser module is low, a single cooling fan 5 can be controlled to operate to maximize efficiency.

[0038] Furthermore, the depth of the groove 9 is less than the height of the heat dissipation fins 8. It can be understood that the groove 9 merely divides the heat sink 6 into two parts, but the heat from the first heat dissipation section 10 can be directed to the second heat dissipation section 11 to reduce the heat dissipation pressure on the first heat dissipation section 10.

[0039] It should be noted that although the first heat dissipation part 10 and the second heat dissipation part 11 are connected, and the heat from the first heat dissipation part 10 can be conducted to the second heat dissipation part 11, the heat from the second heat dissipation part 11 generally will not be conducted to the first heat dissipation part 10. The reason is that the heat generated by the cooling module 1 is generally conducted downward from the top of the second heat dissipation module, and the second heat dissipation part 11 is located at the air outlet of the cooling fan 5. The temperature of the air here is low, which provides the best heat dissipation effect for the second heat dissipation part 11. Therefore, before the heat on the second heat dissipation part 11 has been conducted to the bottom of the second heat dissipation part 11, that is, before it can be conducted to the first heat dissipation part 10 through the bottom of the second heat dissipation part 11, most of the heat of the second heat dissipation part 11 has been dissipated by the cooling fan 5. When the heat of the first heat dissipation part 10 is too high, it can be conducted to the second heat dissipation part 11 through the fins connected between the first heat dissipation part 10 and the second heat dissipation part 11, so as to reduce the heat dissipation pressure of the first heat dissipation part 10, thereby making the heat dissipation effect of the entire heat sink 6 better.

[0040] Furthermore, in the horizontal direction, the area ratio of the first heat dissipation part 10 to the second heat dissipation part 11 is 1.5-2.3. Since the laser module generates a large amount of heat, the heat dissipation capacity of the first heat dissipation part 10 is greater than that of the second heat dissipation part 11. The larger the area of ​​the heat dissipation fins 8 in the horizontal direction, the stronger their heat dissipation capacity. A ratio of 1.5-2.3 between the areas of the first heat dissipation part 10 and the second heat dissipation part 11 ensures optimal heat dissipation for both parts.

[0041] A hair removal device includes a body, in which the aforementioned heat dissipation device is provided. The hair removal device with the heat dissipation device has a better heat dissipation effect. Furthermore, by integrating the heat dissipation fins 8 of the traditional cooling plate heat dissipation structure and the laser heat dissipation structure into one unit, the internal installation space of the hair removal device is greatly reduced, making it easier to make the hair removal device more compact and convenient for users to use.

[0042] In summary, the heat dissipation device provided by this utility model features an inverted L-shaped cross-section for each heat dissipation fin, which effectively prevents wind diffusion and reduces airflow velocity, thus significantly improving heat dissipation. The airflow guide shroud directs airflow from the cooling fan to the heat dissipation shroud, preventing heat loss during airflow towards the shroud and ensuring optimal heat dissipation. The diameter of the airflow guide shroud near the cooling fan is larger than that near the second heat dissipation section, altering the airflow velocity and increasing the airflow velocity towards the shroud, thereby greatly improving the heat dissipation effect. Furthermore, this utility model integrates the heat dissipation fins of a traditional cooling plate structure and a laser heat dissipation structure, significantly reducing the installation space inside the hair removal device. The cooling fan further enhances the heat dissipation efficiency of the cooling plate structure by cooling the fins.

[0043] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the scope of protection of the present invention.

Claims

1. A heat dissipating device, characterized by, The device includes a cooling module (1) and a laser heat dissipation module (2). The cooling module (1) includes a semiconductor cooling chip (3). The semiconductor cooling chip (3) includes a middle electrocouple layer and hot and cold surfaces at both ends. A first heat-conducting element (4) is disposed in contact with the hot surface. The laser heat dissipation module (2) includes a cooling fan (5), a heat sink (6), and a second heat-conducting element (7) that contacts the heating end of the laser module of the hair removal device. The heat sink (6) is provided with a groove (9) perpendicular to the heat dissipation fins (8) of the heat sink (6). The groove (9) divides the heat sink (6) into a first heat dissipation part (10) connected to the second heat-conducting element (7) and a second heat dissipation part (11) connected to the second heat-conducting element (7). The cooling fan (5) is located on one side of the heat sink (6), and the second heat dissipation part (11) is located between the first heat dissipation part (10) and the cooling fan (5).

2. The heat dissipation device according to claim 1, characterized in that, The cooling fan (5) is a blower, and the airflow of the cooling fan (5) blows from the second heat dissipation part (11) to the first heat dissipation part (10).

3. The heat dissipation device according to claim 1, characterized in that, The cross-section of a single heat dissipation fin (8) of the radiator (6) is an inverted L-shape.

4. The heat dissipation device according to claim 1, characterized in that, An airflow guide shroud (12) is provided between the cooling fan (5) and the second heat dissipation part (11).

5. The heat dissipation device according to claim 4, characterized in that, The diameter of the airflow guide shroud (12) near the cooling fan (5) is larger than the diameter of the airflow guide shroud (12) near the second heat dissipation part (11).

6. The heat dissipation device according to claim 1, characterized in that, The first heat-conducting component (4) includes a first heat-conducting sheet (13), a second heat-conducting sheet (14), and a heat-conducting pipe (15). The first heat-conducting sheet (13) is in contact with the hot surface of the semiconductor cooling chip (3), the second heat-conducting sheet (14) is in contact with the top of the heat dissipation fins (8) of the second heat dissipation part (11), and the two ends of the heat-conducting pipe (15) are respectively connected to the first heat-conducting sheet (13) and the second heat-conducting sheet (14).

7. The heat dissipation device according to claim 1, characterized in that, There are two cooling fans (5), and the two cooling fans (5) are stacked.

8. The heat dissipation device according to claim 1, characterized in that, The depth of the groove (9) is less than the height of the heat dissipation fins (8).

9. The heat dissipation device according to claim 1, characterized in that, In the horizontal direction, the ratio of the area of ​​the first heat dissipation part (10) to that of the second heat dissipation part (11) is 1.5-2.

3.

10. A hair removal device, comprising a body, characterized in that, The machine body is provided with a heat dissipation device as described in any one of claims 1-9.

Images